JP2019212533A - Luminaire - Google Patents

Abstract

To provide a luminaire which is favorable to suppress the increase in the temperature of light emitting elements.SOLUTION: A luminaire 1A includes: a light source substrate having light emitting elements; a tabular heat sink base 4 arranged on the rear surface side of the light source substrate; a heat radiation fin 5 protruding from the surface of the heat sink base 4 on the opposite side from the light source substrate; and a heat conductive member 6 constituted by a component different from the heat sink base 4 and the heat radiation fin 5. The heat conductive member 6 comes into contact with the heat sink base 4 or the light source substrate directly or via a heat conductive material. When viewed from a substrate perpendicular direction which is a direction perpendicular to the light source substrate, the heat conductive member 6 extends outward from a central region of the heat sink base 4. The heat conductivity of the heat conductive member 6 is equal to or greater than the heat conductivity of the heat sink base 4.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a lighting device.

  For example, lighting devices using light emitting elements such as light emitting diodes are widely used. When the temperature of the light-emitting element is increased due to heat generation of the light-emitting element, energy efficiency is reduced or the life of the light-emitting element is shortened. The lighting device disclosed in Patent Document 1 includes a heat sink for dissipating heat from the light emitting element.

JP2013-4168A

  Compared to the portion near the outer periphery of the heat sink, heat is less likely to dissipate in the central portion of the heat sink. For this reason, there exists a subject that the temperature of the light emitting element arrange | positioned in the center part of a heat sink tends to become high.

  SUMMARY An advantage of some aspects of the invention is that it provides an illumination device that is advantageous in suppressing an increase in the temperature of a light-emitting element.

  An illumination device according to the present invention includes a light source substrate having a light emitting element, a plate-like heat sink base disposed on the back side of the light source substrate, a heat radiation fin protruding from the surface of the heat sink base opposite to the light source substrate, A heat conduction member configured by a component different from the heat sink base and the heat radiation fin, and the heat conduction member is in contact with the heat sink base or the light source substrate directly or via a heat conductive material. When viewed from the direction perpendicular to the substrate, which is a direction perpendicular to the substrate, the heat conduction member extends outward from the central region of the heat sink base, and the heat conductivity of the heat conduction member is the heat conductivity of the heat sink base. That's it.

  ADVANTAGE OF THE INVENTION According to this invention, it was possible to provide the illuminating device advantageous in suppressing that the temperature of a light emitting element becomes high by providing the heat conductive member extended toward the outer side from the center area | region of a heat sink base. Become.

It is the perspective view which looked at the illuminating device by Embodiment 1 from diagonally downward. 1 is a bottom view of a lighting device according to Embodiment 1. FIG. 1 is a plan view of a lighting device according to Embodiment 1. FIG. 1 is a cross-sectional view of a lighting device according to Embodiment 1. FIG. It is a figure which shows typically the temperature distribution of the light source board | substrate when the heat conductive member is not provided. 1 is a plan view of a lighting device according to Embodiment 1. FIG. It is a cross-sectional perspective view which shows a part of 1st flame | frame with which the illuminating device by Embodiment 2 is provided, and a heat conductive member. It is a bottom view of the illuminating device by Embodiment 3. It is a bottom view of the illuminating device by Embodiment 4.

  Hereinafter, embodiments will be described with reference to the drawings. In the drawings, common or corresponding elements are denoted by the same reference numerals, and redundant description is simplified or omitted. The present disclosure may include all combinations of configurations that can be combined among the configurations described in the following embodiments.

Embodiment 1 FIG.
FIG. 1 is a perspective view of lighting apparatus 1A according to Embodiment 1 as viewed obliquely from below. FIG. 2 is a bottom view of lighting apparatus 1A according to the first embodiment. FIG. 3 is a plan view of lighting apparatus 1A according to the first embodiment. FIG. 4 is a cross-sectional view of lighting apparatus 1A according to the first embodiment. The lighting device 1A of the first embodiment shown in these drawings can be preferably used for an application in which a space below the lighting device 1A is illuminated by irradiating light downward. The lighting device 1A is particularly suitable for installation on a high ceiling of a factory, a warehouse, a gymnasium, a competition facility, or the like.

  As shown in FIG. 4, the lighting device 1 </ b> A includes a light source substrate 3 having a light emitting element 2, a plate-like heat sink base 4, heat radiating fins 5, and a heat conducting member 6. The heat sink base 4 is disposed on the back side of the light source substrate 3. That is, the heat sink base 4 is disposed on the surface of the light source substrate 3 opposite to the light emitting element 2. In the present embodiment, a plurality of light emitting elements 2 are mounted on one light source substrate 3. On the light source substrate 3, a conductive pattern for supplying power to the plurality of light emitting elements 2 is formed.

  The light source substrate 3 is provided so as to be able to conduct heat to the lower surface of the heat sink base 4. The heat generated in the light emitting element 2 is conducted from the light source substrate 3 to the heat sink base 4. The light source substrate 3 may be in direct contact with the lower surface of the heat sink base 4 or may be in contact via a heat conductive material. In the present specification, the thermally conductive material may be, for example, any one of thermally conductive grease, a thermally conductive sheet, a thermally conductive adhesive, and a thermally conductive double-sided pressure-sensitive adhesive tape.

  The light emitting element 2 may use a light emitting diode (LED). For example, as the light emitting element 2, at least one of a surface mount type LED package, a bullet type LED package, an LED package with a light distribution lens, a chip scale package LED, and a chip on board (COB) type LED package. May be used. Further, the light emitting element 2 is not limited to the one using an LED, and may be an element using an organic electroluminescence (EL) element or a semiconductor laser, for example.

  A plurality of heat radiating fins 5 are arranged on the heat sink base 4. The heat sink base 4 and the radiating fin 5 cool the light emitting element 2 by dissipating the heat generated in the light emitting element 2 to the surrounding air. The heat radiating fins 5 protrude from the surface of the heat sink base 4 on the side opposite to the light source substrate 3. That is, the heat radiating fins 5 protrude from the upper surface of the heat sink base 4. The heat radiating fins 5 are perpendicular to the upper surface of the heat sink base 4. The radiation fin 5 in the present embodiment has a plate shape. The heat generated in the light emitting element 2 is thermally conducted to the heat sink base 4 and further conducted from the heat sink base 4 to the radiation fin 5. Heat is dissipated from the surfaces of the heat sink base 4 and the radiation fins 5 to the surrounding air. By increasing the surface area of the heat sink by the heat sink base 4 and the radiation fins 5, the heat generated in the light emitting element 2 can be efficiently dissipated.

  The heat conducting member 6 is composed of parts different from the heat sink base 4 and the heat radiating fins 5. The heat conducting member 6 is in contact with the upper surface of the heat sink base 4. The heat conductive member 6 may be in direct contact with the upper surface of the heat sink base 4 or may be in contact via a heat conductive material. The heat conducting member 6 has a flat contact surface that contacts the heat sink base 4. The contact surface extends along the longitudinal direction of the heat conducting member 6. Since the heat conductive member 6 has a flat contact surface, the contact area with the heat sink base 4 can be increased, so that the heat of the heat sink base 4 can be efficiently transmitted to the heat conductive member 6. The heat conductivity of the heat conducting member 6 is equal to or higher than the heat conductivity of the heat sink base 4. Thermal conductivity varies with temperature. In this specification, “thermal conductivity” refers to thermal conductivity at room temperature. “Normal temperature” is, for example, 20 ° C.

  FIG. 5 is a diagram schematically showing the temperature distribution of the light source substrate 3 when the heat conducting member 6 is not provided. As shown in FIG. 5, a large number of light emitting elements 2 are arranged on the light source substrate 3. The elliptical curve in FIG. 5 is an isotherm connecting points having the same temperature. As shown in FIG. 5, a temperature distribution that becomes higher as the distance from the center of the light source substrate 3 increases.

  In the following description, the direction perpendicular to the light source substrate 3 is referred to as “substrate vertical direction”. FIG. 3 corresponds to a view seen from the direction perpendicular to the substrate. As shown in FIG. 3, when viewed from the substrate vertical direction, the heat conducting member 6 extends outward from the central region of the heat sink base 4. The central region of the heat sink base 4 tends to become high temperature for the reason described with reference to FIG. The heat in the central region of the heat sink base 4 travels through the heat conducting member 6 and moves to a region near the periphery of the heat sink base 4 that is at a relatively low temperature. For this reason, the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4 can be lowered. As a result, the efficiency of the light emitting element 2 can be improved and the life of the light emitting element 2 can be extended.

  The heat conducting member 6 has a thermal conductivity equal to or higher than that of the heat sink base 4. For this reason, according to the heat conductive member 6, the heat | fever of the center area | region of the heat sink base 4 can be efficiently moved toward the outer side. The heat conductivity of the heat conducting member 6 may be equal to the heat conductivity of the heat sink base 4. That is, the material of the heat conducting member 6 may be the same as the material of the heat sink base 4.

  You may comprise so that the heat conductivity of the heat conductive member 6 may become higher than the heat conductivity of the heat sink base 4. FIG. That is, the heat conductive member 6 may be made of a material having a higher thermal conductivity than the material of the heat sink base 4. For example, the heat conducting member 6 and the heat sink base 4 may be made of different metal materials. For example, when the heat sink base 4 is made of aluminum or an aluminum alloy, the heat conducting member 6 may be made of copper or a copper alloy having a thermal conductivity larger than that of aluminum or the aluminum alloy. When the heat conducting member 6 has a higher thermal conductivity than the heat sink base 4, the heat in the central region of the heat sink base 4 can be more efficiently moved outward by the heat conducting member 6. This is further advantageous in lowering the temperature of the light emitting element 2 arranged in the central region of 4.

  When the heat sink base 4 is made of a heat conductive resin material, the heat conductive member 6 is made of a metal material so that the heat conductive member 6 has a higher thermal conductivity than the heat sink base 4. Also good. The heat conductive resin material may be one in which a heat conductive filler is kneaded into the resin material. The following effects are acquired by doing as mentioned above. By making the heat sink base 4 made of a heat conductive resin, the heat sink base 4 can be reduced in weight, which is advantageous in reducing the weight of the lighting device 1A. Since the heat conducting member 6 has a higher thermal conductivity than the heat sink base 4, the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4 is high even if the heat sink base 4 is made of a heat conductive resin. Can be reliably suppressed.

  The lighting device 1 </ b> A in the present embodiment includes six heat conducting members 6. Providing the plurality of heat conductive members 6 is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4. In the present embodiment, the plurality of heat conducting members 6 are arranged so as to extend radially outward from the central region of the heat sink base 4. Thereby, the heat of the central region of the heat sink base 4 can be moved radially outward. As a result, it is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4.

  The heat sink base 4 in the present embodiment has a rectangular or square shape when viewed from the substrate vertical direction. Instead of such a configuration, the heat sink base 4 may have, for example, a circular or elliptical shape when viewed from the direction perpendicular to the substrate.

  The lighting device 1 </ b> A in the present embodiment includes a first frame 7 and a second frame 8 attached to the edge of the heat sink base 4. In the present embodiment, since the heat sink base 4 can be reinforced by the first frame 7 and the second frame 8, the strength against external force or vibration applied to the lighting device 1A can be increased. The method of fixing the first frame 7 and the second frame 8 to the heat sink base 4 includes, for example, a fitting structure in which the heat sink base 4 is fitted into the notches formed in the first frame 7 and the second frame 8, bolting, Any method such as welding, brazing, or bonding may be used.

  The first frame 7 and the second frame 8 are arranged so as to sandwich the heat sink base 4 therebetween. When viewed from the substrate vertical direction, the first frame 7 is attached to the first side of the heat sink base 4, and the second frame 8 is attached to the second side of the heat sink base 4 parallel to the first side. It is attached. The first frame 7 and the second frame 8 in the present embodiment have symmetrical shapes.

  When viewed from the substrate vertical direction, the first frame 7 and the second frame 8 have an elongated shape extending along the first side and the second side of the heat sink base 4. That is, the first frame 7 and the second frame 8 have a shape whose longitudinal direction is the direction along the first side and the second side.

  The lighting device 1 </ b> A in the present embodiment includes both a heat conducting member 6 that is an integral part of the first frame 7 and a heat conducting member 6 that is an integral part of the second frame 8. Thereby, increasing both the number of the heat conductive members 6 and suppressing the increase in the number of parts can be achieved. In the present embodiment, among the six heat conductive members 6, three heat conductive members 6 are integral parts with the first frame 7, and the remaining three heat conductive members 6 are the second frame 8. It is an integral part. Each heat conducting member 6 protrudes from the first frame 7 or the second frame 8 toward the central region of the heat sink base 4.

  If it is this Embodiment, the following effects are acquired because the heat conductive member 6 is a component integral with the 1st flame | frame 7 or the 2nd flame | frame 8. FIG. The heat in the central region of the heat sink base 4 travels through the heat conducting member 6 and reaches the first frame 7 or the second frame 8 efficiently. The heat that reaches the first frame 7 or the second frame 8 is dissipated from the surface of the first frame 7 or the second frame 8 to air or the like. In this way, the heat in the central region of the heat sink base 4 can be efficiently dissipated from the surface of the first frame 7 or the second frame 8, so the light emitting element 2 disposed in the central region of the heat sink base 4. This is further advantageous in reducing the temperature of the.

  Desirably, the longitudinal elastic modulus of the first frame 7 and the second frame 8 is equal to or greater than the longitudinal elastic modulus of the heat sink base 4. By doing so, the mechanical strength of the first frame 7 and the second frame 8 can be sufficiently increased, so that the reinforcing effect by the first frame 7 and the second frame 8 can be more reliably exhibited. It becomes.

  As shown in FIG. 1, lighting device 1 </ b> A in the present embodiment includes arm 9. The arm 9 is connected to the first frame 7 or the second frame 8. The arm 9 supports the heat sink base 4 via the first frame 7 or the second frame 8. The arm 9 has an elongated plate-like base portion 9a and a pair of support portions 9b protruding from both ends of the base portion 9a. The lighting device 1A can be fixed to the mounting surface by fixing the base 9a to the mounting surface such as a ceiling surface or a beam of the building with a bolt or the like.

  The arm 9 may be made by bending a metal plate. Each support portion 9b protrudes in a direction perpendicular to the longitudinal direction of the base portion 9a. Each of the first frame 7 and the second frame 8 has a side wall portion projecting in the substrate vertical direction. The front end portion of each support portion 9 b is fixed to the side wall portions of the first frame 7 and the second frame 8 by two bolts 10 and 11, respectively. A long hole 9c that is curved in an arc shape around the bolt 10 is formed at the tip of each support portion 9b. The bolt 11 is inserted through the long hole 9c.

  In FIG. 1, the surface of the base 9a of the arm 9 is perpendicular to the substrate vertical direction. That is, the surface of the base portion 9 a is parallel to the light source substrate 3 and the heat sink base 4. When the mounting surface such as a ceiling surface or a beam is horizontal, the light source substrate 3 and the heat sink base 4 are illuminated horizontally by fixing the base 9a to the mounting surface in the state shown in FIG. The apparatus 1A can be installed. The base 9a may be fixed to the mounting surface by, for example, bolting. In the illustrated example, a hole for inserting a bolt is formed in the base portion 9a.

  When the bolts 10 and 11 are loosened, the arm 9 can rotate with respect to the first frame 7 and the second frame 8 within a predetermined angle range around the bolt 10. When the bolts 10 and 11 are tightened again after rotating the arm 9, the surface of the base portion 9 a of the arm 9 can be inclined with respect to the light source substrate 3 and the heat sink base 4. When the mounting surface such as the ceiling surface or the beam is inclined with respect to the horizontal plane, the light source substrate 3 and the heat sink base 4 are horizontally arranged by fixing the base portion 9a to the mounting surface in such a state. The lighting device 1A can be installed as described.

  The side wall portions of the first frame 7 and the second frame 8 are in contact with the support portion 9b of the arm 9 so as to be able to conduct heat. Thermally conductive grease may be interposed between the side wall portions of the first frame 7 and the second frame 8 and the support portion 9b. In the present embodiment, the heat in the central region of the heat sink base 4 can be further conducted to the arm 9 after reaching the first frame 7 or the second frame 8 through the heat conducting member 6. For this reason, the heat in the central region of the heat sink base 4 can be efficiently dissipated from the surface of the arm 9, which is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4. become.

  As shown in FIG. 3, when viewed from the direction perpendicular to the substrate, the plurality of heat dissipating fins 5 are arranged radially. Each of the plurality of radiating fins 5 extends outward from the central region of the heat sink base 4. In the present embodiment, two adjacent radiating fins 5 are constituted by one component formed by bending one sheet metal into a U-shape. The component is fixed to the heat sink base 4. Not limited to such a configuration, each of the radiating fins 5 may be a separate component, or the heat sink base 4 and the radiating fin 5 may be integrally formed by, for example, aluminum die casting. As a modification, a plurality of plate-like heat radiation fins 5 may be arranged in parallel to each other. As another modification, the heat radiation fin 5 may be a pin fin having a pin shape.

  D1 in FIG. 4 corresponds to the maximum dimension of the heat conducting member 6 in the substrate vertical direction. D2 corresponds to the maximum dimension of the heat sink base 4 in the substrate vertical direction. The maximum dimension D1 in the substrate vertical direction of the heat conducting member 6 is desirably larger than the maximum dimension D2 in the substrate vertical direction of the heat sink base 4. By doing so, the following effects can be obtained. Since it becomes advantageous in reducing the thermal resistance of the heat conducting member 6 along the longitudinal direction of the heat conducting member 6, the heat in the central region of the heat sink base 4 can be moved more efficiently toward the outside.

  The heat conducting member 6 in the present embodiment is disposed between the radiation fins 5. The distance between the radiation fins 5 increases from the central region of the heat sink base 4 toward the outside. In the following description, the direction perpendicular to the longitudinal direction of the heat conducting member 6 and parallel to the light source substrate 3 is referred to as the “width direction” of the heat conducting member 6. The dimension in the width direction of the heat conducting member 6 increases from the central region of the heat sink base 4 toward the outside. The dimension in the width direction of the heat conducting member 6 is substantially equal to the size of the gap formed between the heat radiating fins 5. According to such a configuration, the dimension in the width direction of the heat conducting member 6 can be sufficiently increased. As a result, it is advantageous for lowering the thermal resistance of the heat conducting member 6 along the longitudinal direction of the heat conducting member 6, so that the heat in the central region of the heat sink base 4 can be moved more efficiently toward the outside. it can.

  D3 in FIG. 3 corresponds to the maximum dimension of the heat conducting member 6 in the width direction. The maximum dimension D3 of the heat conducting member 6 in the width direction is larger than the maximum dimension D1 of the heat conducting member 6 in the substrate vertical direction. Thereby, the following effects are acquired. Since it becomes advantageous in reducing the thermal resistance of the heat conducting member 6 along the longitudinal direction of the heat conducting member 6, the heat in the central region of the heat sink base 4 can be moved more efficiently toward the outside. If the maximum dimension D1 in the substrate vertical direction of the heat conducting member 6 is too large, the heat conducting member 6 may hinder the flow of air passing between the radiation fins 5. On the other hand, in the present embodiment, the maximum dimension D1 in the substrate vertical direction of the heat conducting member 6 is smaller than the maximum dimension D3 in the width direction of the heat conducting member 6, so that the space between the radiation fins 5 is reduced. It can prevent more reliably that the flow of the air which passes is blocked | interrupted by the heat conductive member 6. FIG.

  The plate thickness of the first frame 7 and the second frame 8 is preferably equal to the plate thickness of the heat sink base 4 or thicker than the plate thickness of the heat sink base 4. By doing so, the heat capacities of the first frame 7 and the second frame 8 can be increased. As a result, it is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4. In addition, since the mechanical strength of the first frame 7 and the second frame 8 can be sufficiently increased, the reinforcing effect by the first frame 7 and the second frame 8 can be more reliably exhibited.

  The plate thickness of the arm 9 is preferably equal to the plate thickness of the first frame 7 and the second frame 8 or thicker than the plate thickness of the first frame 7 and the second frame 8. By doing so, the heat capacity of the arm 9 can be increased. As a result, it is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4. Moreover, since the mechanical strength of the arm 9 can be sufficiently increased, the lighting device 1A can be fixed to the mounting surface with higher strength.

  As illustrated in FIG. 4, the illumination device 1 </ b> A according to the present embodiment includes a lens array 12 and a translucent cover 13. The lens array 12 includes a lens portion formed at a position facing each light emitting element 2. The light emitted from each light emitting element 2 passes through the lens portion of the lens array 12 and the translucent cover 13 and is irradiated to the outside of the illumination device 1A. The lens portion of the lens array 12 has a function of narrowing the light distribution angle of the light emitted from the light emitting element 2. The lens array 12 corresponds to an arrangement in which lens portions for the respective light emitting elements 2 are aligned and integrated. In general, in a high ceiling lighting fixture, since the distance from the lighting fixture to the floor is long, it is advantageous to narrow the light distribution angle in order to obtain good irradiation characteristics. If it is lighting apparatus 1A of this Embodiment, the characteristic more suitable when using it as a high ceiling lighting fixture will be acquired by having provided the lens array 12. FIG.

  The translucent cover 13 covers the entire light source substrate 3 and the lens array 12. The translucent cover 13 has a contact surface in contact with the heat sink base 4. As shown in FIGS. 1 and 2, in the present embodiment, the translucent cover 13 has a square or rectangular outer shape when viewed from the direction perpendicular to the substrate. In the illustrated configuration, the translucent cover 13 is fixed by screws 14 disposed at the four corners thereof. The translucent cover 13 may be fixed to the heat sink base 4 or may be fixed to the first frame 7 and the second frame 8.

  In the present embodiment, by providing the translucent cover 13, the light emitting element 2, the light source substrate 3, and the lens array 12 can be reliably protected from dirt or water. The translucent cover 13 may be made of a transparent material that transmits light in the regular direction. Alternatively, the translucent cover 13 may diffuse and transmit light. The translucent cover 13 may be made of a resin material such as polycarbonate resin, acrylic resin, polystyrene resin, or glass material, for example. The surface of the light-transmitting cover 13 may be subjected to a coating process such as a hard coat process, which is advantageous for suppressing aging deterioration. The translucent cover 13 may have waterproofness. A sealing material or an adhesive having a waterproof property may be provided at a joint portion between the translucent cover 13 and the heat sink base 4. The sealing material or adhesive may be made of, for example, a soft resin material, a sealing material such as silicone, or a rubber material.

  In the following description, an area where the light emitting element 2 is arranged is referred to as a “light source arrangement area”. The light source arrangement region corresponds to a region surrounded by a plurality of light emitting elements 2 arranged in a ring on the outermost periphery. As shown in FIGS. 2 and 5, in the present embodiment, the light source arrangement region has a relatively long direction and a relatively short direction when viewed from the substrate vertical direction. The first direction corresponds to a “relatively long direction”. The second direction corresponds to a “relatively short direction”. The second direction is a direction orthogonal to the first direction. When viewed from the substrate vertical direction, the length of the light source arrangement region in the first direction is longer than the length of the light source arrangement region in the second direction.

  As shown in FIG. 2, the first direction is parallel to the direction connecting the pair of support portions 9 b included in the arm 9. The first direction is parallel to the direction connecting the first frame 7 and the second frame 8 with the shortest distance. The second direction is parallel to the side where the first frame 7 and the second frame 8 are arranged among the four sides of the heat sink base 4.

  As shown in FIG. 3, the angle between the longitudinal direction of the heat conducting member 6 and the first direction is smaller than the angle between the longitudinal direction of the heat conducting member 6 and the second direction of the light source arrangement region. Here, the angle between the longitudinal direction of the heat conducting member 6 and the first direction or the second direction is parallel to the line passing through the center of the width direction of the heat conducting member 6 and the first direction or the second direction. It refers to an inferior angle with a straight line. In the illustrated example, the line passing through the center in the width direction of the heat conducting member 6 is a straight line. Not limited to the illustrated configuration, at least a part of a line passing through the center in the width direction of the heat conducting member 6 may be a curved line. When the line passing through the center in the width direction of the heat conducting member 6 is a curved line, the subordinate angle between the tangent line of the curved line and the straight line parallel to the first direction or the second direction is defined as the angle of the heat conducting member 6. It may be regarded as an angle between the longitudinal direction and the first direction or the second direction.

  As shown in FIG. 5, assuming that there is no heat conducting member 6, the high temperature region in the central portion of the light source arrangement region extends long along the first direction. On the other hand, according to the present embodiment, the following effects can be obtained by configuring as described above. The heat conducting member 6 becomes closer to the first direction than the second direction. For this reason, the heat conducting member 6 can move heat more efficiently along the first direction than in the second direction. As a result, the phenomenon that the high temperature region in the central portion of the light source arrangement region extends long along the first direction can be more reliably mitigated, and the temperature of the light emitting element 2 in the central portion of the light source arrangement region can be reduced. Become advantageous. Further, the heat of the central portion of the light source arrangement region can be efficiently moved in the direction of the first frame 7, the second frame 8, and the arm 9 by the heat conducting member 6. As a result, the heat in the central portion of the light source arrangement region can be efficiently dissipated from the first frame 7, the second frame 8, and the arm 9.

  As shown in FIG. 3, in the present embodiment, of the six heat conducting members 6, the two heat conducting members 6 are angles between the longitudinal direction of the heat conducting member 6 and the first direction. Is 0 degrees. That is, the longitudinal direction of the two heat conducting members 6 is parallel to the first direction. For the remaining four heat conducting members 6, the angle between the longitudinal direction of the heat conducting member 6 and the first direction is an angle that is greater than 0 degree and less than 45 degrees.

  Energy saving by a lighting fixture using a semiconductor light source such as an LED has progressed conventionally. As for high ceiling lighting fixtures, with the use of LEDs as light sources, the size of the heat dissipation structure has been increased in order to increase the luminous flux, increase the efficiency, and extend the service life. However, in consideration of workability and the like, the lighting fixture is required to be lightweight. Conventionally, components of high ceiling lighting fixtures are mainly composed of metal materials such as aluminum alloys and steel materials. In particular, the heat sink is often formed of an aluminum alloy because it requires light weight, rigidity, and the like. There is a demand for lighter heat sinks that occupy most of the mass of lighting fixtures.

  In addition to the heat sink, a metal material is used for the high ceiling lighting fixture. If the heat generated by the light source can be released to the heat sink as well, the temperature of the light source can be lowered more efficiently than if the heat is radiated by the heat sink alone. From this point of view, according to the present embodiment, the heat of the light emitting element 2 can be efficiently released to the first frame 7, the second frame 8, and the arm 9. It becomes advantageous for the conversion. As a result, it is advantageous in achieving a large luminous flux, high efficiency, and long life of the lighting device 1A.

  Of the three heat conducting members 6 that are integral parts with the first frame 7, one heat conducting member 6 is connected to the first frame 7 at a position close to one end in the longitudinal direction of the first frame 7. Another heat conductive member 6 is connected to the first frame 7 at a position near the other end in the longitudinal direction of the first frame 7, and the other heat conductive member 6 is connected to the first frame 7. It is connected to the first frame 7 at a position close to the center in the longitudinal direction. With this configuration, according to the present embodiment, the heat of the central region of the heat sink base 4, that is, the heat of the central portion of the light source arrangement region can be transmitted evenly to the entire first frame 7. For this reason, heat can be dissipated by using the entire first frame 7 more efficiently.

  Of the three heat conducting members 6 that are integral parts with the second frame 8, one heat conducting member 6 is connected to the second frame 8 at a position close to one end in the longitudinal direction of the second frame 8. Another heat conducting member 6 is connected to the second frame 8 at a position near the other end in the longitudinal direction of the second frame 8, and the other heat conducting member 6 is connected to the second frame 8. It is connected to the second frame 8 at a position close to the center in the longitudinal direction. With this configuration, according to the present embodiment, the heat in the central region of the heat sink base 4, that is, the heat in the central portion of the light source arrangement region, can be transmitted to the entire second frame 8 evenly. For this reason, heat can be dissipated by using the entire second frame 8 more efficiently.

  As shown in FIG. 1, the illumination device 1 </ b> A of the present embodiment includes a power supply device 15. The power supply device 15 includes a casing having a substantially rectangular parallelepiped shape, a circuit board disposed in the casing, and the like. The housing of the power supply device 15 is fixed to the pair of support portions 9 b of the arm 9. One end surface in the longitudinal direction of the casing of the power supply device 15 is fixed to one support portion 9b, and the other end surface in the longitudinal direction is fixed to the other support portion 9b. The power supply device 15 is located between the radiation fin 5 and the base portion 9 a of the arm 9. There is a space through which air can pass between the heat radiation fin 5 and the power supply device 15. The power supply device 15 includes a lighting circuit that generates DC power for lighting the light emitting element 2. The lighting circuit of the power supply device 15 includes, for example, a power supply circuit that generates DC power from AC power supplied from a commercial power supply. The power supply line 17 connects the central portion of the light source substrate 3 and the power supply device 15. The light emitting element 2 is turned on when power is supplied from the power supply device 15 to the light source substrate 3 through the feeder line 17. In FIG. 4, illustration of the base 9a and the power supply device 15 is omitted. That is, FIG. 4 corresponds to a cross-sectional view in which the support portion 9 b is cut at a position between the radiation fin 5 and the power supply device 15.

  The illumination device 1A may not include the power supply device 15 as described above. That is, the illuminating device 1A may turn on the light emitting element 2 by receiving supply of DC power from a power supply device arranged outside the illuminating device 1A.

  FIG. 6 is a plan view of lighting apparatus 1A according to the first embodiment. FIG. 6 is a view similar to FIG. 3 except that the 1/2 area H and the 3/4 area TQ are entered. The ½ region H corresponds to a region surrounded by a virtual figure in which the outer shape of the heat sink base 4 when viewed from the substrate vertical direction is reduced to a similarity ratio of ½ while maintaining the center position. The 3/4 region TQ corresponds to a region surrounded by a virtual figure in which the outer shape of the heat sink base 4 is reduced to a similarity ratio of 3/4 while maintaining its center position. As shown in FIG. 6, heat conductive member 6 in the present embodiment extends from the inside of ½ region H to the outside of ¾ region TQ. The inside of the ½ region H can be considered to correspond to the central region of the heat sink base 4. It can be considered that the outside of the 3/4 region TQ corresponds to a region close to the periphery of the heat sink base 4. In the present embodiment, the heat conduction member 6 extending from the inside of the ½ area H to the outside of the 3/4 area TQ is provided, so that the heat of the central area of the heat sink base 4 is transferred to the heat conduction member 6. Thus, it can be moved more efficiently toward the outside, which is further advantageous in reducing the temperature of the light emitting element 2 arranged in the central region of the heat sink base 4.

  In the present embodiment, all of the plurality of heat conducting members 6 extend from the inside of the ½ region H to the outside of the ¾ region TQ. Not limited to this configuration, if at least one of the plurality of heat conducting members 6 extends from the inside of the ½ region H to the outside of the ¾ region TQ, an effect similar to the above effect can be obtained. .

  In the present embodiment, all of the plurality of heat conducting members 6 are connected to the first frame 7 or the second frame 8. Not limited to this configuration, the heat conducting member 6 may not be connected to either the first frame 7 or the second frame 8. Even if the heat conducting member 6 is not connected to either the first frame 7 or the second frame 8, or the lighting device 1A does not include the first frame 7 and the second frame 8, the heat sink base 4 The heat in the central region travels through the heat conducting member 6 and moves to a region near the periphery of the heat sink base 4 that is at a relatively low temperature. For this reason, since the temperature of the center area | region of the heat sink base 4 can be lowered | hung, the effect similar to Embodiment 1 mentioned above is acquired.

  A groove may be formed in the first frame 7 and the second frame 8, and at least one of the light source substrate 3 and the heat sink base 4 may be fitted into the groove. In such a case, the light source substrate 3 or the heat sink base 4 and the first frame 7 and the second frame 8 are more firmly in contact with each other, so that the heat from the light emitting element 2 can be more efficiently transferred to the first frame 7. And can escape to the second frame 8.

Embodiment 2. FIG.
Next, the second embodiment will be described with reference to FIG. 7. The description will focus on the differences from the first embodiment described above, and the description of the same or corresponding parts will be simplified or omitted. FIG. 7 is a cross-sectional perspective view showing a part of the first frame 7 and the heat conducting member 6 included in the lighting apparatus according to the second embodiment. The lighting apparatus according to the second embodiment is the same as that of the first embodiment except that the lighting apparatus includes a heat pipe 16 disposed along the heat conducting member 6. The heat pipe 16 is disposed along the longitudinal direction of the heat conducting member 6.

  According to this embodiment, not only the heat conducting member 6 but also the heat pipe 16 can efficiently move the heat in the central region of the heat sink base 4 toward the outside. For this reason, it is further advantageous in reducing the temperature of the light emitting element 2 disposed in the central region of the heat sink base 4.

  The first frame 7 includes a bottom wall portion 7a that is parallel to the heat sink base 4, and a side wall portion 7b that protrudes in a direction perpendicular to the bottom wall portion 7a. The heat pipe 16 is in contact with the bottom wall portion 7a and the side wall portion 7b. According to such a configuration, the heat in the central region of the heat sink base 4 can be more efficiently transmitted to the first frame 7. Although not shown, a similar heat pipe 16 may be provided for the heat conducting member 6 formed of a part integral with the second frame 8. Moreover, it replaces with the heat pipe 16 and the effect similar to the effect of this Embodiment is acquired also by providing a heat conductive sheet etc., for example.

Embodiment 3 FIG.
Next, the third embodiment will be described with reference to FIG. 8. The description will focus on the differences from the first embodiment described above, and the description of the same or corresponding parts will be simplified or omitted. FIG. 8 is a bottom view of lighting apparatus 1B according to the third embodiment.

  As shown in FIG. 8, the lighting device 1 </ b> B according to the third embodiment includes a heat conductive member 18 instead of the heat conductive member 6 in the first embodiment. The heat conductive member 18 is in contact with the light source substrate 3 directly or via a heat conductive material. A part of the light source substrate 3 is sandwiched between the heat sink base 4 and the heat conducting member 18. That is, the heat conducting member 18 is in contact with the surface on which the light emitting element 2 is disposed, of the two surfaces of the light source substrate 3. On the contact surface between the light source substrate 3 and the heat conducting member 18, the heat of the light source substrate 3 is transmitted to the heat conducting member 18. The plurality of light emitting elements 2 included in the light source substrate 3 are arranged avoiding the position of the heat conducting member 18.

  When viewed from the substrate vertical direction, the heat conducting member 18 extends outward from the central region of the heat sink base 4. The heat of the central portion of the light source arrangement region that tends to become high temperature travels through the heat conducting member 18 and moves to a region near the periphery of the light source arrangement region that becomes relatively low temperature. For this reason, the temperature of the light emitting element 2 arrange | positioned in the center part of the light source arrangement | positioning area | region can be reduced. As a result, the efficiency of the light emitting element 2 can be improved and the life of the light emitting element 2 can be extended.

  Lighting device 1B in the present embodiment includes two heat conducting members 18. Of the two heat conducting members 18, one heat conducting member 18 is an integral part of the first frame 7, and the other heat conducting member 18 is an integral part of the second frame 8. Each heat conducting member 18 protrudes from the first frame 7 or the second frame 8 toward the central portion of the light source arrangement region. The longitudinal direction of the heat conducting member 18 is parallel to the first direction.

  If it is this Embodiment, the following effects are acquired because the heat conductive member 18 is a component integral with the 1st flame | frame 7 or the 2nd flame | frame 8. FIG. The heat in the central portion of the light source arrangement region passes through the heat conducting member 18 and efficiently reaches the first frame 7 or the second frame 8. The heat that reaches the first frame 7 or the second frame 8 is dissipated from the surface of the first frame 7 or the second frame 8 to air or the like. In this way, the heat of the central portion of the light source arrangement region can be efficiently dissipated from the surface of the first frame 7 or the second frame 8, so that the light emitting element 2 arranged in the central portion of the light source arrangement region. This is further advantageous in reducing the temperature of the.

  As described above, the heat conducting member 18 in the present embodiment is in contact with the light source substrate 3 instead of the heat sink base 4. According to the present embodiment, an effect similar to that of the first embodiment can be obtained. The illumination device 1B according to the present embodiment may include the lens array 12 and the translucent cover 13 as in the first embodiment, but illustration thereof is omitted in FIG.

Embodiment 4 FIG.
Next, the fourth embodiment will be described with reference to FIG. 9. The difference from the first embodiment will be mainly described, and the description of the same or corresponding parts will be simplified or omitted. FIG. 9 is a bottom view of lighting apparatus 1C according to the fourth embodiment. The illuminating device 1C of the present embodiment may include the lens array 12 and the light transmitting cover 13 as in the first embodiment, but illustration thereof is omitted in FIG.

  As shown in FIG. 9, the lighting device 1 </ b> C according to the fourth embodiment includes a heat conductive member 19 instead of the heat conductive member 6 in the first embodiment. The heat conductive member 19 is in contact with the bottom surface of the heat sink base 4 directly or via a heat conductive material. That is, the heat conducting member 19 is in contact with the surface of the two surfaces of the heat sink base 4 where the heat dissipating fins 5 are not disposed.

  An illumination device 1C according to the fourth embodiment includes two light source substrates 20 and 21 instead of the light source substrate 3 in the first embodiment. It can be considered that the light source substrates 20 and 21 correspond to the light source substrate 3 in the first embodiment divided into two. A plurality of light emitting elements 2 are mounted on each of the light source substrates 20 and 21. When viewed from the substrate vertical direction, each of the light source substrates 20 and 21 has a rectangular outer shape whose longitudinal direction is parallel to the first direction.

  When viewed from the direction perpendicular to the substrate, the heat conducting member 19 extends outward from the central region of the heat sink base 4. Lighting device 1 </ b> C in the present embodiment includes one heat conducting member 19. The heat conducting member 19 is arranged so as to cross the central region of the heat sink base 4, that is, the central portion of the light source arrangement region. The heat conducting member 19 is arranged so as to pass through the center of the heat sink base 4, that is, the center of the light source arrangement region.

  When viewed from the substrate vertical direction, there is an elongated gap extending along the first direction between the light source substrate 20 and the light source substrate 21. The heat conducting member 19 is disposed in the gap between the light source substrate 20 and the light source substrate 21.

  If it is this Embodiment, the heat | fever of the center part of the light source arrangement | positioning area | region which tends to become high temperature will move to the area | region near the periphery of the light source arrangement | positioning area | region which becomes comparatively low temperature along the heat conductive member 19. FIG. For this reason, the temperature of the light emitting element 2 arrange | positioned in the center part of the light source arrangement | positioning area | region can be reduced. As a result, the efficiency of the light emitting element 2 can be improved and the life of the light emitting element 2 can be extended.

  One end of the heat conducting member 19 is integrally connected to the first frame 7. The other end of the heat conducting member 19 is integrally connected to the second frame 8. That is, the heat conducting member 19, the first frame 7, and the second frame 8 are formed by one integrated part.

  If it is this Embodiment, the following effects are acquired because the heat conductive member 19 is a component integral with the 1st flame | frame 7 and the 2nd flame | frame 8. FIG. The heat of the central portion of the light source arrangement region travels through the heat conducting member 19 and efficiently reaches the first frame 7 and the second frame 8. The heat that has reached the first frame 7 and the second frame 8 is dissipated from the surfaces of the first frame 7 and the second frame 8 to air or the like. In this way, the heat of the central portion of the light source arrangement region can be efficiently dissipated from the surfaces of the first frame 7 and the second frame 8, so that the light emitting element 2 disposed in the central portion of the light source arrangement region. This is further advantageous in reducing the temperature of the. According to the present embodiment, an effect similar to that of the first embodiment can be obtained.

  In addition, since the first frame 7 and the second frame 8 are connected via the heat conducting member 19, it is advantageous in increasing the rigidity of the lighting device 1C. As a result, the lighting device 1C can have a stronger structure against vibration, deformation due to external force, and the like.

  With reference to the first frame 7, the heat conducting member 19 protrudes from the first frame 7 toward the central portion of the light source arrangement region. With the second frame 8 as a reference, the heat conducting member 19 protrudes from the second frame 8 toward the central portion of the light source arrangement region. The longitudinal direction of the heat conducting member 19 is parallel to the first direction.

  Although the embodiment has been described above, the present invention is not limited to the embodiment. For example, the present invention is not limited to a lighting device that is installed on a ceiling and illuminates a floor, and can be applied to various lighting devices such as a projector.

1A, 1B, 1C Illumination device, 2 light emitting element, 3 light source substrate, 4 heat sink base, 5 heat radiating fin, 6 heat conducting member, 7 first frame, 7a bottom wall portion, 7b side wall portion, 8 second frame, 9 arm 9a base, 9b support, 9c long hole, 10, 11 bolt, 12 lens array, 13 translucent cover, 14 screw, 15 power supply device, 16 heat pipe, 17 feed line, 18 heat conduction member, 19 heat conduction member 20, 21 Light source board

Claims (14)

A light source substrate having a light emitting element;
A plate-shaped heat sink base disposed on the back side of the light source substrate;
A radiation fin projecting from the surface of the heat sink base opposite to the light source substrate;
A heat conducting member composed of parts different from the heat sink base and the heat dissipating fins;
The heat conductive member is in contact with the heat sink base or the light source substrate directly or through a heat conductive material,
When viewed from a substrate vertical direction that is a direction perpendicular to the light source substrate, the heat conducting member extends outward from a central region of the heat sink base,
The lighting device, wherein the thermal conductivity of the thermal conductive member is equal to or higher than the thermal conductivity of the heat sink base.   The lighting device according to claim 1, wherein the thermal conductivity of the thermal conductive member is higher than the thermal conductivity of the heat sink base.   The lighting device according to claim 1, wherein a maximum dimension of the heat conducting member in the substrate vertical direction is larger than a maximum dimension of the heat sink base in the substrate vertical direction. The width direction is a direction perpendicular to the longitudinal direction of the heat conducting member and parallel to the light source substrate,
The lighting device according to any one of claims 1 to 3, wherein a maximum dimension of the heat conducting member in the width direction is larger than a maximum dimension of the heat conducting member in a direction perpendicular to the substrate. Comprising a frame attached to the heat sink base;
The lighting device according to any one of claims 1 to 4, wherein the heat conducting member and the frame are an integral part.   The lighting device according to claim 5, wherein a longitudinal elastic modulus of the frame is equal to or greater than a longitudinal elastic modulus of the heat sink base. An arm connected to the frame and supporting the heat sink base via the frame;
The lighting device according to claim 5, wherein heat conduction is possible from the frame to the arm.   The lighting device according to claim 7, wherein a thickness of the arm is equal to or greater than a thickness of the frame. The frame has a first frame and a second frame arranged so as to sandwich the heat sink base therebetween,
The lighting device according to any one of claims 5 to 8, comprising the heat conducting member that is a part integral with the first frame and the heat conducting member that is a part integral with the second frame. . The frame has a first frame and a second frame arranged so as to sandwich the heat sink base therebetween,
The lighting device according to any one of claims 5 to 8, wherein the heat conducting member, the first frame, and the second frame are integral parts. When viewed from the substrate vertical direction, the length of the light source arrangement region, which is the region where the light emitting elements are arranged, in the first direction is the light source arrangement in the second direction orthogonal to the first direction. Longer than the length of the area,
The angle between the longitudinal direction of the heat conducting member and the first direction is smaller than the angle between the longitudinal direction of the heat conducting member and the second direction of the light source arrangement region. Item 11. The illumination device according to any one of Items 10.   The lighting device according to any one of claims 1 to 11, further comprising a plurality of the heat conducting members extending radially outward from the central region of the heat sink base.   The illuminating device according to any one of claims 1 to 12, further comprising a heat pipe disposed along the heat conducting member. The area surrounded by the figure reduced to a similarity ratio of 1/2 while maintaining the center position of the outer shape of the heat sink base when viewed from the substrate vertical direction is a 1/2 area,
A region surrounded by a figure obtained by reducing the outer shape of the heat sink base to a similarity ratio of 3/4 while maintaining the center position is a 3/4 region,
The lighting device according to any one of claims 1 to 13, wherein the heat conducting member extends from the inside of the 1/2 region to the outside of the 3/4 region.

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