JP2014203682A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hanging lighting device which has a long support medium that is a rigid body and achieves a high safety level when vibrations, such as an earthquake, are applied from a construction material to the support medium.SOLUTION: A lighting device 1 includes: a light emitting module 20; a module plate 10 in which the light emitting module 20 is disposed; a long support medium 30 connected with the module plate 10 at a front end part 31; and an attachment part 70 with which a rear end part 32 of the support medium 30 is connected, the attachment part 70 attached to a construction material. The support medium 30 is formed so as to have a shaft part 300 that is a rigid body and vibration control parts P, Pdisposed in the shaft part 300 and used for performing vibration control to the module plate 10.

Description

  The present invention relates to an illumination device using a semiconductor light emitting element such as an LED (Light Emitting Device) as a light source for illumination.

2. Description of the Related Art In recent years, lighting devices using semiconductor light emitting elements such as LEDs as light sources have become widespread.
FIG. 16 is an external configuration diagram showing a configuration example of a conventional hanging type (pendant type) lighting device 1x described in Patent Document 1. In FIG. The lighting device 1x includes a cable 2x, an LED 3x attached to the tip of the cable 2x, a reflection portion 4x disposed in front of the LED 3x in the emission direction, and a case (shade) arranged to cover the LED 3x and the reflection portion 4x. 5x. An attachment portion (not shown) for attaching the lighting device 1x to the construction material is provided at the rear end of the cable 2x. A phosphor layer 6x is applied to the inner surface of the case 5x. When the lighting device 1x is driven, the emitted light from the LED 3x is irradiated to the phosphor layer 6x directly or after being reflected by the reflecting portion 4x (arrow in the figure). Thereafter, the wavelength of the light from the LED 3x is converted by the phosphor layer 6x and emitted to the outside as illumination light.

  A plurality of hanging type illumination devices as shown in FIG. 16 are provided on the ceiling of a public facility such as a gymnasium.

Special table 2010-520604

In the above-described suspended illumination device, it is assumed that a rigid and long support is used instead of the cable 2x, and the irradiation surface of the LED 3x is fixed to some extent.
Here, when vibrations such as an earthquake shake are applied to the construction material, the lighting device may swing accordingly. When the lighting device includes a rigid and long support, in the lighting device, the support swings around the connecting portion between the mounting portion and the support, and vibration is transmitted to each part of the lighting device via the support. It is assumed that the lighting device is deformed or damaged.

Therefore, it is desirable to take safety measures for preventing such deformation and breakage of the lighting device in advance.
The present invention has been made in view of the above problems, and in a suspended illumination device having a rigid and long support, safety when a vibration such as an earthquake is applied to the support from the construction material. It aims at providing the illuminating device which can exhibit favorable.

  In order to solve the above-described problem, a lighting device according to one embodiment of the present invention includes a semiconductor light-emitting element, a base on which the semiconductor light-emitting element is disposed, and a long support body having one end connected to the base. And the other end of the support is connected and attached to the construction material, and the support is provided with a rigid shaft portion and is disposed on the shaft portion and controls the base. And a vibration control unit for the purpose.

Further, as another aspect of the present invention, the vibration damping portion includes an elastic member, and is attached to the shaft portion at one end of the support, and the support is connected to the base in the vibration damping portion. It can also be set as the structure connected.
As another aspect of the present invention, the base has an insertion portion into which one end of the support is inserted, the vibration damping portion is annular, and the shaft portion at the one end of the support is It is also possible to adopt a configuration in which the shaft portion is connected to the periphery of the insertion portion with the vibration damping portion interposed between the periphery of the shaft portion and the insertion portion. it can.

As another aspect of the present invention, the vibration damping portion includes an elastic member, and is attached to the shaft portion at the other end of the support, and the support is attached to the mounting portion at the vibration damping portion. It can also be set as the structure connected with these.
Further, as another aspect of the present invention, the attachment portion has an insertion portion into which the other end of the shaft portion is inserted, the vibration damping portion is annular, and the attachment portion at the other end of the support body A configuration in which the shaft portion is connected to the periphery of the insertion portion in a state of being fitted to the outer periphery of the shaft portion and the vibration damping portion being interposed between the periphery of the shaft portion and the insertion portion; You can also

As another aspect of the present invention, the shaft portion may include a pair of shaft portions, and the vibration damping portion may be disposed so as to connect the pair of shaft portions.
Further, as another aspect of the present invention, the vibration damping portion may be configured to include any one of an elastic member, a spring mechanism, a ball joint mechanism, and a chain mechanism.
Further, as another aspect of the present invention, the vibration damping portion can be configured to have thermal conductivity.

  As another aspect of the present invention, the base is plate-shaped, the semiconductor light emitting element is disposed on one surface of the base, and the support is perpendicular to the other surface of the base. A heat sink that is extended and disposed on the other surface of the base so as to be thermally coupled to the semiconductor light emitting element may be further included.

  In the lighting device according to one aspect of the present invention, the support connected to the base and the mounting portion is a rigid shaft portion, and the vibration control portion is disposed on the shaft portion for damping the base. It has. For this reason, when vibration such as earthquake is applied to the mounting part of the lighting device from the construction material with the mounting part fixed to the construction material, even if the mounting part vibrates together with the construction material, Vibrations that reach the base are suppressed, and vibrations that are transmitted to each part of the lighting device via the support part can be reduced.

  Thus, even when a rigid shaft portion is used, it is possible to provide an illuminating device that can satisfactorily exhibit safety when vibration such as an earthquake is applied to the support from the construction material.

Appearance block diagram of lighting device 1 viewed from obliquely below Appearance block diagram of lighting device 1 viewed from diagonally above Exploded view showing the internal configuration of the lighting device 1 Sectional drawing which shows the internal structure of the illuminating device 1 seen from diagonally upward The top view (a) which looked at the illuminating device 1 from the front, The figure (b) which shows the structure of the light emitting module 20 and the socket 24 External view of damping part P ₁ Partial sectional view showing the configuration around the front end 31 External view of damping part P ₂ Partial sectional view showing the configuration around the rear end 32 Partial sectional view around the rear end 32 showing the effect of the vibration control part P ₂ Partial sectional view around the front end 31 showing the effect of the damping part P ₁ Partial external view of lighting apparatus 1A according to Embodiment 2 Partial external view of lighting apparatus 1B according to Embodiment 3 Partial external view of lighting apparatus 1C according to Embodiment 4 Partial external view of lighting apparatus 1D according to Embodiment 5 Sectional drawing which shows the structure of the conventional illuminating device 1x.

<Embodiment 1>
Hereinafter, the illumination device 1 according to the first embodiment will be described with reference to FIGS.
(Overall configuration of lighting device 1)
1 to 4, 6, and 7, the direction indicated by the arrow Y is backward, and the opposite direction is forward. In the illuminating device 1, light is mainly emitted forward.

  As shown in FIGS. 1 to 4, the lighting device 1 includes a module plate 10, a plurality of light emitting modules 20 disposed on the front surface of the module plate 10, and a long shape extending backward from the center of the module plate 10. The support 30 is provided. The lighting device 1 includes an inner heat sink 40 and an outer heat sink 50 attached to the rear surface of the module plate 10.

The inner heat sink 40 has a plurality of heat radiation fins 42, and the outer heat sink 50 also has a plurality of heat radiation fins 52. The plurality of heat radiation fins 42 and 52 are arranged to extend rearward from the module plate 10 so as to surround the periphery of the support 30.
Further, the lighting device 1 includes a case 60 that extends rearward from the outer edge of the module plate 10 and surrounds the inner heat sink 40 and the outer heat sink 50.

An attachment portion 70 that is a member for attaching the support 30 to a construction material (a gymnasium, a factory, a ceiling of a warehouse, etc.) is attached to the rear end portion 32 of the support 30.
A cover 80 that covers the plurality of light emitting modules 20 is attached to the front surface of the module plate 10.
Wirings 90 a and 90 b (see FIG. 5A) for supplying power to the plurality of light emitting modules 20 from a power supply device installed outside are inserted into the support 30. 4, 7, and 9 to 12, the wirings 90 a and 90 b are omitted for simplification of illustration.

A vibration damping portion P ₁ is disposed between the connecting portion between the front end portion 31 of the support 30 and the module plate 10. A vibration damping portion P ₂ is disposed between the connecting portion between the rear end portion 32 of the support 30 and the mounting portion 70.
This illuminating device 1 is attached to a construction material and used as an illuminating device that substitutes for an HID lamp.

Each component of the illuminating device 1 is demonstrated below.
(Module plate 10)
The module plate 10 is a disk-shaped member (base). Examples of the material of the module plate 10 include a highly heat conductive material, for example, a metal material such as aluminum or magnesium. A fitting hole 11 for opening the front end portion 31 of the support 30 is formed in the center portion of the module plate 10.

In a central region of one surface (front surface) of the module plate 10, a module mounting region 12 for mounting a plurality (six) of light emitting modules 20 around the fitting hole 11 is secured. In the peripheral region surrounding the module attachment region 12, a plurality of vent holes 13 are arranged in an annular shape along the circumferential direction.
Each air hole 13 is formed by punching a plate material of the module plate 10. By forming the air holes 13 at regular intervals, bridges 14 are formed between the adjacent air holes 13.

The diameter of the module plate 10 is, for example, 260 mm, and the plate thickness is, for example, 1.0 to 5.0 mm.
(Light Emitting Module 20)
A plurality (six) of light emitting modules 20 are annularly arranged in the module mounting region 12. As shown in FIG. 5A, each light emitting module 20 is disposed around the fitting hole 11 at an angle of 60 °.

Each light emitting module 20 is an LED module, and includes a substrate 21 and a light emitting unit 22 formed on the substrate 21 as shown in FIG.
The substrate 21 is formed of, for example, alumina or aluminum material, and a wiring pattern (not shown) for supplying power to the light emitting unit 22 is formed on the surface of the substrate 21.
The light emitting unit 22 includes a plurality of (for example, 132) COB (Chip on Board) type LEDs 23 mounted on the surface of the substrate 21 and a sealing layer including a phosphor disposed so as to cover the LEDs 23. It is configured. The LED 23 is an example of a semiconductor light emitting element. The light emitting unit 22 emits white light by converting a part of blue light emitted from the LED 23 into light having a relatively long wavelength with a phosphor and mixing with blue light.

Each light emitting module 20 is attached to the module attachment region 12 of the module plate 10 while being thermally coupled.
Specifically, as shown in FIG. 5A, each light emitting module 20 is covered with a socket 24 having quick connection terminals 24a and 24b. Since the socket 24 is screwed to the module plate 10, the light emitting module 20 is fixed while being pressed against the front surface of the module plate 10. Thereby, the heat generated from the light emitting module 20 is efficiently transferred to the module plate 10. The quick connection terminals 24 a and 24 b of the socket 24 are connected to the anode terminal 25 a and the cathode terminal 25 b of the light emitting module 20.

(Support 30)
The support 30 includes vibration damping parts P ₁ and P ₂ for damping the module plate 10 and a long shaft part 300 to which the vibration damping parts P ₁ and P ₂ are attached.
(I) Vibration control parts P ₁ and P ₂
When the vibration from the construction material reaches the lighting device 1, the vibration control parts P ₁ and P ₂ dampen the vibration and control the vibration.

The damping part P ₁ is an annular member as shown in FIG. 6, and includes a main body part 100 and a pair of ribs 100 </ b> A and 100 </ b> B provided on both sides in the thickness direction of the main body part 100.
As shown in FIG. 8, the damping part P ₂ is cylindrical and has a hole 101 on the outer periphery.
The damping parts P ₁ and P ₂ have elastic members, and here are made of an elastomer material as an example. As elastic members constituting the vibration damping portions P ₁ and P ₂ , in addition to elastomer materials, nitrile rubber, silicone rubber, acrylic rubber, fluorine rubber such as polytetrafluoroethylene (PTFE), styrene rubber, ethylene Either propylene (EP) rubber or styrene butadiene (SB) rubber can be used.

(Ii) Shaft unit 300
The shaft part 300 is a rigid body, and is a long straight pipe as an example. The shaft part 300 is preferably formed of a material having good heat conductivity. Examples of the material of the shaft part 300 include a metal such as stainless steel or a resin having good heat conductivity (a heat conductive resin obtained by mixing carbon with a resin). A portion of the shaft portion 300 at one end (front end portion 31) of the support 30 is connected to the module plate 10 by caulking. A plurality of long holes 320 are provided in the portion of the shaft portion 300 at the other end (rear end portion 32) of the support body 30. The screw 30 is screwed into the elongated hole 320, whereby the support 30 is connected to the mounting portion 70.

The connection of the support 30, the module plate 10, and the mounting portion 70 will be described with reference to FIGS. 7 and 9. First, as shown in FIG. 7, the damping part P ₁ is fitted on the outer periphery of the shaft part 300 in the front end part 31. The shaft portion 300 is enlarged in a state where the shaft portion 300 of the front end portion 31 is inserted into the fitting hole 11 so that the vibration damping portion P ₁ is interposed between the periphery of the shaft portion 300 and the fitting hole 11. And is caulked to the periphery of the fitting hole 11. As a result, the shaft portion 300 is connected to the periphery of the fitting hole 11, and the support body 30 is connected to the module plate 10 at the vibration control portion P ₁ .

On the other hand, as shown in FIG. 9, the damping part P ₂ is fitted on the outer periphery of the shaft part 300 at the rear end part 32. In a state where the shaft portion 300 at the rear end portion 32 is inserted into the insertion port 72 so that the vibration damping portion P ₂ is interposed between the periphery of the shaft portion 300 and the insertion port 72, Further, the screw B is fastened to the long hole 320 through the hole 101 of the damping material P ₂ . Thus, the shaft portion 300 is connected to the peripheral edge of the insertion port 72, the support 30 is connected to the attachment portion 70 in the vibration damping portion P _2.

  The support 30 supports the module plate 10 in the lighting device 1. The support 30 has a function of fixing the irradiation surface in the vertical direction when the lighting device 1 is suspended from the ceiling. Further, the support 30 also functions as a passage that conducts heat from the module plate 10 to the mounting portion 70 satisfactorily. Further, the hollow portion inside the shaft portion 300 is used as a passage through which the wires 90a and 90b are inserted.

The length of the shaft portion 300 is about the same as or higher than the height of the case 60, and is about 30 cm to 40 cm, for example.
The strength increases as the outer diameter and the wall thickness of the shaft part 300 both increase. In addition, the larger the outer diameter and the wall thickness, the larger the cross-sectional area, so that the heat transfer efficiency is improved and the temperature of the module plate 10 can be reduced. However, the weight increases. It may be determined within a range.

When the shaft portion 300 is made of metal, for example, the support 30 has an outer diameter of 27 mm and a thickness of about 1 mm to 3 mm.
(Inner heat sink 40, outer heat sink 50)
The inner heat sink 40 has a plurality of heat radiation fins 42 erected on the other surface (back surface) of the module plate 10. Similarly, the outer heat sink 50 also has a plurality of heat radiation fins 52 erected on the other surface (back surface) of the module plate 10. The inner heat sink 40 and the outer heat sink 50 are arranged in a state where at least one of them faces the LED 23 via the module plate 10.

  Specifically, the inner heat sink 40 includes an annular support portion 41 joined to the rear surface of the module plate 10 around the support body 30, and a plurality of strip-shaped heat radiation fins 42 extending rearward from the outer peripheral portion of the support portion 41. It consists of and. The outer heat sink 50 includes an annular support portion 51 joined to the rear surface of the module plate 10 around the support portion 41, and a plurality of strip-shaped heat radiation fins 52 extending rearward from the outer peripheral portion of the support portion 51. Has been. The support part 41 and the support part 51 are fastened to the module plate 10 with rivets or screws.

  The plurality of radiating fins 42 surround the support 30 and extend in parallel with the support 30, and the plurality of radiating fins 52 surround the outside and extend in parallel with the support 30. That is, as shown in FIG. 4, the radiating fins 42 and 52 are arranged so as to surround a reference position (a position through which the axis of the support 30 passes) existing on the surface of the module plate 10 facing the case 60. Is done. Specifically, the radiation fins 42 and 52 are arranged along a plurality of (here, two) circumferences centered on the reference position.

As with the module plate 10, the inner heat sink 40 and the outer heat sink 50 are formed of a material having high thermal conductivity (for example, a metal such as aluminum).
Each of the radiation fins 42 and 52 is inclined at a certain angle (for example, 45 °) with respect to the radial direction from the central axis of the support 30 when viewed in plan from the Y direction.
The height of the heat radiation fins 42 and 52 is set to a height that is sufficient to obtain appropriate heat radiation characteristics. In accordance with the shape of the case 60, the height of the radiating fins 42 on the circumference close to the reference position is adjusted to be higher than the height of the radiating fins 52 on the circumference far from the reference position.

(Case 60)
As shown in FIGS. 1 to 4, the case 60 surrounds the inner heat sink 40 and the outer heat sink 50 and is connected to the outer edge portion of the module plate 10. Specifically, the case 60 has a frustoconical appearance, and includes a cylindrical tubular portion 61 that extends rearward from the outer edge of the module plate 10 and a top plate portion 62 that closes the rear portion of the tubular portion 61. The cylindrical portion 61 surrounds the outside of the heat radiation fin 52. The front end portion 61a of the cylindrical portion 61 is opened, and the module plate 10 is attached thereto.

The cylindrical portion 61 and the module plate 10 are fixed by caulking the front end portion 61 a of the cylindrical portion 61 to the outer edge portion 15 of the module plate 10.
A through hole 63 through which the support 30 passes is formed in the center of the top plate portion 62. The edge of the through hole 63 in the top plate portion 62 is joined to the support 30.
As this joining method, for example, a pipe clamp may be installed at the edge of the through hole 63 in the top plate portion 62 and fastened to the support 30 with the pipe clamp, or the edge of the through hole 63 and the support 30 with an adhesive. May be joined.

The case 60 is also formed of a heat conductive material (for example, a metal such as aluminum or magnesium, or a heat conductive resin obtained by mixing carbon with a resin).
A plurality of vent holes 64 are formed from the rear end side of the cylindrical portion 61 in the case 60 to the top plate portion 62. Each air hole 64 is formed by forming a cut in the plate material of the case 60 and bending it inward. The vent hole 64 of the case 60 exists at a position where it overlaps at least one of the radiation fins 42 and 52 when any surface of the module plate 10 is viewed in plan.

In addition, a plurality of beads 65 are formed in the tubular portion 61 at regular intervals by pressing, thereby increasing the strength of the tubular portion 61.
The diameter of the front end 61 a of the case 60 is equal to the diameter of the module plate 10. The height of the case 60 in the Y direction is, for example, 270 mm, and the plate thickness is, for example, 1 mm.
(Mounting part 70)
The attachment portion 70 has a function of fixing the rear end portion 32 of the support 30 to a construction material such as a ceiling.

As shown in FIGS. 1 to 4, the mounting portion 70 includes a pedestal portion 71 having a truncated cone-like appearance whose diameter increases in the rear, and a rear end portion of the support body 30 provided on the front end side of the pedestal portion 71. 32 and a flange portion 73 provided on the rear end side of the pedestal portion 71.
The rear end 32 of the support 30 is inserted into the insertion port 72 and fixed. This fixing method is performed by, for example, a method of fastening with a screw penetrating the insertion port 72 and the support 30 or a method of bonding with an adhesive. The mounting portion 70 is also formed of a heat conductive material like the support body 30.

Here, since the internal space of the insertion port 72 communicates with the internal space of the pedestal portion 71, the internal space of the support body 30 inserted into the insertion port 72 and the internal space of the pedestal portion 71 also communicate with each other.
A plurality of insertion holes 74 are formed in the flange portion 73. When the attachment portion 70 is fixed to the construction material with screws, the flange portion 73 is fixed to the construction material by inserting a screw into the insertion hole 74 and screwing it into the construction material.

(Cover 80)
The cover 80 is mounted so as to cover the plurality of light emitting modules 20 disposed on the front surface of the module plate 10 as a whole.
The cover 80 has a Fresnel lens structure, collects the light emitted from the plurality of light emitting modules 20 and emits the light forward.

The cover 80 is formed by injection-molding a transparent resin material such as acrylic resin, polyethylene terephthalate, or polycarbonate.
The cover 80 is fixed to the front surface of the module plate 10 by bonding or screwing.
(Wiring 90a, 90b)
Wirings 90a and 90b shown in FIG. 5A are wirings for supplying power, and the module plate 10 is fitted from the power supply device (not shown) through the internal space of the mounting portion 70 and the internal space of the support 30. It extends to the joint hole 11.

Lead wires 91a and 91b are branched from the wires 90a and 90b. The leading ends of the branched lead wires 91 a and 91 b are connected to the quick connection terminals 24 a and 24 b of the sockets 24.
The wirings 90a and 90b and the lead wires 91a and 91b are heat-resistant electric wires. For example, cross-linked polyethylene insulated wires, silicone rubber insulated wires, fluororesin insulated wires, silicone glass heat-resistant wires, and the like are used.

Power is supplied from the power supply unit to each light emitting module 20 with a direct current via the power supply wirings 90a and 90b and the lead wires 91a and 91b.
[About driving of lighting device 1]
When using the lighting device 1, the user operates the power supply device to turn on the lighting device 1. Thereby, the light emitting part 22 of each light emitting module 20 emits light. The emitted light is condensed when passing through the Fresnel lens structure of the cover 80 and is emitted to the outside as illumination light. Heat generated by driving each light emitting module 20 is transferred to the inner heat sink 40 and the outer heat sink 50 inside the case 60 through the module plate 10.

  In the illuminating device 1, air is ventilated inside the case 60 through the vent holes 13 of the module plate 10. Inside the case 60, the air exchanges heat by contacting the radiation fins 42 of the inner heat sink 40 and the radiation fins 52 of the outer heat sink 50. As a result, the heated air rises and is radiated to the outside of the case 60 through the vent holes 64 that exist directly above the heat radiation fins 42 and 52. Since air always flows up and down in the case 60, the heat of the radiation fins 42 and 52 can be efficiently radiated to the air, and excellent heat radiation characteristics can be expected.

  As shown in FIG. 1, in the lighting device 1, when any surface of the module plate 10 is viewed in plan, the connection position between the module plate 10 and the case 60 (position corresponding to the outer edge portion of the module plate 10). , Present outside the position of the vent hole 13. Depending on the connection between the module plate 10 and the case 60 and the arrangement relationship between the vent holes 13, the LED 23 in each light emitting portion 22 circulates through the vent holes 13 to transmit heat to the case 60 via the module plate 10. The effect of being reduced by cooling with the air to be produced. That is, when the heat generated by the LEDs 23 in each light emitting unit 22 is transferred to the connection position between the module plate 10 and the case 60 outside the vent hole 13, the heat exists between the adjacent vent holes 13. It travels through the bridge 14. At this time, the heat is sufficiently cooled by the air flowing through the vent hole 13 in the bridge 14, and therefore, it is difficult to transfer to the case 60 across the bridge 14. As a result, the temperature rise of the case 60 can be more effectively suppressed.

[Vibration control effect]
As an example, a case where the lighting device 1 is installed on a ceiling will be described. When the ceiling shakes due to an earthquake or the like, in the lighting device 1, the support portion 30 swings mainly using the mounting portion 70 side as a fulcrum. Here, the state around the rear end portion 32 and the state around the front end portion 31 when the shaft portion 300 is inclined with respect to the vertical (Y) direction are shown in FIGS. 10 and 11 in the same order.

For example, as shown in FIG. 10, when the shaft portion 300 is inclined to the left side in the drawing with respect to the vertical (Y) direction, the shaft portion 300 is interposed between the rear end portion 32 of the shaft portion 300 and the insertion port 72 of the mounting portion 70. The vibration damping part P ₂ is compressed to the inclined side and elastically deformed. With the elastic deformation of the damping portion P _2, the vibration of the shaft portion 300 is absorbed in the damping portion P _2, damping effect is exhibited. Further, even if a strong vibration is instantaneously applied between the shaft portion 300 and the mounting portion 70 immediately after the occurrence of an earthquake or the like, the damping portion P ₂ serves as a buffer material, and the shaft portion 300 and the mounting portion 70 come into contact with each other. To prevent damage.

On the other hand, for example, as shown in FIG. 11, when the shaft portion 300 is inclined to the left side in the drawing with respect to the vertical (Y) direction, the shaft portion 300 is interposed between the front end portion 31 of the shaft portion 300 and the hole 11 of the module plate 10. The damping part P ₁ is compressed in the vertical (Y) direction and elastically deformed. With the elastic deformation of the damping portion P _1, the vibration of the shaft portion 300 is absorbed in the damping portion P _1, damping effect is exhibited. Further, even if strong vibration is instantaneously applied between the shaft portion 300 and the module plate 10 immediately after the occurrence of an earthquake or the like, the damping portion P ₁ becomes a buffer material like the damping portion P _2, and the shaft portion 300 and the module plate 10 are abutted against each other and are not damaged.

In addition, since both the damping parts P ₁ and P ₂ are provided over the entire circumference of the outer periphery of the shaft part 300, the above-described vibration damping part P ₁ , P ₂ The same effect can be expected. As a result, even if the construction material vibrates due to an earthquake or the like, it is possible to maintain a good form of the lighting device 1 and to expect high safety.
[Prevention of incorrect connection]
The illuminating device 1 is installed by directly attaching the attachment portion 7 to a construction material such as a ceiling, and is supplied with direct-current power from an external power supply device to emit light. For this reason, since it is not necessary to install the illuminating device 1 with respect to the existing base socket, there is no possibility that the illuminating device 1 is erroneously connected so as to supply AC power via the base socket by mistake.

Hereinafter, another embodiment of the present invention will be described focusing on differences from the first embodiment.
<Embodiment 2>
FIG. 12 is a partially enlarged view of the lighting apparatus 1A according to the second embodiment. Lighting apparatus 1A in the longitudinal (Y) direction middle of the shaft portion 300A of the support member 30A, a position close to the mounting portion 70 has a feature in that arranged damping portion P ₃ made with a spring mechanism . The damping part P ₃ has one end 102 connected to the mounting part 70 side and the other end 103 connected to the module plate 10 side.

In such a lighting device 1A, when the vibration is transmitted from the building material the vibration is damped by the elastic deformation of the damping portion P _3. Therefore, the same effect as in the first embodiment can be expected. In addition, by configuring the vibration damping portion P ₃ with a spring body made of a metal material, a good vibration damping effect can be expected over a relatively long period.
<Embodiment 3>
FIG. 13 is a partially enlarged view of the lighting apparatus 1B according to the second embodiment. The illuminating device 1B is characterized in that a vibration damping portion P ₄ having an elastic member is disposed in the longitudinal (Y) direction intermediate portion of the shaft portion 300B in the support 30B.

Specifically, the shaft portion 300B has a pair of shaft portions (a first shaft portion 301 and a second shaft portion 302).
The damping part P ₄ is disposed so as to connect the first shaft part 301 and the second shaft part 302. The damping part P ₄ is made of an elastomer material as an example, and one end of each of the first shaft part 301 and the second shaft part 302 is inserted into the damping part P ₄ and fixed with an adhesive. The dotted lines in FIG. 13 indicate the positions of the respective ends of the first shaft portion 301 and the second shaft portion 302 inserted into the vibration damping portion P ₄ .

In such a lighting device 1B, when a vibration is transmitted from the building material the vibration is damped by the elastic deformation of the vibration damping portion P _4. Therefore, the same effect as in the first embodiment can be expected. Further, by forming the damping portion P ₄ in an elastic member of an elastomer material or the like, can be realized at relatively low cost.
<Embodiment 4>
FIG. 14 is a partially enlarged view of the lighting apparatus 1C according to the fourth embodiment. Lighting device 1C is similar to the third embodiment, the longitudinal (Y) direction middle of the shaft portion 300C of the support member 30C, characterized in that arranged damping portion P ₅ made with a ball joint mechanism .

Specifically, the shaft portion 300 </ b> C includes a first shaft portion 303 in which the cup portion 104 is formed at one end and a second shaft portion 304 in which the ball portion 105 is formed at one end as a pair of shaft portions.
The dotted lines in FIG. 14 indicate the internal structure of the first shaft portion 303 and the second shaft portion 304. The vibration damping part P ₅ includes a cup part 104 and a ball part 105 that is rotatably held in all directions inside the cup part 104. Accordingly, the vibration damping portion P ₅ is disposed so as to connect the first shaft portion 303 and the second shaft portion 304. Here if somewhat designed tight than the inner diameter of the cup portion 104 to the outside diameter of the ball portion 105, it is possible to increase the tightening torque of the vibration damping portion P _5.

In such a lighting device 1C, when vibration from the construction material is transmitted, the second shaft portion 302 bends with respect to the first shaft portion 301 against a certain friction torque in the vibration control portion P ₅ . . As a result, the vibration is attenuated, so that the same effect as in the first embodiment can be expected. Moreover, 1C of illuminating devices have the advantage that the angle between a 1st axial part and a 2nd axial part can be adjusted and an irradiation direction can be adjusted also at normal time by utilizing a joint mechanism.

<Embodiment 5>
FIG. 15 is a partially enlarged view of the illumination device 1D according to the fifth embodiment. Lighting device 1D is in the longitudinal (Y) direction middle of the shaft portion 300D of the support member 30D, at a position close to the mounting portion 70 has a feature in that arranged damping portion P ₆ made with a chain mechanism . The damping part P ₆ is formed of a chain in which one end 106 is connected to the mounting part 70 side and the other end 107 is connected to the module plate 10 side.

In such a lighting device 1D, when the vibration is transmitted from the building material the vibration is damped by the damping unit P ₆ is flexibly swing. Therefore, the same effect as in the first embodiment can be expected. Further, by configuring the vibration damping portion P ₆ using a chain made of a metal material, it is possible to expect a good vibration damping effect for a relatively long period of time as in the second embodiment.
<Other matters>
In each of the above-described embodiments, a suspended illumination device is shown. However, the lighting device of the present invention is not limited to this type. For example, a lighting device such as a desk stand type, a ceiling type, or a downlight type may be used.

Although the module plate 10 has a disk shape, the present invention is not limited to this. For example, it may be any one of a rectangular shape, a polygonal shape, and an elliptical shape. A plurality of module plates 10 can also be used.
The number of LED modules is not limited to six, and may be other numbers. Further, the arrangement shape of the LED modules on the module plate 10 is not limited to the circumferential shape as shown in FIG. 3, but may be a rectangular shape or a radial shape.

Although the inner heat sink 40 and the outer heat sink 50 are configured to have the radiation fins 42 and 52, the heat sink in the present invention is not limited to the configuration including the radiation fins. For example, the heat sink may be configured to include heat radiation pins and heat pipes instead of the heat radiation fins.
The semiconductor light emitting device in the present invention is not limited to an LED, and may be an organic EL or a semiconductor laser.

The light emitting module 20 may be fixed to the module plate 10 via a heat conductive member such as a heat conductive sheet or a heat conductive grease.
In addition, in the illuminating device of this invention, a fixed damping effect can be expected only by providing any _one of the damping parts P _{1 to} P ₅ . In order to obtain a satisfactory vibration damping effect, it is desirable to provide both the vibration damping parts P ₁ and P _{2 in} the _first embodiment. In order to obtain a better vibration damping effect, it seems that it is more preferable to provide any one of the vibration damping parts P _{3 to} P ₅ in addition to the first embodiment.

  It is desirable that the vibration control unit has thermal conductivity. As a result, it is possible to expect an effect of efficiently radiating the heat generated by driving the LED from the mounting portion to the building material side via the vibration control portion. In the case where the damping part is configured to have an elastic member, it is preferable to use a thermally conductive silicon-containing material. If the damping part is configured to have a spring mechanism or a ball joint mechanism, a certain thermal conductivity can be expected in the damping part.

P _{1 to} P ₅ vibration control unit 1 lighting device 10 module plate 13 vent hole 20 light emitting module 21 substrate 22 light emitting unit 23 LED
30, 30A to 30C Support body 31 Front end portion 32 Rear end portion 40 Inner heat sink 42 Heat radiation fin 50 Outer heat sink 52 Heat radiation fin 60 Case 61 Cylindrical portion 62 Top plate portion 63 Through hole 64 Vent hole 70 Attachment portion 80 Cover 100 Main body portion 100A, 100B Rib 101 Hole 300, 300A-300D Shaft 301, 303 First Shaft 302, 304 Second Shaft 320 Slot

Claims (9)

A semiconductor light emitting device;
A base on which the semiconductor light emitting element is disposed;
An elongated support having one end connected to the base;
The other end of the support is connected, and includes an attachment portion attached to the construction material,
The said support body is an illuminating device which has the axial part which is a rigid body, and the damping part for damping | damping the said base provided in the said axial part. The vibration damping portion has an elastic member, and is attached to the shaft portion at one end of the support,
The illuminating device according to claim 1, wherein the support body is connected to the base at the vibration control unit. The base has an insertion part into which one end of the support is inserted,
The vibration damping portion is annular and is fitted to the outer periphery of the shaft portion at the one end of the support,
The lighting device according to claim 2, wherein the shaft portion is connected to the periphery of the insertion portion in a state where the vibration suppression portion is interposed between the shaft portion and the periphery of the insertion portion. The vibration damping portion has an elastic member, and is attached to the shaft portion at the other end of the support,
The illuminating device according to claim 1, wherein the support body is connected to the attachment portion at the vibration damping portion. The mounting portion has an insertion portion into which the other end of the shaft portion is inserted,
The vibration damping portion is annular and is fitted to the outer periphery of the shaft portion at the other end of the support,
The lighting device according to claim 4, wherein the shaft portion is connected to the periphery of the insertion portion in a state where the vibration suppression portion is interposed between the shaft portion and the periphery of the insertion portion. The shaft portion includes a pair of shaft portions,
The lighting device according to claim 1, wherein the vibration damping unit is disposed so as to connect the pair of shaft portions. The lighting device according to claim 6, wherein the vibration suppression unit includes any one of an elastic member, a spring mechanism, a ball joint mechanism, and a chain mechanism. The lighting device according to claim 1, wherein the damping unit has thermal conductivity. The base is plate-shaped,
The semiconductor light emitting element is disposed on one surface of the base,
The support is extended in a direction perpendicular to the other surface of the base,
The lighting device according to claim 1, further comprising: a heat sink disposed on the other surface of the base so as to be thermally coupled to the semiconductor light emitting element.

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