200907648 九、發明說明： 【發明所屬之技術領域】 尤係一種可以加強 本發明涉及一種散熱器背板組合 電路板強度之散熱器背板組合。 【先前技術】 隨著電子產業之迅遠私展 ,,,. 产 、展，如中央處理器等電子元件 之運鼻速度大幅度提高，並產也 %甘^ 门/、產生之熱置也隨之加劇，為保 姐·其正常運行，通常在雷说士 一 冤路板上加灰一散熱裝置來將電子 兀件產生之熱量散發出去。為了滿足中央處理器之散埶需 未’所需散熱裝置之體積和重量也逐漸增大。此類散熱裝 置裝設於電路板上，容易造成電路板f曲變形，進而對安 裳在電路板上之其他電子元件之功能造成影響。為此，常 在電路板下方墊設-散熱器背板組合，以增加電路板之強 習知散熱器背板組合種類很多，如中國專利第 鹰32〇118845.8號揭示了其中一種，該散熱器背板组合包 括一金屬板、設置於金屬板上方之一彈性體及與彈性體相 配合之二扣合件。該彈性體之主體部分呈環狀，其相對兩 側往上翹起形成二彈性臂，在該二彈性臂之中部分別設置 有一按壓塊，在二彈性臂之連接處分別向外延伸出一凸 耳，該二凸耳穿設在二扣合件中從而將彈性體固定在金屬 板上。s亥散熱益背板組合與電路板組裝後，彈性體設置在 電路板之下方用來加強電路板之強度。然而電路板僅與二 6 200907648 彈性臂中部之按壓塊接觸， 路板間之作用力主要集中在 處，從而導致電路板變形。 【發明内容】 接觸面積小，導致彈性體與電 電路板與彈性臂之按壓塊接觸 ▲ -種散熱器背板組合，設置于電路板下方，用於支撐 該電路板，該散熱器背板組合包括—背板及設置於背板上 之-彈性支架，其中還包括貼設於該彈性支架上之一彈性 塾片，該彈性支架具有支撐電路板之一框體，該彈性墊片 貼设於該彈性支架之框體上4上表面抵頂於電路板上， 亚將该彈性支架固定在背板上。 =知技術相比’本發明散熱器背板組合與電路板接 觸面積大、電路板產生之變形小。 【實施方式】 參閱圖i，本發明散熱器背板組合6〇固定至電路板 =增加電路板10之強度’並和電路板1〇上方之散 。20稭由固定架30相連。 件步參閱圖2，該電路板1〇令部設置有一電子元 在電子7G件12之四周分別設置有—通孔14。 该散熱器20包括—其你^ ^ 散敎匕祐基板22、弟一散熱片組24、第二 :、、、且26及稷數熱管28。該基板22為― 金屬板#，让&主二人致呈矩幵/之 ，、氐表面中#向下凸伸形成一矩形凸a 22〇用 於與電路板10上之雷；-# , 兜小凸台220用 之電子兀件12接觸以吸收哕雷丰分杜19 產生之埶吾。 叹Η又。豕電子兀件12 艾熱里。该弟一散熱片組24自基板 向上M Ab J3X _U、 a ^ ZZ之頂表面垂直 之伸形成，且各散熱片（圖未 不j十仃間隔設置，使 200907648 基板22之-側形成—屋靠邊22 數水平散熱Η圖未標）相互連接熱片組26由複 片組24並焊接於第—散埶 垂直於第一散熱 ，、、、片組24之上方。複數埶營2S办 -在基板22、第一散熱片組24及：牙 來提升散熱器20之散熱能力。 相片組26令，用 該固定架30為一方形框體，由四 而成。該固定架30之相對兩本：垂：相連 ，成-承接部32。用來承載散熱器心=向二伸 本體3 2之頂部邊緣相向凸伸分 土板2，5亥— 凸伸部322相對設置之— ^ 凸伸部322及與該 伸條-用來固繼器^基^ 伸部322及凸 上之壓靠邊222插入承接部320與凸伸板22 20之基板22之另也丨杯 甲口1V322間，散熱器 之本體3…端設置有:二。相鄰-側 在該固定架30之底面四角上乂 ： 4 26。另外， 支腳36。 刀別延伸有内部設有螺紋之 一彎折之金屬扣具40包括—舫拉加， 接f直延㈣圖未標）及自樞 定架30-本體32之承接部32〇。二:樞接部樞接於固 接部上形成有—抵壓部（圖未示）^322 =間’該枢 壓邹42之末端延伸出之一彎折二？' 4〇還包括自按 定架3〇本體32上之扣合二;= S部緊緊壓設在散熱器20之基板 /上之抵 双之壓#邊222上，而 200907648 使散熱β 20更加穩固之固定在固定架3〇上。 請進一步參閱圖3 ,該散熱器背板組合00包括—與带 •路板1〇接觸之彈性塾片62、位於彈性墊片62下方之 -性支架64及承接該彈性支架64之背板66。 戎背板66為一矩形水平金屬板，在其中部設置有二相 郯之通孔660，在臨近每一通孔66〇處向上、同向凸伸出— 扣勾662, 一弧形凸耳664設置于通孔66〇之一側。該背板 66通孔660之相對兩側分別設置有一加強肋用來加強 背板66之強度。四安裝孔_分別設置在背板％之四角 上並與電路板1〇之通孔14相對應。 該彈性墊片62設置於電路板10與彈性支架64之間， 以與電路板10接觸。該彈性墊片62為—環形片體，由四 個本體620環繞而成。二本體62〇相連接處分別形成一弧 形連接段（圖未標），且每一本體62〇之中部設置有—弧 形缺口（圖未標），每一弧形缺口之相對兩側分別設置有 …一向下之阻擋條6202。一固定片624形成於彈性墊片62 内之二相對之弧形連接段之間。該固定片624包括連接弧 形連接段之二連接臂624〇及位於二連接臂624〇中部之固 定部6242。該固定部6242上設置有與背板％之扣勾662 相對應之二扣孔6244，固定部6242與連接臂624〇連接處 之一側設有背板66上之弧形凸耳664相對應之一缺口 6246。該固定片624兩端之二連接臂624〇略向下凹陷使該 固定片624形成一弧形結構，以便於固定部6242與背板％ 上之扣勾662及弧形凸耳664配合。 9 200907648 :彈=64設置於背板"部，由四本_目 連^成&形框體，該環形框俨之t 狀大致相同，本〜U " 形狀與彈性墊片62之形 ㈤，四連處均形成—弧形連接段（圖未 匕每四―個支撐腳644 ,一本體64〇之中部向下延伸形 nl: 644之見度車父彈性墊片62之弧形缺口小。 先將：性：二，將彈性支架64組裝在背板66上時， 644平产地Γ北Μ放置於背板％之令部，使其四個支掉腳 架64 H、月板66接觸，再將彈性墊片62貼設在彈性支 在 ’使其弧形缺口相對兩側之阻擔條6202跨設 制64之支撐腳644兩側，該阻擋條_用於限 62沿支择腳644兩側移動。彈性墊片62之固 =片^上之固定部6242之二扣孔6244與水片板體66上 勾662扣合’背板66上之弧形凸耳664抵靠於固定 上之缺口 6246内，使彈性支架64穩固地定位於背 板66上。 〜將散熱器背板組合6〇、電路板1〇及散熱器2〇藉由固 广3〇組裝在一起時，固定架3〇之四個支腳36穿過電路 uo之通孔14及背板66之通孔_再與螺釘（圖未示） 旋合，並令散熱器背板組合6〇之彈性墊片62、彈性支架 64之四個支稽聊644產生彈性變形，從而使散熱器2〇、電 :板10及散熱器背板組合6〇裝設在一起。此時，散熱器 背板組合60之彈性墊片62及彈性支架64位於電路板、f〇 之下方，並藉由彈性墊片62之上表面抵頂在電路板1〇上。 由於彈性墊片62與電路板10為面接觸，較傳統之散熱器 200907648 背板組合而言，接觸面積增大、電路板忉 接觸處受力均勻、形變量小。 62 綜上所述，本發明符合發明專利要件，爰依 利申請。‘淮，以上所述者僅為本發明之較佳實施例，= 热悉本案技fc之人士，在爰依本發明精神所作之 : 或變化，皆應涵蓋於以下之申請專利範圍内。 > 【圖式簡單說明】200907648 IX. INSTRUCTIONS: [Technical field to which the invention pertains] In particular, it is possible to enhance the heat sink backboard assembly of the present invention which relates to the strength of a heat sink backplane combined circuit board. [Prior Art] With the rapid development of the electronics industry, the production and exhibition, such as the central processing unit and other electronic components, the nose speed has been greatly improved, and the production is also a good result. Intensified accordingly, in order to protect the sister's normal operation, usually a heat sink is added to the Lei Shishi road board to dissipate the heat generated by the electronic components. In order to meet the divergence of the central processing unit, the volume and weight of the required heat sink are also gradually increased. Such a heat dissipating device is mounted on the circuit board, which is liable to cause distortion of the circuit board, thereby affecting the function of other electronic components on the circuit board. For this reason, the heat sink backplane combination is often placed under the circuit board to increase the strength of the circuit board. There are many types of heat sink backboard combinations, such as the Chinese Patent No. 32〇118845.8, which discloses one of the heat sinks. The backboard assembly includes a metal plate, an elastic body disposed above the metal plate, and two fastening members that cooperate with the elastic body. The main body portion of the elastic body has an annular shape, and the opposite sides thereof are upwardly lifted to form two elastic arms, and a pressing block is respectively disposed at an inner portion of the two elastic arms, and a convex portion is outwardly extended at a joint of the two elastic arms respectively. The two lugs are threaded into the two fastening members to fix the elastic body on the metal plate. After the assembly of the backplane and the board are assembled, the elastomer is placed under the board to enhance the strength of the board. However, the board is only in contact with the pressing block in the middle of the spring arm of the 2009-0648, and the force between the boards is mainly concentrated, resulting in deformation of the board. SUMMARY OF THE INVENTION The contact area is small, and the elastic body and the electric circuit board are in contact with the pressing block of the elastic arm. The heat sink back plate is combined and disposed under the circuit board for supporting the circuit board. The heat sink back plate combination The elastic backing plate includes an elastic brace piece attached to the elastic support, and the elastic support has a frame supporting the circuit board, and the elastic spacer is attached to the elastic plate The upper surface of the upper surface of the frame of the elastic bracket abuts against the circuit board, and the elastic bracket is fixed on the back plate. = Known technology compared to the present invention, the heat sink back plate combination has a large contact area with the circuit board, and the deformation of the circuit board is small. [Embodiment] Referring to Figure i, the heat sink backplane assembly 6 of the present invention is fixed to the circuit board = increasing the strength of the circuit board 10 and scattering above the circuit board 1 。. 20 straw is connected by a fixing frame 30. Referring to FIG. 2, the circuit board 1 is provided with an electronic unit. Each of the electronic 7G members 12 is provided with a through hole 14. The heat sink 20 includes a heat sink 12, a second heat sink, a second heat sink, a second heat sink, a second heat sink, a heat sink 20 The substrate 22 is a metal plate #, causing the & main two to form a matrix, and the surface of the crucible is downwardly convex to form a rectangular protrusion a 22 for the lightning on the circuit board 10; The small boss 220 is contacted by the electronic component 12 to absorb the scorpion produced by the 哕雷丰分杜19. Sigh and again.豕 Electronic components 12 Eger. The heat sinker group 24 is formed vertically from the top surface of the substrate M Ab J3X _U, a ^ ZZ, and each heat sink (the figure is not arranged at intervals), so that the side of the 200907648 substrate 22 is formed. The edge-to-edge heat-dissipation group 26 is connected to the first-stage heat-dissipating group 24 and is soldered to the first heat-dissipating body, and is disposed above the first heat-dissipating group. The plurality of camps 2S - the substrate 22, the first fin set 24 and the teeth to enhance the heat dissipation capability of the heat sink 20. The photo frame is 26, and the fixing frame 30 is a square frame made of four. The two opposite parts of the fixing frame 30 are: hanging: connecting, forming-receiving portion 32. For carrying the heat sink core = facing the top edge of the two-folding body 3 2, the protruding land is 2, 5 _ - the convex portion 322 is oppositely disposed - the convex portion 322 and the extension - for fixing The base portion 322 and the convex pressing portion 222 are inserted between the receiving portion 320 and the substrate 22 of the protruding plate 22 20, and the body of the heat sink 3 is provided with two ends. Adjacent-sides are at the four corners of the bottom surface of the holder 30: 4 26 . In addition, the legs 36. The metal fastener 40 extending from the knives and having a threaded inner portion includes a 舫 加 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Two: the pivoting portion is pivotally connected to the fixing portion and formed with a pressing portion (not shown) ^ 322 = Between the ends of the pivoting end 42 and extending one of the two bends? '4〇 also includes the snap-on two on the body 32 of the fixed frame; = the S-section is tightly pressed on the substrate/on the double-sided pressure # side 222 of the heat sink 20, and 200907648 makes the heat dissipation β 20 It is more firmly fixed on the holder 3〇. Referring to FIG. 3 further, the heat sink backplane assembly 00 includes an elastic cymbal 62 that is in contact with the belt slab 1 -, a sturdy bracket 64 located below the elastic shims 62, and a backing plate 66 that receives the elastic bracket 64. . The back plate 66 is a rectangular horizontal metal plate, and a two-phase through hole 660 is disposed at a middle portion thereof, and protrudes upward and in the same direction adjacent to each of the through holes 66. A buckle 662, an arcuate lug 664 It is disposed on one side of the through hole 66〇. A reinforcing rib is respectively disposed on opposite sides of the through hole 660 of the back plate 66 for reinforcing the strength of the back plate 66. The four mounting holes _ are respectively disposed at the four corners of the back plate and correspond to the through holes 14 of the circuit board 1 . The elastic spacer 62 is disposed between the circuit board 10 and the elastic bracket 64 to be in contact with the circuit board 10. The elastic spacer 62 is an annular sheet body surrounded by four bodies 620. The two body 62 〇 phase joints respectively form an arc-shaped connecting section (not shown), and each of the main body 62 〇 is provided with an arc-shaped notch (not shown), and the opposite sides of each arc-shaped notch respectively Set with a downward barrier bar 6202. A fixing piece 624 is formed between the two opposite arcuate connecting sections in the elastic spacer 62. The fixing piece 624 includes two connecting arms 624 connected to the arc connecting segments and a fixing portion 6242 located at the center of the two connecting arms 624. The fixing portion 6242 is provided with two fastening holes 6244 corresponding to the buckle 662 of the back plate. The fixing portion 6242 corresponds to the curved lug 664 on the back plate 66 on one side of the connection of the connecting arm 624〇. One of the gaps 6246. The two connecting arms 624 at both ends of the fixing piece 624 are slightly recessed downward to form the fixing piece 624 to form an arc structure, so that the fixing portion 6242 cooperates with the buckle 662 and the curved lug 664 on the back plate %. 9 200907648 : The bomb = 64 is set on the back panel & section, which consists of four _ mesh joints into the & frame, the ring frame 大致 t shape is roughly the same, this ~U " shape and elastic gasket 62 Shape (5), four joints are formed - curved connecting section (Fig. 匕 every four - support legs 644, a body 64 〇 middle part downwardly extending nl: 644 visibility of the car's elastic spacer 62 curved The gap is small. First: Sex: Second, when the elastic bracket 64 is assembled on the backboard 66, the 644 flat production area is placed in the back of the back panel, so that the four legs fall off the frame 64 H, the moon board 66 contact, and then the elastic spacer 62 is attached to the elastic support on both sides of the resisting strip 6202 of the opposite sides of the curved notch, and the barrier strip _ is used for the limit 62 The foot 644 is moved on both sides of the foot 644. The two fastening holes 6244 of the fixing portion 6242 of the elastic gasket 62 and the hook 662 of the water plate body 66 are engaged with the curved lug 664 on the back plate 66. In the fixed notch 6246, the elastic bracket 64 is stably positioned on the back plate 66. ~ The heat sink back plate assembly 6〇, the circuit board 1〇 and the heat sink 2〇 are assembled by a solid 3〇 When the four legs 36 of the fixing frame 3 are passed through the through hole 14 of the circuit uo and the through hole of the back plate 66, and then screwed with the screw (not shown), and the elastic back plate is combined to be elastic. The spacer 62 and the four branches 644 of the elastic bracket 64 are elastically deformed, so that the heat sink 2, the electric board 10 and the heat sink back board combination 6 are mounted together. At this time, the radiator back board combination The elastic spacer 62 and the elastic bracket 64 of the 60 are located under the circuit board, and are abutted on the circuit board 1 by the upper surface of the elastic spacer 62. Since the elastic spacer 62 is in surface contact with the circuit board 10 Compared with the traditional heat sink 200907648 backboard combination, the contact area is increased, the force on the circuit board is uniform, and the shape variable is small. 62 In summary, the invention meets the requirements of the invention patent, and the application is applied. The above is only the preferred embodiment of the present invention, and the person who is interested in the present invention, in the spirit of the present invention, or changes, should be included in the following patent application. Simple description of the schema]
圖1係散熱器背板組合與相關元件之立體組合圖。 圖2係圖1之立體分解圖Q 【主要元件符號說明】 圖3係圖1中散熱器背板組合之放大圖。 電路板 10 電子元件 12 通孔 14 散熱器 20 基板 22 第一散熱片組 24 第一散熱片組 26 敎管 4、、、 口 28 固定架 30 本體 32、620、660、640 支腳 36 扣具 40 按壓部 42 扣勾 44 散熱器背板組合 60 彈性墊片 62 彈性支架 64 背板 66 凸台 220 壓靠邊 222 承接部 320 凸伸部 322 11 326200907648 凸伸條 324 扣合塊 固定片 624 支撐腳 扣勾 662 弧形凸耳 加強肋 665 安裝孔 阻擂條 6202 連接臂 固定部 6242 扣孔 缺口 6246 644 664 668 6240 6244 12Figure 1 is a perspective view of a combination of a heat sink backplane assembly and associated components. 2 is a perspective exploded view of FIG. 1. [Main component symbol description] FIG. 3 is an enlarged view of the heat sink back plate assembly of FIG. Circuit board 10 Electronic component 12 Through hole 14 Heat sink 20 Substrate 22 First heat sink set 24 First heat sink set 26 Tube 4, Port 28 Mounting bracket 30 Body 32, 620, 660, 640 Leg 36 Buckle 40 Pressing portion 42 Buckle 44 Radiator back plate assembly 60 Elastic spacer 62 Elastic bracket 64 Back plate 66 Boss 220 Pressing edge 222 Receiving portion 320 Projecting portion 322 11 326200907648 Projecting strip 324 Buckle block fixing piece 624 Supporting foot Buckle 662 Curved lug rib 665 Mounting hole bar 6202 Connecting arm fixing part 6242 Button hole notch 6246 644 664 668 6240 6244 12