TWM308441U - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- TWM308441U TWM308441U TW095207839U TW95207839U TWM308441U TW M308441 U TWM308441 U TW M308441U TW 095207839 U TW095207839 U TW 095207839U TW 95207839 U TW95207839 U TW 95207839U TW M308441 U TWM308441 U TW M308441U
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- TW
- Taiwan
- Prior art keywords
- heat
- gap
- distance
- side edge
- oblique side
- Prior art date
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/30—Pivoted housings or frames
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
M3 08441 八、新型說明: f新型所屬之技術領域j 本新型是有關於一種散埶琴 /rt ll …裔特別疋指一種散熱鰭片 被此間之間隙呈由窄漸寬,於 乍口〖开/成冋》皿區,於寬部形 成較低溫區,由窄部向寬邱 办L 見一形成一熱對流,熱可快速的由 見口Ρ向外作散熱之散熱器。 【先前技術】 :熱器,應用的非常廣泛,具有散熱鰭片的散 取W遍’可用來作為代表例 ...... 散熱,如圖i,係在m/又疋用來作電腦CPU的 的方向凸出設有呈等距配 ^ ^ u 置的復數片的散熱鰭片u,殽埶 ”'、曰片11的用意是在大量辦 …、 吸收後迅速傳導至各散熱續片u m、原由庄體1 鰭片11的表面⑴作輔敎、,由各散熱 熱鰭片11的片數即散孰’”、、,旦由於為了大量增加散 隙呈相當的窄雖ΓΓ使散熱轉片11彼此間的間 夂声面m,欠、熱源容易傳導到散熱轉片U的 ° 料法肖k 來散熱’因要借助方風扇,所 7助風扇 製造出一種散熱鰭片彼 订構心 ,^ F ^ ^ 之間隙呈由窄漸寬,於窄部形 成,£’於寬部形成較低溫區 對流,熱可快速的由畜 °卩向見邛形成一熱 範圍可更廣泛,是—可二作散熱之散熱器,且運用的 疋可作改進的課題。 【新型内容】 因此,本新型之主 勺,即在提供一種散熱鰭片彼 M308441 此間之間隙呈由窄漸寬,於窄部形成高溫區,☆寬部形成 較低溫區’形成_熱對流,熱可快速的由寬部向 之散熱器。 … 於疋,本新型一種散熱器,係在一座體的—面,以遠 離.亥座體的方向凸出設有複數片厚度由厚漸薄的散熱縫片 ’使,熱鰭片彼此間之間隙由座體的—面向著遠離的方向 乍斬免於乍部形成局溫區,於寬部形成較低溫區, 由乍p向成—熱對流’熱可快速的由寬部向外作散 熱者。 本新5L之功效能提供一種散熱器,可快速作散埶, 且運用的範圍可更廣泛者。 … 【實施方式】 有關本新型之前述及其他技術内容、特點與功效,在 以下配合參考圖式之二個較佳實施例的詳細說明中,將可 清楚的呈現。 ° 疋本新型政熱為的第一實施例,係在一座體2的 面20,以逐離該座體2的方向凸出設有複數片厚度由厚 漸薄的散熱鰭片21,使散熱鰭片21彼此間之間隙22,參考 圖3 ’由座體的一面2〇向著遠離的方向呈由窄漸寬,於窄 部=形成高溫區’於寬部221形成較低溫區,由窄部22〇 向寬部221形成一熱對流,熱可快速的由寬部向外作散熱 者,更詳細說明如后: μ 制名座體2 ’―般是採用高熱導材質,如「紹」質材質所 製程,具有第一面20及遠離第一面20的第二面23,由該 M308441 第-面20,以遠離座體2該第一面2〇的方向,凸出設有複 數片厚度由厚漸薄的散熱鰭片21,使散熱讀片⑴皮此間之 間隙22’由座體的-面2G向著遠離的方向呈由窄漸寬,配 合圖3,各散熱鰭片21具有一與第一面2〇連結之根部21〇 及一游離端部川,兩根部21〇間即為窄部咖之最窄部位 纖,本實施例各游離端部训為凸弧狀,最窄部屬為 凹弧狀’切於凸弧游離端部211的頂點有一水平假想上切線 Η,切於凹弧最窄部2200的底點有一水平假想下切線m, 而形成該間隙22的兩側緣,為前散熱鰭片21的第一斜側緣 :及後散熱籍片21,的第二斜側、㈣,定義第一斜側緣d、 第斜側緣D1與水平假想上切線H的交又點間之間距為間 审貝距a疋義第-斜側緣D、第二斜側緣⑴與水平假相 下切線m的交又點間之間距為間隙底距b,依實驗,間= 底距V間隙頂距…,75的散熱效果為較佳,但以; 〇·5為最佳。 = 、座體2的第—面23貼觸於—發熱體如上述電腦CPU (未顯旬,當熱源迅速由該第二面23經由座體2傳導至 :政熱㈣21 ’再配合圖3 ’熱大部份先聚集在凹弧最窄 部2200附近’即先前所稱的在窄部咖附近,形成一古、、田 當熱傳導至散熱韓片21的游離端部211附近由於有二 又巨離即在寬部221的熱度會遠低於在窄部220的熱产 ,熱氣往上升再配合間隙22的逐漸變寬,自然形成—向二 的熱對流,熱氣可快速的由寬部221向外作散熱者。 如圖4、圖5 ’是本新型散熱器的第二實施例,將該 M308441 座體2’作成大型,一側並樞設一關節24,方便作角度的調 整,並在該第二面23進一步的向内凹設有一容設空間23〇 ,於該容設空間230内並置組一具有複數排高功率(或稱高 瓦數)的LED燈組3,作為一路燈照射,該複數排高功率 的LED燈組3是包括於該容設空間23〇内,置組有一石墨 導熱板3 1,該石墨導熱板31的一面與該容設空間之壁面 2 3 1作貼觸,於5亥石墨導熱板31另一未貼觸面,並貼設有 一鋁質電路積板32,該鋁質電路積板32上並設有數排的 LED燈30,於各LED燈30上且對應設有一反射鏡33,於 該銘質電路積板32之周緣可封設有一防水圈34,蓋覆於紹 質電路積板32上有一蓋板35且定位各反射鏡33,該蓋板 35並封合容設空間230,採用防水圈34是防止雨水滲入容 δ又空間230内,藉由石墨導熱板3 1與該座體2,貼觸,使該 LED燈組3可作最佳的熱傳導於座體2,,如此,當複數排 高功率的LED燈30發光作照明時,其高熱可經由石墨導熱 板3 1傳$至座體2 ’並由散熱鰭片21 ’,以前述的對流的 方式作快速排出,作路燈使用時因為座體2,、散熱鰭片21, 都直接暴露於大氣中所以散熱效果佳,如果座體、複數排高 功率的LED燈組的LED燈皆製為小型,則可作為一普通的 檯燈來使用,當然防碰觸到座體2,、散熱鰭片21,與燈座3 是必要的考慮,而防水圈3 5此時並非絕對一定要的可將其 移除’因至内檯燈不必一定要考慮防水的,於此不再另繪圖 示意。 又上述的石墨導熱板31的設置也並非絕對一定要的可 M3 08441 將其移除,因為座豸2,本身就是―高熱,且蓋板% 是封合容設空間230,熱源充滿於容設空間23〇後可確實傳 導到座體2,作散熱,石墨導熱板31只是加強其導熱速度而 已〇 、”丁上所陳本新型確貫可因散熱籍片彼此間之間隙呈由 窄漸寬,於窄部形成高溫區,於寬部形成較低溫區,形成一 熱對流,可快速的由寬部向外作散熱。 、所述者,僅為本新型之較佳實施例而已,去 r· is 新型實施之範圍’即大凡依本新型申請專利 :及:型說明書内容所作之簡單的等效變化 專J 應仍屬本新型專利涵蓋之範圍内。 0 M308441 【圖式簡单說明】 圖1是習知散熱器的立體示意圖; ‘圖2是本新型散熱器第一實施例的立體示意圖; 圖3是圖2散熱部位的放大示意圖; 圖4是本新型散熱器第二實施例的立體分解示意圖; 及 圖5是圖4的組立圖。
10 M308441 【主要元件符號說明】 2、2, 座體 Η 水平假想上切線 20 座體第一面 HI 水平假想下切線 21 、 21, 厚度由厚漸薄 D 前散熱鰭片的第 的散熱鰭片 一斜側緣 210 散熱鰭片根部 D1 後散熱鰭片的第 211 散熱鰭片游離 二斜側緣 端部 a 間隙頂距 22 散熱鰭片彼此 b 間隙底距 間之間隙 220 間隙之窄部 2200 間隙之最窄部 221 間隙之寬部 23 座體第二面 230 容設空間 231 容設空間一面 24 關節 3 LED燈組 30 LED 燈 31 石墨導熱板 32 鋁質電路積板 33 反射鏡 34 防水圈 35 蓋板 11
Claims (1)
- M3 08441 九、申請專利範圍·· !.-種散熱器,係在一座體的一面,以遠離該座體的方向 凸出設有複數片厚度由厚漸薄的散熱轉片,使散熱續片 彼此=之間隙由座體的—面向著遠離的方向呈由窄漸寬 ’於窄部形成高溫區,於寬部形成較低溫區,由窄部向 寬部形成-熱對流’熱可快速的由寬部向外作散熱者者2·依據中請專利範圍第1項所述之散熱器,該散熱器是由 一铭質材質所製成。 3·依據f請專利範圍第1項或第2項所述之散熱器,各散 熱!曰片具有_與該座體_面連結之根部及—游離端部, ::艮:P間即為間隙之最窄部,各游離端部為凸弧狀,最 乍邛為凹弧狀,切於凸弧游離端部的頂點有一水平假想 上切線,切於凹弧最窄部的底點有一水平假想下切線了 形成該間隙的兩側緣,為前散熱鰭片的第一斜側緣及後 政熱鰭片的第二斜側緣,定義第一斜側緣、第二斜側緣 :水平假想上切線的交又點間之間距為間隙頂距,定義 第斜側緣、第二斜側緣與水平假想下切線的交又點間 之間距為間隙底距,間隙底距/間隙頂距$ 0.75的散 熱效果為較佳。 4.依據申請專利範圍第3項所述之散熱器,其中該間隙底 距/間隙頂距’以^ 0·5為可產生最佳的散熱效果。 據土申β月專利範圍第i項或第2項所述之散熱器,該座 體遠離該-面有一第二面,在該第二面,進—步的向 12
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW095207839U TWM308441U (en) | 2006-05-08 | 2006-05-08 | Heat sink |
US11/744,378 US20070258214A1 (en) | 2006-05-08 | 2007-05-04 | Heat-Dissipating Device with Tapered Fins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW095207839U TWM308441U (en) | 2006-05-08 | 2006-05-08 | Heat sink |
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TWM308441U true TWM308441U (en) | 2007-03-21 |
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TW095207839U TWM308441U (en) | 2006-05-08 | 2006-05-08 | Heat sink |
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US (1) | US20070258214A1 (zh) |
TW (1) | TWM308441U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421437B (zh) * | 2009-05-08 | 2014-01-01 | Foxconn Tech Co Ltd | 發光二極體燈具 |
CN109974334A (zh) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | 一种风冷型半导体制冷装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8434912B2 (en) | 2006-02-27 | 2013-05-07 | Illumination Management Solutions, Inc. | LED device for wide beam generation |
KR101156272B1 (ko) | 2006-02-27 | 2012-06-21 | 일루미네이션 매니지먼트 솔루션스 인코퍼레이티드 | 배열, 조명 설비 및 조사 장치 |
US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
WO2008144672A1 (en) | 2007-05-21 | 2008-11-27 | Illumination Management Solutions, Inc. | An improved led device for wide beam generation and method of making the same |
FR2926349B1 (fr) * | 2008-01-15 | 2013-12-27 | Jwr | Dispositifs d'eclairage a base de diodes electroluminescentes (led). |
BRPI0918716A2 (pt) | 2008-08-14 | 2015-12-01 | Cooper Technologies Co | dispositivos de diodo emissor de luz para a geracao de feixe largo offset |
MX2011005753A (es) | 2008-12-03 | 2011-11-18 | Illumination Man Solutions Inc | Una lámpara led de repuesto y un método de sustitución de luminarias preexistentes con ensamble de luminaria led. |
US8388198B2 (en) | 2010-09-01 | 2013-03-05 | Illumination Management Solutions, Inc. | Device and apparatus for efficient collection and re-direction of emitted radiation |
US20120211214A1 (en) * | 2010-12-09 | 2012-08-23 | Panasonic Avionics Corporation | Heatsink Device and Method |
US9140430B2 (en) | 2011-02-28 | 2015-09-22 | Cooper Technologies Company | Method and system for managing light from a light emitting diode |
EP2681484B1 (en) | 2011-02-28 | 2023-11-08 | Signify Holding B.V. | Method and system for managing light from a light emitting diode |
US8845129B1 (en) | 2011-07-21 | 2014-09-30 | Cooper Technologies Company | Method and system for providing an array of modular illumination sources |
US9080739B1 (en) | 2012-09-14 | 2015-07-14 | Cooper Technologies Company | System for producing a slender illumination pattern from a light emitting diode |
US9200765B1 (en) | 2012-11-20 | 2015-12-01 | Cooper Technologies Company | Method and system for redirecting light emitted from a light emitting diode |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3480294D1 (en) * | 1984-11-15 | 1989-11-30 | Japan Traffic Manage Tech Ass | Signal light unit having heat dissipating function |
US4899256A (en) * | 1988-06-01 | 1990-02-06 | Chrysler Motors Corporation | Power module |
JPH03222350A (ja) * | 1990-01-29 | 1991-10-01 | Hitachi Ltd | 樹脂封止形半導体装置及びその実装構造 |
US5552961A (en) * | 1995-05-18 | 1996-09-03 | Northern Telecom Limited | Electronic unit |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
EP0954210A1 (en) * | 1998-04-28 | 1999-11-03 | Lucent Technologies Inc. | Cooling electronic apparatus |
US6374912B1 (en) * | 1998-12-30 | 2002-04-23 | Lucent Technologies | Deep drawn enclosure with integrated heatsink and fastening details |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6577504B1 (en) * | 2000-08-30 | 2003-06-10 | Intel Corporation | Integrated heat sink for different size components with EMI suppression features |
KR100457220B1 (ko) * | 2002-02-27 | 2004-11-16 | 잘만테크 주식회사 | 칩셋 냉각용 히트싱크장치 |
TW566830U (en) * | 2003-04-11 | 2003-12-11 | Via Tech Inc | Side blowing type heat sink fin combination for electronic components |
US7180745B2 (en) * | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
TWM246689U (en) * | 2003-10-31 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat dissipation assembly |
US7196459B2 (en) * | 2003-12-05 | 2007-03-27 | International Resistive Co. Of Texas, L.P. | Light emitting assembly with heat dissipating support |
US7170751B2 (en) * | 2005-01-05 | 2007-01-30 | Gelcore Llc | Printed circuit board retaining device |
US7284882B2 (en) * | 2005-02-17 | 2007-10-23 | Federal-Mogul World Wide, Inc. | LED light module assembly |
KR100760750B1 (ko) * | 2005-06-08 | 2007-09-21 | 삼성에스디아이 주식회사 | 히트싱크 및 이를 구비한 플라즈마 디스플레이 장치 |
-
2006
- 2006-05-08 TW TW095207839U patent/TWM308441U/zh not_active IP Right Cessation
-
2007
- 2007-05-04 US US11/744,378 patent/US20070258214A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421437B (zh) * | 2009-05-08 | 2014-01-01 | Foxconn Tech Co Ltd | 發光二極體燈具 |
CN109974334A (zh) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | 一种风冷型半导体制冷装置 |
CN109974334B (zh) * | 2017-12-27 | 2024-01-16 | 宁波方太厨具有限公司 | 一种风冷型半导体制冷装置 |
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US20070258214A1 (en) | 2007-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |