CN2733823Y - A base plate for drilling printed circuit board - Google Patents

A base plate for drilling printed circuit board Download PDF

Info

Publication number
CN2733823Y
CN2733823Y CN 200420048752 CN200420048752U CN2733823Y CN 2733823 Y CN2733823 Y CN 2733823Y CN 200420048752 CN200420048752 CN 200420048752 CN 200420048752 U CN200420048752 U CN 200420048752U CN 2733823 Y CN2733823 Y CN 2733823Y
Authority
CN
China
Prior art keywords
gummed paper
printed circuit
circuit board
dipping
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200420048752
Other languages
Chinese (zh)
Inventor
朱朝辉
佘忠元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200420048752 priority Critical patent/CN2733823Y/en
Application granted granted Critical
Publication of CN2733823Y publication Critical patent/CN2733823Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The utility model relates to a base plate for drilling printed circuit board, comprising a dipping gummed paper 2, a basal plate 3, a dipping gummed paper 4. The dipping gummed paper 2 is arranged on the basal plate 3, and the dipping gummed paper 4 is arranged below the basal plate which is compositely formed after the heat pressing. The utility model has the advantages of proper hardness, good planeness and elasticity, lower cost, un-easy abrasion of the drill head, no putty spot or sentus in the drilled hole, no warpage or deformation for long term storing, low producing cost, and wide popularization value.

Description

The boring bottom backing plate of a kind of printed circuit board
The utility model belongs to hot-forming composite board, the boring bottom backing plate of a kind of printed circuit board.
When printed circuit board is holed, in order to protect drilling platform and to guarantee drilling quality, the essential bottom backing plate that uses.At present, most of producers adopt phenolic board or epoxy resin bonded fiber as the bottom backing plate, and the shortcoming that adopts these two kinds of sheet materials to make the bottom backing plate is that the greasy dirt of epoxy is many in hardness height, poor flexibility, the hole, burr is many, drill bit is easy to wear and useful life short.For a long time, the effective way that always overcomes the above problems of people in exploration.
The purpose of this utility model is, in order to overcome the shortcoming that traditional bottom backing plate exists, designed therefore that hardness is suitable, do not had the boring bottom backing plate of a kind of printed circuit board of be bored with dirt and burr in evenness and good springiness, drill bit not easy to wear, long service life, the hole.
The utility model is realized as follows:
The boring bottom backing plate of a kind of printed circuit board, bottom backing plate 1 are to be composited by dipping gummed paper 2, substrate 3 and dipping gummed paper 4, are provided with dipping gummed paper 2 on substrate 3, are provided with dipping gummed paper 4 below it.
The utility model has the advantages that: hardness is suitable, evenness and good springiness, does not have the dirt of being bored with and burr in drill bit not easy to wear, the useful life of having improved drill bit, the hole that gets out.
Description of drawings:
Fig. 1 is a front view of the present utility model;
Fig. 2 is a plan structure schematic diagram of the present utility model.
Introduce embodiment of the present utility model with reference to the accompanying drawings:
The boring bottom backing plate of a kind of printed circuit board, the upper and lower surface at substrate 3 during enforcement is provided with dipping gummed paper 2 and dipping gummed paper 4 respectively, through the hot pressing composite molding.Substrate is to adopt vegetable fibre board, preferably adopt medium density fibre board (MDF), substrate 3 will carry out sand milling before Compound Machining, and is even to guarantee monolith substrate thickness, size is on request cut then, will flood to organize plate after gummed paper is cut by the size of substrate again.The program of group plate is to place dipping gummed paper 4 on the metal supporting plate earlier, dipping gummed paper 4 has facing down of remover, accordingly substrate 3 is placed on then on the dipping gummed paper 4, to flood again gummed paper 2 have remover towards on be placed on the substrate 3, put backplate above the gummed paper 2 or put an amount of money supporting plate again at dipping and organize one group of plate separately to carry out many plates compound.The plate that group is good is sent into and is carried out hot forming in the hot press.The utility model plate face is smooth, good springiness, do not peel off, long-term storage warpage, indeformable not, low production cost has promotional value widely.

Claims (1)

1, the boring bottom backing plate of a kind of printed circuit board, bottom backing plate (1) is to be composited by dipping gummed paper (2), substrate (3) and dipping gummed paper (4), it is characterized in that on substrate (3), being provided with dipping gummed paper (2), be provided with dipping gummed paper (4) below it.
CN 200420048752 2004-04-05 2004-04-05 A base plate for drilling printed circuit board Expired - Fee Related CN2733823Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420048752 CN2733823Y (en) 2004-04-05 2004-04-05 A base plate for drilling printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420048752 CN2733823Y (en) 2004-04-05 2004-04-05 A base plate for drilling printed circuit board

Publications (1)

Publication Number Publication Date
CN2733823Y true CN2733823Y (en) 2005-10-12

Family

ID=35069658

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200420048752 Expired - Fee Related CN2733823Y (en) 2004-04-05 2004-04-05 A base plate for drilling printed circuit board

Country Status (1)

Country Link
CN (1) CN2733823Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101951734A (en) * 2010-09-30 2011-01-19 深圳市大族激光科技股份有限公司 Method for processing micro through hole of flexible circuit board
CN102248202A (en) * 2011-04-27 2011-11-23 金安国纪科技股份有限公司 Cover board or backing board for drilling printed circuit board, and processing method thereof
CN101795534B (en) * 2010-01-19 2012-04-25 苏州思诺林电子有限公司 Drilling liner plate of circuit board
CN108127150A (en) * 2017-11-30 2018-06-08 广州兴森快捷电路科技有限公司 The thin size plate processing method of light and small

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101795534B (en) * 2010-01-19 2012-04-25 苏州思诺林电子有限公司 Drilling liner plate of circuit board
CN101951734A (en) * 2010-09-30 2011-01-19 深圳市大族激光科技股份有限公司 Method for processing micro through hole of flexible circuit board
CN101951734B (en) * 2010-09-30 2013-04-17 深圳市大族激光科技股份有限公司 Method for processing micro through hole of flexible circuit board
CN102248202A (en) * 2011-04-27 2011-11-23 金安国纪科技股份有限公司 Cover board or backing board for drilling printed circuit board, and processing method thereof
CN108127150A (en) * 2017-11-30 2018-06-08 广州兴森快捷电路科技有限公司 The thin size plate processing method of light and small
CN108127150B (en) * 2017-11-30 2019-11-08 广州兴森快捷电路科技有限公司 Light and small thin size plate processing method

Similar Documents

Publication Publication Date Title
WO2008087837A1 (en) Mold for glass substrate molding, method for producing glass substrate, method for producing glass substrate for information recording medium, and method for producing information recording medium
CN2733823Y (en) A base plate for drilling printed circuit board
CN202984737U (en) Lubrication base board for circuit board drilling
CN207032748U (en) A kind of parquets stone material
CN1323192C (en) Electrolytic aluminium production process by prebaked anode adhesive method
CN203295813U (en) Bamboo shaving sewing machine platen
CN206272963U (en) A kind of electronic product pcb board production environmental protection backing plate
CN2741741Y (en) Combineable single head plate hole drilling machine
CN206009605U (en) Corrugated plating pressing mold
CN2451305Y (en) Core-board
CN218527886U (en) Sole location installation mould
CN217259078U (en) Gilding press with preheat gilt roller structure
CN2285177Y (en) Electroplating lamination diamond bit
CN2762986Y (en) Copound board contg. wood and metals
CN206185977U (en) Blanket machine
CN219392862U (en) Foundation pit warning device for building construction
CN216507535U (en) Novel shape lithography mould of preapring for an unfavorable turn of events
CN2632288Y (en) Double-blade artificial synneusis diamond composite sheet
CN2434238Y (en) Paper storage sheet
CN202037554U (en) Grinding tool for grinding alloy cutting tool
CN201152018Y (en) Flanging type building mould
CN207758289U (en) High temperature heat-resistant transfer decorative body paper
CN215904094U (en) Environment-friendly waterproof high-strength artificial board
CN212388897U (en) Novel fast-assembling environmental protection floor
CN210865504U (en) Novel efficient energy-saving mark

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee