JP2014170675A - Illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a base and a case where a semiconductor light-emitting element is disposed with a distance away from a ceiling, to radiate heat from the semiconductor light-emitting element to the surroundings efficiently, and to secure space for a power supply path from a power source to the light emitting element, with a simple device configuration, in an illumination device having the semiconductor light-emitting element and mounted on the ceiling and the like.SOLUTION: An illumination device 1 includes: a module plate 10; a plurality of light-emitting modules 20 arranged in front of the module plate 10; and a support pipe 30 extending backward from a central part of the module plate 10. The support pipe 30 is formed by a material having satisfactory heat conductivity, and a front end part 31 is bonded with the central part of the module plate 10. A rear end part 32 of the support pipe 30 is bonded being inserted into an insertion port 72 of a fitting part 70, and the rear end part 32 of the support pipe 30 is fixed at a building material 100 such as a ceiling and the like. A hollow part inside the support pipe 30 is a passage where wiring 90a and 90b for power supply is inserted.

Description

  The present invention relates to a lighting device including a semiconductor light emitting element such as an LED (light emitting diode).

2. Description of the Related Art In recent years, lighting devices including semiconductor light emitting elements such as LEDs as light sources have been adopted.
As an example thereof, as disclosed in Patent Document 1, a plurality of light emitting modules mounted with LED light emitting elements are arranged on the front surface of a module plate serving as a base, and light from the plurality of LEDs is respectively There is an illuminating device adapted to be emitted forward. In such an illumination device, since the semiconductor light emitting element generates heat during driving, a heat dissipation structure using a heat sink is employed. Specifically, a heat sink having fins is attached to the back side of the base, and a case is provided so as to cover the heat sink. These heat sinks and cases are formed of a material having high thermal conductivity.

  Such an illuminating device is formed in the same external shape as an existing HID (High Intensity Discharge) lamp, and power is often supplied via a base socket and a base. As an alternative to the HID lamp, it is used by being attached to a gymnasium, a factory, a ceiling surface of a warehouse, or the like. In attaching the lighting device, a method of holding the case with a support member or the like and attaching the support member to a ceiling surface or the like is employed.

JP2012-14900A

As described above, a lighting device that is an alternative to HID is required to satisfy the following functions.
1. A base or case on which a semiconductor light emitting element is arranged is held at an appropriate distance from a construction material such as a ceiling.
2. The heat from the semiconductor light emitting element is efficiently radiated to the surroundings.

3. A space for the power supply path from the power source to the light emitting module is secured.
It is desirable to make the device configuration as simple as possible.
It is an object of the present invention to provide an illuminating device having the above-described function with the simplest possible configuration under such a background.

  In order to achieve the above object, a lighting device according to one embodiment of the present invention includes a semiconductor light emitting element, a base on which the semiconductor light emitting element is disposed on one surface, and the other surface of the base. A heat sink, a case disposed so as to cover the heat sink, and a support pipe having one end joined to the base and extending from the other surface of the base and extending through the case. The pipe is made of a heat conductive material, a wiring for supplying power to the semiconductor light emitting element is inserted, and an attachment portion attached to the construction material is provided at the other end of the support pipe.

In the above illumination device, the following may be performed.
The base is plate-shaped, one end of the support pipe is joined to the center of the base, and a plurality of semiconductor light emitting elements are arranged around the center of the base.
A heat sink is joined to the other surface of the base.
The case is provided with a cylindrical portion extending from the outer edge of the base to the other surface side, and a top plate portion that closes the opening on the other surface side of the cylindrical portion, and the support pipe penetrates the top plate portion. And it is set as the structure joined to the top-plate part in the said penetration part.

According to the illumination device of the above aspect, the support pipe has the following functions.
That is, the support pipe is joined to the base and extends rearward from the base, and has a mounting portion attached to the construction material at the rear end thereof. Can be held at an appropriate distance from the construction material.
Further, since the support pipe is formed of a heat conductive material, it becomes a path for efficiently transferring heat from the base on which the light emitting module is disposed to the construction material.

Moreover, since the wiring which supplies electric power to each light emitting module is penetrated by the support pipe, the space of the electric power supply from a power supply to a light emitting module can be ensured inside a support pipe.
Therefore, it is possible to satisfy the plurality of functions mentioned in the above problem with a simple apparatus configuration.

The external appearance perspective view which looked at the illuminating device 1 concerning embodiment from the back side. The external appearance perspective view which looked at the illuminating device 1 concerning embodiment from the front side. The exploded perspective view of the illuminating device 1. FIG. FIG. 3 is a partially cutaway sectional view of the lighting device 1. FIG. 3 is a schematic cross-sectional view illustrating the effect of the lighting device 1. The top view (a) which looked at the illuminating device 1 from the front, and the figure (b) which shows the structure of the light emitting module 20 and the socket 24. FIG. The figure which shows the modification of the illuminating device 1. FIG.

[Background to Invention]
In this type of lighting device, as described above, when attaching to a construction material such as a ceiling, a method is employed in which the case is held by a support member and the support member is attached to the ceiling surface or the like. In that case, part of the heat generated in the light emitting module is radiated to the construction material via the case and the support member.

However, since LED lamps that can replace HID lamps have high output and a large amount of heat generation, it is desirable to efficiently radiate heat from a light emitting module to a construction material or the like.
Then, this inventor noticed that the heat radiation from a module plate to a building material can be performed efficiently by attaching a module plate to a building material directly via a support pipe. In addition, by installing the support pipe in this way, the module plate can be supported at a distance from the construction material, and further, the internal space of the support pipe is used as a space for inserting a wiring for supplying power to the light emitting module. I found that it can be used.

The present invention pays attention to the fact that by providing the support pipe with a plurality of functions necessary for the lighting device in this way, the lighting device can be satisfied with the functions required for the lighting device while having a simple configuration. Arrived.
[Embodiment]
Hereinafter, an illumination device according to an embodiment will be described with reference to the drawings.

(Overall configuration of lighting device 1)
1-4, the direction shown by the arrow Y is the back, and the opposite direction is the front. In the illuminating device 1, light is mainly emitted forward.
As illustrated in FIGS. 1 to 4, the lighting device 1 includes a module plate 10, a plurality of light emitting modules 20 disposed on the front surface of the module plate 10, and a support pipe 30 extending rearward from the center of the module plate 10. Yes.

In the lighting device 1, an inner heat sink 40 and an outer heat sink 50 are attached to the rear surface of the module plate 10.
The inner heat sink 40 has a plurality of heat radiation fins 42, and the outer heat sink 50 also has a plurality of heat radiation fins 52. Thereby, a plurality of heat radiation fins 42 and 52 extending rearward from the module plate 10 are disposed so as to surround the periphery of the support pipe 30.

Further, in the lighting device 1, a case 60 is attached that extends rearward from the outer edge of the module plate 10 and surrounds the inner heat sink 40 and the outer heat sink 50.
The support pipe 30 extends rearward through the case 60. And the attachment part 70 which is a member for attaching the support pipe 30 to the construction material 100 (refer FIG. 5) is mounted | worn with the rear-end part 32 of the support pipe 30. As shown in FIG.

A cover 80 that covers the plurality of light emitting modules 20 is attached to the front surface of the module plate 10.
Wirings 90 a and 90 b for supplying power to the plurality of light emitting modules 20 are inserted into the support pipe 30.
As shown in FIG. 5, the lighting device 1 is attached to a construction material 100 (a gymnasium, a factory, a ceiling of a warehouse, etc.), and is used as a lighting device instead of an HID lamp.

Each component of the illuminating device 1 is demonstrated below.
(Module plate 10)
The module plate 10 is a thermally conductive material (a disk-shaped member formed of a material having high thermal conductivity. Examples of the thermally conductive material include metals such as aluminum and magnesium. A fitting hole 11 is formed in the center of the plate 10 to fit the front end 31 of the support pipe 30.

On the front surface of the module plate 10, a module mounting region 12 for securing a plurality (six) of light emitting modules 20 around the fitting hole 11 is secured, and a plurality of vent holes 13 are provided around the outer periphery of the module plate 10. Along the direction, they are arranged in an annular shape.
Each air hole 13 is formed by cutting out the plate material of the module plate 10, and a bridge 14 is formed between the air holes 13.

The diameter of the module plate 10 is, for example, 260 mm, and the plate thickness is, for example, 1.0 to 5.0 mm.
(Light Emitting Module 20)
A plurality (six) of light emitting modules 20 are fixed in an annular shape in the module mounting region 12. These light emitting modules 20 are arranged at an angle of 60 ° around the fitting hole 11 as shown in FIG.

Each light emitting module 20 includes a substrate 21 and a light emitting unit 22 formed on the substrate 21 as shown in FIG.
The substrate 21 is formed of, for example, alumina or aluminum material, and a wiring pattern (not shown) for supplying power to the light emitting unit 22 is formed on the surface of the substrate 21.
The light emitting unit 22 includes a plurality of (for example, 132) COB (Chip on Board) type LEDs 23 mounted on the substrate 21 and a sealing layer including a phosphor arranged to cover the LEDs 23. Has been. And a part of blue light radiated | emitted from LED23 is converted into light of a comparatively long wavelength with fluorescent substance, and white light is radiated | emitted by mixing with blue light.

Each light emitting module 20 is attached to the module attachment region 12 of the module plate 10 while being thermally coupled.
Specifically, as shown in FIG. 6B, each light emitting module 20 is covered with a socket 24 having quick connection terminals 24a and 24b. Since the socket 24 is screwed to the module plate 10, the light emitting module 20 is fixed in a state of being pressed against the front surface of the module plate 10. Therefore, the quick connection terminals 24 a and 24 b of the socket 24 are connected to the light emitting module 20. Are connected to the anode terminal 25a and the cathode terminal 25b. Further, the heat generated from the light emitting module 20 is efficiently transferred to the module plate 10.

(Support pipe 30)
The support pipe 30 is a straight pipe formed of a material having good heat conductivity. Examples of the material of the support pipe 30 include a metal such as stainless steel, or a resin having good heat conductivity (a heat conductive resin obtained by mixing carbon or the like with a resin).
The front end portion 31 of the support pipe 30 is fitted in the fitting hole 11 and joined to the module plate 10. Specifically, the front end portion 31 of the support pipe 30 is inserted into the fitting hole 11 of the module plate 10 and is joined by caulking the front end portion 31 to the edge of the fitting hole 11.

On the other hand, the rear end portion 32 of the support pipe 30 is joined to the attachment portion 70 while being inserted into the insertion port 72 of the attachment portion 70.
As described above, the support pipe 30 has a function of supporting the module plate 10 and serves as a passage that conducts heat from the module plate 10 to the mounting portion 70 satisfactorily. Further, the hollow portion inside the support pipe 30 is a passage through which the wires 90a and 90b are inserted.

The length of the support pipe 30 is about the same as or higher than the height of the case 60 and is, for example, about 30 cm to 40 cm.
The strength increases as the outer diameter and thickness of the support pipe 30 increase. In addition, the larger the outer diameter and the wall thickness, the larger the cross-sectional area, so that the heat transfer efficiency is improved and the temperature of the module plate 10 can be reduced. However, the weight increases. It may be determined within a range.

When the support pipe 30 is made of metal, for example, the support pipe 30 has an outer diameter of 27 mm and a thickness of about 1 mm to 3 mm.
(Inner heat sink 40, outer heat sink 50)
The inner heat sink 40 includes an annular support portion 41 joined to the rear surface of the module plate 10 around the support pipe 30 and a plurality of strip-shaped heat radiation fins 42 extending rearward from the outer peripheral portion of the support portion 41. Has been. The outer heat sink 50 includes an annular support portion 51 joined to the rear surface of the module plate 10 around the support portion 41, and a plurality of strip-shaped heat radiation fins 52 extending rearward from the outer peripheral portion of the support portion 51. Has been. The support portion 41 and the support portion 51 are fastened to the module plate 10 with rivets or screws.

The plurality of radiating fins 42 surround the support pipe 30 and extend in parallel with the support pipe 30, and the plurality of radiating fins 52 surround the outside and extend in parallel with the support pipe 30.
As with the module plate 10, the inner heat sink 40 and the outer heat sink 50 are formed of a material having high thermal conductivity (for example, a metal such as aluminum).

Each of the radiation fins 42 and 52 is inclined at a certain angle (for example, 45 °) with respect to the radial direction from the central axis of the support pipe 30 when viewed in plan from the Y direction.
(Case 60)
As shown in FIGS. 1 to 4, the case 60 includes a cylindrical tubular portion 61 that extends rearward from the outer edge of the module plate 10, and a top plate portion 62 that closes the opening on the rear end side of the tubular portion 61. The cylindrical portion 61 surrounds the outside of the heat radiating fins 52. The front end portion 61a of the cylindrical portion 61 is opened, and the module plate 10 is attached thereto.

The cylindrical portion 61 and the module plate 10 are fixed by caulking the front end portion 61 a of the cylindrical portion 61 to the outer edge portion 15 of the module plate 10.
A through hole 63 through which the support pipe 30 passes is formed in the center of the top plate portion 62. The edge of the through hole 63 in the top plate portion 62 is joined to the support pipe 30.
For this joining, for example, a pipe clamp may be installed at the edge of the through hole 63 in the top plate portion 62 and fastened to the support pipe 30 with the pipe clamp, or the edge of the through hole 63 may be bonded with an adhesive. The support pipe 30 may be joined.

The case 60 is also formed of a heat conductive material (for example, a metal such as aluminum or magnesium, or a heat conductive resin obtained by mixing carbon with a resin).
A plurality of vent holes 64 are formed from the rear end side of the cylindrical portion 61 in the case 60 to the top plate portion 62. Each air hole 64 is formed by forming a cut in the plate material of the case 60 and bending it inward.

In addition, a plurality of beads 65 are formed in the tubular portion 61 at regular intervals by pressing, thereby increasing the strength of the tubular portion 61.
The diameter of the front end 61 a of the case 60 is equal to the diameter of the module plate 10. The height of the case 60 in the Y direction is, for example, 270 mm, and the plate thickness is, for example, 1 mm.
(Mounting part 70)
As shown in FIG. 5, the attachment portion 70 has a function of fixing the rear end portion 32 of the support pipe 30 to a construction material 100 such as a ceiling.

As shown in FIGS. 1 to 4, the mounting portion 70 includes a pedestal portion 71 having a frustoconical external shape whose diameter increases rearward, and a rear end portion 32 of the support pipe 30 provided on the front end side of the pedestal portion 71. And a flange portion 73 provided on the rear end side of the pedestal portion 71.
Then, the rear end portion 32 of the support pipe 30 is inserted into the insertion port 72 and fixed. This fixing is performed by, for example, a method of fastening with a screw passing through the insertion port 72 and the support pipe 30 or a method of bonding with an adhesive.

The mounting portion 70 is also formed of a heat conductive material like the support pipe 30.
Here, since the internal space of the insertion port 72 communicates with the internal space of the pedestal portion 71, the internal space of the support pipe 30 inserted into the insertion port 72 and the internal space of the pedestal portion 71 also communicate with each other.
A plurality of insertion holes 74 are formed in the flange portion 73. When fixing the attachment portion 70 to the construction material 100 with screws, the flange portion 73 is fixed to the construction material 100 by inserting a screw through the insertion hole 74 and screwing it into the construction material.

(Cover 80)
The cover 80 is mounted so as to cover the plurality of light emitting modules 20 disposed on the front surface of the module plate 10 as a whole.
The cover 80 has a Fresnel lens structure, collects the light emitted from the plurality of light emitting modules 20 and emits the light forward.

The cover 80 is formed by injection-molding a transparent resin material such as acrylic resin, polyethylene terephthalate, or polycarbonate.
The cover 80 is fixed to the front surface of the module plate 10 by bonding or screwing.
(Wiring for power supply)
As shown in FIG. 5, the power supply wirings 90 a and 90 b are connected to the module from the power supply unit (not shown) through the through hole 101 of the construction material 100, the internal space of the mounting portion 70, and the internal space of the support pipe 30. The plate 10 extends to the fitting hole 11.

The lead wires 91a and 91b are branched from the wires 90a and 90b, and the tips of the branched lead wires 91a and 91b are connected to the quick connection terminals 24a and 24b.
The wires 90a and 90b and the lead wires 91a and 91b are heat-resistant wires, and for example, a crosslinked polyethylene insulated wire, a silicone rubber insulated wire, a fluororesin insulated wire, a silicone glass heat-resistant wire, or the like is used.

Power is supplied from the power supply unit to each light emitting module 20 with a direct current via the power supply wirings 90a and 90b and the lead wires 91a and 91b.
The power consumption in each light emitting module 20 is, for example, 100W to 200W.
When each light emitting module 20 is driven, the LED 23 emits light, and the light emitted from the light emitting unit 22 passes through the cover 80 and is emitted to the front of the lighting device 1.

(Effects of lighting device 1)
According to the illuminating device 1, the support pipe 30 has the following functions.
1. The support pipe 30 is joined to the module plate 10, extends backward from the module plate 10, and a rear end portion 32 is attached to the building material 100 via the attachment portion 70.

Further, the front end portion 61a of the case 60 is joined to the outer edge portion 15 of the module plate 10, and the top plate portion 62 of the case 60 is also joined to the support pipe 30 penetrating therethrough.
Therefore, the support pipe 30 has a function of holding the module plate 10 and the case 60 at an appropriate distance from the construction material 100 in the front.
2. Since the support pipe 3 and the attachment part 70 are formed of a heat conductive material, they serve as a path for efficiently transferring heat from the module plate 10 on which the light emitting module 20 is disposed to the construction material 100.

3. The support pipe 30 is inserted with wirings 90a and 90b for supplying power to each light emitting module 20. That is, a space for a power supply path from the power supply unit to the light emitting module 20 is secured in the support pipe 30.
Therefore, in the lighting device 1, the light emitting module 20 and the case 60 are held with a comparatively simple device configuration, the heat generated in the light emitting module 20 is efficiently radiated to the surroundings, and power is supplied from the power source to the light emitting module 20. A road can be secured.

Here, with reference to FIG. 5, a path through which heat generated in the light emitting module 20 in the lighting device 1 is radiated will be described in more detail.
In FIG. 5, the white arrow A is transmitted from the light emitting module 20 to the front end portion 31 of the support pipe 30 via the module plate 10, and further to the rear of the support pipe 30, and to the construction material 100 via the attachment portion 70. The path of the released heat is shown.

In FIG. 5, white arrows B indicate heat paths that are transmitted from the light emitting module 20 to the heat radiation fins 42 and 52 through the module plate 10 and discharged from the heat radiation fins 42 and 52 to the outside.
Since the support portions 41 and 51 on the front end side of the radiation fins 42 and 52 are joined to the rear surface of the module plate 10, heat is efficiently transferred from the light emitting module 20 to the radiation fins 42 and 52 via the module plate 10. .

A white arrow D indicates air that flows from the outside through the vent hole 13, flows through the inside of the case 60, and flows to the outside through the vent hole 64. By this air flow D, heat is efficiently radiated from the radiation fins 42 and 52 to the outside.
In FIG. 5, a white arrow C indicates a path of heat that is transmitted from the light emitting module 20 to the case 60 via the module plate 10 and released to the outside.

Thus, in the illuminating device 1, since the heat | fever which generate | occur | produces in the light emitting module 20 is discharge | released outside the apparatus through the several path | route shown by white arrow AC, it is excellent in heat dissipation.
In particular, the support pipe 30 is formed of a thermally conductive material and linearly connects the central portion of the module plate 10 and the construction material 100. Therefore, as shown by the white arrow A, the support pipe 30 is A large amount of heat can be radiated to the construction material 100 via the route. Therefore, in the lighting device 1, the support pipe 30 greatly contributes to radiating the heat generated in the light emitting module 20.

In addition, since the plurality of light emitting modules 20 are arranged around the support pipe 30 and each light emitting module 20 is located close to the support pipe 30, this point also transfers heat from each light emitting module 20 to the support pipe 30. It contributes to make it easier.
(Variations, etc.)
1. In the lighting device 1, the COB type LED is mounted on the light emitting module 20, but the same can be implemented using a light emitting module mounted with an SMD type LED. Further, as a semiconductor light emitting element mounted on the light emitting module, an LD (laser diode), an EL element (electric luminescence element), or the like may be used in addition to the LED.

2. In the lighting device 1, the support pipe 30 is configured by a single pipe material, but the support pipe 30 may be configured by jointly connecting a plurality of pipe materials. Thereby, the length of the support pipe 30 can be changed as needed.
Moreover, in the illuminating device 1, the support pipe 30 may be square cylinder shape which was cylindrical shape.

  3. In the lighting device 1, the support pipe 30 has a straight tube shape, but may be bent or curved. For example, as shown in FIGS. 7A and 7B, the support pipe 30 is bent into an L shape, or as shown in FIG. 7C, the support pipe 30 is bent into an S shape or a crank shape. It may be. Similarly, when the support pipe 30 has such a shape, heat can be efficiently radiated from the light emitting module 20 to the construction material 100.

4). In the lighting device 1, the support pipe 30 is connected to the central portion of the module plate 10, but the position where the support pipe 30 is connected to the module plate 10 is not necessarily the central portion of the module plate 10.
For example, the front end portion of the support pipe 30 may be connected to a position off the central portion of the module plate 10, and in this case as well, heat can be efficiently radiated from the light emitting module 20 to the construction material 100.

5. In the lighting device 1, the module plate 10 has a circular shape and the case 60 has a cylindrical shape, but the module plate has a polygonal shape such as a square, a pentagon, and a hexagon, and the case has a polygonal cylindrical shape. Good.
6). In the lighting device 1, the inner heat sink 40 and the outer heat sink 50 are configured to have heat radiation fins, but the heat sink is not limited to the configuration including the heat radiation fins. For example, the heat sink may be configured to include heat radiation pins and heat pipes instead of the heat radiation fins.

  7). The lighting device 1 can also be applied to spotlights, downlights, etc., as well as HID alternative lighting devices attached to gymnasiums, factories, warehouse ceilings, and the like.

1 Lighting device 10 Module plate 13 Vent hole 20 Light emitting module 21 Substrate 22 Light emitting part 23 LED
30 support pipe 31 front end portion 32 rear end portion 40 inner heat sink 42 heat radiating fin 50 outer heat sink 52 heat radiating fin 60 case 61 cylindrical portion 62 top plate portion 63 through hole 64 vent hole 70 mounting portion 80 cover 90a, 90b wiring 91a, 90b Lead wire 100 Construction material

Claims (3)

A semiconductor light emitting device;
A base on which the semiconductor light emitting element is disposed on one surface;
A heat sink disposed on the other surface of the base;
A case arranged to cover the heat sink;
One end is joined to the base, and a support pipe that stands up from the other surface of the base and extends through the case,
The support pipe is
Made of thermally conductive material,
A wiring for supplying power to the semiconductor light emitting element is inserted,
The other end of the support pipe is provided with an attachment portion that is attached to the construction material.
Lighting device. The base is plate-shaped,
One end of the support pipe is joined to the center of the base,
A plurality of the semiconductor light emitting elements are arranged around a central portion of the base,
The lighting device according to claim 1. The case is
A cylindrical portion extending from the outer edge of the base to the other surface side, and a top plate portion that closes the opening on the other surface side of the cylindrical portion,
The support pipe is
Penetrates the top plate, and is joined to the top plate at the penetrating part,
The lighting device according to claim 2.

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