M393722 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱結構，更詳而言之，係關於 一種能免除使用工具即能組卸之散熱結構。 【先前技術】 現今電腦系統的運算速度愈來愈快，且運算量也愈來 愈大’當該電腦處於高運算量時，其例如電腦内的中央處 理 (CPU，Central Processing Unit)或微處理器 (Mic〇rprocessor)等會產生大量熱源，而此大量熱源即有可 能造成該中央處理器或微處理器，甚至其它組件之毁損。 為解決該中央處理器或微處理器的過熱問題，通常係 於，中央處理器或微處理器上裝設散熱器（Heat Sink)及風 扇等散熱裝置’以藉由該散熱器吸取該中央處理器或微處 理器所產生的廢熱’並且藉由該風扇冷卻該散熱器，藉以 降低s亥中央處理器或微處理器於運算過程中所產生的散熱 問題。 而習知技術通常係將散熱器靠在中央處理器或微處 里°°上’並固疋在主機板上，藉以達到散熱的目地’其可 例如第1圖所示之我國專利公告第M317607號之散熱裝 置’該散熱裝置具有主機板11、設置於該主機板11上之 中央處理器12、設置於該主機板11底面並相對應於該中 央處理器12之底座13、設置於該中央處理器12上之散熱 态14。該主機板11具有複數個穿孔110，而該底座13具 有相對應各該穿孔110之螺柱131，且各該螺柱131係穿 mjyjιδδ 設料穿孔UG而凸出於該中央處理器12之周邊，又該散 目對應各該螺柱⑶之腳片141，且該腳片141 之2’以令各該鎖111件142旋人各該螺柱131 散熱器14固定於該主機板U上，並且>1 二理r 19央處理11 12 ’俾能藉由該散熱器Μ吸收該t央 ΐ夫：-Γ運作時所產生的熱能，再藉由散熱風扇(圖式 中未表不）吹送冷空氣以進行散熱。M393722 V. New description: [New technical field] This creation is about a heat dissipation structure. More specifically, it relates to a heat dissipation structure that can be assembled without the use of tools. [Prior Art] Today's computer systems are getting faster and faster, and the amount of computing is getting bigger and bigger. 'When the computer is in high computational capacity, it is, for example, a central processing unit (CPU) or microprocessor in the computer. A large number of heat sources are generated by the Mic〇rprocessor, etc., and this large number of heat sources may cause damage to the central processing unit or the microprocessor or even other components. In order to solve the overheating problem of the central processing unit or the microprocessor, a heat sink (Heat Sink) and a heat sink such as a fan are usually disposed on the central processing unit or the microprocessor to absorb the central processing by the heat sink. The waste heat generated by the processor or the microprocessor is used to cool the heat sink by the fan, thereby reducing the heat dissipation problem generated by the central processing unit or the microprocessor during the operation. However, the conventional technology usually relies on the heat sink on the central processing unit or the micro-section and is fixed on the main board to achieve the purpose of heat dissipation, which can be, for example, the Chinese Patent Publication No. M317607 shown in FIG. The heat dissipating device has a main board 11, a central processing unit 12 disposed on the main board 11, a base 13 disposed on the bottom surface of the main board 11 and corresponding to the central processing unit 12, and disposed at the center The thermal state 14 on the processor 12. The main board 11 has a plurality of through holes 110, and the base 13 has studs 131 corresponding to the perforations 110, and each of the studs 131 is pierced by a mjyjιδδ material through hole UG and protrudes from the periphery of the central processing unit 12. And the foot piece 141 corresponding to each of the studs (3), and the 2' of the leg piece 141 is fixed to the main plate U by the heat sinks 14 of the studs 131 And >1 二理 r 19央处理11 12 '俾 can absorb the t-coin by the radiator ::-Γ the heat energy generated during operation, and then by the cooling fan (not shown in the figure) Blow cold air for heat dissipation.
/惟，設於該散熱器14周邊之腳片141上的鎖固件142 必須以係如螺絲起子之手 于具將其螺入该底座13上的螺 端’以藉由該散熱器14及底座13上下夾設的方 工A、"主機板11及設於該主機板11上之中央處理器 =因而在組卸上必須藉由額外的工具，故在組卸上較為 且容易造成中央處理器或主機板及其上之元件的損 壞。 、 月多閱第2圖，其係為我國專利公告第M298735於 ▲之散熱器固定裳置，士闰痛- • 疋哀置如圖所不，其包括具有底板2]之散熱 ° 又置°亥政熱态2之固定座22、及樞設於該固定座 22側邊之彈性壓桿23 ;所述之固定座22㈣定於主機板 (圖式中未表不）上，且该固定座22具有容設中央處理器（圖 式中未表示）之開口 220，於該固定座22之側邊設有兩樞 接部221 ’而該彈㈣桿23係呈框型結構，並且插設於該 些插接部221上，於該彈性壓桿23兩側具有壓制部23卜 又於。亥固疋座22上相對應於該些樞接部221之位置設有第 口定。Ρ 222’且於該彈性壓桿23上設有相對應於該第一 5 M393722 固定部222之第二固定部232，令該散熱器2壓靠在該中 央處理器上，然後將該框型結構之彈性壓桿23靠在該散熱 器2兩側邊之壓制部231分別靠在該散熱器2之底板21 上，再將該彈性壓桿23之第一固定部222結合在該固定座 22之第二固定部232上，俾將該散熱器2固定於該主機板 上，並且壓靠在中央處理器上，以供該中央處理器進行散 熱。反之，令該彈性壓桿23之第一固定部222脫離該第二 固定部232，並向上翻轉該彈性壓桿23，使該彈性壓桿23 之壓制部231脫離該底板21，即能拆解該散熱器2，因而 能免除使用手工具即能拆卸及組裝該散熱器2。 惟，該固定座22需框設於該中央處理器週緣，因而 佔用主機板之面積，對於該主機板製造商而言，必須在有 限的空間内，額外挪出部份無用空間裝設該固定座22，進 而造成主機板可用面積的浪費。 因此，如何提出一種散熱結構，以克服習知技術之使 用手工具拆解與組裝、及佔用主機板面積之缺失，實已成 爲目前業界亟待克服之課題。 【新型内容】 鑒於上述習知技術之缺點，本創作之主要目的在於提 供一種散熱結構，能免除使用手工具。 本創作之又一目的在於提供一種散熱結構，能避免佔 用直電路板面積。 為達上述及其他目的，本創作提供一種散熱結構，包 括：電路板，具有相對之第一面及第二面，該第一面設有 發熱元件：且該電路板在該發熱元件的周邊具有複數穿 孔，加強背板，緊鄰於該電路板之第二面，並設於 該發熱元件的位置，該加強昔柘 強月板上具有對應該些穿孔的複 數支撐柱，該些支撐㈣過該㈣孔；魏n定件，八= 對應該些支撐城穿孔之—設置，具有相對之第—端2 -端，各_定件係於第—端可拉伸地連接所_的支樓 柱’並於第二端具有軸部及片體，該片體設於該轴部上二 ^該片體的長度尺寸大於該軸部的直徑尺寸；以及散熱 器，覆於該發熱元件上，具有複數十字固定部，該些十’字 固定部具有對應該㈣定件之-軸部形㈣對應該 些固定件之一片體形狀的貫穿槽及凹槽，其中，各該^字 固定部的貫穿槽及凹槽間具有一相交夾角；其中，:序: 由分別拉伸各該固定件使其軸部及片體#過所對應的t十^ 固定部的貫穿槽，及旋轉各該固定件使其片體壓靠在所對 應的十字固定部的凹槽中，以將該散熱器固定於該電路板 上0 依上述散熱結構之實施例中，該支撐柱可具有導引孔 使其呈t空管體。該散熱結構可包括彈性伸縮件，該彈性 伸縮件之一端穿設於該支撐柱的導引孔内，並固接於該導 引孔的底面，該固定件係於第一端穿設進入並連接該彈性 伸'件之另一端，以使§亥固定件能相對於該支撐柱在遠離 或靠近該支撑柱的方向上移動。該支撐柱導引孔的底面可 具有一凸塊，相應地，該彈性伸縮件固接於該凸塊上。 再者’該固定件的第一端可具有導引軸，相應地，該 M393722 彈性伸縮件連接於該導引軸遠離該轴部的一端上。該彈性 伸縮件為拉伸彈簧。該片體突出於該轴部，且該片體與該 軸部之間形成一方便操作的挖空區域。各該十字固定部的 貫穿槽及凹槽間的相交夾角為九十度。 综上所述，本創作之散熱結構具有設有發熱元件的電 路板、覆於該發熱元件上之散熱器、於該電路板下方設置 之加強背板、及可拉伸地連接該加強背板之複數固定件。 該散熱器具有對應該些固定件的複數十字固定部，各該固 定件能穿越設於該散熱器對應之十字固定部，以將該散熱 器固定於電路板並壓靠在該發熱元件上以進行散熱，且反 向操作即能完成拆解，因而能免除使用手工具即能完成組 裝及拆解動作，並且僅在於該電路板上設有複數穿孔，以 供該固定件穿越，而能避免佔用電路板之面積，以提高該 電路板之佈線空間。 【實施方式】 以下係藉由特定的具體實例說明本創作之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容輕易地 暸解本創作之其他優點與功效。 請參閱第3及4圖，係為本創作之散熱結構局部的立 體分解圖。如圖所示，本創作之散熱結構係具有電路板 31、加強背板33、複數固定件36、以及散熱器3。 該電路板31上具有相對之第一面及第二面，該第一 面設有例如中央處理器之發熱元件3 2，且該電路板31在 該發熱元件32的周邊具有複數穿孔310。該加強背板33 M393722 緊鄰於該電路板31之第二面，並設於相對應該發熱元件 32的位置，以輔助強化具有該發熱元件32的該電路板31 的強度，進而提供支撐力以防止該電路板31翹曲。 該加強背板33係為具有一定強度的剛體結構，於本 實施例中，該加強背板33具有對應該些穿孔310的複數支 撐柱34，如圖所示，該些支撐柱34的外形係對應於該些 • 穿孔310的孔形，俾令該些支撐柱34得分別穿過該些穿孔 310。 > 所述的複數固定件36係分別對應於該些支撐柱34及 穿孔310之一設置，以供將該散熱器3固定於該電路板31 上。各該固定件36具有相對之第一端及第二端。各該固定 件36係於第一端可拉伸地連接所對應的支撐柱34，並於 第二端具有軸部361及片體362，該片體362設於該轴部 361 上。 如圖所示，該片體362的長度尺寸大於該軸部361的 B 直徑尺寸，但不以此為限，亦可依情況調整該片體362與 - 軸部361的尺寸比例。於本實施例中，該片體362突出於 該軸部361之一端側，且該片體362與該軸部361之間形 成一方便操作的挖空區域，如圖所示，該挖空區域係例如 為矩形，但不以此為限。 該散熱器3係為一種形式的散熱鰭片，該散熱器3係 覆於該發熱元件32上，並具有用於固定該散熱器3的複數 十字固定部37。該些十字固定部37具有對應該些固定件 36之一轴部361形狀的軸孔371、對應該些固定件36之一 9 M393722 片體362形狀的貫穿孔372及凹槽373，其中，各該十字 固定部37的貫穿孔372及凹槽373間具有一相交夾角，如 圖所示，該貫穿孔372及凹槽373之相交角度為九十度， 但其間之相交角度仍可適當改變，並不以圖中所示者為限。 於本實施例中，該散熱結構的裝配係依序藉由分別拉 伸各該固定件36使其軸部361及片體362穿過所對應的十 字固定部37的貫穿孔372，及旋轉各該固定件36使其片 體362壓靠在所對應的十字固定部37的凹槽373中，以將 該散熱器3固定於該電路板31上。此外，該支撐柱34具 有導引孔341使其呈中空管體，相應地，該固定件36的第 一端具有導引軸363，藉由該導引軸363與該導引孔341 的配合，使該固定件36能相對於該支撑柱34在遠離或靠 近該支撑柱34的方向上移動。於本實施例中，該彈性伸縮 件35的一端係連接於該導引軸363遠離該軸部361的端側 上，而另一端係連接於該支撐柱34上。但不以此為限。 如圖所示，該散熱結構還包括有彈性伸縮件35，該彈 性伸縮件35之一端穿設於該支撐柱34的導引孔341内， 並固接於該導引孔341的底面，因而能藉由該導引孔341 限制該彈性伸縮件35的運動行程。該固定件36係於第一 端穿設進入並連接該彈性伸縮件35之另一端，以使該固定 件36能相對於該支撑柱34在遠離或靠近該支撑柱34的方 向上移動。 所述之彈性伸縮件35可例如為彈簧，較佳者係為拉 伸彈簧，但不以此為限。於本實施例中，該支撐柱34中具 M393722 . 有用以固定該彈性伸縮件35 —端的凸塊，以避免該彈性伸 縮件35於形變過程中脫離該支撐柱34，但仍可選用其它 的固定機制，將該彈性伸縮件35固定於該支撐柱34上。 請參閱第5A至5D圖，係為本創作之散熱器3固定 於電路板31之發熱元件32上的作動示意圖。 首先，如第5A圖所示，該固定件36係穿設於該彈性 伸縮件35内並設置於該支撐柱34中，以使該固定件36 - 能相對於該支撑柱34在遠離或靠近該支撑柱34的方向上 • 移動，令該固定件36穿過該電路板31之穿孔310，而凸 出於該電路板31之表面，且對應於該散熱器3之十字固定 部37。 其次，如第5B圖所示，令該固定件36穿過該十字固 定部37，其中，令該固定件36之軸部361穿入該十字固 定部37之轴孔371，而令該固定件36之片體362穿越過 該十字固定部37之貫穿孔372並凸出於該散熱器3之表 • 面。 - 接著，如第5C圖所示，將該固定件36朝背對於該電 路板31之方向拉起，令該固定件36之軸部361超越過該 十字固定部37之孔端。 再者，如第5D圖所示，旋轉該固定件36，令該固定 件36之片體362由該十字固定部37之貫穿孔372中轉向 凹槽373中，之後放開該固定件36，而藉由該彈性伸縮件 35之彈性回復力，使該固定件36之片體362嵌入該十字 固定部37之凹槽373中，俾藉由該固定件36將該散熱器 M393722 3緊密壓靠在該發熱元件32上。 反之，若欲拆下該散熱器3，則反向向上提起該固定 件36，令該固定件36之片體362脫離該十字固定部37之 凹槽373，且轉向靠入該十字固定部37之貫穿孔372，令 該固定件36置入該十字固定部37中，之後即能將該散熱 器3取下，如此即能完成拆解的動作。 經由上述可知，本創作之散熱結構具有設有發熱元件 的電路板、覆於該發熱元件上之散熱器、於該電路板下方 設置之加強背板、及可拉伸地連接該加強背板之複數固定 件。該散熱器具有對應該些固定件的複數十字固定部，各 該固定件能穿越設於該散熱器對應之十字固定部，以將該 散熱器固定於電路板並壓靠在該發熱元件上以進行散熱， 且反向操作即能完成拆解，因而能免除使用手工具即能完 成組裝及拆解動作，並且僅在於該電路板上設有複數穿 孔，以供該固定件穿越，而能避免佔用電路板之面積，以 提高該電路板之佈線空間。 上述實施例僅例示性說明本創作之原理及其功效，而 非用於限制本創作。任何熟習此項技藝之人士均可在不違 背本創作之精神及範疇下，對上述實施例進行修飾與改 變。因此，本創作之權利保護範圍，應如後述之申請專利 範圍所列。 【圖式簡單說明】 第1圖係為本國專利公告第M317607號之散熱裝置 的立體分解圖； M393722 第2圖係為本國專利公告帛M298735號之散熱器固 定裝置的立體分解圖； ^ 第3圖係為本創作之散熱結構局部的立體分解圖； •第4 ®縣賴作之散熱結狀付較部的上視/ /, the fastener 142 provided on the leg piece 141 of the periphery of the heat sink 14 must be screwed into the screw end of the base 13 by a hand such as a screwdriver to pass the heat sink 14 and the base The upper and lower clamping A, "the motherboard 11 and the central processor disposed on the motherboard 11; therefore, the additional tools must be used in the group unloading, so it is easy to cause central processing in the group unloading. Damage to the unit or motherboard and the components on it. Read more than the second picture in the month, which is the fixed number of the radiator of the Chinese patent announcement No. M298735 in ▲, the gentry pain - • 疋 置 置 , , , , , , , , , , , , , , , , , The fixed seat 22 of the hot state 2 and the elastic pressing rod 23 pivoted on the side of the fixing seat 22; the fixing seat 22 (4) is fixed on the main board (not shown in the drawing), and the fixing seat 22 has an opening 220 for receiving a central processing unit (not shown), two pivoting portions 221 ′ are disposed on the side of the fixing base 22 , and the elastic (four) rods 23 are frame-shaped and are inserted in The insertion portions 221 have pressing portions 23 on both sides of the elastic pressing rod 23. The position of the hinge portion 22 corresponding to the pivot portion 221 is set. Ρ 222' and a second fixing portion 232 corresponding to the first 5 M393722 fixing portion 222 is disposed on the elastic pressing rod 23, so that the heat sink 2 is pressed against the central processing unit, and then the frame type is The pressing portion 23 of the structure is placed on the bottom plate 21 of the heat sink 2 against the pressing portion 231 of the heat sink 2, and the first fixing portion 222 of the elastic pressing rod 23 is coupled to the fixing seat 22. The second fixing portion 232 fixes the heat sink 2 to the motherboard and presses against the central processing unit for heat dissipation by the central processing unit. On the contrary, the first fixing portion 222 of the elastic pressing rod 23 is disengaged from the second fixing portion 232, and the elastic pressing rod 23 is turned upward to disengage the pressing portion 231 of the elastic pressing rod 23 from the bottom plate 21. The heat sink 2 thus eliminates the need to disassemble and assemble the heat sink 2 using a hand tool. However, the fixing base 22 needs to be framed on the periphery of the central processing unit, and thus occupies the area of the motherboard. For the motherboard manufacturer, it is necessary to additionally remove some useless space to install the fixing in a limited space. The seat 22, in turn, causes a waste of the available area of the motherboard. Therefore, how to propose a heat dissipating structure to overcome the conventional techniques of disassembling and assembling the hand tool and occupying the lack of the main board area has become an urgent problem to be overcome in the industry. [New content] In view of the above shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipation structure that eliminates the use of hand tools. Another object of the present invention is to provide a heat dissipation structure that avoids occupying a straight board area. To achieve the above and other objects, the present invention provides a heat dissipation structure comprising: a circuit board having opposite first and second faces, the first face being provided with a heat generating component: and the circuit board having a periphery of the heat generating component a plurality of perforations, a reinforcing back plate, adjacent to the second side of the circuit board, and disposed at a position of the heating element, the reinforcing sun slab having a plurality of supporting columns corresponding to the perforations, the supporting (four) passing the (4) Holes; Wei n fixed pieces, eight = corresponding to the support of the city perforation - set, with the opposite end - end 2 - end, each _ set is attached to the first end of the extension of the branch column And having a shaft portion and a sheet body at the second end, the sheet body being disposed on the shaft portion, the length of the sheet body being larger than the diameter of the shaft portion, and the heat sink covering the heating element a plurality of cross-fixing portions, the ten-shaped fixing portions having a through-groove and a groove corresponding to the shape of one of the fixing members (four) of the fixing member, wherein each of the fixing portions is penetrated There is an intersecting angle between the groove and the groove; wherein: Stretching each of the fixing members so that the shaft portion and the sheet body # pass through the corresponding through grooves of the fixing portion, and rotating the fixing members to press the sheet body against the corresponding groove of the cross fixing portion In the embodiment in which the heat sink is fixed on the circuit board. According to the embodiment of the heat dissipation structure, the support column may have a guiding hole to make it a t-tube body. The heat dissipation structure may include an elastic expansion member, one end of the elastic expansion member is disposed in the guiding hole of the support column, and is fixed to the bottom surface of the guiding hole, and the fixing member is inserted into the first end and enters The other end of the elastic extension member is coupled to enable the § hai fixture to move relative to the support column in a direction away from or near the support post. The bottom surface of the support post guiding hole may have a bump, and correspondingly, the elastic telescopic member is fixed to the bump. Further, the first end of the fixing member may have a guiding shaft, and correspondingly, the M393722 elastic stretching member is coupled to an end of the guiding shaft away from the shaft portion. The elastically stretchable member is a tension spring. The sheet body protrudes from the shaft portion, and a hollowed-out area for easy operation is formed between the sheet body and the shaft portion. The intersecting angle between the through grooves and the grooves of each of the cross fixing portions is ninety degrees. In summary, the heat dissipation structure of the present invention has a circuit board provided with a heating element, a heat sink over the heating element, a reinforcing backing plate disposed under the circuit board, and a stretchable connection of the reinforcing backing plate Multiple fixtures. The heat sink has a plurality of cross fixing portions corresponding to the fixing members, and each of the fixing members can pass through a cross fixing portion corresponding to the heat sink to fix the heat sink to the circuit board and press against the heating element The heat is dissipated, and the disassembly is completed in the reverse operation, so that the assembly and disassembly operations can be eliminated by using the hand tool, and only the plurality of perforations are provided on the circuit board for the fixing member to pass through, thereby avoiding Occupy the area of the board to increase the wiring space of the board. [Embodiment] The following describes the implementation of the present invention by way of specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. Please refer to Figures 3 and 4 for a partial exploded view of the heat dissipation structure of this creation. As shown, the heat dissipation structure of the present invention has a circuit board 31, a reinforcing back plate 33, a plurality of fixing members 36, and a heat sink 3. The circuit board 31 has opposing first and second faces, the first face being provided with a heat generating component 32 such as a central processing unit, and the circuit board 31 having a plurality of through holes 310 at the periphery of the heat generating component 32. The reinforcing back plate 33 M393722 is adjacent to the second surface of the circuit board 31 and disposed at a position corresponding to the heat generating component 32 to assist in strengthening the strength of the circuit board 31 having the heat generating component 32, thereby providing a supporting force to prevent The circuit board 31 is warped. The reinforced back plate 33 is a rigid body structure having a certain strength. In the embodiment, the reinforced back plate 33 has a plurality of support columns 34 corresponding to the plurality of through holes 310. As shown, the shape of the support columns 34 is Corresponding to the hole shapes of the perforations 310, the support posts 34 are respectively passed through the through holes 310. > The plurality of fixing members 36 are respectively disposed corresponding to one of the support columns 34 and the through holes 310 for fixing the heat sink 3 to the circuit board 31. Each of the fixing members 36 has opposite first and second ends. Each of the fixing members 36 is detachably connected to the corresponding support post 34 at the first end, and has a shaft portion 361 and a sheet body 362 at the second end. The sheet body 362 is disposed on the shaft portion 361. As shown, the length of the body 362 is larger than the diameter of the B portion of the shaft portion 361. However, the size ratio of the body 362 to the shaft portion 361 may be adjusted as appropriate. In the embodiment, the sheet body 362 protrudes from one end side of the shaft portion 361, and a convenient hollowed-out area is formed between the sheet body 362 and the shaft portion 361. As shown in the figure, the hollowed out area is shown. For example, it is a rectangle, but is not limited thereto. The heat sink 3 is a type of heat radiating fin which is attached to the heat generating component 32 and has a plurality of cross fixing portions 37 for fixing the heat sink 3. The cross fixing portion 37 has a shaft hole 371 corresponding to the shape of one of the shaft portions 361 of the fixing member 36, a through hole 372 corresponding to the shape of one of the fixing members 36, 9 M393722, and a groove 373, wherein each The intersecting hole 372 and the groove 373 of the cross fixing portion 37 have an intersecting angle. As shown, the intersecting angle of the through hole 372 and the groove 373 is ninety degrees, but the angle of intersection therebetween can be appropriately changed. Not limited to those shown in the figure. In this embodiment, the assembly of the heat dissipating structure sequentially stretches each of the fixing members 36 such that the shaft portion 361 and the sheet body 362 pass through the through holes 372 of the corresponding cross fixing portion 37, and rotate each The fixing member 36 presses the sheet body 362 against the groove 373 of the corresponding cross fixing portion 37 to fix the heat sink 3 to the circuit board 31. In addition, the support post 34 has a guiding hole 341 to be a hollow tube body. Correspondingly, the first end of the fixing member 36 has a guiding shaft 363, and the guiding shaft 363 and the guiding hole 341 are The mating member 36 is movable relative to the support post 34 in a direction away from or adjacent to the support post 34. In this embodiment, one end of the elastic expansion member 35 is connected to the end side of the guiding shaft 363 away from the shaft portion 361, and the other end is connected to the supporting column 34. But not limited to this. As shown in the figure, the heat dissipation structure further includes an elastic expansion member 35. One end of the elastic expansion member 35 is disposed in the guiding hole 341 of the support column 34 and is fixed to the bottom surface of the guiding hole 341. The movement stroke of the elastically stretchable member 35 can be restricted by the guide hole 341. The fixing member 36 is threaded at the first end to enter and connect the other end of the elastic expansion member 35 so that the fixing member 36 can move relative to the support column 34 in a direction away from or close to the support column 34. The elastically stretchable member 35 can be, for example, a spring, and is preferably a tension spring, but is not limited thereto. In this embodiment, the support column 34 has M393722. There is a protrusion for fixing the end of the elastic expansion member 35 to prevent the elastic expansion member 35 from being detached from the support column 34 during deformation, but other options are still available. The fixing mechanism fixes the elastic expansion member 35 to the support column 34. Referring to Figures 5A through 5D, the operation of the heat sink 3 of the present invention is fixed to the heat generating component 32 of the circuit board 31. First, as shown in FIG. 5A, the fixing member 36 is disposed in the elastic expansion member 35 and disposed in the support column 34, so that the fixing member 36 can be away from or close to the support column 34. The support column 34 is moved in the direction of the support post 34 so that the fixing member 36 passes through the through hole 310 of the circuit board 31 and protrudes from the surface of the circuit board 31 and corresponds to the cross fixing portion 37 of the heat sink 3. Next, as shown in FIG. 5B, the fixing member 36 is passed through the cross fixing portion 37, wherein the shaft portion 361 of the fixing member 36 is inserted into the shaft hole 371 of the cross fixing portion 37, and the fixing member is made The sheet 362 of 36 passes through the through hole 372 of the cross fixing portion 37 and protrudes from the surface of the heat sink 3. - Next, as shown in Fig. 5C, the fixing member 36 is pulled back in the direction of the circuit board 31, so that the shaft portion 361 of the fixing member 36 passes over the hole end of the cross fixing portion 37. Moreover, as shown in FIG. 5D, the fixing member 36 is rotated, and the piece 362 of the fixing member 36 is turned into the groove 373 from the through hole 372 of the cross fixing portion 37, and then the fixing member 36 is released. The sheet 362 of the fixing member 36 is inserted into the recess 373 of the cross fixing portion 37 by the elastic restoring force of the elastic stretching member 35, and the heat sink M393722 3 is closely pressed by the fixing member 36. On the heating element 32. On the other hand, if the heat sink 3 is to be removed, the fixing member 36 is lifted up in the opposite direction, so that the piece 362 of the fixing member 36 is disengaged from the groove 373 of the cross fixing portion 37 and turned into the cross fixing portion 37. The through hole 372 allows the fixing member 36 to be placed in the cross fixing portion 37, and then the heat sink 3 can be removed, so that the disassembling operation can be completed. According to the above, the heat dissipation structure of the present invention has a circuit board provided with a heating element, a heat sink covering the heating element, a reinforcing back board disposed under the circuit board, and a stretchable connection of the reinforcing back board. Multiple fixtures. The heat sink has a plurality of cross fixing portions corresponding to the fixing members, and each of the fixing members can pass through a cross fixing portion corresponding to the heat sink to fix the heat sink to the circuit board and press against the heating element The heat dissipation and the reverse operation can complete the disassembly, so that the assembly and disassembly operations can be eliminated without using the hand tool, and only the plurality of perforations are provided on the circuit board for the fixing member to pass through, and can be avoided. Occupy the area of the board to increase the wiring space of the board. The above embodiments are merely illustrative of the principles of the present invention and their effects, and are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of National Patent Publication No. M317607; M393722 Fig. 2 is an exploded perspective view of a heat sink fixture of the national patent publication 帛M298735; ^3 The figure is a partial exploded view of the heat dissipation structure of the creation; • The top view of the heat dissipation knot of the 4th County
第5Α至5D圖係為本 電路板之發熱元件上的作動 【主要元件符號說明】 11 主機板 110 穿孔 12 中央處理器 13 底座 131 螺柱 14 散熱器 141 腳片 142 鎖固件 2 散熱器 21 底板 22 固定座 220 開口 221 樞接部 222 第一固定部 23 彈性壓桿 231 壓制部 創作散熱結構之散熱器固定於 示意圖。 第二固定部 散熱器 電路板 穿孔 發熱元件 加強背板 支撐柱 導引孔 彈性伸縮件 固定件 軸部 片體 導引軸 十字固定部 軸孔 貫穿孔 凹槽 14Figure 5 to 5D is the operation of the heating element on the board [Main component symbol description] 11 Motherboard 110 Perforation 12 Central processor 13 Base 131 Stud 14 Heat sink 141 Leg 142 Lock 2 Heat sink 21 Backplane 22 Fixing seat 220 Opening 221 pivoting portion 222 First fixing portion 23 Elastic pressing rod 231 Pressing portion The heat sink of the heat dissipating structure is fixed to the schematic view. Second fixing part Heat sink Circuit board Perforation Heating element Reinforced back plate Support column Guide hole Elastic expansion joint Fixing piece Shaft part Sheet Guide shaft Cross fixing part Shaft hole Through hole Groove 14