CN2600228Y - Upper backing plate for perforating on printed circuit board - Google Patents

Upper backing plate for perforating on printed circuit board Download PDF

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Publication number
CN2600228Y
CN2600228Y CN 03212133 CN03212133U CN2600228Y CN 2600228 Y CN2600228 Y CN 2600228Y CN 03212133 CN03212133 CN 03212133 CN 03212133 U CN03212133 U CN 03212133U CN 2600228 Y CN2600228 Y CN 2600228Y
Authority
CN
China
Prior art keywords
circuit board
printed circuit
perforating
backing plate
upper backing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 03212133
Other languages
Chinese (zh)
Inventor
王连科
陈瑞林
冯勇
李光勋
文哲权
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEILONGJIANG PAPER INDUSTRY RESEARCH INSTITUTE
Original Assignee
HEILONGJIANG PAPER INDUSTRY RESEARCH INSTITUTE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEILONGJIANG PAPER INDUSTRY RESEARCH INSTITUTE filed Critical HEILONGJIANG PAPER INDUSTRY RESEARCH INSTITUTE
Priority to CN 03212133 priority Critical patent/CN2600228Y/en
Application granted granted Critical
Publication of CN2600228Y publication Critical patent/CN2600228Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)

Abstract

An upper backing plate for perforating on the printed circuit board is that the two sides of the paper core layer (1) are respectively provided with the glue layer (2) and the aluminum foil layer (3). The utility model has the advantages of the proper hardness, the good smoothness and elasticity, the easy penetration, highly abrasion-resistant drill head, no ring-oxygen greasy pollution and burr, and so on.

Description

The boring upper padding plate of a kind of printed circuit board
Technical field: the utility model relates to the compound pressing plate of aluminium-containing alloy paper tinsel.
Background technology: the upper padding plate when being used for printed circuit board boring, generally adopt upper padding plates such as aluminium sheet, phenolic board, epoxy resin bonded fiber at present, have hardness height, poor flexibility, be difficult for penetrating, greasy dirty many, the shortcoming such as burr is many, drill bit is easy to wear and lack service life of epoxy in the hole.
Summary of the invention: the purpose of this utility model provides that a kind of hardness is suitable, flatness and good springiness, easily penetrate, drill bit is not easy to wear and the boring upper padding plate of printed circuit board long service life.It is to be provided with glue-line and alloy foil layer successively on papery sandwich layer two sides.It has that hardness is suitable, flatness and good springiness, easily penetrate, the no epoxy advantages such as dirt and burr of being bored with in the drill bit not easy to wear, long service life, hole.
Description of drawings: accompanying drawing is the utility model embodiment sectional structure schematic diagram.
Embodiment: as shown in the figure, it is to be provided with glue-line 2 and alloy foil layer 3 successively on papery sandwich layer 1 two sides.

Claims (1)

  1. The boring upper padding plate of a kind of printed circuit board is characterized in that, papery sandwich layer (1) two sides is provided with glue-line (2) and alloy foil layer (3) successively.
CN 03212133 2003-03-22 2003-03-22 Upper backing plate for perforating on printed circuit board Expired - Lifetime CN2600228Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03212133 CN2600228Y (en) 2003-03-22 2003-03-22 Upper backing plate for perforating on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03212133 CN2600228Y (en) 2003-03-22 2003-03-22 Upper backing plate for perforating on printed circuit board

Publications (1)

Publication Number Publication Date
CN2600228Y true CN2600228Y (en) 2004-01-21

Family

ID=34159374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03212133 Expired - Lifetime CN2600228Y (en) 2003-03-22 2003-03-22 Upper backing plate for perforating on printed circuit board

Country Status (1)

Country Link
CN (1) CN2600228Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100478131C (en) * 2006-04-11 2009-04-15 合正科技股份有限公司 Heat radiation assistant board used for high speed drilling
CN103143903A (en) * 2011-12-07 2013-06-12 富泰华工业（深圳）有限公司 Method for processing hole of metal piece
CN103624480A (en) * 2013-12-02 2014-03-12 上海现代先进超精密制造中心有限公司 Punching method for wedge-shaped plate of photoetching machine
CN107584557A (en) * 2016-07-06 2018-01-16 精工计时系统有限公司 Boring device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100478131C (en) * 2006-04-11 2009-04-15 合正科技股份有限公司 Heat radiation assistant board used for high speed drilling
CN103143903A (en) * 2011-12-07 2013-06-12 富泰华工业（深圳）有限公司 Method for processing hole of metal piece
CN103624480A (en) * 2013-12-02 2014-03-12 上海现代先进超精密制造中心有限公司 Punching method for wedge-shaped plate of photoetching machine
CN107584557A (en) * 2016-07-06 2018-01-16 精工计时系统有限公司 Boring device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20130322

Granted publication date: 20040121