TWM303416U - Cooling module - Google Patents

Description

• M303416 VIII. New Description·· 【New Technology Fields】 This creation department provides a kind of heat dissipation module, especially the heat dissipation module that can be quickly located on the heat source of electronic products, and is clamped by heat dissipation device and positioning means. On both sides of the electronic product, in order to achieve rapid assembly of thermal modules, it can assist the rapid cooling of electronic products. # [Previous Technology] Hey, today's technology information is developing rapidly, while personal computers, electronic notebooks and pens. Due to its strong function and fast speed, the capillary has been widely used in various industries. The advent of the Internet era has caused the popularity of computers. In the operation of the chip, the heat generated by the chip will be generated, and the speed will be faster. The higher the generated thermal energy, in order to avoid burning the wafer due to high, and shorten the life of the wafer, so that heat sinks are provided on each of the wafers to transfer the heat generated on the wafer to the heat sink, and then the fan is generated. The cold air is blown to the surface of the heat sink to dissipate heat. However, for better heat dissipation, the heat sink must be placed on the wafer to absorb the heat energy of the wafer and assist the heat dissipation of the wafer. The way to set the heat sink or fan is to use the screw _ on the board, or use the clip to buckle on the buckle seat, please refer to the seventh figure, as shown in the bulletin No. 5 8 7 7 6 8 (2), in the Republic of China on January 3, 9.2, filed a new type of patent application, application number No. 9 2 2◦19 6 3 'and approved the publication of the patent in the Republic of China in May 1993 Reported that its solid frame a is borrowed from multiple solids The fixing member A passes through the electronic heating element B1 of the circuit board B, and then locks the bottom plate c on the other side of the circuit board B, and the heat sink D is placed in the fixed frame a 5 M303416, and the heat sink D is covered. The frame D1 and the fan D2 are provided, and the hooks A3 and D4 are respectively used to fasten the hook holes A2 of the shelf frame A by the hooks D3 and D4, so as to fix the heat sink D on the fixed frame A, When the heat sink is actually used, there are still many shortcomings, such as:

(1) The electronic heating element Bi of the circuit board B is to be provided with the heat sink D. The fixing frame A must be installed at the electronic heating element B first, then the radiator D, the frame D1 and the fan D2 are assembled, and finally the buckle D3 is used. The D4 is fixed and the steps are quite complicated, troublesome, and time consuming. (2) There are many components and assembly steps for heat dissipation D, which will increase the cost of the assembly and the economic benefits. When the components must be installed one by one, it is necessary to consider whether the connection position of each component is accurate. The position must be installed by a professional, and the utility is not good. (3) In order to fix the heat sink d to the fixed frame A, the fasteners D3 and D4 must have a high clamping force. When the buckles 03 and D4 are operated, it is necessary to use a relatively strong force, which is quite inconvenient. /Yes, how to solve the problem of heat dissipation n's cake, which is the direction of the relevant manufacturers engaged in this industry. [New content] Therefore, in view of the above problems and deficiencies, the creators have collected relevant information, identified and evaluated by multiple parties, and have been engaged in the experience of the general (4) product, and have tried and modified the design. The birth of the patent for the creation of a heat-dissipating function. ",, wheel, and 6 M303416

The main purpose of the present invention is that the heat dissipating device of the heat dissipating module is provided with a plurality of heat dissipating portions on one side of the base portion, and another positioning plane is disposed, and a thief bracket is fixedly disposed above the positioning plane. The red branch is provided with a plurality of card holes, and the elastic elements of the bottom end have a stop body, and the plurality of positioning rods can respectively pass through the plurality of perforations on the pressing plate for each buckle rod to be buckled. The clamping plane of the heat sink can be used to abut the heat source of the electronic product, and the pressing plate on the other side and the positioning device 2 abuts against the electronic product, and the positioning rod on the pressing plate is embedded in the hole of each positioning rod. To achieve the purpose of quickly fixing the heat sink on the heat source of the electronic product, and assisting the electronic product to quickly dissipate heat. [Embodiment] = The purpose and effect of the above-mentioned purpose, the purpose of the creation of the creation, the technical characteristics of the special *, and the effect of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ /, 立,==二二三' The picture shown in the four figures is the solution of the three-dimensional appearance of the creation, the partial enlargement of the positioning means before assembly, and the assembly of the grain means the present big picture. Clearly see &, the money module is composed of Baozhen hot clothes set 1, positioning means 2, of which: 7 1 The heat sink 1 has a base Η, and the base worker side is extended 2 Korean yi On the other side of the plurality of fins H i , there is a wind & i and a positioning plane 113 is provided on the other side of the base 11 . The material 2 is provided with a positioning rod 21 1 , 2 M303416 12 which is vertically arranged on both sides of the support 21 including the bracket 21 , the pressing plate 2 2 and the holding rod 2 , and is respectively disposed on each of the positioning rods 211 and 212 . There are card holes 2 χ i!, ^121 ', and each of the positioning rods 21 1 , 212 is sleeved with elastic bodies 2112 and 2122 having bottom stoppers/13 and 2123, and is disposed above each positioning 11 212 . Pressing the plate 2 2 while pressing the plate 2 2

The positions of the two positions #211, 212 are provided with a plurality of perforations 2 21, and each of the holes 2 21 can be respectively placed on each of the positioning rods 2 i丨, 2 i 2 , and the perforations 2 on the pressing plate 2 The inner side of the 21 is respectively provided with a limiting portion 2 2 2 , and the locking rods 2 3 are respectively engaged and latched by the respective limiting portions 2 2 2 , and the two sides of each of the fastening rods 2 3 are successively formed to form a cassette. The rods 2 3 丨, the card turns 2 3 丨, respectively, to the respective perforations 221 on the pressing plate 22. When the above components are assembled, the positioning plane of the base portion 1 1 of the heat sink 1 is taken! 1 3 relative bracket 2 of the planting means 2 1 SJ, each bracket 2 1 is locked to the miscellaneous plane} i 3 by the lock solid 2 1 3 respectively, that is, the two bodies 2112 are respectively inserted on each bracket 2丄Then, the positioning rod 2 11 of each bracket 21 passes through the pressing plate 2 2, and the elastic plate 2112 and 212 2 are used to hold the pressing plate 2 2 ' to complete the structure of the loosening group. In the second, third and fourth figures, it is the three-dimensional exploded view of the creation, the partial enlargement of the hand and the partial enlargement of the assembly, the partial enlargement of the positioning means, and the enlarged view of the positioning means. It can be clearly seen that the heat dissipation module of the present invention is used for the heat source 3 of the circuit board 3 of the electronic product with the base ii, and the positioning rods 21 of the bracket 21 by the positioning means 2 are used. 1, 212 respectively through the preset hole 3 2 on the circuit board 3, protruding from the back of the circuit board 3, the back of the 8 M303416 circuit board 3 can be pressed against the pressing plate 2 2, and the pressing plate 2 2 Each of the through holes 2 2 1 is located on each of the positioning rods 211 and 212, and the pressing plate 2 2 can be pressed downward, and the positioning rods 211 and 212 are respectively passed through the respective perforations 2 21 , and each position is 2 1 1 , 2 1 2 simultaneously push the card clamps 2 3 1 at each of the perforations 2 2 1 to elastically deform the respective card masts 2 31 until the card holes 2 Η 1 and 2121 on the positioning rods 211 and 212 When the perforations 2 21 are exposed, the card mast 2 31 of the holding cup 2 3 is rebounded by the elastic restoring force of the elastic deformation thereof, so as to provide a card mast 2 3 1 bribe In the card holes 2 111 and 2121 on the positioning rods 2 1 1 and 2 1 2, the circuit board 3 is firmly clamped between the positioning means 2 and can utilize the heat dissipating fins 1 1 ; L and the fan ii 2 The heat energy of the heat source 31 of the circuit board 3 is quickly dissipated, and the circuit board 3 of the auxiliary electronic product performs rapid heat dissipation. When the pressing means 2 is pressed down by the pressing plate 2, each of the perforations 22 is respectively passed through the positioning rods 21 1 and 212 of the respective brackets 21, and simultaneously presses the plate 2 2 and pushes the circuit board 3 to push the pattern. The rods 2 ii, 2 i & the elastic bodies 2112, 2122 are pushed down to push the respective elastic bodies 2112, 21 2 2 to compress and generate a rebounding force, so as to achieve the circuit board 3 The heat source 3 works stably against the fixed surface ii 3 of the interspersed i, so that the circuit board 3 and the heat dissipating device i are not fascinated, and the heat dissipating device 1 can be closely attached to the circuit. The heat source 3 of the board 3 achieves the effect of rapid cooling of the auxiliary circuit board 3. And the positioning means 2 is disposed on each of the positioning rods 21 i, 212 of each bracket 21, and at least one or more card holes 2 M303416 can be respectively provided to adjust between the pressing plate 2 2 and each of the brackets 2 The gap distance can be matched with the heat source of different types of circuit boards 3 1, the positioning means 2 firmly holds the heat source 3 1 of different thicknesses and sizes (such as wafers of different scales, central processing unit, electronic parts, etc.) at the base 11 is positioned between the plane worker 3 and the pressing plate 2 2 . Therefore, the above description is only a preferred embodiment of the present invention, and thus is not limited to the special design of the present, the heat dissipation mold (4) of the heat dissipation mold and the positioning means 2 are held on the circuit board 3 Both sides of the heat source 31 '* achieve the purpose of rapid cooling of the auxiliary circuit board 3' and the positioning means 2 the sewing plate 2 2 feeds the road plate 3 so that the perforations 2 21 are passed through the positioning rods 211, 2丄2, and then Each of the card clamps 2 3 1 of each of the fastening functions 2 3 is respectively embedded in the card holes 2111 and 2121 of each of the positioning rods 2 and 2, and the heat source for holding the heat sink i on the circuit board 3 can be achieved. 3 The purpose of 1 is, therefore, the structure and device of the above-mentioned silk should be covered by this creation. Such simple modification and equivalent structural changes should be included in the scope of the patent of this creation. Bright. The heat dissipation module of the present invention has the following advantages when it is actually used, such as: () The thermal device 1 is disposed on the circuit board 3 by using the positioning means 2 so that the base 11 abuts against the circuit board 3 At the heat source 31, and by the respective holding rods 2 of the positioning means 2, the positioning rods 211, 2 12' respectively embedded in the brackets 21 can smoothly clamp the heat sink 1 to the circuit without using a hand tool. The heat source 31 of the board 3 is easy to operate, saves time and labor. M303416 (1) The opposite brackets 21 of the clamped section 2 are respectively locked on the clamping plane 113 of the heat dissipating device 1 'that can be clamped on both sides of the circuit board 3 by the snap-fit assembly method'" Generally, the operator can operate and assemble, and has wide practicality. (3) The pressing plate 22 of the positioning means 2 has a large area and is easy to apply, and the perforating holes 21 of the pressing plate 2 2 are required to be worn on the respective brackets 2 i. Each of the positioning rods 21 • 1 and 212 is also quite convenient. 'It does not need to use a lot of effort, and the force is easy to apply. Therefore, this creation combines the method of the needle to the wire, and can combine the heat dissipation device with the positioning method. The heat source that is simply and quickly clamped on the circuit board is the main point of protection, only when the positioning means is pressed against the slab, the perforations are allowed to pass through the positioning rod, and then the lever is divided. The card is applied to each positioning rod to achieve the stability of the fixed position, and has the advantages of simple assembly, saving time and effort. However, the above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the creation. Therefore, the use of this manual and the content of the schema is simple. Easy-modification and equivalent structural bottles shall be included in the scope of this patent for the same reason, and shall be combined with Chen Ming. In summary, the above-mentioned heat-dissipating module of the present invention can achieve its efficacy and purpose when used. Therefore, this creation is a practical and excellent creation, in order to meet the application requirements of the new patents, 爰 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the creators’ hard work. Please do not hesitate to give us a letter, the creator will try his best to cooperate with him, and he will feel it. 11 M303416 [Simple illustration] The first picture is the three-dimensional appearance of the creation. The second picture is the three-dimensional exploded view of the creation. The figure is a partial enlarged view of the original positioning means before assembly. The fourth picture is a partial enlarged view of the original positioning means after assembly. The fifth picture is an enlarged view of the positioning means of the creation. The sixth picture is the creation The side view is a three-dimensional exploded view of the conventional heat sink. [Main component symbol description] 1. Heat sink 1 1 , base 111 , heat sink fin 2 , positioning means 2 1 , branch 211, positioning rod 2111, card hole 21 12, elastic body 2 1 13 , stop body 1 12, fan 1 1 3, positioning plane 2 1 2 3, stop body 2 1 3, lock solid 2 2, pressing plate 2 21, perforation 2 2 2, the limit portion 12 M303416 212, the positioning rod 2121, the card hole 212 2, the elastic body 2 3, the holding rod 2 31, the card mast

3, the circuit board 3 1, heat source A, fixed frame A 1, fixed parts 3 2, preset holes

A 2, hook L B, circuit board B1, electronic heating element

C, bottom plate D, radiator D 1, frame D 2, fan D3, buckle D31, buckle hook D 4, buckle D4 1, buckle hook 13

Claims (1)

M303416 IX. Scope of application for patents: 丄, ^ heat-dissipation modules, especially those that can be easily and quickly located on the heat source of electronic products, such as,,,,,,,,,,,,,,,,, _The thermal device is configured to dissipate heat from the base-ship, and the other side of the base has a positioning plane that can be attached to the heat source of the electronic product; the positioning means is fixed on the positioning plane of the base, and is arranged side by side. And • the bracket of the positioning rod, each of the positioning rods is provided with a card hole, and then each of the positioning rods is provided with a bottom part with a miscellaneous component of the ship, and each of them is turned to pass through the scrapping board respectively. The plurality of buttons are mixed with the plurality of limit portions of the shackle-type buckles, and the card holders of the card holes of the brackets are respectively arranged on the two sides of the button. 2. The heat dissipation module according to the application of the patent scope, wherein the heat dissipation device is provided with a fan on a side of the heat dissipation fin of the base. 3, if the towel, please follow the heat-dissipation touch mentioned in the first item, and at least one or more card holes may be provided on each positioning rod of the positioning means. 14