JP2003094217A - Fitting plate for drilling and its manufacturing method - Google Patents

Fitting plate for drilling and its manufacturing method

Info

Publication number
JP2003094217A
JP2003094217A JP2001294289A JP2001294289A JP2003094217A JP 2003094217 A JP2003094217 A JP 2003094217A JP 2001294289 A JP2001294289 A JP 2001294289A JP 2001294289 A JP2001294289 A JP 2001294289A JP 2003094217 A JP2003094217 A JP 2003094217A
Authority
JP
Japan
Prior art keywords
plate
water
soluble polymer
aluminum foil
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001294289A
Other languages
Japanese (ja)
Inventor
Wakana Aizawa
和佳奈 相澤
Masahiko Umigami
雅彦 海上
Kenji Hyodo
建二 兵頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Priority to JP2001294289A priority Critical patent/JP2003094217A/en
Publication of JP2003094217A publication Critical patent/JP2003094217A/en
Pending legal-status Critical Current

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  • Drilling And Boring (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a fitting plate for drilling and the manufacturing method, which reduce a friction generated between a drill and a plate work such as a printing board, radiate the generated friction heat immediately and reduce pollution on the products and manufacturing environment. SOLUTION: The fitting plate for drilling is constituted by putting laminated paper made of pulp between aluminum foil layers through water-soluble polymer layers, and the manufacturing method for the fitting plate for drilling is constituted by laminating water-soluble polymer sheet and aluminum foil layers in the order on both the surfaces of the laminated paper made of pulp and by bonding them with the heat-bonding technique.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、両面もしくは多層
プリント配線板用の張積層板や治工具に用いる積層板、
プラスチック板等の被加工板に孔開け加工をするときに
用いる孔開け加工用当て板およびその製造方法に関す
る。特に、被加工板等の下面に配する下当て板として優
位に用いることができる孔開け加工用当て板およびその
製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated laminate for double-sided or multilayer printed wiring boards and a laminate for use in jigs and tools,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a perforating plate used when perforating a plate to be processed such as a plastic plate, and a manufacturing method thereof. In particular, it relates to a punching plate which can be used as a lower plate placed on the lower surface of a plate to be processed, and a manufacturing method thereof.

【0002】[0002]

【従来の技術】両面もしくは多層プリント配線板用の銅
張積層板や治工具に用いる積層板、プラスチック板等の
被加工板に、スルーホール等の貫通孔を穿設する場合、
貫通孔の縁にバリが生じたり、穿設ドリルの高速回転に
よる摩擦熱で被加工板の一部を構成する樹脂が軟化し
て、孔を塞ぐという問題が発生している。また、スルー
ホール等の貫通孔の壁面が、穿設ドリルとの摩擦や、軟
化した樹脂や金属片といった切り屑によって、粗面化さ
れてしまうという問題も発生している。
2. Description of the Related Art When a through hole such as a through hole is formed in a work piece such as a copper clad laminate for double-sided or multilayer printed wiring boards, a laminate used for jigs and tools, a plastic plate, etc.
There is a problem that a burr is generated at the edge of the through hole or the resin constituting a part of the plate to be processed is softened by frictional heat generated by high speed rotation of the drill and the hole is closed. There is also a problem that the wall surface of a through hole such as a through hole is roughened due to friction with a drill and a chip such as softened resin or metal piece.

【0003】バリや摩擦熱による問題を防ぐために、一
般にこの被加工板の上下に当て板を配して、孔開け加工
を実施している。被加工板の上面に配する上当て板とし
ては、例えばアルミニウム箔を使用することができる。
このアルミニウム箔は、その良好な放熱性によって摩擦
熱を放散させ、樹脂の軟化を防ぐことができる。
In order to prevent problems due to burrs and frictional heat, generally, a backing plate is arranged above and below this plate to be perforated. An aluminum foil, for example, can be used as the upper cover plate arranged on the upper surface of the plate to be processed.
This aluminum foil can dissipate frictional heat and prevent resin softening due to its excellent heat dissipation.

【0004】被加工板の下面に配する下当て板として
は、フェノール積層板、紙エポキシ樹脂板、ファイバー
ボード等が使用されているが、これらの材料は熱伝導性
が低いために、摩擦熱を放散させることができない。そ
のため、被加工板の樹脂が軟化して、孔を塞いでしまう
ことがある。このような孔の閉塞を防止するために、特
開平5ー208398号公報には、厚紙にアルミニウム
箔を貼着し、そのアルミニウム箔側が被加工板であるプ
リント配線板の下面に接した状態で孔開け加工を行う方
法が開示されている。しかしながら、このような構成の
当て板では、穿設ドリルとの摩擦によって発生する孔の
壁面における粗面化を抑制することまではできない。
Phenol laminates, paper epoxy resin plates, fiber boards, etc. are used as the lower backing plate to be placed on the lower surface of the plate to be processed. Cannot be dissipated. Therefore, the resin of the plate to be processed may soften and block the holes. In order to prevent such blockage of holes, in JP-A-5-208398, an aluminum foil is attached to a cardboard, and the aluminum foil side is in contact with the lower surface of a printed wiring board which is a work board. A method of making a hole is disclosed. However, with the backing plate having such a configuration, it is not possible to prevent the wall surface of the hole from being roughened due to friction with the drill.

【0005】孔の壁面における粗面化は、穿設時の摩擦
力を低下させることで抑制することができる。例えば、
滑剤である水溶性高分子をアルミニウム箔やプラスチッ
ク板に設けたシートを上あて板として使用する方法が特
許2855818号、同2855819号、同2855
820号、同2855821号、同2855822号、
同2855823号、同2855824号公報等に記載
されている。
The roughening of the wall surface of the hole can be suppressed by reducing the frictional force at the time of drilling. For example,
A method of using a sheet in which a water-soluble polymer that is a lubricant is provided on an aluminum foil or a plastic plate as an upper cover plate is disclosed in Japanese Patent Nos. 2855818, 2855819 and 2855.
No. 820, No. 2858521, No. 2855522,
No. 2,855,823 and No. 2,855,824.

【0006】このような当て板は滑剤が吸水性を有して
いるために、べたついてしまい、長期保存性が低いとい
う問題がある。また、この上当て板を使用して孔開け加
工を実施する場合、滑剤が割れて飛散し、孔の壁面にお
ける粗面化を抑制することができないばかりか、製品や
製造環境を汚染することがあった。
[0006] Such a backing plate has a problem that it becomes sticky and its long-term storability is low because the lubricant has a water absorbing property. In addition, when drilling is performed using this upper backing plate, the lubricant may crack and scatter, and it is not possible to suppress the roughening of the wall surface of the hole, and it may contaminate the product or manufacturing environment. there were.

【0007】[0007]

【発明が解決しようとする課題】本発明は、穿設ドリル
と被加工板との間で生じる摩擦力を低減でき、また発生
した摩擦熱を瞬時に放散できると共に、製品やその製造
環境の汚染を減らすことができる孔開け加工用当て板お
よびその製造方法を提供することにある。特に、被加工
板の下面に配する下当て板として優位に用いることがで
きる孔開け加工用当て板およびその製造方法を提供す
る。
DISCLOSURE OF THE INVENTION The present invention can reduce the frictional force generated between a drill and a plate to be processed, instantaneously dissipate the generated frictional heat, and contaminate the product or its manufacturing environment. It is an object of the present invention to provide a reed plate for punching and a method for manufacturing the same. In particular, the present invention provides a patch plate for punching, which can be used as a lower patch plate disposed on the lower surface of a plate to be processed, and a manufacturing method thereof.

【0008】[0008]

【課題を解決するための手段】本発明者らは上記課題を
解決するために、鋭意検討した結果以下の発明に至っ
た。すなわち、 (1)パルプからなる積層紙を水溶性高分子層を介して
アルミニウム箔層で挟持してなる孔開け加工用当て板。 (2)パルプからなる積層紙の厚みが0.5〜2.0m
mであることを特徴とする上記(1)記載の孔開け加工
用当て板 (3)水溶性高分子層の厚みが2〜150μmであるこ
とを特徴とする上記(1)〜(2)記載の孔開け加工用
当て板 (4)アルミニウム箔層の厚みが5〜500μmである
ことを特徴とする上記(1)〜(3)記載の孔開け加工
用当て板 (5)パルプからなる積層紙の両面に水溶性高分子シー
トおよびアルミニウム箔層を順に積層し、熱圧着するこ
とを特徴とする孔開け加工用当て板の製造方法である。
Means for Solving the Problems The inventors of the present invention have made extensive studies in order to solve the above problems, and as a result, have reached the following inventions. That is, (1) A perforated caul plate in which laminated paper made of pulp is sandwiched between aluminum foil layers with a water-soluble polymer layer interposed therebetween. (2) The thickness of laminated paper made of pulp is 0.5 to 2.0 m.
(3) The perforating pad plate (3) according to the above (1), wherein the water-soluble polymer layer has a thickness of 2 to 150 μm. (4) Perforating patch plate (4) The aluminum foil layer has a thickness of 5 to 500 μm, and the punching patch plate (5) is a laminated paper comprising pulp. A method for producing a patch plate for perforating, which comprises laminating a water-soluble polymer sheet and an aluminum foil layer on both surfaces in order and thermocompressing them.

【0009】本発明の孔開け加工用当て板は、図1に示
したように、パルプからなる積層紙を水溶性高分子層を
介してアルミニウム箔層で挟持してなる。該当て板を用
いて孔開け加工を実施する場合、被加工板の下面とアル
ミニウム箔層とが接するので、穿設ドリルと被加工板と
の間で生じる摩擦熱は瞬時にアルミニウム箔層で放散す
ることができる。
As shown in FIG. 1, the punching patch of the present invention comprises laminated paper made of pulp sandwiched between aluminum foil layers with a water-soluble polymer layer interposed therebetween. When performing perforation processing using the corresponding plate, since the lower surface of the plate to be processed contacts the aluminum foil layer, the friction heat generated between the drill and the plate to be processed is instantly dissipated in the aluminum foil layer. can do.

【0010】また、本発明の孔開け加工用当て板は、穿
設ドリルと被加工板との間で生じる摩擦力を、滑剤とし
て作用する水溶性高分子層によって低減することができ
る。このように、層間に設けられた水溶性高分子層は、
保存時に吸湿しにくく、べたつきの原因とならない。さ
らに、孔開け加工時に割れ等も発生しにくく、仮に発生
したとしても、アルミニウム箔層が存在するので、直接
製品や製造環境を汚染することがない。
Further, in the punching patch plate of the present invention, the frictional force generated between the drill and the plate to be processed can be reduced by the water-soluble polymer layer acting as a lubricant. In this way, the water-soluble polymer layer provided between the layers is
Does not absorb moisture during storage and does not cause stickiness. Further, cracks and the like are less likely to occur at the time of punching, and even if they do occur, the aluminum foil layer is present, so that the product or the manufacturing environment is not directly polluted.

【0011】本発明の孔開け加工用当て板の製造方法で
は、パルプからなる積層紙の両面に水溶性高分子シート
およびアルミニウム箔層を順に積層し、熱圧着すること
により孔開け加工用当て板を製造する。本発明の製造方
法によれば、複層構造の孔開け加工用当て板を容易に製
造することができる。
In the method for manufacturing a punching patch according to the present invention, the punching patch is obtained by sequentially laminating a water-soluble polymer sheet and an aluminum foil layer on both sides of a laminated paper made of pulp and thermocompressing them. To manufacture. According to the manufacturing method of the present invention, it is possible to easily manufacture a punching plate having a multilayer structure.

【0012】[0012]

【発明の実施の形態】以下、本発明を詳説する。本発明
の孔開け加工用当て板およびその製造方法に係わるパル
プからなる積層紙としては、パルプを叩解したスラリー
を用いて湿式抄造により湿紙を形成し、任意の枚数を重
ね合わせて、ホットプレスにより加熱加圧して一体化さ
れたものを用いる。湿紙の積層数を変えることで、任意
の厚さの積層紙とすることができるが、その厚さは0.
5〜2.0mmであることが好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below. As the laminated paper consisting of pulp according to the punching plate and the manufacturing method thereof of the present invention, a wet paper is formed by wet papermaking using a pulp-beaten slurry, and an arbitrary number of sheets are superposed, and hot pressed. The one integrated by heating and pressurizing is used. By changing the number of laminated wet paper sheets, a laminated paper sheet having an arbitrary thickness can be obtained.
It is preferably 5 to 2.0 mm.

【0013】パルプとしては、クラフトパルプを優位に
用いることができる。クラフトパルプとしては、針葉樹
未晒クラフトパルプ、針葉樹晒クラフトパルプ、広葉樹
未晒クラフトパルプ、広葉樹晒クラフトパルプ等を挙げ
ることができる。また、再生パルプを使用しても良い。
Kraft pulp can be used predominantly as the pulp. Examples of the kraft pulp include unbleached softwood kraft pulp, bleached softwood kraft pulp, unbleached hardwood kraft pulp, and bleached hardwood kraft pulp. In addition, recycled pulp may be used.

【0014】本発明の孔開け加工用当て板およびその製
造方法に係わるアルミニウム箔層は5〜500μmであ
ることが好ましい。アルミニウム箔層の厚さが5μm未
満であると、穿設ドリルによる摩擦熱の放散が不十分と
なる。また、アルミニウム箔層の厚みが500μmを超
えると、穿設加工時の障害となる。
The thickness of the aluminum foil layer relating to the punching plate and the method for producing the same of the present invention is preferably 5 to 500 μm. If the thickness of the aluminum foil layer is less than 5 μm, the diffusion of frictional heat by the drill will be insufficient. Further, when the thickness of the aluminum foil layer exceeds 500 μm, it becomes an obstacle during the drilling process.

【0015】本発明の孔開け加工用当て板およびその製
造方法に係わる水溶性高分子としては、ポリビニルアル
コール、ポリエチレングリコール、ポリプロピレングリ
コール、ポリビニルピロリドン、ポリアクリルアミド、
ポリアクリル酸およびその塩、ポリビニルエーテル、ポ
リマレイン酸共重合体、ポリエチレンイミン、メチルセ
ルロース、エチルセルロース、カルボキシメチルセルロ
ース、ヒドロキシエチルセルロース、アラビアゴム、ア
ルギン酸ナトリウム等を用いることができる。
As the water-soluble polymer relating to the punching plate and the method for producing the same of the present invention, polyvinyl alcohol, polyethylene glycol, polypropylene glycol, polyvinylpyrrolidone, polyacrylamide,
Polyacrylic acid and its salts, polyvinyl ether, polymaleic acid copolymer, polyethyleneimine, methylcellulose, ethylcellulose, carboxymethylcellulose, hydroxyethylcellulose, gum arabic, sodium alginate and the like can be used.

【0016】本発明の孔開け加工用当て板およびその製
造方法に係わる水溶性高分子層の厚さは、2〜150μ
mであることが好ましい。水溶性高分子層の厚さが2μ
mより小さいと、十分な滑剤としての効果が得られず、
孔の壁面における粗面化を抑制することができない。水
溶性高分子層は厚くても問題は無いが、経済的な観点か
ら、150μmを超えないことが望ましい。
The thickness of the water-soluble polymer layer according to the punching plate and the method for producing the same of the present invention is 2 to 150 μm.
It is preferably m. Water-soluble polymer layer thickness is 2μ
If it is smaller than m, the effect as a sufficient lubricant cannot be obtained,
Roughening of the wall surface of the hole cannot be suppressed. Although there is no problem even if the water-soluble polymer layer is thick, it is desirable that it does not exceed 150 μm from the economical viewpoint.

【0017】本発明の孔開け加工用当て板は、(A)パ
ルプからなる積層紙の表面上に、水溶性高分子を含有す
る塗布液を用いてロールコート法、カーテンコート法等
で水溶性高分子層を設けた後、さらにアルミニウム箔を
載せて熱圧着する方法、(B)アルミニウム箔層の表面
上に、水溶性高分子を含有する塗布液を用いて、ロール
コート法、カーテンコート法等で水溶性高分子層を設け
た後、パルプからなる積層紙を載せて熱圧着する方法等
で製造することができる。作業性の観点から、本発明の
孔開け加工用当て板の製造方法である(C)予め水溶性
高分子シートを形成しておき、パルプからなる積層紙と
アルミニウム箔層とで該水溶性高分子シートを挟み、熱
圧着して形成する方法が最も好ましい。
The perforating plate of the present invention is water-soluble by a roll coating method, a curtain coating method or the like using a coating solution containing a water-soluble polymer on the surface of a laminated paper (A) pulp. After providing the polymer layer, a method of further placing an aluminum foil and performing thermocompression bonding, (B) a roll coating method or a curtain coating method using a coating solution containing a water-soluble polymer on the surface of the aluminum foil layer. After the water-soluble polymer layer is provided by, for example, a laminated paper made of pulp may be placed and thermocompression bonded. From the viewpoint of workability, the water-soluble polymer sheet is previously formed (C) which is the method for producing a perforating cauldron plate of the present invention, and the water-soluble high-polymer sheet is formed by a laminated paper made of pulp and an aluminum foil layer. The most preferable method is to sandwich the molecular sheets and thermocompress them.

【0018】[0018]

【実施例】以下本発明を実施例により説明する。積層紙の製造 クラフトパルプからなる湿紙を複数層重ね合わせた後、
ホットプレスにより、温度140℃、圧力50kgf/
cm2で脱水および乾燥を行って、厚さ0.5mm、
1.0mm、2.0mmの積層紙をそれぞれ製造した。
EXAMPLES The present invention will be described below with reference to examples. Manufacture of laminated paper After laminating multiple layers of wet paper made of kraft pulp,
By hot press, temperature 140 ℃, pressure 50kgf /
Dewatering and drying at cm 2 , thickness 0.5 mm,
1.0 mm and 2.0 mm laminated papers were manufactured, respectively.

【0019】水溶性高分子シートの製造 分子量50000のポリエチレングリコール 20質量
%、分子量100000のポリプロピレングリコール
70質量%、ポリオキシエチレンモノラウリレート 1
0質量%からなる水溶性高分子混合液を120℃で混合
し、押し出し法によって、厚さ10μm、50μm、1
50μmの水溶性高分子シートを得た。
Production of Water-Soluble Polymer Sheet Polyethylene glycol having a molecular weight of 50,000 20% by mass, polypropylene glycol having a molecular weight of 100,000
70% by mass, polyoxyethylene monolaurate 1
A water-soluble polymer mixed solution of 0 mass% was mixed at 120 ° C., and a thickness of 10 μm, 50 μm, 1 was obtained by an extrusion method.
A 50 μm water-soluble polymer sheet was obtained.

【0020】実施例1 厚さ5μmのアルミニウム箔、厚さ10μmの水溶性高
分子シート、厚さ0.5mmの積層紙、厚さ10μmの
水溶性高分子シート、厚さ5μmのアルミニウム箔を順
に積層し、180℃、20kgf/cm2で熱圧着し
て、本発明の孔開け加工用当て板Iを得た。
Example 1 An aluminum foil having a thickness of 5 μm, a water-soluble polymer sheet having a thickness of 10 μm, a laminated paper having a thickness of 0.5 mm, a water-soluble polymer sheet having a thickness of 10 μm, and an aluminum foil having a thickness of 5 μm were successively formed. The layers were laminated and thermocompression-bonded at 180 ° C. and 20 kgf / cm 2 to obtain a punching plate I of the present invention.

【0021】実施例2〜3 厚さ10μmの水溶性高分子シートの代わりに、厚さ5
0μmおよび厚さ150μmの水溶性高分子シートを使
用したほかは、実施例1と同様の方法で、本発明の孔開
け加工用当て板IIおよびIIIを得た。
Examples 2 to 3 Instead of a water-soluble polymer sheet having a thickness of 10 μm, a thickness of 5 was used.
Except for using a water-soluble polymer sheet having a thickness of 0 μm and a thickness of 150 μm, punching plates II and III of the present invention were obtained in the same manner as in Example 1.

【0022】実施例4 厚さ5μmのアルミニウム箔、厚さ50μmの水溶性高
分子シート、厚さ1.0mmの積層紙、厚さ60μmの
水溶性高分子シート、厚さ5μmのアルミニウム箔を順
に積層し、180℃、30kgf/cm2で熱圧着し
て、本発明の孔開け加工用当て板IVを得た。
Example 4 5 μm thick aluminum foil, 50 μm thick water-soluble polymer sheet, 1.0 mm thick laminated paper, 60 μm thick water-soluble polymer sheet, 5 μm thick aluminum foil in this order. The layers were laminated and thermocompression bonded at 180 ° C. and 30 kgf / cm 2 to obtain a punching plate IV of the present invention.

【0023】実施例5〜6 厚さ5μmのアルミニウム箔の代わりに、厚さ100μ
mおよび厚さ500μmのアルミニウム箔を使用したほ
かは、実施例4と同様の方法で、本発明の孔開け加工用
当て板VおよびVIを得た。
Examples 5 to 6 Instead of an aluminum foil having a thickness of 5 μm, a thickness of 100 μm was used.
In the same manner as in Example 4, except that an aluminum foil having a thickness of m and a thickness of 500 μm was used, the punching plates V and VI of the present invention were obtained.

【0024】実施例7〜8 厚さ0.5mmの積層紙の代わりに、厚さ1.0mmお
よび2.0mmの積層紙を使用したほかは、実施例1と
同様の方法で、本発明の孔開け加工用当て板VIIおよびV
IIIを得た。
Examples 7 to 8 In the same manner as in Example 1, except that the laminated paper having the thickness of 1.0 mm and the thickness of 2.0 mm were used in place of the laminated paper having the thickness of 0.5 mm, the present invention was prepared. Perforating patch plates VII and V
I got III.

【0025】実施例9 分子量2500のポリビニルアルコール 20質量%、
分子量50000のポリエチレングリコール 50質量
%、ポリオキシエチレンモノラウリレート 10質量
%、水 10質量%とからなる水溶性高分子混合液を8
0℃で混合し、ロールコート法で厚さ1.0mmの積層
紙の片面に塗布後、140℃で乾燥し、積層紙上に水溶
性高分子層を設けた。次いで、もう片面にも同様の方法
で水溶性高分子層を設けた。水溶性高分子層の厚さは3
0μmであった。該水溶性高分子層上を設けた積層紙
を、厚さ30μmのアルミニウム箔層で挟持し、180
℃、20kgf/cm2で熱圧着して、本発明の孔開け
加工用当て板IXを得た。
Example 9 20% by mass of polyvinyl alcohol having a molecular weight of 2500,
A water-soluble polymer mixed solution containing 50% by mass of polyethylene glycol having a molecular weight of 50,000, 10% by mass of polyoxyethylene monolaurate, and 10% by mass of water was used.
The mixture was mixed at 0 ° C., applied on one side of a laminated paper having a thickness of 1.0 mm by a roll coating method, and then dried at 140 ° C. to form a water-soluble polymer layer on the laminated paper. Then, a water-soluble polymer layer was provided on the other surface by the same method. Water-soluble polymer layer thickness is 3
It was 0 μm. The laminated paper provided on the water-soluble polymer layer was sandwiched between aluminum foil layers having a thickness of 30 μm,
Thermocompression bonding was carried out at 20 ° C. and 20 kgf / cm 2 to obtain a punching plate IX of the present invention.

【0026】実施例10 実施例9で調製した水溶性高分子混合液を80℃で混合
し、ロールコート法で厚さ200μmのアルミニウム箔
層の片面に塗布後、140℃で乾燥して、厚さ2μmの
水溶性高分子層を設けた。該水溶性高分子層を設けた面
を積層紙に接するようにして、厚さ1.0mmの積層紙
をアルミニウム箔層で挟持し、次いで180℃、30k
gf/cm2で熱圧着して、本発明の孔開け加工用当て
板Xを得た。
Example 10 The water-soluble polymer mixture prepared in Example 9 was mixed at 80 ° C., applied on one side of an aluminum foil layer having a thickness of 200 μm by a roll coating method, and then dried at 140 ° C. A water-soluble polymer layer having a thickness of 2 μm was provided. A 1.0 mm-thick laminated paper was sandwiched between aluminum foil layers so that the surface provided with the water-soluble polymer layer was in contact with the laminated paper, and then 180 ° C., 30 k
Thermocompression bonding was performed at gf / cm 2 to obtain a punching pad X of the present invention.

【0027】比較例1 厚さ1.0mmの積層紙の片面に厚さ100μmのアル
ミニウム箔をエポキシ系接着剤で貼り付け比較例の孔開
け加工用当て板aとした。
Comparative Example 1 An aluminum foil having a thickness of 100 μm was attached to one surface of a laminated paper having a thickness of 1.0 mm with an epoxy adhesive to obtain a perforating patch plate a of Comparative Example.

【0028】比較例2 厚さ1.0mmの積層紙、厚さ150μmの水溶性高分
子シートを順に積層し、180℃、10kgf/cm2
で熱圧着して、比較例の孔開け加工用当て板bを得た。
Comparative Example 2 A laminated paper sheet having a thickness of 1.0 mm and a water-soluble polymer sheet having a thickness of 150 μm were laminated in this order, and the temperature was 180 ° C. and 10 kgf / cm 2.
Then, thermocompression bonding was performed to obtain a punching plate b for a comparative example.

【0029】評価方法 厚さ1.6mmのガラス基材エポキシ樹脂6層板(内層
4層、内層銅箔厚40μm、外層厚さ18μm銅箔)を
用い、孔開け加工を下記条件で実施した。上当て板とし
ては、200μmのアルミニウム箔層の片面に厚さ50
μmの水溶性高分子層を設けたものを使用した。下当て
板として、本発明の孔開け加工用当て板および比較例の
孔開け加工用当て板を使用した。比較例の当て板bは、
水溶性高分子層を6層板と接するように配した。
Evaluation Method Using a glass-based epoxy resin 6-layer board (inner layer 4 layers, inner layer copper foil thickness 40 μm, outer layer thickness 18 μm copper foil) having a thickness of 1.6 mm, perforation processing was performed under the following conditions. As the upper backing plate, a thickness of 50 μm is provided on one side of an aluminum foil layer of 200 μm.
The one provided with a water-soluble polymer layer of μm was used. As the lower patch, the punching plate of the present invention and the punching plate of Comparative Example were used. The patch b of the comparative example is
The water-soluble polymer layer was placed in contact with the 6-layer plate.

【0030】 ドリルビットの直径:0.30mm ドリル回転数 :80000rpm 送り速度 :1.6mm/分 配置 :(ドリル)上当て板/6層板/下
当て板
Diameter of drill bit: 0.30 mm Drill rotation speed: 80000 rpm Feed rate: 1.6 mm / min Arrangement: (drill) Upper cover plate / 6 layer plate / lower cover plate

【0031】評価は目視もしくは顕微鏡によって、貫通
孔側面の粗面化、下当て板に接する面における貫通孔の
バリ・閉塞を観察し、これらの欠点のないものを○、あ
るものを×とした。また、保存性試験では、これらの当
て板を3ヶ月間保存し、反りやべたつきが発生している
ものを×とした。結果を表1にまとめた。
For the evaluation, the side surface of the through hole was roughened and the burr and blockage of the through hole on the surface in contact with the lower backing plate were observed by visual observation or a microscope. . Further, in the storability test, these patch plates were stored for 3 months, and those having warpage or stickiness were evaluated as x. The results are summarized in Table 1.

【0032】[0032]

【表1】 [Table 1]

【0033】本発明の実施例の孔開け加工用当て板I〜
Xを用いて孔開け加工を実施した6層板には、貫通孔側
面の粗面化や貫通孔のバリ・閉塞等の欠陥は見られなか
った。また、実施例の孔開け加工用当て板I〜Xは保存
試験においても、べたつきや反りは確認されなかった。
Reliable plate I for punching according to the embodiment of the present invention.
No defects such as roughening of the side surface of the through hole and burrs and blockages of the through hole were found in the 6-layer plate subjected to the drilling process using X. In addition, in the storage tests of the punching patch plates I to X of the example, stickiness and warpage were not confirmed.

【0034】比較例の孔開け加工用当て板aでは、水溶
性高分子層がないため、貫通孔側面の粗面化が確認され
た。また、孔開け加工用当て板bでは、アルミニウム箔
層がないために、貫通孔のバリ・閉塞が確認された。ま
た、孔開け加工用当て板bでは、3カ月後に表面の水溶
性高分子層にべたつきおよび剥離、当て板全体の反りが
確認された。
In the punching patch a of the comparative example, since the water-soluble polymer layer was not present, it was confirmed that the side surface of the through hole was roughened. Further, in the punching patch b, since there was no aluminum foil layer, burrs and blockages of the through holes were confirmed. Moreover, in the patch plate b for perforation processing, stickiness and peeling of the water-soluble polymer layer on the surface and warpage of the entire patch plate were confirmed after 3 months.

【0035】実施例1〜8の本発明の孔開け加工用当て
板の製造方法は、アルミニウム箔層、水溶性高分子層、
積層紙、水溶性高分子層、アルミニウム箔層の積層が一
工程ででき、容易に当て板を製造することができた。
The manufacturing method of the punching plate of the present invention in Examples 1 to 8 is carried out by using an aluminum foil layer, a water-soluble polymer layer,
The laminated paper, the water-soluble polymer layer, and the aluminum foil layer were laminated in one step, and the patch plate could be easily manufactured.

【0036】[0036]

【発明の効果】以上説明したごとく、本発明の孔開け加
工用当て板は、穿設ドリルと被加工板との間で生じる摩
擦力を低減でき、また発生した摩擦熱を瞬時に放散でき
ると共に、製品やその製造環境の汚染を減らすことがで
きる。また、本発明の孔開け加工当て板の製造方法は作
業性に優れている。
As described above, the punching plate of the present invention can reduce the frictional force generated between the drill and the plate to be machined, and can instantaneously dissipate the generated frictional heat. , Can reduce the pollution of the product and its manufacturing environment. Further, the method for manufacturing a perforated patch according to the present invention is excellent in workability.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の孔開け加工用当て板の一例を表す概念
FIG. 1 is a conceptual diagram showing an example of a punching pad of the present invention.

【符号の説明】[Explanation of symbols]

1 パルプからなる積層紙 2 水溶性高分子層 3 アルミニウム箔層 1 Laminated paper consisting of pulp 2 Water-soluble polymer layer 3 Aluminum foil layer

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C036 CC07 4F100 AB10D AB10E AB33D AB33E AK01B AK01C AK41 AK54 BA05 BA06 BA10D BA10E DG10A GB43 JB09B JB09C YY00A YY00B YY00C YY00D YY00E    ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C036 CC07                 4F100 AB10D AB10E AB33D AB33E                       AK01B AK01C AK41 AK54                       BA05 BA06 BA10D BA10E                       DG10A GB43 JB09B JB09C                       YY00A YY00B YY00C YY00D                       YY00E

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 パルプからなる積層紙を水溶性高分子層
を介してアルミニウム箔層で挟持してなる孔開け加工用
当て板。
1. A punching plate for laminating a laminated paper made of pulp between aluminum foil layers with a water-soluble polymer layer interposed therebetween.
【請求項2】 パルプからなる積層紙の厚みが0.5〜
2.0mmであることを特徴とする請求項1記載の孔開
け加工用当て板。
2. The thickness of the laminated paper made of pulp is 0.5 to
It is 2.0 mm, The patch plate for perforation processing of Claim 1 characterized by the above-mentioned.
【請求項3】 水溶性高分子層の厚みが2〜150μm
であることを特徴とする請求項1〜2記載の孔開け加工
用当て板。
3. The water-soluble polymer layer has a thickness of 2 to 150 μm.
The patch plate for perforating according to claim 1 or 2, wherein
【請求項4】 アルミニウム箔層の厚みが5〜500μ
mであることを特徴とする請求項1〜3記載の孔開け加
工用当て板。
4. The aluminum foil layer has a thickness of 5 to 500 μm.
m. The punching plate according to any one of claims 1 to 3, wherein m is m.
【請求項5】 パルプからなる積層紙の両面に水溶性高
分子シートおよびアルミニウム箔層を順に積層し、熱圧
着することを特徴とする孔開け加工用当て板の製造方
法。
5. A method of manufacturing a patch plate for punching, comprising laminating a water-soluble polymer sheet and an aluminum foil layer on both sides of a laminated paper made of pulp in this order and thermocompressing the laminated sheet.
JP2001294289A 2001-09-26 2001-09-26 Fitting plate for drilling and its manufacturing method Pending JP2003094217A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001294289A JP2003094217A (en) 2001-09-26 2001-09-26 Fitting plate for drilling and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001294289A JP2003094217A (en) 2001-09-26 2001-09-26 Fitting plate for drilling and its manufacturing method

Publications (1)

Publication Number Publication Date
JP2003094217A true JP2003094217A (en) 2003-04-03

Family

ID=19115925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001294289A Pending JP2003094217A (en) 2001-09-26 2001-09-26 Fitting plate for drilling and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2003094217A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006346912A (en) * 2005-06-14 2006-12-28 Uniplus Electronics Co Ltd High radiation lubricating aluminum cover for drilling and its manufacturing method
KR20140147089A (en) 2012-03-21 2014-12-29 미츠비시 가스 가가쿠 가부시키가이샤 Entry sheet for forming drill hole and drill hole-forming method
US10159153B2 (en) 2012-03-27 2018-12-18 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling
US10674609B2 (en) 2014-03-31 2020-06-02 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling
CN115151695A (en) * 2020-02-28 2022-10-04 日本制纸株式会社 Backing plate and method for manufacturing same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006346912A (en) * 2005-06-14 2006-12-28 Uniplus Electronics Co Ltd High radiation lubricating aluminum cover for drilling and its manufacturing method
KR20140147089A (en) 2012-03-21 2014-12-29 미츠비시 가스 가가쿠 가부시키가이샤 Entry sheet for forming drill hole and drill hole-forming method
US9826643B2 (en) 2012-03-21 2017-11-21 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and drilling method
US10159153B2 (en) 2012-03-27 2018-12-18 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling
US10674609B2 (en) 2014-03-31 2020-06-02 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling
CN115151695A (en) * 2020-02-28 2022-10-04 日本制纸株式会社 Backing plate and method for manufacturing same

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