M308850 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種電路板鑽孔用之熱壓樹脂板，尤指 一種具有降低鑽針磨損率及板材可回收再利用之功效設 計者。 【先前技術】 目前印刷電路板（PCB)的製程中，其在基板上必須配合 預定電路板設計而鑽設數個貫穿孔，而在鑽孔的作業中，為 了防止加工台面的損傷及鑽頭的磨損，因此會在基板底部放 置一底墊板作為保護。 另一方面，由於在鑽孔時容易造成的鑽孔邊緣產生毛邊 及切削，因此該底墊板的材質必須具有降低該鑽孔時所產生 的毛邊、切削，而達到其品質及後續之處理流程之便利性。 因此，目前已知的電路板鑽孔用之底墊板則是採用纖維 板所製成，其該纖維板的表面或底面分別塗覆有陶瓷釉藥原 料或UV陶瓷漆等增加其硬度強化層的構成，另一種則是採 用電木板，雖然以上兩者底墊板皆可達到對基板或鑽頭甚至 機台的保護，但仍是有些缺失是需要改進加強的。 如纖維板來說，它的密度有低、中、高之板材分別，其優 點在於它並無公害問題之產生，但仍有缺失是因表層的硬度 有限，所以在鑽孔時，比較容易對於基板在鑽孔後產生毛邊 及切肖彳，對於電路板的品質亦造成下降，且於後續的作業也 會添加些許不便；再者，若該纖維板採用密度較高之板材製 作，其製程較顯繁瑣，生產效率降低，因此容易造成成本過高 -5- M308850 的情況發生。 再者，如電木板來說，其所屬一較昂貴之板材，其優點在 於因為該電木板之硬度較高，因此在定位鑽孔時，可承受較 高的鑽孔壓力以達到容易鑽設的效果，但其缺失是，因為該 電木板屬於硬度較高的板材，對於鑽頭比較容易造成損傷， 且該電木板的成本較高，對於該底墊板係屬消耗材來說，這 樣的成本實在會是一筆可觀的開銷，另外，加上電木板使用 過後必須以廢料處理時，使用掩埋法處理並不會造成分解; 而使用燃燒法會產生有毒氣體的情況，因此使用電木板的情 況下，容易有環保廢料處理的問題產生。 綜上所述，雖然習知的底墊板材質有其一定的功能及優 點，但仍有幾點缺失是需要深慮改進的： 一、 板材硬度及材質使用。 二、 環保廢料處理之問題。 三、 經濟成本過高之評估。 緣此，本創作人有鑑於上述習知技術之缺失，在構想上 以能加長鑽頭鑽針的使用壽命，以及降低鑽孔所產生的毛邊 切削來提高品質，希望能藉此以達到降低鑽針磨損且又符合 經濟效益及環保再回收利用之特性。 【新型内容】 緣是，本創作之主要目的，係在提供一種電路板鑽孔用 之熱壓樹脂板，其具有降低鑽針磨損之功效增進者。 本創作之另一目的，係在提供一種電路板鑽孔用之熱壓 樹脂板，其具有板材可回收再利用之特性者。M308850 VIII. New description: [New technical field] This is a hot-pressed resin board for drilling circuit boards, especially one that has the effect of reducing the wear rate of the drill and recycling the board. [Prior Art] At present, in the manufacturing process of a printed circuit board (PCB), a plurality of through holes must be drilled on a substrate in accordance with a predetermined circuit board design, and in the operation of drilling, in order to prevent damage of the processing table and the drill bit Wear, so a bottom pad is placed on the bottom of the substrate for protection. On the other hand, due to the burrs and cutting of the drilled edges which are easily caused during drilling, the material of the bottom plate must have the burrs and cuttings generated during the drilling to achieve the quality and subsequent processing. Convenience. Therefore, the currently known bottom plate for drilling a circuit board is made of a fiberboard, and the surface or the bottom surface of the fiberboard is coated with a ceramic glaze material or a UV ceramic varnish to increase the hardness of the layer. The other is the use of bakelite. Although both of the bottom plates can protect the substrate or the drill bit or even the machine, there are still some defects that need to be improved. For fiberboard, its density is low, medium and high. The advantage is that it has no pollution problems, but there are still missing because the hardness of the surface is limited, so it is easier to drill the substrate. After the drilling, the burrs and the cut edges are generated, which also causes a decrease in the quality of the circuit board, and adds some inconvenience to the subsequent operations. Moreover, if the fiberboard is made of a plate having a higher density, the process is more complicated. The production efficiency is reduced, so it is easy to cause the cost to be too high -5-M308850. Moreover, if it is a relatively expensive sheet material, the advantage of the electric board is that the hardness of the electric board is high, so that when drilling the hole, it can withstand high drilling pressure to achieve easy drilling. The effect, but the lack thereof is because the bakelite is a harder plate, which is more likely to cause damage to the drill bit, and the cost of the bakelite is higher, and the cost is practical for the bottom plate. It will be a considerable expense. In addition, when the bakelite must be disposed of with waste after use, the use of the buried method will not cause decomposition; and the use of the combustion method will produce toxic gases, so in the case of bakelite, It is easy to have problems with environmental waste disposal. In summary, although the known bottom pad material has certain functions and advantages, there are still some missing points that need to be improved: First, the hardness and material of the board. Second, the issue of environmental waste disposal. Third, the assessment of economic costs is too high. Therefore, in view of the above-mentioned lack of the above-mentioned prior art, the present creator has conceived to improve the service life of the drill bit and reduce the burr cutting generated by the drilling to improve the quality, and hope to reduce the bur. Wear and economical and environmentally friendly recycling characteristics. [New content] The main purpose of this creation is to provide a hot-pressed resin sheet for drilling a circuit board, which has an improved effect of reducing the wear of the drill. Another object of the present invention is to provide a hot-pressed resin sheet for drilling a circuit board, which has the characteristics that the sheet can be recycled and reused.
-6- M308850 本創作之再一目的，係在提供一種電路板鑽孔用之熱壓 樹脂板，其具有符合經濟效益之特性者。 為達上述功效，本創作之技術手段包含： 一基材，係以適用於印刷電路板鑽孔墊底用之板材所構 成；以及 一熱固性樹脂構成，係由酚酚樹脂及三聚氰胺樹脂其一 為主材料，經熱壓與該基材緊密結合，藉以形成具硬度及光 滑度之樹脂板構造。 【實施方式】 首先，請參閱第一、二圖所示，其係藉由一基材（10)、_ 貼紙（20)以及一熱固性樹脂構成（30)所結合而成一熱壓樹 脂板（40)。 該基材（10)係以適用於印刷電路板鑽孔墊底用之板材 所構成，且該基材（10)係包括選自密集板及纖維板其中任_ 所構成，但不限定於此，其它適用板材亦可。 另，該貼紙（20)係設於該熱固性樹脂構成（30)及該基材 (10)之間，且該貼紙（20)材質之密度係大於該基材（1〇)材質 之密度，如此一來才能緊密貼合於該基材（1〇)上，進而於鑽孔 時，板材不易產生毛邊及切削。 又，該熱固性樹脂構成（30)係由酚醛樹脂（phen〇1 resin，PF)及三聚氰胺樹脂（Melamine resin，MF)其一為主材 料，該酚酴樹脂（PF)係具有電氣絕緣性、耐熱、耐酸性強等 特性；而三聚氰胺樹脂（MF)則具有耐熱強、耐水性佳及硬度 大等特性，因此，該熱固性樹脂構成（30)運用在該熱壓樹脂板 (40)上，係可達到降低對電路板於鑽孔時所會產生的損壞及 M308850 磨損等現象。 進一步，請再參閱第三、四圖所示，係為本創作第二可行 實施例，其相同於第一實施例者以相同圖號表示，其差異性 在於本實施中沒有貼紙（20)，此對於基材（10)密度較高者，可 直接將該熱固性樹脂構成（30)係與基材（10)熱壓成型，進而 構成一熱壓樹脂板(40)，其與第一實施例具有相同之功效。 _ 再者，請參閱第五圖所示，係為本創作第三實施例，該熱 ' 固性樹脂構成（30)係由酚酚樹脂（PF)及三聚氰胺樹脂（MF) 其一為主材料，經加入該基材（10)後，整體熱壓成型，藉此，亦 ® 可使基材（10)形成具硬度及光滑度之表層（31)構造，且整體 熱壓成型更加提升熱壓樹脂板(40)之強度及使用壽命。 本創作使用的熱固性樹脂構成（30)，以上述之方式構成 其熱壓樹脂板（40),其在製作成本上不僅降低許多，且在電路 板鑽孔時，比較不會有毛邊及切削的狀況發生，對於電路板 的品質上提高了許多，且對於後續作業的人也不會因為電路 板鑽孔時所產生的毛邊及切削造成其極大困擾，在本創作確 實可以克服這項缺失 • 又，對於電路板鑽孔用之鑽頭鑽針的磨損率，相對的也 降低了不少，不會再因為躜頭鑽針的損壞需經常更換，而無 意間造成浪費。 另外，該熱固性樹脂構成（30)之材料，不僅硬度佳耐磨性 好且不易造成表面之受損，加上該材料無毒又安全，對於環 境廢料處理亦不會造成困擾，另一方面，由於使用在電路板 下鑽孔用之基材（10)係為耗材，因此本創作基於考量到經濟 成本上的問題，故創作之熱壓樹脂板（4 0)是具有可回收再利 M308850 用之特性，藉此以達到符合經濟效益之功效設計。 藉此，本創作人藉助上揭之技術手段，欲改善其習用技 術不足之處，希望能達到其功效之展現。 絲上所述，本創作所揭示之構造，為昔所無，且確能達到 預期之功效，並具可供產業利用性，完全符合新型專利要件， 祈請貴審查委員核賜專利，以勵創新，無任德感。 惟，上述所揭露之圖式、說明，僅為本創作之較佳實施例 大凡熟悉此項技藝人士，依本案精神料所作之修 ’ 變化，仍應包括在本案申請專利範圍内。 / f双-6- M308850 A further objective of the present invention is to provide a hot-pressed resin sheet for drilling a circuit board which has economical characteristics. In order to achieve the above effects, the technical means of the creation include: a substrate, which is composed of a plate suitable for drilling a bottom of a printed circuit board; and a thermosetting resin composed of a phenolic phenol resin and a melamine resin. The material is tightly bonded to the substrate by hot pressing to form a resin sheet structure having hardness and smoothness. [Embodiment] First, please refer to the first and second figures, which are combined by a substrate (10), a sticker (20) and a thermosetting resin (30) to form a hot-pressed resin plate (40). ). The substrate (10) is composed of a plate material suitable for a bottom of a printed circuit board, and the substrate (10) is composed of a dense plate and a fiber plate, but is not limited thereto. Applicable to plates. In addition, the sticker (20) is disposed between the thermosetting resin (30) and the substrate (10), and the density of the sticker (20) is greater than the density of the substrate (1). In order to be closely attached to the substrate (1〇), the sheet is less likely to be burred and cut during drilling. Further, the thermosetting resin (30) is mainly composed of a phenol resin (PF) and a melamine resin (MF), which is electrically insulating and heat resistant. The melamine resin (MF) has the characteristics of high heat resistance, good water resistance and high hardness. Therefore, the thermosetting resin composition (30) is applied to the hot-pressed resin sheet (40). Reduce the damage caused to the board when drilling holes and the wear of the M308850. Further, please refer to the third and fourth figures, which is the second feasible embodiment of the present invention, which is the same as the first embodiment, and the difference is that there is no sticker (20) in the present embodiment. For the higher density of the substrate (10), the thermosetting resin composition (30) and the substrate (10) may be directly thermoformed to form a hot-pressed resin sheet (40), which is the same as the first embodiment. Have the same effect. _ Further, please refer to the fifth embodiment, which is a third embodiment of the present invention. The thermal 'solid resin composition (30) is mainly composed of a phenolic phenol resin (PF) and a melamine resin (MF). After the substrate (10) is added, the whole body is hot-pressed, whereby the substrate (10) can be formed into a surface layer (31) having hardness and smoothness, and the overall hot press forming is more suitable for hot pressing. The strength and service life of the resin board (40). The thermosetting resin used in the present invention is composed of (30), and the hot-pressed resin sheet (40) is formed in the above manner, which is not only reduced in manufacturing cost, but also has no burrs and cutting when drilling a circuit board. When the situation occurs, the quality of the board is much improved, and the people who follow the work will not be greatly troubled by the burrs and cuttings generated when the board is drilled. This creation can indeed overcome this deficiency. The wear rate of the drill bit for the drilling of the circuit board is relatively reduced, and it will not be replaced frequently because of the damage of the drill bit, and the waste is inadvertently caused. In addition, the thermosetting resin constitutes the material of (30), which not only has good hardness and good wear resistance, but also is not easy to cause damage to the surface, and the material is non-toxic and safe, and does not cause trouble for environmental waste disposal, on the other hand, The substrate (10) used for drilling under the circuit board is a consumable material. Therefore, this creation is based on the consideration of economic cost, so the created hot-pressed resin sheet (40) is recyclable and used for M308850. Features to achieve cost-effective design. In this way, the creator relies on the technical means of the above, and wants to improve the inadequacy of his conventional technology, hoping to achieve its efficacy. As stated on the silk, the structure revealed by this creation is unprecedented, and it can achieve the expected effect, and it can be used for industrial utilization. It fully complies with the new patent requirements, and asks your review committee to grant a patent to encourage Innovation, no sense of morality. However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Those who are familiar with the art, the changes made in accordance with the spirit of the case should still be included in the scope of the patent application. / f double
M308850 【圖式簡單說明】 第一圖係本創作第一實施例之組合及部分剖視圖。 第一圖係本創作第一實施例之局部放大示意圖。 第二圖係本創作第二實施例之組合及部分剖視圖。 第四圖係本創作第二實施例之局部放大示意圖。 第五圖係本創作第三實施例之局部放大示意圖。 【主要元件符號說明】 (10)基材 (20)貼紙 (30) 熱固性樹脂構成 (31) 表層 (40)熱壓樹脂板M308850 [Simple Description of the Drawings] The first drawing is a combination and a partial cross-sectional view of the first embodiment of the present creation. The first figure is a partially enlarged schematic view of the first embodiment of the present creation. The second drawing is a combination and a partial cross-sectional view of the second embodiment of the present creation. The fourth figure is a partially enlarged schematic view of the second embodiment of the present creation. The fifth drawing is a partially enlarged schematic view of the third embodiment of the present creation. [Main component symbol description] (10) Substrate (20) sticker (30) Thermosetting resin composition (31) Surface layer (40) Hot-pressed resin sheet