CN102023689B - Adjustable heat dissipating module and computer device having same - Google Patents
Adjustable heat dissipating module and computer device having same Download PDFInfo
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- CN102023689B CN102023689B CN 200910170341 CN200910170341A CN102023689B CN 102023689 B CN102023689 B CN 102023689B CN 200910170341 CN200910170341 CN 200910170341 CN 200910170341 A CN200910170341 A CN 200910170341A CN 102023689 B CN102023689 B CN 102023689B
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- heat pipe
- back side
- fixed head
- heating radiator
- heat conduction
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Abstract
The present invention discloses an adjustable heat dissipating module and a computer device having the same. The adjustable heat dissipating module comprises a radiator, a fixed plate and at least one heat pipe. The fixed plate can be locked to a position of the back side of the radiator or unlocked from the position. The heat pipe consists of a heat absorption segment and a radiating segment extending from the heat absorption segment. The radiating segment is provided between the back side of the radiator and the fixed plate. When the fixed plate is locked to the position of the back side ofthe radiator, the radiating segment of the heat pipe is tightly griped between the back side of the radiator and the fixed plate. In addition, when the fixed plate is unlocked from the position, the radiating segment of the heat pipe are allowed to be adjusted to a proper position.
Description
Technical field
The present invention relates to the technical field of radiating module, refer to a kind of adjustable radiating module especially and have the computer installation of this radiating module, wherein this adjustable radiating module can be useful on the motherboard that is installed in different size by the position of adjusting its heat pipe.
Background technology
The cpu heat of traditional computer is to cooperate the motherboard of each producer's different size and design mostly, therefore this heating radiator often is limited on the motherboard that only can be configured in specific model or is configured in ad-hoc location on the motherboard, for example: by 4 blocks that predetermined perforation is defined on the motherboard.The user also may face the awkward situation that can't be assembled on the motherboard if bought the heating radiator of off-gauge.
For reaching compatible purpose at the different size motherboard, M298167 number novel patent of TaiWan, China discloses a kind of adjustable fixer for heat radiator, and it comprises that one has heating radiator and a fixing structure of base.This patent case mainly is to cooperatively interact and adjust by one first adjustment unit of this fixing structure and one second adjustment unit, makes the applicable motherboard at different size of heating radiator.
Though above-mentioned patent case can reach the purpose that elasticity is adjusted, only structure amplitude quite complicated and that adjust is limited.Especially the two ends of each heat pipe of its heating radiator be limited in the locating slot of this base respectively and perforation that the radiating fin group of this heating radiator defines on, can't do adjustment by a relatively large margin.
Summary of the invention
The invention provides a kind of adjustable radiating module that is useful in the different size motherboard, be used for remedying the traditional heat-dissipating device be limited in specification and lack can the elasticity assembling shortcoming.
Know clearly it, adjustable radiating module of the present invention comprises a heating radiator, a fixed head and at least one heat pipe.This fixed head can be locked in this heating radiator the back side a position or by loose from this position.This heat pipe has an endotherm section and extends a radiating segment from this endotherm section.This radiating segment is located between the back side and this fixed head of this heating radiator.Wherein, when this fixed head was locked in this position at this heating radiator back side, the radiating segment of this heat pipe was clamped between the back side and this fixed head of this heating radiator; And when this fixed head by pine during from this position, the radiating segment of this heat pipe is allowed to be adjusted to an appropriate location.Because the radiating segment of this heat pipe is allowed to do the adjustment of position, so visual demand and be arranged on the nonspecific position of motherboard.
Preferably, this adjustable radiating module more comprises a heat conduction paster (thermal pad), for example a silica gel heat conduction paster.Moreover the endotherm section of this heat pipe is to be flat.So, can be bonded together through endotherm section and the thermal source of this heat conduction paster with this heat pipe, effectively the heat energy of thermal source be exported to the endotherm section of this heat pipe.
On the other hand, the present invention also discloses the computer installation with above-mentioned adjustable radiating module simultaneously.Except this adjustable radiating module, this computer installation more comprises a motherboard.As previously mentioned, the heat pipe adjustable position of this adjustable radiating module and by the heat conduction paster the nonspecific position at the glutinous back side to this motherboard, use being useful in the different size motherboard.
Preferably, this computer installation more comprises a shell and another heat conduction paster.This another heat conduction paster is used for cohering endotherm section and this shell of this heat pipe, makes that the combination of the motherboard of this computer installation and heat pipe is more firm.If this shell is metal system, then this computer installation can utilize its metal shell to dispel the heat, and more helps the lifting radiating effect.
As for other summary of the invention of the present invention and more detailed technology and effect explanation, with the explanation that discloses subsequently.
Description of drawings
Fig. 1 is the three-dimensional exploded view of first preferred embodiment of the adjustable radiating module of the present invention.
Fig. 2 is that this first preferred embodiment is combined in the sectional view on the motherboard.
Fig. 3 is that this first preferred embodiment is combined in the combination appearance figure on the motherboard.
Fig. 4 is that the heat pipe that shows this Fig. 3 is adjusted to the another location.
Fig. 5 is that the adjustable radiating module that shows this Fig. 3 is adjusted to other direction.
Fig. 6, the sectional view of another preferred embodiment of the adjustable radiating module of demonstration the present invention.
Embodiment
Fig. 1 to Fig. 5 is first preferred embodiment that shows adjustable radiating module of the present invention, points out that wherein this adjustable radiating module comprises a heating radiator 1, a fixed head 2, two heat pipes 3 (heat pipe) and two heat conduction pasters 4 (thermalpad).
Consult Fig. 1, the radiating fin group that this heating radiator 1 is made up of plurality of radiating fins.This fixed head 2 is can be by plural locked assembly 5, screw for example, and be locked in this heating radiator the back side a position or by loose from this position.Each heat pipe 3 has an endotherm section 31 and extends a radiating segment 32 from this endotherm section 31.As shown in the figure, this endotherm section 31 is to be flat.This radiating segment 32 is located between the back side and this fixed head 2 of this heating radiator 1.This fixed head 2 supplies the radiating segment 32 of this heat pipe 3 optionally to arrange in the face of the one side of this heating radiator 1 is to define the detent 20 that plural number is arranged in parallel.So, when this fixed head 2 was locked in this position at this heating radiator 1 back side, the radiating segment 32 of this heat pipe 3 was clamped between the back side and this fixed head 2 of this heating radiator 1, as shown in Figure 3; And when this fixed head 2 by loose during from this position, the radiating segment 32 of this heat pipe 3 is allowed to be adjusted to an appropriate location.After being adjusted to this appropriate location, the radiating segment 32 of this heat pipe 3 is fixed on the back side of this heating radiator 1 again seeing through this fixed head 2 of locking, as shown in Figure 4.
Fig. 2 shows that this adjustable radiating module is applied in the synoptic diagram of a motherboard 6.The radiating segment 32 of this heat pipe 3 is clamped between the back side and this fixed head 2 of this heating radiator 1.The end face of the endotherm section 31 of this heat pipe 3 and the bottom surface of this heat conduction paster 4 are pasted, and the bottom surface that the end face of this heat conduction paster 4 sticks at this motherboard 6 (or claims: the back side).Carry a chip 7 to be dispelled the heat on this motherboard 6.In the present embodiment, this heat conduction paster 4 is silica gel heat conduction pasters.This silica gel heat conduction paster has excellent heat conductivity and processability, and it is soft and all can fit closely in the mechanism of various smooth or convex-concave surfaces from glutinous characteristic, effectively the heat energy on the motherboard 6 is exported to the endotherm section 31 of this heat pipe 3.
As shown in Figure 3, this heating radiator 1 is the outside at an edge of this motherboard 6 of vertically standing upright by those heat pipes 3.Owing to two radiating segments 32 of this two heat pipe 3 can be adjusted to different positions by lax this fixed head 2, as shown in Figure 4, so relatively allow to adjust distance between this two heat pipe 3.So, those heat pipes 3 can be done suitable adjustment according to motherboard 6 heat radiation positions differences, thereby are useful in the motherboard of different size.
What deserves to be mentioned is, because the back side of general motherboard is formed with the assembly pin (not shown) of many energising projectioies usually, be unfavorable for the configuration of heat pipe, so the bright rare back side person who heat pipe is located at motherboard in the known technology.On the contrary, because the position of heat pipe of the present invention can be done suitably and be adjusted, so when assembling, as long as the endotherm section 31 of shilling this two heat pipe 3 is flexibly avoided those assembly pin, again the radiating segment 32 of this two heat pipe 3 is arranged on accordingly wherein two detents 20 of this fixed head 2, just can be laid on the back side of this motherboard 6 dexterously.Therefore, the present invention reaches and takes full advantage of the effectiveness that heat radiation is done at the motherboard back side.Yet what must state is, though the present invention can take full advantage of the effectiveness that heat radiation is done at the motherboard back side, does not limit at this, and those heat pipes and heat conduction paster also can be laid on the front of motherboard and not influence its adjustable speciality.
In addition, be the trend of the hot-fluid of coupled computer inner space, these two heat pipes, 3 variable orientation of the present invention make this heating radiator 1 be located at the outside of another vertical edge of motherboard 6, as shown in Figure 5, use in response to environment and improve radiating effect.
Seeing also the 6th Fig. 6, is to be another preferred embodiment of the present invention.As shown in the figure, the each several part of this preferred embodiment is formed described identical with Fig. 1 to Fig. 5 substantially, and be the back side that those heat pipes 3 and heat conduction paster 4 is located at motherboard 6 equally, only in this preferred embodiment, below the endotherm section 31 of each heat pipe 3, increase another heat conduction paster 4a.Because radiator structure of the present invention is the back side that is configured in this motherboard, therefore be able to by this another heat conduction paster 4a the endotherm section 31 of this heat pipe 3 and a shell 9 of this computer installation are bonded together.That is to say that the end face of this another heat conduction paster 4a is the bottom surface that sticks at the endotherm section 31 of this heat pipe 3, and the bottom surface of this another heat conduction paster 4a sticks the inwall at this shell 9.So, this motherboard 6 can firmly be fixed on this shell 9.More particularly, because the shell 9 of computer installation metal system normally, so the heat that this another heat conduction paster 4a comes out from these endotherm section 31 conduction more can derive by this metal shell 9, help the lifting radiating effect.Therefore, present embodiment more in conjunction with the superior thermal conductivity of metal shell, is given full play to its radiating effect, and this is to show rare person in the known technology.Be described in detail in as for other structure of this preferred embodiment and function among the embodiment of Fig. 1～shown in Figure 5, therefore repeated no more.
From above-mentioned explanation, the adjustable radiating module that is appreciated that computer installation of the present invention can cooperate the group of walking always of the heat radiation position of motherboard or hot-fluid to establish, and can be useful in the motherboard of different size, and can organize the back side that is located at this motherboard easily, give full play to the function at this motherboard back side.Especially the present invention gives full play to the characteristic of metal shell heat conduction, gives its extra heat sinking function.
In any case anyone can obtain enough instructions from the explanation of above-mentioned example, and according to and understand content of the present invention and be different from prior art really, and have the practicality on the industry, and sufficient creative.Be that the present invention has really met patent requirement, now file an application in accordance with the law.
Claims (6)
1. adjustable radiating module is characterized in that comprising:
One heating radiator;
One fixed head, can be locked in described heating radiator the back side a position or by the pine from described position; And
At least one heat pipe has an endotherm section and extension from a radiating segment of described endotherm section, and described radiating segment is located between the back side and described fixed head of described heating radiator;
Wherein, when described fixed head was locked in the described position at the described heating radiator back side, the radiating segment of described heat pipe was clamped between the back side and described fixed head of described heating radiator; And when described fixed head by pine during from described position, the radiating segment of described heat pipe is allowed to be adjusted to an appropriate location;
Wherein, described fixed head supplies the radiating segment of described heat pipe optionally to arrange in the face of the one side of described heating radiator is to define the detent that plural number is arranged in parallel.
2. according to the described adjustable radiating module of claim 1, it is characterized in that more comprising a heat conduction paster (thermal pad), and the endotherm section of described heat pipe is to be flat, the bottom surface of described heat conduction paster is the end face that sticks at described endotherm section, and the end face of described heat conduction paster is for sticking at a thermal source.
3. according to the described adjustable radiating module of claim 2, it is characterized in that more comprising another heat conduction paster, its end face is the bottom surface that sticks at described endotherm section, and the bottom surface of described another heat conduction paster is for the inwall that sticks at a shell.
4. a computer installation is characterized in that comprising a motherboard and an adjustable radiating module, and described adjustable radiating module comprises:
One heating radiator;
One fixed head, can be locked in described heating radiator the back side a position or by the pine from described position;
At least one heat pipe has an endotherm section and extension from a radiating segment of described endotherm section, and described radiating segment is located between the back side and described fixed head of described heating radiator; And
One heat conduction paster (thermal pad), its bottom surface is the end face that sticks at the endotherm section of described heat pipe, and the end face of described heat conduction paster is the back side that sticks at described motherboard;
Wherein, when described fixed head was locked in the described position at the described heating radiator back side, the radiating segment of described heat pipe was clamped between the back side and described fixed head of described heating radiator; And when described fixed head by pine during from described position, the radiating segment of described heat pipe is allowed to be adjusted to an appropriate location;
Wherein, described fixed head supplies the radiating segment of described heat pipe optionally to arrange in the face of the one side of described heating radiator is to define the detent that plural number is arranged in parallel.
5. according to the described computer installation of claim 4, the endotherm section that it is characterized in that described heat pipe is to be flat.
6. according to the described computer installation of claim 5, it is characterized in that more comprising a shell and another heat conduction paster, the end face of described another heat conduction paster is the bottom surface that sticks at the endotherm section of described heat pipe, and the bottom surface of described another heat conduction paster is an inwall that sticks at described shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910170341 CN102023689B (en) | 2009-09-11 | 2009-09-11 | Adjustable heat dissipating module and computer device having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910170341 CN102023689B (en) | 2009-09-11 | 2009-09-11 | Adjustable heat dissipating module and computer device having same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102023689A CN102023689A (en) | 2011-04-20 |
| CN102023689B true CN102023689B (en) | 2013-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910170341 Expired - Fee Related CN102023689B (en) | 2009-09-11 | 2009-09-11 | Adjustable heat dissipating module and computer device having same |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9535470B2 (en) | 2014-07-02 | 2017-01-03 | Asia Vital Components Co., Ltd. | Electronic substrate with heat dissipation structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017387A (en) * | 2006-02-10 | 2007-08-15 | 台湾精星科技股份有限公司 | Heat dissipating device |
| CN201115256Y (en) * | 2007-06-15 | 2008-09-10 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
-
2009
- 2009-09-11 CN CN 200910170341 patent/CN102023689B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017387A (en) * | 2006-02-10 | 2007-08-15 | 台湾精星科技股份有限公司 | Heat dissipating device |
| CN201115256Y (en) * | 2007-06-15 | 2008-09-10 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
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| Publication number | Publication date |
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| CN102023689A (en) | 2011-04-20 |
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