M295883 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種軍工規筆記型電腦結構之 改良，特別係一種增益其散熱效果之軍工規筆記型 電腦結構之改良。 【先前技術】 近來為了使電子裝置能夠更加的輕薄短 小，功能能更強大，晶片的體積需越做越小， 且運算速度需越來越快，但運算速度越來越快 的結果，相對的，晶片所產生的熱量也會越來 越多，而當電子裝置内部的熱量因累積而無法 消散時，係會影響到其中電子元件的可靠度以 及性能的穩定度，甚而縮短其壽命。因此，電 子裝置中散熱結構的設計，便成為設計電子裝 置時所不能輕忽的重要課題。 而對於體積朝著輕薄短小的方向設計的筆 記型電腦來說，其内部的散熱問題，更是各個 廠商所關心的，因此各個廠商都提出不同的散 熱結構設計以解決其散熱問題。而筆記型電腦 其實又可區分為軍工規筆記型電腦以及一般筆 記型電腦，因此在設計軍工規筆記型電腦以及 5 M295883 一般筆記型電腦的時候，需理解到軍工規筆記 型電腦的需求與一般筆記型電腦不同，而必需 根據其各別的特性分別對做散熱結構的設計。 舉例來說，軍工規筆記型電腦常需在惡劣環境 下使用，例如常在濕氣重或者多沙塵的惡劣環 境下使用，故該型電腦對於防水、防震以及防 塵的需求遠大於一般筆記型電腦，而一般筆記 型電腦所在乎的輕薄短小等因子，對於軍工規 筆記型電腦便不是主要考量的重點，也就是說 軍工規筆記型電腦結構在設計或作散熱結構設 計時，會首先考量到必需兼顧其防水或者防塵 功能，而一般筆記型電腦在設計或作散熱結構 設計時，首先會考量到必需兼顧其輕薄短小等 因子。 舉例來說，如第1圖所示，顯示目前一般 常應用於習知一般筆記型電腦1中的散熱結構 之一例子，該散熱結構通常包含將中央處理器3 貼附於電路板之導熱塊（圖未顯示）、鰭片式的 散熱模組5以及散熱風扇7，其主要係利用熱傳 導的原理將中央處理器3產生的熱經由熱導管 (圖未顯示）導引至散熱模組5上的鰭片上，再 6 M295883 利用散熱風扇 7帶動空氣流動，使其與集熱之 鰭片進行熱交換，以迅速帶走該散熱模組5之 熱量來達到降溫的目的◦故，風扇的風量、風 壓的大小以及鰭片熱交換的面積即決定此散熱 結構的效能，但此散熱結構需考量到一般筆記 型電腦所付予的空間，即其所重視的輕薄短小 等因子，因此設計一般筆記型電腦散熱結構的 困難點便在於要能有效的散熱，並且能夠兼顧 其輕薄短小的需求。 而以另一方面來說，如第 2圖所示，所顯 示的為目前習知的軍工規筆記型電腦 9之一例 子。顯而易見的是，目前習知的軍工規筆記型 電腦，因考量其防水、防震以及防塵的需求， 多半係以金屬一體成形作為自身之外殼，以儘 量避免内部電子元件受到外界環境的影響，例 如水氣、灰塵等，所以其係利用自身金屬機殼 11高的熱傳導率將中央處理器1 3產生的熱透過 導熱塊15、導熱墊17與金屬機殼11向外導出 以達到系統散熱的目的。因此在第2圖中並不 會見到如第1圖所示的，常使用於習知一般筆 記型電腦1中的風扇7等散熱結構，且因該金 7 M295883 屬外殼11之導熱效果較一般筆記型電腦所使用 的塑膠外殼要來的好，所以也不太需要習知一 般筆記型電腦所使用的散熱結構。 但，馨於目前晶片的速度越來越快，其產生的 熱量也越來越多，單靠軍工規筆記型電腦之金屬外 叙已不足以有效迅速地將中央處理器快速產生的大 _里熱里V出，並且當熱能的產生大於自然對流所能 負2的程度時，其高溫便會造成系統的過熱，甚而 使得系統運作不良，&，隨著電腦晶片速度的快速 么展’如何在兼顧軍工規筆記型電腦防水以及防震 特=同時，增益其散熱效果，便成為當前設計軍 工見筆s己型電腦所需克服的重要問題。 【新型内容】 於提供_種軍 ,’本創作的目的 幻“ 見“型電腦之改良結構，在 ”防水以及防塵特性的同時 為了達到本創作的目的，本創作？、效果c 在於使組成該軍工規筆之主要概 改變，使該主機殼體包含：：之主機殼體作. 空間，-為容置有主機’屬機殼隔開之兩a 空間，-為下獨 、電子元件之上獨立; 夏二間，該下獨立容置空g 8 M295883M295883 VIII. New Description: [New Technology Field] This creation department is about the improvement of a computer-based notebook computer structure, especially the improvement of the military-structured notebook computer structure that enhances its heat dissipation effect. [Prior Art] Recently, in order to make the electronic device more light and thin, the function can be more powerful, the volume of the wafer needs to be smaller and smaller, and the operation speed needs to be faster and faster, but the operation speed is faster and faster, and the relative The heat generated by the wafer will also increase. When the heat inside the electronic device cannot be dissipated due to accumulation, it will affect the reliability of the electronic components and the stability of the performance, and even shorten the life. Therefore, the design of the heat dissipation structure in the electronic device has become an important issue that cannot be neglected when designing an electronic device. For the notebook computer designed in the direction of light, thin and short, the internal heat dissipation problem is of concern to all manufacturers. Therefore, various manufacturers have proposed different heat dissipation structure design to solve the heat dissipation problem. The notebook computer can be divided into a military notebook computer and a general notebook computer. Therefore, when designing the military notebook computer and the 5 M295883 general notebook computer, it is necessary to understand the requirements and general requirements of the military notebook computer. Notebook computers are different, and they must be designed for the heat dissipation structure according to their respective characteristics. For example, military notebook computers often need to be used in harsh environments, such as in heavy environments with heavy moisture or dust, so the demand for waterproof, shockproof and dustproof computers is much larger than that of general notebooks. Computers, and the thin and short factors of the general notebook computer, are not the main considerations for the military-based notebook computer. That is to say, when designing or designing the heat-dissipating structure, the military-structured notebook computer structure will be considered first. It is necessary to take into account its waterproof or dustproof function. When designing or designing a heat dissipation structure, the general notebook computer will first consider the factors such as lightness, thinness and shortness. For example, as shown in FIG. 1, an example of a heat dissipation structure generally used in the conventional notebook computer 1 is generally shown, and the heat dissipation structure usually includes a heat conduction block that attaches the central processing unit 3 to the circuit board. (not shown), the fin-type heat dissipation module 5 and the heat dissipation fan 7, which mainly guide the heat generated by the central processing unit 3 to the heat dissipation module 5 via a heat pipe (not shown) by the principle of heat conduction. On the fins, the 6 M295883 uses the cooling fan 7 to drive the air to exchange heat with the heat collecting fins, so as to quickly take away the heat of the heat dissipation module 5 to achieve the purpose of cooling, the air volume of the fan, The size of the wind pressure and the heat exchange area of the fin determine the efficiency of the heat dissipation structure. However, the heat dissipation structure needs to consider the space that the general notebook computer pays, that is, the light, short, and other factors that are emphasized, so the general notes are designed. The difficulty of the computer's heat dissipation structure is that it can effectively dissipate heat, and can balance its light, thin and short needs. On the other hand, as shown in Fig. 2, an example of a conventional military notebook computer 9 is shown. Obviously, the current military notebook computer, considering its waterproof, shockproof and dustproof requirements, is mostly made of metal as its own shell, in order to avoid internal electronic components being affected by the external environment, such as water. Because of the high thermal conductivity of the metal casing 11, the heat generated by the central processing unit 13 is transmitted through the heat conducting block 15, the thermal pad 17 and the metal casing 11 to achieve heat dissipation. Therefore, in FIG. 2, the heat dissipation structure such as the fan 7 used in the conventional notebook computer 1 is not seen as shown in FIG. 1, and the heat conduction effect of the casing 7 is relatively high. The plastic case used in the notebook computer is good, so it is not necessary to know the heat dissipation structure used in the general notebook computer. However, the speed of the current wafer is getting faster and faster, and the heat generated by it is increasing. The metal profile of the military notebook computer alone is not enough to effectively and quickly generate the CPU. When the heat is generated, and the heat energy is greater than the natural convection, the high temperature will cause the system to overheat, even making the system malfunction. &, with the rapid speed of the computer chip In addition to the military workmanship notebook computer waterproof and shockproof special = at the same time, gaining its heat dissipation effect, it has become an important problem that the current design military industry has to overcome. [New content] In the provision of _ seed army, 'the purpose of the creation of the illusion' see "the improved structure of the computer, in the waterproof and dust-proof characteristics, in order to achieve the purpose of this creation, the creation?, the effect c is to make up the The main changes in the military regulations are such that the mainframe housing contains: the main body of the housing. Space, - for housing two main spaces separated by the main chassis, - for the next, electronic components Independent on the top; Xia Erjian, the next independent accommodation g 8 M295883
由位於該主機殼體之一凹 一蓋體所形成，並為與外 而，本創作之另一概 個政熱鰭片容置於該下獨 軍工規筆記型電腦可藉由 複數個散熱鰭片，並藉該 熱政出该下獨立容置空間 且’本創作之再一概 工間與该上獨立容置空間 機殼隔開，在該下獨立容 導熱時，外界的水氣以及 置空間影響該上獨立容置 過邊主機殼體與該空氣導 保持其防水與防塵之特性 故’本創作之又一概 工規筆記型電腦不但係可 熱元件產生的熱以傳導方 與該蓋體形成的與外界空 間以及容置於内的風扇 空氣以對流方式散出。 為以上述的概念達到_ 座，以及與該凹座搭配之 界空氣導通之一空間。 念為，有一風扇以及複數 立容置空間中，藉此，該 金屬外殼導熱至該空間之 風扇以空氣對流的方式將 外。 念在於，因該下獨立容置 係以主機殼體的下殼體之 置空間與外界做空氣對流 灰塵係無法經該下獨立容 空間内的電子元件，故透 熱空間的兩層構造，仍能 0 念為，利用本創作之該軍 藉該周邊的金屬外殼將發 式散出，而且能藉該凹座 氣導通之一下獨立容置空 及複數個散熱鰭片將熱經 h述的目的，本創作一種 9 M295883 軍工規筆記型電腦，包人 殼體，與該液晶板“3二―液晶板，以及-主機 殼體隔開之—上獨立；體包含完全以-間，其中該下獨立定罢： 下獨立容置空 而該下獨立容置空:間頂部一端設有一風扇， 散熱鰭片，其中二^ ^部之另一端垂直形成複數個 散熱鰭片，且該‘羽：軸方向係平行於該複數個 風孔正對於該I 立容置空間底部具有複數個通 該下獨立容置空‘：:以及具有複數個通風孔位於 為以 8則面，對著該複數個散熱鰭片。 ，、、、 述的概念達到上述的目的，太彻你_ 軍工規筆記型電腦 種 板組裝之—主機^ r 一液晶板以及與該液晶 部呈有—凹/又體’其特徵在於：該主機殼體底 該凹座底部之另違凹座底部之一端設有-風扇，而 中兮门戶另—端垂直形成複數個散熱鰭片，其 一：二羽轉軸方向係平行於該複數個散熱鰭片；及 底部：乂共°亥凹座組裝以遮蓋該凹座’該蓋體 " 禝文個通風孔正對於該凹座之風扇處，以 二 通風孔位於該蓋體側面，對著該複數 為以上述的概念達到上述的目的，本創作一種 、筆°己里Β腦，包含一液晶板以及與該液晶板 10 M295883 組裝之-主機殼體，該主機殻體具有一上殼體及一 下殼體，而其内部包含一主機板、一導熱塊與—導 熱管，該主機板上設置有-發熱元件，該導熱塊置 於該發熱元件上並與該導熱管連接，其特徵在於·該 下殼體底部具有一凹座’該凹座底部-端設有-風 扇，而該凹座底部另一端番古 、 _ I力知：直形成與該導熱管連接 =數個散熱m其中該風扇轉軸方向係平行於 遠硬數個散熱鰭片；及—蓋體，用以與該 :;蓋屬，該蓋體底部具有複數個通風孔正； 凹座之風扇處，以及具有複數個通風孔位於， 现體側面，對著該複數個散熱韓片，葬… 係在該蓋體與該凹座形成之空間二’：風扇 【實施方式】 "成工氧流動。 以下將配合圖示以文字 〜、 實施例，其中於圖示及詳細說明：明本創作之較佳 以清楚說明本發明方法及其壯 會附加參考標號 相同的組件或是功能相：：置’因此在本文中， 號表示。 、、、且件會以相同的參考標 請同時參閱第3Α圖以 軍工規筆記型電腦1 9之〜 圖，係為本創作 腦19包含有-主機殼趙：佳實施例。該筆記型電 21及—液晶板23,該主機 M295883 殼體21有一上殼體25及一下殼體，並利用該上 殼體25與該下殼體27接合後於該主機殼體21内形 成一上獨立容置空間，該上獨立容置空間中容置有 主機板2 9，主機板2 9上含有一發熱元件31 (例如 為中央處理器），發熱元件31上有一導熱塊33藉導 熱墊35貼附於下殼體27上，且有一導熱管39分別 參與複數個散熱鰭片47以及導熱墊35連接，該下殼 體27係設計為具有一凹座43，該凹座43中設有一 風扇45以及複數個散熱鰭片47，又另有一蓋體， 與該凹座43接合時，與該凹座43形成一下獨立容 置空間51’並與下殼體27形成為一完整形體，以構 成美麗的外觀，且該蓋體49底部相對於該風扇處有 複數個通風孔53,以及該蓋體側面也係具有複數個 _ 用以氣流流通之通風孔5 5。 该發熱兀件31之一面係設置於電路板29上， 而4發熱凡件31之另一面係藉導熱塊33以及導熱 墊35設置於下殼體27的内部表面上，為方便說明 本創作，在本實施例係當作中央處理器，但在實際 運用本創作時，該發熱元件係可為其它類似中央^ 理器的發熱晶片。 導熱管39可由導熱性佳的材料所組成，如銅、 12 M295883 之内侧表面設置， 熱傳導至其連接的 用 散 銘或其合金’其延著該下殼體 以將導熱塊3 3、導熱墊3 5上的 熱鰭片47上。 複數個散熱鰭片47由導埶性佳的 …任1土的材料所組成， 如銅、铭或其合金，以垂直上驽 土且上a又體25、下殼體27的 方向設置於下殼體25上，並突出於凹部‘3中，鰭 片47與導熱f 39之間的接觸以及其 : 以導熱膠加以黏結。 該凹座43可對應於該發熱元件Μ所在的位 置，其上靠近下殼體27表面係設有—風扇45，以及 突出的複數個散熱鰭片47,該風扇45 體^置，並經該下殼體27 一設計之穿孔、（圖= 不）與電腦内部電性連接，該風扇45用以將縱向導 鲁入之氣流朝複數個散熱鰭片47所在的方向橫向吹 出。 ϋ玄蓋體4 9係設計與該凹座4 3搭配，蓋體4 9上 相對於邊風扇4 5處具有矩陣排列或以任何形式排列 勺第通風孔5 3以與外界流通氣流，並在該風扇4 5 轉5玄複數個散熱鰭片47的串聯方向靠近散熱鰭片的 侧面上具有複數個第二通風孔5 5用以與外界流通氣 流。 13 M295883 藉由上述的凹座43以及與其搭配之蓋體4 可構成-空氣流通的獨立空間51，但該獨 系 係與該下殼體27以及上殼體25所構成之上1 置空間以下殼體27隔開。 在組裝上是形成具有一凹座43之下殻沪 殼體27係由導熱性佳的金屬或金屬合金所：成，，： 凹座43用以容晉句冬涵戶读 、 谷置包3風扇45與散熱鰭片〇， 該導熱塊33置於發熱元件35 卜， 亚使其黏附认 殼體27的内侧表面上，即該凹逢《的背面，:： 有-導熱官39延著該下殼體27内側表面： 背面橫向延伸’該導熱管39之-端與該導熱塾35 連接，而其另一端與該複數個散熱鰭片47連接，立 中：可以導熱膠將複數個鰭片47黏附於導熱管之； 另一端上，並以導熱膠充填該複數個散熱鰭片二 間的空隙，以及散熱鰭片47與導熱管Μ之 六 隙，接著該風扇45會被架設於該下殼p 曰的空 表面上，即該凹座43的底部，且使該侧 該凹座43底部預設之孔洞與該電腦内部電性、、&由 最後會以契合該凹座形狀之具有第一通風孔53，二 二通風孔55之一蓋體49組裝於該凹座43上與第 該蓋體49貞該凹# 43 %成一空氣導熱的以使 卜獨立容 14 M295883 置空間…且使該下殼體η形成為完整之方形體。 藉此，该風扇45自該篦一、s门 "亥弟通風孔53導入氣流，由 第二通風孔5 5導出顧汽可* # ^ 、， 一 # ^ 在该工氣導熱空間造成空 氣流動，以藉以將熱以對流方式導出。 其中組裂之特徵在於，該下殼體27具有之凹座 43以及與之，配之蓋冑49，該凹座‘3與該蓋體b 係構成一空氣導熱的滿办％ Μ 的獨立二間51，該空氣導熱的獨 立空間51係藉由金屬製成的下殼體27，與該上殼體 25以及下殼體27所構成之内空間隔開，並可藉由其 中所谷置的風扇45以及蓋體49上具有之複數個通 風孔？3’55)，達到以空氣對流導熱的效果。 藉由以上所逑之軍工規筆記型電腦之改良結 ’此較佳貫施例之—散熱流程為：該發熱元件所產 ' 係έ蛵由導熱塊與導熱管傳導至突出於凹 部的散熱鰭片，於該空氣導熱的獨立空間中，萨 風扇的方疋轉’氣流會自第一氣孔縱向導入並橫向吹 <主該散熱鰭月，# 使付政熱鰭片上所包含的熱量可很 、猎由動的氣流由第二氣孔散出；而另— 流程為·兮八也 力 放熱 亥發熱元件所產生的熱，係會直接經由導熱 ^ 與導熱塊連接的下金屬殼體以及上全屬Μ辦 以傳導方彳处， 久工孟屬戎體 工放出。因此，該軍工規筆記型電腦藉由 15 M295883 該金屬外殼再加上本創作之散熱結構，更能夠快速 地將熱自主機殼體中散出。 ^再者n氣導熱獨立空間係、藉該下殼體與 該上下殼體所構成之内空間隔開’故雖該线導熱 空間與外界相通，但位於内空間裡的重要電子元件 係不會與外界之水氣以及灰塵接觸，而風扇也係為 防水、防塵之型式，因此藉本創作結構，便可達到 增益散熱效果並同時保有原始防水、防塵功能的目 的。 所述者’僅為本創作其中的較佳實施例而已， 亚非用來限定本創作的實施範圍；即凡依本創作申 :她圍所作的均等變化與修飾，皆為本創作專 利乾圍所涵蓋。 【圖式簡單說明】 :1圖係顯示習知的-般筆記型電腦的剖面示意圖； 弟2圖係顯示習知的軍工規筆記型電腦的剖面示意 圖； ^ 弟3 A圖係顯示本創作里 立 +到作軍工規筆記型電腦的立體示意 圖；及 第3B圖係顯示本創作軍工規筆記型電腦的剖面示意 圖。 16 M295883Formed by a concave cover body located in one of the main body casings, and for the outside, another piece of the political heat fin of the present invention can be accommodated by the plurality of heat sink fins. The film, and by the enthusiasm out of the independent accommodating space and 'the other work of this creation is separated from the upper independent accommodating space casing, under the independent heat conduction, the external moisture and space Affecting the characteristics of the upper and lower housings of the host housing and the air guide to maintain their waterproof and dustproof characteristics, the notebook computer of the present invention is not only the heat generated by the heat generating component but also the conductive body and the cover body. The formed fan air is convectively separated from the outside space and the inside of the fan. In order to achieve the _ seat with the above concept, and the space with the recess is connected to a space of air. It is said that there is a fan and a plurality of vertical accommodation spaces, whereby the fan of the metal casing that conducts heat to the space is convected by air. The idea is that since the lower accommodating space is made up of the space of the lower casing of the main casing and the outside air, the convection dust cannot pass through the electronic components in the lower independent space, so the two-layer structure of the heat permeable space, It can still be pronounced as 0. The army using this creation will use the surrounding metal casing to dissipate the hair style, and it can use the recessed gas to conduct one of the air and a plurality of heat-dissipating fins. Purpose, this creation is a 9 M295883 military gauge notebook computer, which is enclosed in a human body, and is separated from the liquid crystal panel "3" - liquid crystal panel, and - the main body casing; the body contains a complete -, wherein The next independent decision: the lower independent space and the lower independent space: a fan at the top end, a heat sink fin, wherein the other end of the second portion forms a plurality of heat sink fins vertically, and the 'feather The axis direction is parallel to the plurality of air holes. For the bottom of the I accommodating space, there are a plurality of venting spaces, and the plurality of venting holes are located at 8 sides, facing the plural Heat sink fins. , , , , To achieve the above purpose, it is too _ military planning notebook computer board assembly - host ^ r a liquid crystal panel and with the liquid crystal portion has a concave / concave body, which is characterized by: the host housing bottom concave At the bottom of the seat, one end of the bottom of the recess is provided with a fan, and the other end of the middle portal is vertically formed with a plurality of fins, one of which: the direction of the two shafts is parallel to the plurality of fins; and the bottom : 乂 ° 亥 凹 凹 组装 组装 组装 组装 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个The concept of the above achieves the above-mentioned purpose. The present invention has a liquid crystal panel and a main body casing assembled with the liquid crystal panel 10 M295883. The main body housing has an upper casing and a lower casing. And the inside thereof comprises a main board, a heat conducting block and a heat conducting tube, wherein the main board is provided with a heating element, and the heat conducting block is disposed on the heating element and connected to the heat conducting tube, wherein the lower shell The bottom of the body has a recess 'the bottom of the recess The end-end is provided with a fan, and the other end of the bottom of the recess is ruined, _I force knows: directly formed to be connected with the heat pipe; a plurality of heat dissipation m, wherein the fan shaft direction is parallel to the far hard number of heat sink fins And a cover body for: and a cover body having a plurality of ventilation holes at the bottom of the cover body; a fan at the recess, and a plurality of ventilation holes located at the side of the body, facing the plurality of heat dissipation Korean film, burial... The space formed by the cover and the recess is two': fan [embodiment] "Operational oxygen flow. The following will be accompanied by the text ~, the example, which is shown in the figure and the details Description: The preferred embodiment of the present invention is to clearly illustrate the method or functional phase of the method of the present invention and its extensions: the same reference numeral:: Therefore, in this document, the number indicates . , , and the parts will have the same reference Please refer to the 3rd drawing to see the military plan notebook computer 1 9 ~ Figure, this is the creation of the brain 19 contains - the main shell Zhao: good example. The notebook type 21 and the liquid crystal panel 23, the main body M295883 housing 21 has an upper housing 25 and a lower housing, and the upper housing 25 is engaged with the lower housing 27 in the main housing 21 Forming an upper accommodating space, the upper accommodating space accommodating the motherboard 2 9, the motherboard 29 includes a heating element 31 (for example, a central processing unit), and the heating element 31 has a heat conducting block 33 The heat-dissipating pad 35 is attached to the lower casing 27, and a heat-conducting pipe 39 is respectively connected to the plurality of heat-dissipating fins 47 and the heat-dissipating pad 35. The lower casing 27 is designed to have a recess 43 in the recess 43. A fan 45 and a plurality of heat dissipating fins 47 are provided, and another cover body is formed. When the recess 43 is engaged, the recess 43 forms a separate accommodating space 51 ′ and forms a complete shape with the lower casing 27 . In order to form a beautiful appearance, the bottom of the cover body 49 has a plurality of ventilation holes 53 at the bottom of the fan, and the side of the cover body also has a plurality of ventilation holes 55 for airflow. One surface of the heat generating element 31 is disposed on the circuit board 29, and the other side of the heat generating element 31 is disposed on the inner surface of the lower case 27 by the heat conducting block 33 and the heat conducting pad 35. In this embodiment, it is regarded as a central processing unit, but in actual use of the present invention, the heating element may be other heat generating chips similar to the central processing unit. The heat pipe 39 may be composed of a material having good thermal conductivity, such as copper, the inner surface of the 12 M295883, and the heat conduction to the connection thereof, or its alloy, which extends the lower casing to heat the heat block 3 3, the thermal pad 3 5 on the hot fin 47. The plurality of heat dissipating fins 47 are composed of a material having a good guiding property, such as copper, Ming or its alloy, and are disposed vertically in the direction of the upper bauxite and the upper a body 25 and the lower casing 27 On the housing 25, and protruding in the recess '3, the contact between the fin 47 and the heat transfer f 39 and its: bonding with a thermal conductive glue. The recess 43 may correspond to a position where the heat generating component is located, and a fan 45 and a plurality of protruding heat radiating fins 47 are disposed on the surface of the lower casing 27, and the fan 45 is disposed. The lower casing 27 is designed to be perforated (Fig. = No) electrically connected to the interior of the computer. The fan 45 is used to blow the longitudinally directed airflow laterally in the direction in which the plurality of heat dissipation fins 47 are located. The ϋ 盖 4 4 9 4 4 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖The fan is connected to the side of the heat dissipation fins in a series direction of the heat dissipation fins 47 to have a plurality of second ventilation holes 5 5 for circulating airflow with the outside. 13 M295883 The above-mentioned recess 43 and the cover 4 matched therewith can constitute a separate space 51 through which air flows, but the system is formed below the space of the lower casing 27 and the upper casing 25 The housings 27 are spaced apart. In the assembly, it is formed with a recess 43 under the shell of the shell. The shell 27 is made of a metal or metal alloy with good thermal conductivity: into, and: the recess 43 is used to accommodate the sentence of the winter han household reading, the valley package 3 The fan 45 and the heat dissipating fins are disposed on the inner surface of the heat generating component 35 so as to adhere to the inner side surface of the housing 27, that is, the back side of the recess: The inner surface of the lower casing 27: the back surface extends laterally. The end of the heat pipe 39 is connected to the heat conducting cymbal 35, and the other end thereof is connected to the plurality of heat radiating fins 47. The center: the plurality of fins can be thermally conductive. 47 is adhered to the heat pipe; at the other end, the gap between the plurality of heat radiating fins is filled with the heat conductive glue, and the six gaps of the heat radiating fin 47 and the heat conducting tube, and then the fan 45 is erected under the heat sink tube The empty surface of the shell p ,, that is, the bottom of the recess 43 , and the hole at the bottom of the recess 43 on the side is electrically connected to the internal portion of the computer, and is finally matched with the shape of the recess The first venting opening 53 and the cover 49 of the second venting opening 55 are assembled on the recess 43 and the first cover 49 贞 The recess # 43 % is thermally conductive to make the space 14 M295883 space and the lower casing η is formed into a complete square body. Thereby, the fan 45 is introduced into the airflow from the first and second gates ventilating holes 53, and the second venting holes 5 5 are exported to the ventilator* #^,, a #^ to cause air in the heat conduction space of the working gas Flow to derive heat from convection. The splitting is characterized in that the lower casing 27 has a recess 43 and a cover 49, and the recess '3 and the cover b constitute an independent heat of the air. The air-heat-conducting independent space 51 is separated from the inner space formed by the upper casing 25 and the lower casing 27 by a lower casing 27 made of metal, and can be placed therein. The fan 45 and the cover 49 have a plurality of ventilation holes? 3'55), the effect of heat conduction by air convection is achieved. According to the above-mentioned modified version of the military-standard notebook computer, the preferred embodiment is that the heat dissipation process is: the heat-generating component is transferred from the heat-conducting block and the heat-conducting pipe to the heat-dissipating fin protruding from the concave portion. In the independent space of the air heat conduction, the fan's square turn 'airflow will be introduced longitudinally from the first air hole and blown horizontally. The main heat dissipation fin month, #使付热热热片的热能可以可以The flow of the hunting movement is dissipated by the second air hole; and the other process is the heat generated by the heat-emitting element of the heat-receiving element, which is directly connected to the lower metal case and the upper part through the heat conduction block. It belongs to the Department of Conduct, and it is released by the Ministry of Health. Therefore, the military standard notebook computer can quickly dissipate heat from the main unit casing by the 15 M295883 metal casing and the heat dissipation structure of the present invention. ^ Further, the n-gas heat-conducting independent space system is separated from the inner space formed by the lower and lower casings. Therefore, although the heat conduction space of the line communicates with the outside, the important electronic components located in the inner space are not It is in contact with the outside water and dust, and the fan is also waterproof and dustproof. Therefore, with the creation structure, the heat dissipation effect can be achieved while maintaining the original waterproof and dustproof functions. The above is only a preferred embodiment of the present invention, and the Asian and African are used to define the scope of implementation of the present creation; that is, the application of the application: the equal changes and modifications made by her circumference are the creation of the patent. Covered. [Simple diagram of the diagram]: 1 diagram shows a schematic diagram of a conventional notebook computer; Brother 2 shows a schematic diagram of a conventional military-type notebook computer; ^ Brother 3 A shows the creation The stereoscopic schematic diagram of the notebook computer for the worksheet; and the 3B diagram shows the schematic diagram of the notebook computer of the creation military plan. 16 M295883
【圖式符號說明】 1 一般筆記型電腦 3 中央處理器 5 鰭片式的散熱模組 7 散熱風扇 9 軍工規筆記型電腦 11 金屬機殼 13 中央處理器 15 導熱塊 17 導熱墊 19 軍工規筆記型電腦 21 主機殼體 23 液晶板 25 上殼體 27 下殼體 29 主機板 31 發熱元件 33 導熱塊 35 導熱墊 39 導熱管 43 凹座 17 M295883 45 風扇 47 散熱鰭片 49 蓋體 51 下獨立容置空間 53 通風孔 55 通風孔[Illustration of the symbol] 1 General notebook computer 3 CPU 5 Fin-type cooling module 7 Cooling fan 9 Military planning notebook computer 11 Metal case 13 Central processing unit 15 Thermal block 17 Thermal pad 19 Military gauge notes Computer 21 Mainframe 23 Liquid crystal panel 25 Upper housing 27 Lower housing 29 Motherboard 31 Heating element 33 Thermal block 35 Thermal pad 39 Heat pipe 43 Recessed seat 17 M295883 45 Fan 47 Heat sink fin 49 Cover 51 Independent Accommodating space 53 vent 55 vent
1818