1337701 099年10月19日梭正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱器背板組合，尤係一種可以加強電 路板強度之散熱器背板組合。 【先前技術】 [0002] 隨著電子產業之迅速發展，如中央處理器等電子元件之 運算速度大幅度提高，其產生之熱量也隨之加劇，為保 證其正常運行，通常在電路板上加裝一散熱裝置來將電 子元件產生之熱量散發出去。為了滿足中央處理器之散 熱需求，所需散熱裝置之體積和重量也逐漸增大。此類 散熱裝置裝設於電路板上，容易:造成電路板彎曲變形， 進而對安裝在電路板上之其他電子、元件之功能造成影響 .· 。為此，常在電路板下方墊設一敖熱器背板組合，以增 加電路板之強度。 [0003] 習知散熱器背板組合種類很多，如中國專利第 200320 1 1 8845. 8號揭示了其中一種，該散熱器背板組合 包括一金屬板、設置於金屬板上方之一彈性體及與彈性 體相配合之二扣合件。該彈性體之主體部分呈環狀，其 相對兩側往上翹起形成二彈性臂，在該二彈性臂之中部 分別設置有一按壓塊，在二彈性臂之連接處分別向外延 伸出一凸耳，該二凸耳穿設在二扣合件中從而將彈性體 固定在金屬板上。該散熱器背板組合與電路板組裝後， 彈性體設置在電路板之下方用來加強電路板之強度。然 而電路板僅與二彈性臂中部之按壓塊接觸，接觸面積小 ，導致彈性體與電路板間之作用力主要集中在電路板與 096128534 表單編號A0101 第4頁/共16頁 0993374745-0 1337701 099年10月19日梭正替換百 彈性臂之按壓塊接觸處，從而導致電路板變形。 【發明内容】 [0004] 一種散熱器背板組合，設置于電路板下方，用於支撐該 電路板，該散熱器背板組合包括一背板及設置於背板上 之一彈性支架，其中還包括貼設於該彈性支架上之一彈 性墊片，該彈性支架具有支撐電路板之一框體，該彈性 墊片貼設於該彈性支架之框體上且其上表面抵頂於電路 板上，並將該彈性支架固定在背板上。 [0005] 與習知技術相比，本發明散熱器背板組合與電路板接觸 面積大、電路板產生之變形小。 【實施方式】 [0006] 參閱圖1，本發明散熱器背板組合60固定至電路板10下方 ，以增加電路板10之強度，並和電路板10上方之散熱器 20藉由固定架30相連。 [0007] 請進一步參閱圖2，該電路板10中部設置有一電子元件12 ，在電子元件12之四周分別設置有一通孔14。 [0008] 該散熱器20包括一基板22、第一散熱片組24、第二散熱 片組26及複數熱管28。該基板22為一大致呈矩形之金屬 板體，其底表面中部向下凸伸形成一矩形凸台220用於與 電路板10上之電子元件12接觸以吸收該電子元件12產生 之熱量。該第一散熱片組24自基板22之頂表面垂直向上 延伸形成，且各散熱片（圖未標）平行間隔設置，使基 板22之一側形成一壓靠邊222。該第二散熱片組26由複數 水平散熱片（圖未標）相互連接形成，垂直於第一散熱 096128534 表單編號A0101 第5頁/共16頁 0993374745-0 1337701 099年10月19日梭正替換頁 片組24並焊接於第一散熱片組24之上方。複數熱管28穿 設在基板22、第一散熱片組24及第二散熱片組26中，用 來提升散熱器20之散熱能力。 [麵9] 該固定架30為一方形框體，由四個本體32垂直相連而成 。該固定架30之相對兩本體32之底部邊緣相向凸伸分別 形成一承接部320用來承載散熱器20之基板22，該二本體 32之頂部邊緣相向凸伸分別形成一凸伸部322及與該凸伸 部322相對設置之一凸伸條324，該等凸伸部322及凸伸 條324用來固定散熱器20之基板22。散熱器20基板22上 之壓靠邊222插入承接部320與凸伸部322間，散熱器20 之基板22之另一側插入承接部320與匕神#324間，使散 熱器20固定於固定支架30上。與¥神%3 2 2扣鄰一侧之本 體32之一端設置有一帶有開口之扣合塊326。另外，在該 固定架30之底面四角上，分別延伸有内部設有螺紋之支 腳36。 [0010] 一彎折之金屬扣具40包括一樞接部（圖未標）及自樞接 部一端垂直延伸而出之一按壓部42。該樞接部枢接於固 定架30—本體32之承接部320及凸伸部322之間，該樞接 部上形成有一抵壓部（圖未示）。該扣具40還包括自按 壓部42之末端延伸出之一彎折之扣勾44，該扣勾44與固 定架30本體32上之扣合塊326扣合，並令樞接部上之抵壓 部緊緊壓設在散熱器20之基板22之壓靠邊222上，而使散 熱器20更加穩固之固定在固定架30上。 [0011] 請進一步參閱圖3，該散熱器背板組合60包括一與電路板 10接觸之彈性墊片62、位於彈性墊片62下方之一彈性支 096128534 表單編號A0101 第6頁/共16頁 0993374745-0 1337701 099年10月 架64及承接該彈性支架64之背板66。 [0012] 該背板66為一矩形水平金屬板，在其中部設置有二相鄰 之通孔660，在臨近每—通孔處向上、同向凸伸出〆 扣勾662 ’ 一弧形凸耳664設置于通孔660之一側。該背 板6 6通孔6 6 0之相對兩側分別設置有一加強肋6 6 5用來加 強背板66之強度。四安裝孔分別設置在背板66之四角 上並與電路板1 0之通孔14相對應》 [0013] 該彈性墊片62設置於電路板丨〇與彈性支架64之間，以與 電路板10接觸。該彈性墊片62為一環形片體，由四個本 體620環繞而成。二本體620相連接處分別形成一弧形連 接段（圖未標），且每一本競620之中部設置有一弧形缺 口（圖未標），每一弧形缺口之相對兩側分別設置有一 向下之阻擋條6202。一固定片624形成於彈性墊片62内 之二相對之弧形連接段之間。該固定片624包括連接弧形 連接段之二連接臂6240及位於二連接臂6240中部之固定 部6242 »該固定部6242上設置有與背板66之扣勾662相 對應之二扣孔6244，固定部6242與連接臂6240連接處之 一側設有背板66上之弧形凸耳664相對應之一缺口 6246 。該固定片624兩端之二連接臂6240略向下凹陷使該固定 片624形成一弧形結構，以便於固定部6242與背板66上 之扣勾662及弧形凸耳664配合。 [0014] 該彈性支架64設置於背板66中部，由四本體640相連形成 一環形框體，該環形框體之形狀與彈性墊片62之形狀大 致相同，本體640相連處均形成一弧_形連接段（圖未標） ，四個支撐腳644自每一本體640之中部向下延伸形成， 096128534 表單煸號Λ0101 第7頁/共16頁 0993374745-0 1337701 099年10月19日修正替换頁 且每一支撐腳644之寬度較彈性墊片62之弧形缺口小。 [0015] 請再次參閱圖2，將彈性支架64組裝在背板66上時，先將 彈性支架64放置於背板‘66之中部，使其四個支撐腳644平 穩地與背板66接觸，再將彈性墊片62貼設在彈性支架64 之上方，使其弧形缺口相對兩側之阻擋條6202跨設在彈 性支架64之支撐腳644兩側，該阻擋條6202用於限制彈 性墊片62沿支撐腳644兩侧移動·>彈性墊片62之固定片 624上之固定部6242之二扣孔6244與水片板體66上之二 扣勾662扣合，背板66上之弧形凸耳664抵靠於固定片 624上之缺口 6246内，使彈性支架64穩固地定位於背板 66上。 ，· . .、， [0016] 將散熱器背板組合60、電路叛Hfi散録器返0藉由固定架 30組裝在一起時，固定架30之四個支腳36穿過電路板10 之通孔14及背板66之通孔668再與螺釘（圖未示）旋合， 並令散熱器背板組合60之彈性墊片62、彈性支架64之四 個支撐腳644產生彈性變形，從而使散熱器20、電路板10 及散熱器背板組合60裝設在一起。此時，散熱器背板組 合60之彈性墊片62及彈性支架64位於電路板10之下方， 並藉由彈性墊片62之上表面抵頂在電路板10上。由於彈 性墊片62與電路板10為面接觸，較傳統之散熱器背板組 合而言，接觸面積增大、電路板10與彈性墊片62接觸處 受力均勻、形變量小。 [0017] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 096128534 表單編號A0101 第8頁/共16頁 0993374745-0 1337701 099年10月19日俊正替换頁 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0018] 圖1係散熱器背板組合與相關元件之立體組合圖。 [0019] 圖2係圖1之立體分解圖。 [0020] 圖3係圖1中散熱器背板組合之放大圖》 【主要元件符號說明】 [0021] 電路板：10 [0022] 電子元件：12 [0023] 通孔：14 [0024] 散熱器：20 [0025] 基板：22 [0026] 第一散熱片組： 24 [0027] 第二散熱片組： 26 [0028] 熱管：28 [0029] 固定架：30 [0030] 本體：32、620 、660 、 640 [0031] 支腳：36 [0032] 扣具：40 [0033] 按壓部：42 [0034] 扣勾：44 表單編號A0101 第9頁/共16頁 096128534 0993374745-0 1337701 [0035] 散熱器背板組合：60 [0036] 彈性墊片 ：62 . [0037] 彈性支架 ：64 [0038] 背板：66 [0039] 凸台：220 [0040] 壓靠邊： 222 [0041] 承接部* 320 [0042] 凸伸部： 322 [0043] 凸伸條： 324 [0044] 扣合塊： 326 [0045] 固定片： 624 [0046] 支撐腳： 644 [0047] 扣勾：662 [0048] 弧形凸耳 ：664 [0049] 加強肋： 665 [0050] 安裝孔： 668 [0051] 阻擋條： 6202 [0052] 連接臂： 6240 [0053] 固定部： 6242 096128534 表單編號A0101 第10頁/共16頁 099年10月19日梭正替换頁 0993374745-0 1337701 [0054] 扣孔：6244[0055] 缺口 ： 6246 096128534 表單編號A0101 第11頁/共16頁 099年10月19日核:正替換頁 0993374745-01337701 October 19, 2010, the replacement of the page is six, the invention description: [Technical field of the invention] [0001] The present invention relates to a heat sink backboard combination, especially a heat sink backboard combination that can strengthen the strength of the circuit board . [Prior Art] [0002] With the rapid development of the electronics industry, the computing speed of electronic components such as central processing units has been greatly improved, and the heat generated by them has also increased. To ensure its normal operation, it is usually added on the circuit board. A heat sink is installed to dissipate the heat generated by the electronic components. In order to meet the heat dissipation requirements of the central processing unit, the volume and weight of the required heat sink are also gradually increased. Such a heat sink is mounted on the circuit board, which is easy: causing the board to be bent and deformed, thereby affecting the functions of other electronic components and components mounted on the circuit board. To this end, a heat sink backplane combination is often placed under the board to increase the strength of the board. [0003] There are many types of conventional heat sink backplanes, such as one of the Chinese Patent No. 200320 1 18845. 8, which comprises a metal plate, an elastic body disposed above the metal plate, and Two fastening members that cooperate with the elastomer. The main body portion of the elastic body has an annular shape, and the opposite sides thereof are upwardly lifted to form two elastic arms, and a pressing block is respectively disposed at an inner portion of the two elastic arms, and a convex portion is outwardly extended at a joint of the two elastic arms respectively. The two lugs are threaded into the two fastening members to fix the elastic body on the metal plate. After the heat sink backplane assembly is assembled with the circuit board, the elastomer is placed under the circuit board to enhance the strength of the circuit board. However, the circuit board is only in contact with the pressing block in the middle of the two elastic arms, and the contact area is small, so that the force between the elastic body and the circuit board is mainly concentrated on the circuit board and 096128534. Form No. A0101 Page 4 / Total 16 Page 0993374745-0 1337701 099 On October 19th, the shuttle was replacing the contact point of the pressing block of the hundred elastic arms, resulting in deformation of the circuit board. [0004] A heat sink backplane assembly is disposed under the circuit board for supporting the circuit board. The heat sink backplane assembly includes a backboard and an elastic bracket disposed on the backboard, wherein The utility model comprises an elastic gasket attached to the elastic bracket, the elastic bracket has a frame supporting the circuit board, the elastic gasket is attached to the frame of the elastic bracket and the upper surface thereof is abutted on the circuit board And fixing the elastic bracket to the backboard. Compared with the prior art, the heat sink back plate assembly of the present invention has a large contact area with the circuit board and a small deformation of the circuit board. [0006] Referring to FIG. 1, a heat sink backplane assembly 60 of the present invention is fixed under the circuit board 10 to increase the strength of the circuit board 10, and is connected to the heat sink 20 above the circuit board 10 by a mounting bracket 30. . Referring to FIG. 2 , an electronic component 12 is disposed in the middle of the circuit board 10 , and a through hole 14 is disposed around the electronic component 12 . The heat sink 20 includes a substrate 22, a first fin set 24, a second fin set 26, and a plurality of heat pipes 28. The substrate 22 is a substantially rectangular metal plate body having a bottom surface projecting downwardly to form a rectangular boss 220 for contacting the electronic component 12 on the circuit board 10 to absorb heat generated by the electronic component 12. The first fin group 24 extends vertically upward from the top surface of the substrate 22, and the heat sinks (not labeled) are arranged in parallel such that one side of the substrate 22 forms a pressing edge 222. The second heat sink group 26 is formed by interconnecting a plurality of horizontal heat sinks (not shown), perpendicular to the first heat sink 096128534. Form number A0101 Page 5 / Total 16 pages 0993374745-0 1337701 October 19th, the shuttle is being replaced The sheet set 24 is welded over the first fin set 24. The plurality of heat pipes 28 are disposed in the substrate 22, the first fin group 24, and the second fin group 26 to enhance the heat dissipation capability of the heat sink 20. [Face 9] The fixing frame 30 is a square frame formed by vertically connecting four bodies 32. The bottom edges of the two opposite bodies 32 of the mounting frame 30 are respectively formed to form a receiving portion 320 for carrying the substrate 22 of the heat sink 20. The top edges of the two bodies 32 are convexly protruded to form a protruding portion 322 and The protruding portion 322 is opposite to one of the protruding strips 324. The protruding portions 322 and the protruding strips 324 are used to fix the substrate 22 of the heat sink 20. The pressing edge 222 of the substrate 20 of the heat sink 20 is inserted between the receiving portion 320 and the protruding portion 322, and the other side of the substrate 22 of the heat sink 20 is inserted between the receiving portion 320 and the 匕神#324 to fix the heat sink 20 to the fixing bracket. 30 on. One end of the body 32 of the side of the body of the god %3 2 2 is provided with a snap block 326 with an opening. Further, on the four corners of the bottom surface of the fixing frame 30, legs 36 internally provided with threads are respectively extended. [0010] A bent metal clip 40 includes a pivoting portion (not shown) and a pressing portion 42 extending perpendicularly from one end of the pivoting portion. The pivoting portion is pivotally connected between the receiving portion 320 and the protruding portion 322 of the fixing frame 30. The pivoting portion is formed with a pressing portion (not shown). The buckle 40 further includes a buckled buckle 44 extending from the end of the pressing portion 42. The buckle 44 is engaged with the fastening block 326 of the main body 32 of the fixing frame 30, and is biased on the pivoting portion. The pressing portion is tightly pressed against the pressing edge 222 of the substrate 22 of the heat sink 20, so that the heat sink 20 is more firmly fixed to the fixing frame 30. [0011] With further reference to FIG. 3, the heat sink backplane assembly 60 includes an elastic spacer 62 in contact with the circuit board 10, and an elastic support 096128534 below the elastic spacer 62. Form No. A0101 Page 6 of 16 0993374745-0 1337701 The frame 64 of October 099 and the back plate 66 of the elastic bracket 64. [0012] The back plate 66 is a rectangular horizontal metal plate, and two adjacent through holes 660 are disposed in the middle portion thereof, and the upward and the same direction protrudes outwardly and in the same direction. The ear 664 is disposed on one side of the through hole 660. A reinforcing rib 6 6 5 is respectively disposed on opposite sides of the back plate 660 through hole 660 for reinforcing the strength of the back plate 66. The four mounting holes are respectively disposed at the four corners of the back plate 66 and correspond to the through holes 14 of the circuit board 110. [0013] The elastic spacer 62 is disposed between the circuit board 丨〇 and the elastic bracket 64 to be connected to the circuit board. 10 contacts. The elastic spacer 62 is an annular sheet body surrounded by four bodies 620. An arc-shaped connecting section (not shown) is formed at the junction of the two bodies 620, and an arc-shaped notch (not shown) is disposed in the middle of each of the biddings 620, and one opposite side of each of the arc-shaped notches is respectively disposed Blocking bar 6202 downward. A retaining tab 624 is formed between the opposing arcuate connecting segments in the resilient spacer 62. The fixing piece 624 includes two connecting arms 6240 connecting the curved connecting segments and a fixing portion 6242 located at the middle of the two connecting arms 6240. The fixing portion 6242 is provided with two fastening holes 6244 corresponding to the buckles 662 of the back plate 66. One side of the joint of the fixing portion 6242 and the connecting arm 6240 is provided with a notch 6246 corresponding to the curved lug 664 on the back plate 66. The two connecting arms 6240 at both ends of the fixing piece 624 are slightly recessed downward so that the fixing piece 624 forms an arc-shaped structure, so that the fixing portion 6242 cooperates with the buckle 662 and the curved lug 664 on the back plate 66. [0014] The elastic bracket 64 is disposed in the middle of the back plate 66, and is connected by the four bodies 640 to form an annular frame. The shape of the annular frame is substantially the same as the shape of the elastic spacer 62, and an arc is formed at the joint of the body 640. Shaped connecting section (not shown), four supporting legs 644 extending downward from the middle of each body 640, 096128534 Form Λ Λ 0101 Page 7 / Total 16 pages 0993374745-0 1337701 Correction replacement on October 19, 099 The width of each of the support legs 644 is smaller than the arcuate notch of the elastic spacer 62. [0015] Referring again to FIG. 2, when the elastic bracket 64 is assembled on the backboard 66, the elastic bracket 64 is first placed in the middle of the backboard '66, so that the four supporting legs 644 smoothly contact the backing plate 66. The elastic strips 62 are attached to the elastic brackets 64, and the barrier strips 6202 on opposite sides of the curved notches are spanned on both sides of the supporting legs 644 of the elastic brackets 64. The barrier strips 6202 are used to limit the elastic spacers. 62 is moved along both sides of the supporting leg 644. The two fastening holes 6244 of the fixing portion 6242 on the fixing piece 624 of the elastic spacer 62 are engaged with the two fastening hooks 662 on the water piece plate 66, and the arc on the back plate 66 The lug 664 abuts against the indentation 6246 in the tab 624, allowing the resilient bracket 64 to be securely positioned on the backing plate 66. [0016] When the heat sink backplane assembly 60 and the circuit rebel Hfi scatterer are returned to each other by the fixing frame 30, the four legs 36 of the fixing frame 30 pass through the circuit board 10. The through hole 668 of the through hole 14 and the back plate 66 is further screwed with a screw (not shown), and the elastic spacer 62 of the heat sink back plate assembly 60 and the four support legs 644 of the elastic bracket 64 are elastically deformed, thereby The heat sink 20, the circuit board 10, and the heat sink backplane assembly 60 are mounted together. At this time, the elastic spacer 62 and the elastic bracket 64 of the heat sink backboard assembly 60 are located below the circuit board 10, and are abutted on the circuit board 10 by the upper surface of the elastic spacer 62. Since the elastic spacer 62 is in surface contact with the circuit board 10, the contact area is increased and the contact between the circuit board 10 and the elastic spacer 62 is uniform and the shape variable is small compared with the conventional heat sink backboard assembly. [0017] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be equivalent to 096128534 in the spirit of the present invention. Form No. A0101 Page 8 / Total 16 Page 0993374745-0 1337701 099 On October 19th, the company will replace the page decoration or change, which should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a perspective assembled view of a heat sink back plate assembly and related components. 2 is an exploded perspective view of FIG. 1. 3 is an enlarged view of the heat sink back plate assembly of FIG. 1 [Main component symbol description] [0021] Circuit board: 10 [0022] Electronic component: 12 [0023] Through hole: 14 [0024] Heat sink : 20 [0025] Substrate: 22 [0026] First heat sink set: 24 [0027] Second heat sink set: 26 [0028] Heat pipe: 28 [0029] Fixing frame: 30 [0030] Body: 32, 620, 660, 640 [0031] Feet: 36 [0032] Buckle: 40 [0033] Pressing part: 42 [0034] Buckle: 44 Form No. A0101 Page 9 of 16 096128534 0993374745-0 1337701 [0035] Cooling Back panel combination: 60 [0036] Elastic spacer: 62 . [0037] Elastic bracket: 64 [0038] Back panel: 66 [0039] Boss: 220 [0040] Pressing edge: 222 [0041] Receiving part * 320 [0042] Projection: 322 [0043] Projection: 324 [0044] Buckle: 326 [0045] Mounting: 624 [0046] Supporting feet: 644 [0047] Buckle: 662 [0048] Curved Lug: 664 [0049] Reinforcing rib: 665 [0050] Mounting hole: 668 [0051] Barrier strip: 6202 [0052] Connecting arm: 6240 [0053] Fixing part: 6242 096128534 Form No. A0101 Page 10 of 16 October 19, 1999 Shuttle Replacement Page 0993374745-0 1337701 [0054] Buttonhole: 6244 [0055] Notch: 6246 096128534 Form No. A0101 Page 11 of 16 Page 099 October 19th nuclear: positive replacement page 0993374745-0