TWM298304U - PU polymer plate used to bore a hole on a circuit board - Google Patents

PU polymer plate used to bore a hole on a circuit board Download PDF

Info

Publication number
TWM298304U
TWM298304U TW95204943U TW95204943U TWM298304U TW M298304 U TWM298304 U TW M298304U TW 95204943 U TW95204943 U TW 95204943U TW 95204943 U TW95204943 U TW 95204943U TW M298304 U TWM298304 U TW M298304U
Authority
TW
Taiwan
Prior art keywords
polymer
drilling
circuit board
substrate
board
Prior art date
Application number
TW95204943U
Other languages
Chinese (zh)
Inventor
Chuan-Shin Liu
Jau-Jr Chiou
Original Assignee
Chuan-Shin Liu
Jau-Jr Chiou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuan-Shin Liu, Jau-Jr Chiou filed Critical Chuan-Shin Liu
Priority to TW95204943U priority Critical patent/TWM298304U/en
Publication of TWM298304U publication Critical patent/TWM298304U/en

Links

Landscapes

  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Description

M298304 八、新型說明: 【新型所屬之技術領域】 本創作係有關一種電路板鑽孔用之PU聚合板,尤指一 種具有降低鑽針磨損率及板材可回收再利用之功效設計者。 【先前技術】 目前印刷電路板(PCB)的製程中,其在基板上必須配合 預定電路板設計而鑽設數個貫穿孔,而在鑽孔的作業中,為 了防止加工台面的損傷及鑽頭的磨損,因此會在基板底部放 置一底墊板作為保護。 另一方面,由於在鑽孔時容易造成的鑽孔邊緣產生毛邊 及切削,因此該底墊板的材質必須具有降低該鑽孔時所產生 的毛邊、切削,而達到其品質及後續之處理流程之便利性。 因此,目前已知的電路板鑽孔用之底墊板則是採用纖維 板所製成,其該纖維板的表面或底面分別塗覆有陶瓷釉藥原 料或UV陶瓷漆等增加其硬度強化層的構成,另一種則是採 用電木板,雖然以上兩者底墊板皆可達到對基板或鑽頭甚至 機台的保護,但仍是有些缺失是需要改進加強的。 如纖維板來說,它的密度有低、中、高之板材分別,其優 點在於它並無公㈣題之產生,但仍有缺失是因表層的硬度 有限,所以在鑽孔時,比較容易對於基板在鑽孔後產生毛邊 及切削’對於電路板的品質亦造成下降,且於後續的作業也 一加些4不便,再者,若該纖維板採用密度較高之板材製 作,其製程較顯繁瑣味& 4、安收k η 只糸貝,生產效率降低,因此容易造成成本過高 的情況發生。 M298304 再者,如電木板來說,其所屬一較昂貴之板材,其優點在 於因為該電木板之硬度較高,因此在定位鑽孔時,可承受較 高的鑽孔壓力以達到容易鑽設的效果,但其缺失是,因為該 電木板屬於硬度較高的板材,對於鑽頭比較容易造成損傷, 且5亥電木板的成本較高,對於該底墊板係屬消耗材來說,這 樣的成本實在會是一筆可觀的開銷,另外,加上電木板使用 過後必須以廢料處理時,使用掩埋法處理並不會造成分解; 而使用燃燒法會產生有毒氣體的情況,因此使用電木板的情 況下,容易有環保廢料處理的問題產生。 綜上所述,雖然習知的底墊板材質有其一定的功能及優 點,但仍有幾點缺失是需要深慮改進的: 一、 板材硬度及材質使用。 二、 環保廢料處理之問題。 三、 經濟成本過高之評估。 緣此,本創作人有鑑於上述習知技術之缺失,在構想上 以能加長鑽頭鑽針的使用壽命,以及降低鑽孔所產生的毛邊 切削來提高品質,希望能藉此以達到降低鑽針磨損且又符合 經濟效益及環保再回收利用之特性。 【新型内容】 緣是,本㈣之主要目的,係在提供—種電路板鑽孔用 之PU聚合板,其具有降低鑽針磨損之功效增進者。 本創作之另-目的,係在提供一種電路板鑽孔用之pu 聚合板,其具有板材可回收再利用之特性者。 本創作之再-目的,係在提供一種電路板鑽孔用之pu 聚合板,其具有符合經濟效益之特性者。 M298304 為達上述功效,本創作之技術手段包含: 一基材,係以適用於印刷電路板鑽孔墊底用之板材所構 成;以及 一 PU聚合物薄層,係緊密結合在該基材表面,藉以增強 基材表面之硬度及光滑度。 【實施方式】 首先,請參閱第一圖所示,係為本創作較佳實施例之結 構分解圖,其包含有一基材(10),且該基材(10)係以適用於印 刷電路板(PCB)鑽孔墊底用之板材所構成,且該基材(10)係 選自密集板及纖維板其中任一所構成,以及一貼紙(20)和一 PU聚合物薄層(30)三者所構成之PU聚合板(40)。 再者,請參閱第二〜三圖所示,該PU聚合物薄層(30)係緊 密結合在該基材(10)之表面上,藉此以增加強化基材(10)表 面上的硬度及光滑度,使其於電路板鑽孔時,能確保電路板 不受到損壞之現象,且其光滑度能平整鑽設之抗壓,進而不 會讓板體有發生變形及走位的現象,另外,該PU聚合物薄層 (30)之材料係為聚氨酯(Polyurethane),該聚氨酯 (Polyurethane)之特性具有硬度大、耐磨性好、安全無毒及 不污染環境等優點,因而可降低對電路板於鑽孔時所會產生 的損壞及磨損等現象;進一步,再於該PU聚合物薄層(30)和 該基材(10)之間設有一層貼紙(20),且該貼紙(20)的材質密 度需大於該基板(10)材質的密度。 該貼紙(20)係可以下列幾種方法結合成型於該基材: 一、該貼紙(20)係可先貼合在基材(10)的表面,然後再將 該PU聚合物薄層(30)結合在該貼紙(20)上,即構成其PU聚 M298304 合板(40)。 二、 在該PU聚合物薄層(30)上,以PU漆塗佈在該貼紙 (20)上所構成,再緊密結合在該基材(10)上,使之成為一 PU 聚合板(40)。 三、 該PU聚合物薄層(30)係以成型之PU膜彼覆在該 貼紙(20)上所構成一 PU聚合板(40)。 四、 該PU膜與貼紙(20)係可先複合成型,在結合於該基 材(10)的表面上以構成一 PU聚合板(40)。 本創作使用貼紙(20)以及PU聚合物薄層(30),以上述幾 種方式構成其PU叕合板(40),其在製作成本上不僅降低許 多,且在電路板鑽孔時,比較不會有毛邊及切削的狀況發生, 對於電路板的品質上提高了許多,且對於後續作業的人也不 會因為電路板鑽孔時所產生的毛邊及切削造成其極大困擾, 在本創作確實可以克服這項缺失 又,對於電路板鑽孔用之鑽頭鑽針的磨損率,相對的也 降低了不少,不會再因為躜頭鑽針的損壞需經常更換,而無 意間造成浪費。 另外,該PU聚合物薄層(30)所使用之材料,不僅耐磨性 好且不易造成表面之受損,加上該材料無毒又安全,對於環 境廢料處理亦不會造成困擾,另一方面,由於使用在電路板 下鑽孔用之基板(10)係為耗材,因此本創作基於考量到經濟 成本上的問題,故創作之PU聚合板(40)是具有可回收再利 用之特性,藉此以達到符合經濟效益之功效設計。 藉此,本創作人藉助上揭之技術手段,欲改善其習用技 術不足之處,希望能達到其功效之展現。 M298304 2所述,本創作所揭示之構造,為昔所無,且確能達到 =之功效,並具可供產業利用性,完全符合新型專利要件, 祈明貴審查委員核賜專利,以勵創新,無任德感。 惟,上述所揭露之圖式、說明,僅為本創作之較佳實施例, 大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或等效 變化,仍應包括在本冥申請專利範圍内。M298304 VIII. New description: [New technical field] This is a PU polymer board for drilling circuit boards, especially a designer who has the effect of reducing the wear rate of the drill and recycling the board. [Prior Art] At present, in the manufacturing process of a printed circuit board (PCB), a plurality of through holes must be drilled on a substrate in accordance with a predetermined circuit board design, and in the operation of drilling, in order to prevent damage of the processing table and the drill bit Wear, so a bottom pad is placed on the bottom of the substrate for protection. On the other hand, due to the burrs and cutting of the drilled edges which are easily caused during drilling, the material of the bottom plate must have the burrs and cuttings generated during the drilling to achieve the quality and subsequent processing. Convenience. Therefore, the currently known bottom plate for drilling a circuit board is made of a fiberboard, and the surface or the bottom surface of the fiberboard is coated with a ceramic glaze material or a UV ceramic varnish to increase the hardness of the layer. The other is the use of bakelite. Although both of the bottom plates can protect the substrate or the drill bit or even the machine, there are still some defects that need to be improved. For fiberboard, its density is low, medium and high. The advantage is that it has no public (4) problems, but there are still missing because the hardness of the surface is limited, so it is easier to drill. The burrs and cuttings of the substrate after drilling are also reduced for the quality of the board, and the subsequent work is also inconvenient. In addition, if the fiberboard is made of a higher density sheet, the process is more complicated. Taste & 4, the collection of k η only mussels, production efficiency is reduced, so it is easy to cause excessive cost. M298304 Furthermore, in the case of bakelite, it belongs to a more expensive sheet, which has the advantage that because of the high hardness of the bakelite, it can withstand high drilling pressure during positioning drilling to achieve easy drilling. The effect, but the lack is because the electric wood board is a harder plate, which is more likely to cause damage to the drill bit, and the cost of the 5th electric board is higher, for the bottom plate is a consumable material, such a The cost will actually be a considerable expense. In addition, when the bakelite must be disposed of with waste after use, the use of the buried method will not cause decomposition; and the use of the combustion method will produce toxic gases, so the use of bakelite Under the circumstance, it is easy to have problems with environmental waste disposal. In summary, although the known bottom pad material has certain functions and advantages, there are still some missing points that need to be improved: First, the hardness and material of the board. Second, the issue of environmental waste disposal. Third, the assessment of economic costs is too high. Therefore, in view of the above-mentioned lack of the above-mentioned prior art, the present creator has conceived to improve the service life of the drill bit and reduce the burr cutting generated by the drilling to improve the quality, and hope to reduce the bur. Wear and economical and environmentally friendly recycling characteristics. [New content] The main purpose of this (4) is to provide a PU polymer board for drilling a circuit board, which has the effect of reducing the wear of the bur. Another object of the present invention is to provide a pu polymer board for drilling a circuit board, which has the characteristics that the board can be recycled and reused. The re-purpose of the present invention is to provide a pu polymer board for drilling a circuit board, which has economical characteristics. M298304 In order to achieve the above effects, the technical means of the present invention comprises: a substrate, which is composed of a plate suitable for a bottom of a printed circuit board, and a thin layer of PU polymer which is tightly bonded to the surface of the substrate. In order to enhance the hardness and smoothness of the surface of the substrate. [Embodiment] First, referring to the first figure, it is an exploded view of a preferred embodiment of the present invention, which comprises a substrate (10), and the substrate (10) is suitable for a printed circuit board. (PCB) is composed of a plate for drilling a bottom, and the substrate (10) is selected from any one of a dense plate and a fiberboard, and a sticker (20) and a PU polymer layer (30). The PU polymer plate (40) is constructed. Furthermore, referring to the second to third figures, the PU polymer thin layer (30) is tightly bonded to the surface of the substrate (10), thereby increasing the hardness on the surface of the reinforcing substrate (10). And smoothness, so that when the circuit board is drilled, it can ensure that the circuit board is not damaged, and its smoothness can level the compression resistance of the drill, so that the plate body will not be deformed and moved. In addition, the material of the PU polymer thin layer (30) is polyurethane, and the characteristics of the polyurethane have the advantages of high hardness, good wear resistance, safety, non-toxicity, and no environmental pollution, thereby reducing the circuit. The damage and wear caused by the plate during drilling; further, a layer of sticker (20) is disposed between the thin layer of the PU polymer (30) and the substrate (10), and the sticker (20) The material density needs to be greater than the density of the substrate (10) material. The sticker (20) can be formed on the substrate by the following methods: 1. The sticker (20) can be attached to the surface of the substrate (10) first, and then the PU polymer layer (30). ) is combined with the sticker (20) to form its PU poly M298304 plywood (40). 2. On the thin layer (30) of the PU polymer, the PU lacquer is coated on the sticker (20), and then tightly bonded to the substrate (10) to make it a PU polymer plate (40). ). 3. The PU polymer layer (30) is formed by laminating a PU film on the sticker (20) to form a PU polymer board (40). 4. The PU film and the sticker (20) may be composite molded first, and bonded to the surface of the substrate (10) to form a PU polymer plate (40). This creation uses a sticker (20) and a thin layer of PU polymer (30) to form its PU plywood (40) in several ways, which not only reduces the manufacturing cost, but also does not compare the drilling of the circuit board. There will be burrs and cutting conditions, and the quality of the board will be improved a lot, and the people who follow the work will not be greatly troubled by the burrs and cuttings generated when the board is drilled. Overcoming this deficiency, the wear rate of the drill bit for the drilling of the circuit board is relatively reduced, and it will not be replaced frequently because of the damage of the drill bit, and the waste is inadvertently caused. In addition, the material used in the thin layer (30) of the PU polymer not only has good abrasion resistance and is not easy to cause damage to the surface, and the material is non-toxic and safe, and does not cause trouble for environmental waste disposal. Since the substrate (10) used for drilling under the circuit board is a consumable material, the creation is based on the consideration of economic cost, so the created PU polymer board (40) has the characteristics of being recyclable and reusable. This is to achieve cost-effective design. In this way, the creator relies on the technical means of the above, and wants to improve the inadequacy of his conventional technology, hoping to achieve its efficacy. According to M298304 2, the structure revealed by this creation is as old as it is, and it can achieve the effect of =, and it can be used for industrial use. It fully complies with the new patent requirements, and prays that the review committee will grant a patent to encourage innovation. There is no sense of morality. However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Those skilled in the art who are familiar with the art, the modifications or equivalent changes made according to the spirit of the case should still be included in the scope of the patent application. .

-9- M298304 【圖式簡單說明】 第一圖係本創作較佳實施例之結構分解示意圖。 第二圖係本創作較佳實施例之組合及部份剖視圖。 第三圖係本創作之局部放大示意圖。 【主要元件符號說明】 (10)基材 (20)貼紙 (30)PU聚合物薄層 (40)PU聚合板-9- M298304 [Simplified description of the drawings] The first figure is a schematic exploded view of the preferred embodiment of the present invention. The second drawing is a combination and a partial cross-sectional view of a preferred embodiment of the present invention. The third figure is a partial enlarged view of the creation. [Main component symbol description] (10) Substrate (20) sticker (30) PU polymer thin layer (40) PU polymer board

-10--10-

Claims (1)

M298304 九、申請專利範圍: 1 · 一種電路板鑽孔用之pu聚合板,包含: 一基材,係以適用於印刷電路板鑽孔墊底用之板材所構 成;以及 一 PU聚合物薄層,係緊密結合在該基材表面,藉以增強 基材表面之硬度及光滑度。 2 ·如申請專利範圍第1項所述之一種電路板鑽孔用 之PU聚合板,其中,該基材包括選自密集板及纖維板其中任 _ 一所構成。 3 ·如申請專利範圍第1項所述之一種電路板鑽孔用 之pu聚合板,其中,該pu聚合物薄層之材料為聚氨酯 (Polyurethane) 〇 4 ·如申請專利範圍第1項所述之一種電路板鑽孔用 之pu聚合板,其中,該pu聚合物薄層與該基材之間更包括 I 設有一層貼紙。 5 ·如申請專利範圍第4項所述之一種電路板鑽孔用 之pu聚合板,其中,該貼紙係先貼合於基材表面,再將該PU 聚合物薄層結合在該貼紙上。 6 ·如申請專利範圍第5項所述之一種電路板鑽孔用 之pu聚合板,其中,該pu聚合物薄層係以pu漆塗佈在該貼 紙上所構成。 -11 - M298304 7 ·如申請專利範圍第5 j貝所迷之一種電路 之PU聚合板,其中,該PU聚合物薄 寻層係以成型之PU膜披覆 在該貼紙上所構成。 8 ·如申請專利範圍第7項所述之一種電路板鑽孔用 之PU聚合板,其中,該PU膜與該貼紙係先複合成型,再結合 在該基材表面。 9 ·如申請專利範圍第4、5、6、7或8項所述之 0 一種電路板鑽孔用之PU聚合板,其中,該貼紙材質之密度需 大於該基板材質之密度。M298304 IX. Patent application scope: 1 · A pu polymer board for drilling a circuit board, comprising: a substrate, which is made of a plate suitable for drilling a bottom of a printed circuit board; and a thin layer of PU polymer, It is tightly bonded to the surface of the substrate to enhance the hardness and smoothness of the surface of the substrate. The PU polymer board for drilling a circuit board according to the above aspect of the invention, wherein the base material comprises any one selected from the group consisting of a dense board and a fiber board. The pu-polymerized plate for drilling a circuit board according to the first aspect of the invention, wherein the pu polymer thin layer is made of a polyurethane (Polyurethane) ·4, as described in claim 1 A pu polymer board for drilling a circuit board, wherein the pu polymer thin layer and the substrate further comprise a layer of a sticker. The pu-polymerized board for drilling a circuit board according to the fourth aspect of the invention, wherein the sticker is attached to the surface of the substrate, and the thin layer of the PU polymer is bonded to the sticker. A pu-polymerized plate for drilling a circuit board according to claim 5, wherein the pu polymer thin layer is formed by coating a pu paint on the paper. -11 - M298304 7 - A PU polymer sheet of a circuit as disclosed in claim 5, wherein the PU polymer thin layer is formed by coating a formed PU film on the sticker. The PU polymer board for drilling a circuit board according to the seventh aspect of the invention, wherein the PU film and the sticker are first composite molded and then bonded to the surface of the substrate. 9. A PU polymer board for drilling a circuit board as described in claim 4, 5, 6, 7, or 8. wherein the density of the sticker material is greater than the density of the substrate material. -12--12-
TW95204943U 2006-03-24 2006-03-24 PU polymer plate used to bore a hole on a circuit board TWM298304U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95204943U TWM298304U (en) 2006-03-24 2006-03-24 PU polymer plate used to bore a hole on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95204943U TWM298304U (en) 2006-03-24 2006-03-24 PU polymer plate used to bore a hole on a circuit board

Publications (1)

Publication Number Publication Date
TWM298304U true TWM298304U (en) 2006-09-21

Family

ID=37988510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95204943U TWM298304U (en) 2006-03-24 2006-03-24 PU polymer plate used to bore a hole on a circuit board

Country Status (1)

Country Link
TW (1) TWM298304U (en)

Similar Documents

Publication Publication Date Title
SE520926C2 (en) Process for making a decorative laminate with sound-absorbing elastomeric layer
CN105072810B (en) Two-sided thickness copper flexible working plate producing process
CN102248202B (en) Cover board or backing board for drilling printed circuit board, and processing method thereof
ATE476302T1 (en) METHOD FOR PRODUCING A PLAIN, PRINTED COMPONENT
CN201491399U (en) Bottom backing board of printed circuit board (PCB)
TWM298304U (en) PU polymer plate used to bore a hole on a circuit board
CN201389654Y (en) Structure of PCB drilling pad
CN202162412U (en) Cover plate or bearing plate used in drilling printed circuit board
JP2009004430A (en) Backup board for drilling, and method of manufacturing the same
TWM308850U (en) Hot press resin board for hole drilling of circuit board
CN201534234U (en) Rider sheets used for borehole machining process in PCB industrial chain
TW200927823A (en) Epoxy resin composition, prepreg, metal-clad laminate, multi-layered printed wiring borad
JP2001232596A (en) Drilling floor plate for printed board
JPH11277499A (en) Backup board for printed wiring board
KR101021489B1 (en) A backup board for manufacturing via holes of a printed circuit board
TWM354303U (en) Aluminum laminates for hole-drilling of circuit board
CN104228157A (en) Backing plate for PCB drilling and manufacturing method of backing plate
CN105517360B (en) A method of improving copper-based copper-clad laminate and drills copper-based bottom peak
CN2600228Y (en) Upper backing plate for perforating on printed circuit board
TWM574372U (en) Composite pad for PCB drilling
KR200448701Y1 (en) Aluminum cover plate for punching with multiple lubricating functions
KR20020082444A (en) The hole-punching method of printed circuit board
JP5434452B2 (en) Magnetic card
JP4314215B2 (en) High heat dissipation aluminum cover for drilling
JP2003094217A (en) Fitting plate for drilling and its manufacturing method

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees