200821499 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種以高功率發光二極體為光源的防 水燈具，特別是指一種具有散熱結構的防水燈具。 【先前技術】 參閱圖1，是發明人先前創作獲准的台灣專利證書號數 M291493專利案，為一種採用高功率發光二極體為光源的 防水燈具1，該防水燈具1具有一燈殼主體U、一散熱板 12，及一電路單元13。 該燈殼主體11具有一中空的燈罩ln，該散熱板12裝 ax在该燈罩111内而被該燈罩111内的數個凸階部112支撐 。該電路單元13安裝在該燈罩1U内，並具有一貼設於該 散熱板12上且佈設有印刷電路的鋁基板131，及數個連接 該鋁基板131的高功率發光二極體組件132。該等發光二極 體組件132發光時產生的熱，是藉由該鋁基板1M傳導至 該散熱板12上。該散熱板12藉由該等凸階部112小面積的 接觸導熱至該燈罩111，使該等發光二極體組件132散熱。 該防水燈具1雖然具有上述的散熱結構，然而該等凸 階部112與該散熱板12的接觸總面積小，於長時間使用的 狀況下，上述的散熱結構無法即時將熱由該鋁基板131傳 導至該燈罩111而散熱，導致熱聚積於該鋁基板131與該等 發光二極體組件132而縮短燈具1使用壽命。 【發明内容】 因此，本發明之目的，即在提供一種可以提高散熱效 200821499 果的具有散熱結構的防水燈具。 於是，本發明具有散熱結構的防水燈具是包含一燈殼 主體、一裝設於該容室的電路單元、一裝設於該容室的散 熱套環，及一防水封閉單元。 該燈殼主體包括一中空的燈罩，及一開放口，該燈罩 具有一界定出一容室的内圍繞壁，及數條由該内圍繞壁沿 徑向與軸向朝内延伸的階級肋條，每一階級肋條具有一朝 向該開放口的階級面。該電路單元包括一散熱板、一貼設 於該散熱板的基板、至少一設置於該基板上的高功率發光 二極體組件，及一驅動該高功率發光二極體組件發亮的驅 動電路組件，該散熱板具有一供該基板貼設的前端面，及 一與該前端面相背設置且與該等階級面抵接的後端面。 該政熱套環具有一圍繞該高功率發光二極體組件的内 %面、一與該内環面相背設置且貼近該等階級肋條的外環 面，及一連接該内、外環面且與該電路單元抵接的環底面 。該防水封閉單元具有—由該開放σ的—端封閉該容室的 透光片、一可將該透光片固定於該容室内的環蓋，及一夾 設於該環蓋與該透光片之間的防水墊圈。本發明的有益效 果在於：藉由該散熱套環加快該電路單元的散熱速度，以 提而散熱效果。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之三個較佳實施例的詳細說明中，將可 清楚的呈現。 6 200821499 在本發明被詳細描述之前，要注意的是，在以下的說 明内谷中’類似的元件是以相同的編號來表示。 如圖2、3、4所示，本發明具有散熱結構的防水燈具 之第一較佳實施例包含一燈殼主體2、一電路單元3、一散 熱套環4，及一防水封閉單元5。 該燈殼主體2包括一中空的燈蕈21、一開放口 22、一 支撐臂23，及一把手24。該燈罩21具有一内圍繞壁211、 一與該内圍繞壁211相背設置的外圍繞壁212、一被該内圍 繞壁211圍繞界定出的容室213、數條由該内圍繞壁211沿 徑向與軸向朝内延伸的階級肋條214，及數條由該外圍繞壁 212沿徑向與軸向朝外延伸而具有散熱功效的凸肋215。本 實施例中，該燈罩21是金屬材質製成。 母一階級肋條214具有一鄰近該開放口 22且朝向該容 至213的前肋接觸面216、一遠離該開放口 22且朝向該容 室213的後肋接觸面217，及一連接該前、後肋接觸面216 、217且朝向該開放口 22的階級面218。該後肋接觸面217 、該階級面218，及該前肋接觸面216依序是呈階級狀地逐 漸朝該内圍繞壁211靠近。該支撐臂23是用來支撐該燈罩 21，該把手24可供使用者調整該燈罩21的照射角度。 該電路單元3是裝設在該燈罩21的容室213内，包括 一散熱板31、一貼設於該散熱板31上且面積小於該散熱板 31的基板32、數個設置於該基板32上的高功率發光二極 體組件33,及一可驅動該高功率發光二極體組件33發亮的 驅動電路組件34。該散熱板31具有一朝向該開放口 22的 7 200821499 鈿面311、一與該前端面3 Π相背設置且與該等階級面 218抵接的後端面312，及一連接該前、後端面3η、312且 貼近該等前肋接觸面216的周面313。該前端面311具有一 供該基板32貼設的貼合部314，及一圍繞該貼合部314的 抵接環部315。 每一高功率發光二極體組件33具有一高功率發光二極 體 331 (High-Power Light Emitting Diode)，及一罩設於該 高功率發光二極體331外的一反射罩332 β本實施例中，該 散熱板31是金屬材質製成，該驅動電路組件34實質上是 -與電源連接且具有多數個電子元件的驅動電路板，該基 板32實質上是—紹基板。該縣板上可佈設印刷電路供該 等高功率發光二極體331、該驅動電路組件34電連接。本 實施例中，該驅動電路組件34與該後端面312之間、該等 反射罩332與該基板32皆是以一導熱膠35密著黏貼。 該散熱套環4是裝設在該燈罩21的容室213内，且與 該電路單元3抵接。該散熱套環4具有―圍繞該等高功率 發光二極體組件33的内環面41、一與該内環面41才目背設 置且貼近該前肋接觸面216的外環面42、-連接該内、外 環面41、42 1與該抵接環部化抵接的環底面43，及一連 接该内、外環面41、42且與該環底面43相反設置的環頂 面44。本實施例中，該散熱 . 去衣4疋一中空的薄形圓環柱 體，且由金屬材質製成。 該防水封閉單元5是用㈣_料Η錢本發明具 防水功效。該防水封閉單元 丹有一可封閉該容室213且 8 200821499 可透光的透光片51、一與該燈罩21鎖接且可將該遂光片 51固定於該容室213内的環蓋52,及一夾設於該環蓋52 與該透光片51之間的防水墊圈53。該透光片51是抵接於 該環頂面44及該等階級肋條214。 由物理學理論得知：熱可藉由傳導、對流，及輻射等 方式傳遞。當該等高功率發光二極體331發亮時將伴隨著 熱的產生，部分的熱將傳導至該基板32，並藉由該基板32 與該貼合面314的面接觸傳導至該散熱板31上，該散熱板 31的熱可由以下三條傳導路徑傳遞至該燈罩21 : 一、 該散熱板31的抵接環部315與該散熱套環4的環 底面43呈環形接觸，且該散熱套環4的外環面42與該前 肋接觸面216具有較大的接觸面積，因此，熱可以迅速地 經由該散熱套環4傳導至該燈罩21。 二、 該散熱板31的後端面312抵接於該燈罩21的階 、、及面218 ’所以該散熱板31部分的熱可藉由該後端面3 12 與該等階級面218小面積接觸而傳導至該燈罩21。 二、該散熱板31的周面313貼近該等前肋接觸面216 ’所以該散熱板31部分的熱可藉由該周面313與該等前肋 接觸面216小面積接觸而傳導至該燈罩21。本說明書的圖 4中，為使各元件可以清楚地區隔，該周面313與該等前肋 接觸面216之間、該外環面42與該前肋接觸面216之間皆 留有一小間隙以方便檢視及區隔。 值得說明的是，如圖5所示，若該基板32與該散熱板 31面積相同時，該基板32將完整貼合於該貼合部314、該 9 200821499 抵接裱部315，使該基板32的外周緣可與該散熱套環4的 %底面43直接接觸，該基板32上的熱將可迅速地直接傳 導至該散熱套環4散熱。 經由以上的說明，可以將本發明的優點歸納如下： 參閱圖4,藉由該散熱套環4的環底面43與該電路單 元3接觸，且該散熱套環4的外環面42與該等階級肋條 214的前肋接觸面216接觸傳導，相較於習知技術，本發明 的該散熱套環4提供了更大的接觸面積，使來自該電路單 元3的熱可快速地傳導散熱。 參閱圖6’是本發明的一第二較佳實施例，該第二較佳 實施例是類似於該第一較佳實施例，其差異之處在於： 該散熱套環4的㈣面41是圍繞且貼近該等高功率發 光二極體組件33，使該内、外環面41、42距離較遠，該散 熱套環4因此具有較大的厚度，此外，該散熱套環4更具 有數個由該環頂面44貫穿至該環底面（圖未示）的散熱孔 45。藉此，該散熱套環4與該散熱板31或基板32有更大 的接觸面積’可加快導熱的速度，而該等散熱孔45也具有 散熱功效而加快散熱速度。 參閱圖7,是本發明的一第三較佳實施例，該第三較佳 實施例是類似於該第二較佳實施例，其差里之 該散熱套環4更具有數個由該外環面42沿徑向與轴向 凸出的散熱塊46,鱗散聽46是貼近且接觸該燈罩21 的内圍繞壁211 ’使該散熱套環4也藉由該等散熱塊46與 該内圍繞壁211接觸，加大該散熱套環4與該燈罩。接觸 10 200821499 . 面積’進而加快散熱的速度。本說明書中，圖7中為使該 散熱套環4與該燈罩21可以清楚地區隔，該散熱套環4與 該燈罩21之間皆留有一小間隙以方便檢視及區隔。 歸納上述，本發明之具有散熱結構的防水燈具，藉由 該散熱套環4的環底面43與該基板32的直接或間接接觸 ’且該散熱套環4與該燈罩21的階級肋條214接觸，以加 快散熱速度，故確實能達到發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 •能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是現有一種防水燈具的一立體分解示意圖； 圖2是本發明具有散熱結構的防水燈具一第一較佳實 施例的立體分解示意圖； • 目3是該第一較佳實施例不包含-封閉防水單元的頂 視示意圖； 圖4是圖3中4 — 4割面線的剖視圖； ’ ® 5是-類似圖4的視圖，說明-基板與一散熱板具 有相同的面積，使一散熱套環與該基板直接接觸； 圖6是本發明具有散熱結構的防水燈具—第二較佳實 施例不包含該封閉防水單元的頂視示意圖；及 ，200821499 IX. Description of the Invention: [Technical Field] The present invention relates to a water-proof lamp using a high-power light-emitting diode as a light source, and more particularly to a waterproof lamp having a heat-dissipating structure. [Prior Art] Referring to Fig. 1, the inventor has previously created the approved Taiwan Patent Certificate No. M291493 patent, which is a waterproof lamp 1 using a high-power light-emitting diode as a light source, the waterproof lamp 1 having a lamp body U A heat sink 12 and a circuit unit 13. The lamp housing main body 11 has a hollow lamp cover ln, and the heat dissipation plate 12 is mounted in the lamp cover 111 and supported by a plurality of convex portions 112 in the lamp cover 111. The circuit unit 13 is mounted in the lamp cover 1U and has an aluminum substrate 131 attached to the heat dissipation plate 12 and provided with a printed circuit, and a plurality of high-power light-emitting diode assemblies 132 connected to the aluminum substrate 131. The heat generated when the light-emitting diode assembly 132 emits light is conducted to the heat dissipation plate 12 by the aluminum substrate 1M. The heat dissipation plate 12 is thermally conducted to the lamp cover 111 by a small area contact of the convex portions 112 to dissipate the light emitting diode assembly 132. The waterproof lamp 1 has the above-mentioned heat dissipation structure. However, the total contact area of the protrusions 112 and the heat dissipation plate 12 is small. Under the condition of long-term use, the heat dissipation structure cannot directly heat the aluminum substrate 131. The heat is transmitted to the lamp cover 111 to cause heat to accumulate on the aluminum substrate 131 and the light emitting diode assemblies 132 to shorten the service life of the lamp 1. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a waterproof light fixture having a heat dissipation structure that can improve the heat dissipation effect of 200821499. Therefore, the waterproof lamp having the heat dissipating structure of the present invention comprises a lamp body, a circuit unit mounted in the chamber, a heat dissipating ring mounted in the chamber, and a waterproof sealing unit. The lamp housing body includes a hollow lamp cover and an opening, the lamp cover has an inner surrounding wall defining a cavity, and a plurality of class ribs extending radially inward and axially from the inner surrounding wall. Each class rib has a class face that faces the open mouth. The circuit unit includes a heat dissipation plate, a substrate attached to the heat dissipation plate, at least one high-power light-emitting diode assembly disposed on the substrate, and a driving circuit for driving the high-power light-emitting diode assembly to illuminate And a heat dissipating plate having a front end surface to which the substrate is attached, and a rear end surface disposed opposite to the front end surface and abutting the level surfaces. The thermal jacket has an inner surface surrounding the high power LED assembly, an outer annular surface disposed opposite the inner annular surface and adjacent to the inner ribs, and a connecting inner and outer annular surfaces The bottom surface of the ring that abuts the circuit unit. The waterproof sealing unit has a light-transmissive sheet that closes the chamber from the end of the open σ, a ring cover that can fix the transparent sheet in the chamber, and a ring cover and the light-transmitting Waterproof gasket between sheets. The beneficial effect of the present invention is that the heat dissipation speed of the circuit unit is accelerated by the heat dissipation collar to improve the heat dissipation effect. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the drawings. 6 200821499 Before the present invention is described in detail, it is to be noted that in the following description, like elements are denoted by the same reference numerals. As shown in Figures 2, 3 and 4, a first preferred embodiment of the waterproof light fixture having a heat dissipating structure of the present invention comprises a lamp housing body 2, a circuit unit 3, a heat radiating collar 4, and a waterproof sealing unit 5. The lamp housing main body 2 includes a hollow lamp housing 21, an opening port 22, a support arm 23, and a handle 24. The lampshade 21 has an inner surrounding wall 211, an outer surrounding wall 212 disposed opposite the inner surrounding wall 211, a chamber 213 defined by the inner surrounding wall 211, and a plurality of strips 211 along the inner surrounding wall 211. The ribs 214 extend radially and axially inwardly, and a plurality of ribs 215 extending radially outwardly from the outer surrounding wall 212 to provide heat dissipation. In the embodiment, the lamp cover 21 is made of a metal material. The female first-class rib 214 has a front rib contact surface 216 adjacent to the opening 22 and facing the receiving portion 213, a rear rib contact surface 217 away from the opening 22 and facing the chamber 213, and a connecting front, The rear rib contact faces 216, 217 and face the level face 218 of the open port 22. The rear rib contact surface 217, the level surface 218, and the front rib contact surface 216 are progressively stepped toward the inner surrounding wall 211 in a stepwise manner. The support arm 23 is for supporting the lamp cover 21, and the handle 24 is for the user to adjust the illumination angle of the lamp cover 21. The circuit unit 3 is disposed in the chamber 213 of the lamp cover 21, and includes a heat dissipation plate 31, a substrate 32 attached to the heat dissipation plate 31 and having a smaller area than the heat dissipation plate 31, and a plurality of the substrate 32 disposed on the substrate 32. The upper power LED assembly 33 and a drive circuit assembly 34 that can drive the high power LED assembly 33 to illuminate. The heat dissipating plate 31 has a bottom surface 311 facing the opening 22, a rear surface 312 disposed opposite to the front end surface 3 且 and abutting the same surface 218, and a front end and a rear end surface connected thereto. 3η, 312 and close to the circumferential surface 313 of the front rib contact surface 216. The front end surface 311 has a bonding portion 314 to which the substrate 32 is attached, and an abutting ring portion 315 surrounding the bonding portion 314. Each of the high-power LED assemblies 33 has a high-power light-emitting diode 331 and a reflector 332 that is disposed outside the high-power LED 331. For example, the heat dissipation plate 31 is made of a metal material, and the drive circuit assembly 34 is substantially a drive circuit board that is connected to a power source and has a plurality of electronic components. The substrate 32 is substantially a substrate. The county board can be provided with printed circuits for electrically connecting the high power light emitting diodes 331 and the driving circuit assembly 34. In this embodiment, between the driving circuit assembly 34 and the rear end surface 312, the reflective cover 332 and the substrate 32 are adhered to each other by a thermal conductive adhesive 35. The heat dissipation collar 4 is mounted in the chamber 213 of the globe 21 and abuts against the circuit unit 3. The heat-dissipating collar 4 has an inner annular surface 41 surrounding the high-power light-emitting diode assembly 33, an outer annular surface 42 disposed adjacent to the inner annular surface 41 and adjacent to the front rib contact surface 216, a ring bottom surface 43 connecting the inner and outer annular surfaces 41, 42 1 and the abutting ring portion, and a ring top surface 44 connecting the inner and outer annular surfaces 41, 42 opposite to the ring bottom surface 43 . In this embodiment, the heat dissipation is performed by peeling off a hollow thin annular cylinder and made of a metal material. The waterproof sealing unit 5 is waterproof with the invention according to (4). The waterproof sealing unit has a light-transmissive sheet 51 which can close the chamber 213 and 8 200821499, and a ring cover 52 which is locked with the lamp cover 21 and can fix the calender sheet 51 in the chamber 213. And a waterproof gasket 53 interposed between the ring cover 52 and the light transmissive sheet 51. The light transmissive sheet 51 abuts against the ring top surface 44 and the class ribs 214. It is known from physics that heat can be transferred by conduction, convection, and radiation. When the high-power light-emitting diodes 331 are illuminated, heat is generated, and part of the heat is transmitted to the substrate 32, and is conducted to the heat-dissipating plate by the surface contact of the substrate 32 with the bonding surface 314. The heat of the heat dissipation plate 31 can be transmitted to the lamp cover 21 by the following three conduction paths: 1. The abutment ring portion 315 of the heat dissipation plate 31 is in annular contact with the ring bottom surface 43 of the heat dissipation collar 4, and the heat dissipation sleeve The outer annular surface 42 of the ring 4 has a large contact area with the front rib contact surface 216, so that heat can be quickly conducted to the globe 21 via the heat dissipation collar 4. 2. The rear end surface 312 of the heat dissipation plate 31 abuts against the step of the lamp cover 21 and the surface 218 ′. Therefore, the heat of the heat dissipation plate 31 can be contacted with the lower surface of the class surface 218 by the rear end surface 3 12 . Conducted to the shade 21. The peripheral surface 313 of the heat dissipation plate 31 is adjacent to the front rib contact surface 216 ′. Therefore, the heat of the heat dissipation plate 31 can be transmitted to the lampshade by the small surface contact of the circumferential surface 313 with the front rib contact surface 216 . twenty one. In Fig. 4 of the present specification, in order to clearly distinguish the components, a small gap is left between the circumferential surface 313 and the front rib contact surfaces 216, and between the outer annular surface 42 and the front rib contact surface 216. For easy viewing and separation. It should be noted that, as shown in FIG. 5 , when the substrate 32 and the heat dissipation plate 31 have the same area, the substrate 32 will be completely attached to the bonding portion 314 and the 9 200821499 abutting the dam portion 315 to make the substrate The outer periphery of 32 can be in direct contact with the % bottom surface 43 of the heat-dissipating collar 4, and the heat on the substrate 32 can be quickly transferred directly to the heat-dissipating collar 4 for heat dissipation. Through the above description, the advantages of the present invention can be summarized as follows: Referring to FIG. 4, the ring bottom surface 43 of the heat dissipation collar 4 is in contact with the circuit unit 3, and the outer ring surface 42 of the heat dissipation collar 4 and the like The front rib contact surface 216 of the class rib 214 is in contact with conduction. Compared to the prior art, the heat sink collar 4 of the present invention provides a larger contact area, so that heat from the circuit unit 3 can quickly conduct heat. Referring to FIG. 6 is a second preferred embodiment of the present invention, the second preferred embodiment is similar to the first preferred embodiment, and the difference is that: the (four) face 41 of the heat dissipation collar 4 is Surrounding and close to the high-power light-emitting diode assemblies 33, the inner and outer annular surfaces 41, 42 are far apart, and the heat-dissipating collar 4 thus has a large thickness. In addition, the heat-dissipating collar 4 has a plurality of The heat dissipation holes 45 are penetrated from the top surface 44 of the ring to the bottom surface of the ring (not shown). Thereby, the heat-dissipating ring 4 has a larger contact area with the heat-dissipating plate 31 or the substrate 32, which can speed up the heat conduction, and the heat-dissipating holes 45 also have a heat-dissipating effect to accelerate the heat-dissipating speed. Referring to FIG. 7, which is a third preferred embodiment of the present invention, the third preferred embodiment is similar to the second preferred embodiment, and the heat-dissipating collar 4 has a plurality of The heat dissipating block 46 protrudes from the annular surface 42 in the radial direction and the axial direction, and the scaled sound 46 is in close contact with the inner surrounding wall 211 ′ of the lamp cover 21 so that the heat dissipating ring 4 is also passed through the heat dissipating block 46 The heat-dissipating collar 4 and the lampshade are enlarged by contact around the wall 211. Contact 10 200821499 . Area 'and thus speed up the heat dissipation. In the present specification, in FIG. 7, the heat-dissipating collar 4 and the lampshade 21 are clearly separated, and a small gap is left between the heat-dissipating collar 4 and the lampshade 21 to facilitate inspection and separation. In summary, the waterproof lamp having the heat dissipation structure of the present invention is in direct or indirect contact with the substrate 32 by the ring bottom surface 43 of the heat dissipation collar 4 and the heat dissipation collar 4 is in contact with the class rib 214 of the lamp cover 21, In order to speed up the heat dissipation, it is indeed possible to achieve the purpose of the invention. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the patent application scope and the description of the invention is Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a conventional waterproof light fixture; FIG. 2 is a perspective exploded view of a waterproof light fixture having a heat dissipation structure according to a first preferred embodiment of the present invention; A preferred embodiment does not include a top view of the enclosed waterproof unit; FIG. 4 is a cross-sectional view of the 4-4 cut line in FIG. 3; '®5 is - a view similar to FIG. 4, illustrating that the substrate has the same shape as a heat sink The area is such that a heat-dissipating ring is in direct contact with the substrate; FIG. 6 is a top view of the waterproof light-emitting device of the present invention having a heat-dissipating structure - the second preferred embodiment does not include the closed waterproof unit;
圖7是本發明具有散熱結構的防水燈具—第三較俨杏 施例不包含該封閉防水單元的頂視示意圖。 乂土K 11 200821499FIG. 7 is a top view of the waterproof light fixture of the present invention having a heat dissipating structure - the third comparative apricot embodiment does not include the closed waterproof unit. Bauxite K 11 200821499
【主要元件符號說明】 2 ··…燈殼主體 315.· 抵接環部 21…燈罩 32…. 基板 211 ··内圍繞壁 3 3…·高功率發光二極體組件 212··外圍繞壁 331 - 高功率發光二極體 213…容室 332·· 反射罩 214··階級肋條 34····驅動電路組件 215··凸肋 35·"· 導熱膠 216 - ·前肋接觸面 4 •… 散熱套環 217··後肋接觸面 41 *… 内環面 218 -階級面 42··.· 外環面 22…開放口 43…· 環底面 23…支撐臂 44*“* 環頂面 24…把手 45 — 散熱孔 3 ··…電路單元 46…· 散熱塊 31…散熱板 5…·· 防水封閉單元 3 11 * •前端面 51···· 透光片 312"後端面 52·… 環蓋 3 13 "周面 53···· 防水墊圈 3 14 ··貼合部 12[Description of main component symbols] 2 ··· Lamp housing main body 315.· Abutting ring part 21... Lamp cover 32.... Substrate 211 ·· Inner surrounding wall 3 3...·High-power LED assembly 212··Outer surrounding wall 331 - High-power light-emitting diode 213... chamber 332·· Reflector 214··Class rib 34····Drive circuit assembly 215·· rib 35·"· Thermal paste 216 - Front rib contact surface 4 •... Heatsink collar 217··Back rib contact surface 41 *... Inner ring surface 218 - Class surface 42··.· Outer ring surface 22... Open port 43...· Ring bottom surface 23... Support arm 44*”* Ring top surface 24...handle 45 - heat dissipation hole 3 ··...circuit unit 46...·heat dissipation block 31...heat dissipation plate 5...·waterproof sealing unit 3 11 *• front end surface 51···· light transmissive sheet 312" rear end surface 52·... Ring cover 3 13 "Circumferential surface 53···· Waterproof gasket 3 14 ··Fitting part 12