M3 5223 8 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種散熱組合，尤指一種用於電子元件之 散熱組合。 [先前技術】 常ί之電子元件散熱結構均包括一具有複數散熱鰭月 之散熱器，該散熱器-般藉由螺絲鎖固或柳合等方式固定 於電子裝置中，該種方式安裝時較費時費力，後來出現一 種散熱裝置，包括一風扇、一固定架、一對扣具、一散埶 器及一固定基座。該固定架呈一门形且具有一頂板及由該 2板兩側邊向下垂直延伸之㈣板，該兩側板底端各並列 又兩缺σ 4扣具採用彈性線材—體彎折成型且旦有一彈 立力部及自該彈力部兩端並列斜向上方料延伸之、兩卡扣 和該卡扣部頂端分別向内側彎折延伸出 片上並列設有兩通槽，該通槽與固定架二 有一方^並將該扣具彈力部容置於其中。該固定基座具 Μ座’其兩側面兩端處分別設有 上各設有-卡扣孔，該卡扣孔可與扣且 種散熱裴置之卡扣 I、之卡勾配合。但該 【新型内容】 稷雜，^'安裝時較為繁續。 馨於以上内容，有必要描供一 6 散熱組合。 要^、“褒方便地電子元件 1埶件散熱組合’該散熱組合包括-支撐架、 月丈…、益及一固定件，命 八 °亥固疋件面向該散熱器延伸有至少 6 M352238 一具自由末端之彈性抵觸片，該散熱器受該抵觸片抵壓固 ^ 定於該支撐架與該固定件間。 ‘相較於習知技術，本創作電子元件散熱組合可藉由直 接衝設於該固定件上之抵觸片抵固該散熱器，結構簡單， 使用方便。 【實施方式】 - 請參閱圖1，本創作電子元件散熱組合包括一支撐架 _ 40、兩散熱器60、兩安裝架50及一用於將該散熱器60固 • 定於該支撐架40上之固定件70。該電子元件散熱組合可 給兩安裝於一主機板10上之兩電子元件20散熱。 該支撐架40包括一開設有兩電子元件安裝口 412之 底板41、沿該底板41兩相對邊豎直向上延伸出之兩側板 42及沿該底板41另兩相對邊豎直向上彎折出之折邊43。 每一側板42分別設有一樞轉部422與一凸柱424。該底板 41中部安裝有一支撐片44，該支撐片44上枢轉連接有一 φ 支撐桿442。 該散熱器60係由複數散熱鰭片平行排列組成之散熱 鰭片組。 該安裝架50用於放置該散熱器60,該安裝架50包括 一底壁51及自底壁51向上彎折出之四個側壁53，該底壁 51開設有一電子元件安裝口 512。該兩相對侧壁53間連 接有一彈性壓片55。該壓片55可由一端打開用以裝入該 散熱器60。 續請參閱圖2，該固定件70包括一固定板71及一樞 7 M352238 轉連接於該固定板71前端之卡扣件75。該卡扣件75對應 一 該支撐架40之兩凸柱424開設兩卡槽755。該固定板71 * 對應該兩散熱器60之中心位置開設兩十字形開槽712,該 固定板71以每一開槽712之交叉處為中心向下衝設形成 兩漏斗形凹陷區域’該固定板71於該凹陷區域内形成有 四個具有自由末端之彈性抵觸片715。該四個抵觸片715 . 之自由末端位於同一平面内，該平面平行且略低於該固定 _ 板71所在面。該固定板71對應該支撐架40之支撐桿442 • 向下彎折有兩固定片717。 續請參閱圖3，組裝時，先將該支撐架40安裝於該主 機板10上使該兩電子元件20分別置於該兩安裝口 412 内，然後將該兩散熱器60分別裝入該安裝架50内，再將 該安裝架50分別對應卡固於該支撐架40内，此時，該電 子元件20剛好透過該安裝架50之安裝口 51與該散熱器 60底部進行熱接觸。將該卡扣件75樞轉安裝於該固定板 I 71，將該組裝好後之固定件70樞轉連接於該支撐架40之 樞轉部422,最後將該固定件70之兩固定片717分別固定 於該支撐架40之支撐桿442上，此時，該電子元件散熱 組合被固定於該主機板10上。 續請參閱圖4，使用時，向下轉動該固定件70至水平 狀態，該固定件70之彈性抵觸片715向上彈性變形並且 向下擠壓該安裝架50之壓片55以抵壓固定該散熱器60, 同時，轉動該卡扣件75使該卡扣件75藉由該卡槽755與 該支撐架40之凸柱424卡扣。該散熱器60被固定於該主 8 M352238 機板ίο上。 於本實施方式中，該安裝架50可根據需要使用，且 本電子元件散熱組合可使用一散熱器60對單一電子元件 20進行散熱。 综上所述，本創作符合新型專利之要件，爰依法提出 專利申請。惟，以上僅為本創作之較佳實施例，舉凡熟悉 本案技藝之人士，在爰依本創作精神所作之等效修飾或變 化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本創作電子元件散熱組合之立體分解圖。 圖2係圖1中固定件沿II-II方向之剖視圖。 圖3係本創作電子元件散熱組合之立體組裝圖。 圖4係本創作電子元件散熱組合使用狀態時之立體組裝 圖。 【主要元件符號說明】 主機板 10 電子元件 20 支撐架 40 底板 41 安裝口 412 侧板 42 枢轉部 422 凸柱 424 折邊 43 支撐片 44 支撐桿 442 安裝架 50 底壁 51 安裝口 512 侧壁 53 壓片 55 M352238 散熱器 60 固定件 70 固定板 71 開槽 712 抵觸片 715 固定片 717 卡扣件 75 卡槽 755M3 5223 8 VIII. New Description: [New Technology Field] This creation involves a heat sink combination, especially a heat sink combination for electronic components. [Prior Art] The heat-dissipating structure of the electronic components of the device includes a heat sink having a plurality of heat-dissipating fins, and the heat sink is generally fixed in the electronic device by means of screw locking or splicing, etc. Time-consuming and laborious, a heat sink has appeared, including a fan, a fixed frame, a pair of fasteners, a diffuser and a fixed base. The fixing frame has a shape of a door and has a top plate and four (4) plates extending perpendicularly from opposite sides of the two plates. The bottom ends of the two side plates are juxtaposed and two σ are missing. The buckle is formed by elastic wire-body bending and And a two-way groove and a top end of the buckle portion are respectively bent inwardly from the two ends of the elastic portion, and the two buckles and the top end of the buckle portion are respectively bent outwardly to extend out of the sheet, and two through grooves are arranged in parallel. The holder 2 has a side and the buckle is placed therein. The fixed base has a latching hole at each of the two ends of the two sides, and the snap hole is matched with the buckle of the buckle and the heat-dissipating clamp I and the hook. But the [new content] is noisy, ^' installation is more complicated. In the above content, it is necessary to describe a 6 heat sink combination. To ^, "褒 地 电子 电子 电子 电子 电子 电子 电子 电子 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The elastic contact piece having a free end, the heat sink is pressed and fixed between the support frame and the fixing member by the contact piece. Compared with the prior art, the heat dissipation combination of the electronic component of the present invention can be directly punched The contact piece on the fixing member is fixed to the heat sink, and has a simple structure and convenient use. [Embodiment] - Referring to FIG. 1 , the heat dissipation combination of the electronic component includes a support frame _ 40, two heat sinks 60, and two installations. The frame 50 and a fixing member 70 for fixing the heat sink 60 to the support frame 40. The electronic component heat dissipating combination can dissipate heat to the two electronic components 20 mounted on a motherboard 10. 40 includes a bottom plate 41 having two electronic component mounting openings 412, two side plates 42 extending vertically upward along opposite sides of the bottom plate 41, and a folded edge 43 bent vertically upward along the other opposite sides of the bottom plate 41. Each side plate 42 is separately provided A pivoting portion 422 and a protruding post 424. A supporting piece 44 is mounted on the middle portion of the bottom plate 41, and a φ support rod 442 is pivotally connected to the supporting piece 44. The heat sink 60 is composed of a plurality of heat dissipating fins arranged in parallel to dissipate heat. The mounting bracket 50 is configured to mount the heat sink 60. The mounting bracket 50 includes a bottom wall 51 and four side walls 53 bent upward from the bottom wall 51. The bottom wall 51 defines an electronic component mounting opening. 512. An elastic pressing piece 55 is connected between the two opposite side walls 53. The pressing piece 55 can be opened at one end for loading the heat sink 60. Referring to Figure 2, the fixing member 70 includes a fixing plate 71 and a pivot. 7 M352238 is connected to the latching member 75 at the front end of the fixing plate 71. The latching member 75 defines two latching slots 755 corresponding to the two protrusions 424 of the supporting bracket 40. The fixing plate 71* corresponds to the two heat sinks 60 Two fixing slots 712 are defined in the center, and the fixing plate 71 is formed downwardly at the intersection of each slot 712 to form two funnel-shaped recessed regions. The fixing plate 71 is formed with four in the recessed region. The elastic end of the free end resists the piece 715. The four resisting pieces 715. The free ends are located in the same plane, which is parallel and slightly lower than the surface of the fixed plate 71. The fixing plate 71 corresponds to the support rod 442 of the support frame 40. • Two fixing pieces 717 are bent downward. 3. When assembling, the support frame 40 is first mounted on the motherboard 10 so that the two electronic components 20 are respectively placed in the two mounting openings 412, and then the two heat sinks 60 are respectively mounted in the mounting bracket 50, The mounting brackets 50 are respectively locked in the support frame 40. At this time, the electronic component 20 is in thermal contact with the bottom of the heat sink 60 through the mounting opening 51 of the mounting bracket 50. The fastening member 75 is pivotally mounted to the fixing plate I 71 , the assembled fixing member 70 is pivotally connected to the pivoting portion 422 of the supporting frame 40 , and finally the fixing piece 70 of the fixing member 70 is fixed. They are respectively fixed on the support rods 442 of the support frame 40. At this time, the electronic component heat dissipation combination is fixed on the motherboard 10. Continuing to refer to FIG. 4, in use, the fixing member 70 is rotated downward to a horizontal state, and the elastic resisting piece 715 of the fixing member 70 is elastically deformed upward and presses the pressing piece 55 of the mounting frame 50 downward to fix the fixing. The heat sink 60, at the same time, rotates the latching member 75 to cause the latching member 75 to be engaged with the boss 424 of the support frame 40 by the card slot 755. The heat sink 60 is fixed to the main 8 M352238 board ίο. In the present embodiment, the mounting bracket 50 can be used as needed, and the heat radiating combination of the electronic component can use a heat sink 60 to dissipate heat from the single electronic component 20. In summary, this creation meets the requirements of the new patent and submits a patent application in accordance with the law. However, the above are only preferred embodiments of the present invention, and those skilled in the art will be able to cover the equivalent modifications or variations in the spirit of the present invention. [Simple description of the drawing] Fig. 1 is an exploded perspective view of the heat dissipation combination of the electronic component of the present invention. Figure 2 is a cross-sectional view of the fixing member taken along line II-II of Figure 1. FIG. 3 is an assembled view of the heat dissipation combination of the electronic component of the present invention. Fig. 4 is a three-dimensional assembly diagram of the heat-dissipating combination state of the electronic component of the present invention. [Main component symbol description] Motherboard 10 Electronic component 20 Support frame 40 Base plate 41 Mounting port 412 Side plate 42 Pivot part 422 Tab 424 Folding 43 Support piece 44 Support rod 442 Mounting frame 50 Bottom wall 51 Mounting port 512 Side wall 53 Pressing plate 55 M352238 Heat sink 60 Fixing member 70 Fixing plate 71 Slot 712 Contact piece 715 Fixing piece 717 Snap member 75 Card slot 755