Μ3Ό3419 八、新型說明·· 【新型所屬之技術領域】 本ϋ作係提供-觀憶體之散絲置，尤指可央固於記憶體 亚助其散熱之散熱裝置，且夾持穩固不易脫離、具良好的散数 功能之功效。 #' 【先前技術】 按，現今科技資訊快速發展，而個人電腦、電子筆記本及筆 記型電腦由於運算功能強、速度快，因此被普遍運用於各個行業 ，而網路時代的來臨更造成電腦的普及化，則利用電驗各種文 曰的處理、_、電子郵件、書信往來、圖像、影像的處理等， ^且對各種細細份儲存，則導致所咖_越來越 夕、貧料量越來越大，處理時中央處理單域記紐運算處理的 功能也必須相當快速，則中央處理單元及記憶體於運作時會產生 熱能’且速度雜生的熱_，麵朗高域毁中央處 理早^魏中央處理單元的使料命，因此在各辦央處理 ^兀上均設有鰭片狀散熱片’使中央處理單元產生之熱能傳導至 散熱片上，再以風扇所產生之冷空氣，吹送至散熱片之表面間隙 中進行散熱’也有業者為了要讓散熱效能更好，則於中央處理單 几之熱源隸設歸，錄—姻設於中域理單元之執源處， 且另-側為設有·助散熱之散㈣，以_熱管—側吸收妖源 所產生的鍾，並將熱量傳送至鮮㈣—側’㈣熱管另 设置之散熱片將熱管所吸收熱量予以排除。 5 4Μ3Ό3419Μ3Ό3419 VIII. New Description·· 【New Technical Fields】 This 提供 系 提供 - - - - 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观 观With good scatter function. #' [Previous technology] Press, today's technology information is developing rapidly, and personal computers, electronic notebooks and notebook computers are widely used in various industries due to their powerful computing functions and speed. The advent of the Internet era has caused computers. Popularization, the use of electro-inspection of various processing, _, e-mail, correspondence, image, image processing, etc., and the storage of various fine parts, resulting in the coffee _ more and more, poor The amount is getting bigger and bigger, and the function of central processing single-field record processing must be quite fast when processing. The central processing unit and the memory will generate heat when operating, and the speed of the hybrid heat _ The central processing of the central processing unit of the early Wei-Wei unit, so that fin-shaped heat sinks are provided on each processing unit to transfer the heat generated by the central processing unit to the heat sink, and then the cold generated by the fan The air is blown to the surface gap of the heat sink for heat dissipation. In order to make the heat dissipation performance better, the heat source in the central processing unit is set up, and the record is set in the middle area. The source of the Yuan, and the other side is the set of heat dissipation (four), the heat generated by the _ heat pipe - side absorbs the clock generated by the demon source, and transfers the heat to the fresh (four) - side ' (four) heat pipe The heat absorbed by the heat pipe is excluded. 5 4Μ3Ό3419
惟記憶體因形狀及裝設位置的影響，所以不適合在記憶體上 衣又· Η片狀放熱片，則有業者以片狀散熱片夹持於記憶體上，藉 以辅助記憶體進行散熱，如證書號數第吧8 3 2 2 4號之「言二 憶體散熱模組」新型專利，係於民國9辑8月2 2日提 ^利申請，中請案號第9 4 2 1 4 3 3 3號，並公告於民國㈠ 12月1i日之專利公報，請參閱第八圖所示，係為習用散敎 桓組之立體分解圖，其係包括：一散熱單元A，設有二具導_ ::fA1，用以相對夹持於記憶體上;以及-夹具單元I ==少，具^，用以夹制固定該些散熱片^及其間的 :二二该習知散熱組件於使用時’仍存在諸多缺失，如： 散熱單元八之二散熱片A1為於外側表面設有凸塊A i i 以t、夹具早tcB之夾具B玉夾持並可利用切溝B 1 1卡 ;11 ’但卡扣時必須使夾具B1底部張開跨過凸 ^^，欲拆除時要將夹具“取離散熱片八卜造成組 衣或拆卸時的不便與麻煩。 (2體央Γ1僅夹扣在散熱片Α1外，並未抵持在内部之記憶 曰’易造成散熱片A 1與記憶體的脫^、分離。 :’如何解決記憶體使用散熱片結構所存在之問題， 【新:内:Γ之相關廠商所亟欲研究改善之方向所在者。 由多人有鑑於上述之贼與缺失，乃侧資料，經 ，估及考量，並輯事於此行㈣積之多年經驗，經由不 6 Μ3Ό3419 斷試作及修改，始玲士^ 專利誕生者。 跳逮政熱之挪體之散熱褒置的創作 μ 目懈崎繼讀―設有兩散 片頂部為分別設有扣接部，表面則分別設有姚 桿編卡槽，即可以失持部供扣具扣夾，再以夹扣 干人二、面之卡槽使散鍵__續於記憶體 上’不賊落分離’且達聰助記㈣散熱之目的。 本創作之次要目的乃在於該散熱模組之兩散熱片，頂部為一 體成型連結呈可供彈性騎之連接部，以供散熱模組更易架設於 記憶體外部。 本創作之再-目的乃在於該散熱模組之兩散熱片，係可於 面上設有複數散熱孔。 ' 馨本創作之又-目的乃在於該散麵組之兩散熱片表面所設之 卡槽，其週圍係可設有凸起之止擔體，以供夾扣桿嵌人兩散熱片 表面之卡槽後，藉由止擋體防止夾扣桿脫離卡槽，達到穩固夾持 之目的。 【實施方式】 為達成上述目的及功效，本創作所採用之目的、構造技術特 徵以及其功效，茲緣圖就本創作之較佳實施例詳加說明其特徵與 功月b如下’俾利完全瞭解。 請參閱第一、二、三、四圖所示，係為本創作之立體外觀圖 Μ3Ό3419 、立體分賴、組裝前之側視剖面圖、、组裝後之側視剖 圖中所示可清騎ώ，本創作之散錄置純括雜麵 具2所組成，其中·· '' i Μπ 該散熱模組1係具有兩相對之散熱片i i、工2 片11、12頂部為分別設有扣接部i 3，而扣接部伟2 可相互嵌卡扣合之卡扣桿i 3 i及嵌合 〜、有 入σ孔132，且於扣接部工 3間設有複數抵持體14，再於兩散熱片丄丄、丄2外表面八 或’上之夾持部15 ’並，^ 該扣具2係為桿體彎折成型之夾扣桿2 i，並於上方 壓部211，而下方則設有夾扣部2 i 2，且抵壓部2 i ^^ 度為大於夾扣部2 i 2之紐，以供夾扣部2 i 2具有_^ 扣效果。 上述構件於組裝時，係將散熱模組1之兩散熱片丄丄、1 利:頂部兩侧之扣接部！ 3相互卡扣，分別以—側之卡扣桿^ 1嵌入另嫩合孔132内，則使秘熱片u、12相= 結合^以兩散熱片H、12之爽持部15供扣具2之奸桿 21嵌入’並以夾扣桿2!之抵壓部2 i i抵壓在兩散熱片^ 、12之抵持體丄4 ’而失扣桿2 i底部之夾扣部2丄2則嵌入 夾持部15之卡槽151内’即組成本創作之散熱裂置。 再請參閱第四、五、六圖所示，係為本創作組裝後之側視剖 圖、較佳實施例之立體外觀圖、再—實施例之立體外觀圖，由 M303419 圖中可以⑺箱$，本創作之散熱觀丨，^ ^ ^ 12夹持在記._3外部，再咖2之綱21=二 熱片11、12之夾持部15，並利用夾扣桿2丄下方之夾扣部 2 1 2 ’抑肷人夾持部1 5之卡槽1 5 1，且抵持在記憶體3 上，而因夾扣桿2 117方之夾扣部2 1 2寬度小於上方之抵壓部However, due to the influence of the shape and the mounting position, the memory is not suitable for the memory jacket and the sheet-like heat release sheet. However, the manufacturer holds the sheet-shaped heat sink on the memory to assist the memory for heat dissipation, such as a certificate. No. 8 3 2 2 No. 4, the new patent for the "Yi Er Yi Body Thermal Module" is based on the Republic of China 9th August 2nd, and the application number is 9 4 2 1 4 3 3 No. 3, and announced in the Republic of China (1) December 1i patent publication, please refer to the eighth figure, which is a three-dimensional exploded view of the conventional dilation group, which includes: a heat dissipation unit A, with two guides _::fA1, for relative clamping on the memory; and - the clamp unit I == less, with ^, for clamping and fixing the heat sink ^ and between: 2nd, the conventional heat dissipation component is used There are still many defects in the time, such as: The heat sink unit VIII two heat sink A1 is provided with a bump A ii on the outer surface, t clamps the jig of the clamp early tcB and can use the cut groove B 1 1 card; 'But the buckle must be made to open the bottom of the clamp B1 across the convex ^^, to be removed, the fixture should be taken to take the discrete heat piece to cause the assembly or disassembly Inconvenience and trouble. (2 body Γ1 only clips on the heat sink Α1, does not resist the internal memory 曰 'easy to cause the heat sink A 1 and the memory to be removed and separated. : 'How to solve the memory The problems with the use of the heat sink structure, [new: inside: the relevant manufacturers of the Γ 研究 研究 研究 研究 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the course of this line (four) years of experience, through the trial and modification of the 6 Μ 3 Ό 3419, the beginning of the linger ^ patent born. Jumping to capture the political heat of the body of the thermal 褒 的 μ 继 继 继 ― ― The tops of the two pieces are respectively provided with fastening portions, and the surface is respectively provided with a Yao rod knitting card slot, that is, the buckle portion can be used for the buckle of the buckle, and then the clamping button is used to make the loose key. _Continued on the memory of 'not thief falling apart' and Da Cong assisted (four) heat dissipation. The second purpose of this creation is the two heat sinks of the heat dissipation module, the top is an integrally formed link for elastic riding The connection part is provided for the heat dissipation module to be more easily mounted on the outside of the memory. - The purpose is to provide two heat sinks for the heat dissipating module, which can be provided with a plurality of heat dissipation holes on the surface. 'Xinben's creation is also aimed at the card slot provided on the surface of the two heat sinks of the surface group. The surrounding system can be provided with a convex supporting body for the purpose of firmly clamping the clamping rod to prevent the clamping rod from coming off the card slot after the clamping rod is embedded in the groove of the surface of the two heat sinks. Means] In order to achieve the above objectives and effects, the purpose, structural features and efficacy of the creation of the creation, the preferred embodiment of the creation of the creation of the details of the creation of the description of the characteristics and merits of the following b's full understanding. Please refer to the first, second, third and fourth figures, which are the three-dimensional appearance of the creation Μ3Ό3419, the three-dimensional distribution, the side cross-sectional view before assembly, and the side view after assembly. Riding a dragonfly, the creation of this creation is composed of a pure mask 2, among which '· i Μ π The heat dissipation module 1 has two opposite heat sinks ii, and the tops of the work 2 sheets 11 and 12 are respectively provided. The fastening portion i 3 and the fastening portion 2 can be mutually engaged with the locking rod i 3 i and the fitting ~, there is a σ hole 132, and a plurality of resisting bodies 14 are provided between the fastening parts 3, and then the outer surfaces of the two heat sinks 丄, 丄2 or the upper clamping portion 15' The buckle 2 is a clamping rod 2 i which is bent and formed by the rod body, and is pressed at the upper pressing portion 211, and the clamping portion 2 i 2 is provided at the lower side, and the pressing portion 2 i ^ ^ degree is larger than the clamping portion 2 i 2 button for the clip portion 2 i 2 to have a _ buckle effect. When the above components are assembled, the two heat sinks of the heat dissipation module 1 are 丄丄, 1 : the fastening portions on both sides of the top! 3The two buckles are respectively inserted into the other tender hole 132 by the side of the snap lever ^1, so that the secret heat film u, 12 phase = combined with the two heat sinks H, 12 of the refreshing portion 15 for the buckle 2 the stalker 21 is embedded in 'and the nip portion 2 ii of the shackle rod 2! is pressed against the absorbing body ' 4 ' of the two heat sinks ^, 12 and the nip portion 2 丄 2 at the bottom of the lost lever 2 i Then, it is embedded in the card slot 151 of the clamping portion 15 to constitute the heat dissipation crack of the present invention. Referring to the fourth, fifth and sixth figures, it is a side sectional view of the present assembly, a three-dimensional external view of the preferred embodiment, and a three-dimensional appearance of the embodiment, which can be (3) box by M303419. $, the heat dissipation view of this creation, ^ ^ ^ 12 clamped in the outside of the note. _3, then the 2nd 21 of the coffee 2 = the clamping part 15 of the two hot sheets 11, 12, and the clip under the clamp rod 2 丄The buckle portion 2 1 2 ' suppresses the card slot 1 5 1 of the gripping portion 15 and resists the memory 3, and the width of the clip portion 2 1 2 of the clip rod 2 117 is smaller than the upper portion. Pressure department
^ ;夾扣#212產生較大的夾持力，以將兩散熱片1 1、12細、緊密的夾持在記憶體3外部不易脫離。 a而散熱模組1為可於秘熱片1 1、1 2之表面分別設有複 數散熱孔1 1 1、1 2 1，以利用複數散熱孔1 1 1、]L ! 2輔 助散熱’以提昇兩散糾11、12之散熱功能。 且兩政熱片11、12頂部係可—體成型結合成連接部16 ’且連接部16具有彈力，可方便兩散熱η ii 2呈彈性彎 折^使兩散細11、12更容易罩覆在記憶體3外部。 請參閱第七圖所示，係為本創作又—實施例之立體外觀圖， 由圖中可以清楚看出，本創作之散熱模組i，為於兩散熱片工工 、12之夾持部i 5分別設有卡槽i 5 i，且分別於卡槽丄5工 週圍設有魏凸起之止龍，_卡槽151週圍之 稷數止触i 5 2形成限位，可防止夹扣則丨、夹扣部2工2 脫離卡槽1 5 1，以供扣具2_的夾持於兩散熱片i ii 2 是以，以场賴為梢作之触實_而已，_此褐限 9 Μ3Ό3419 本創作之專利範圍，本創作之散熱模組i為於兩散糾u 2之夾持部15設有卡槽⑸，藉以供扣具2以夾扣桿21失 扣在夾持部1 5 ’並利収扣桿2 1下方的夾扣部2 ! 2嵌入失 持部15之卡槽i 51，同時利用卡槽i 5 i週圍之止擒體丄5 2形成限位，可防止夾扣部212脫離卡槽i 5 i，而達到將兩 散熱片11、12穩固夾持之目的，並利用兩散熱片U、12 •上設置複數散熱孔Η 1、12 i，俾可達到輔助兩散熱片丄丄 、1 2快速散熱之目的’故舉凡可達絲述效果之結構、裝置皆 應受本創作蓋，此_紐叙較結構·，均應同理包 含於本創作之專利範圍内，合予陳明。 上述本創狀記題之散絲置於實際制時，為可具有下 列各項優點，如： _ 政熱核組1之兩散熱片11、12夾持於記憶體3外部， 並利用扣具2以炎扣桿21底部之夾扣部2 i 2嵌入夾持 邛15之卡槽151，並以夾扣部212抵持於記憶體3 上’俾可將兩散熱片11、12穩固夾持於記憶體3上。 (二）散熱模組1係於兩散熱片i ii 2之卡槽i 5 i週圍分 別設有凸起之止擋體15 2，則夾扣桿21底部之夾扣部 212嵌入卡槽151後，並受到止擋體15 2的限位， 可確保扣具2不易由兩散熱片11、12上脫落、分離。 故’本創作為主要針對散熱模組之兩散熱片及扣具的相互夾 Μ3Ό3419 扣，而可將兩散熱片穩固夾持在記憶體上，以防止兩散熱片自記 憶體上脫離為主要保護重點，乃僅使兩散熱片於夾持部所設之卡 槽及止擋體，供扣具夾扣桿底部之夾扣部嵌入，並具有穩固夾扣 之優勢，惟，以上所述僅4本創作之較佳實施例而已，非因此印 侷限本創作之專利範園 ’故舉凡朝本創作朗書及圖式内容所為之㈣修飾及等 效結觀化，均應同理包含於本創作之專利範圍内，合予陳明。 綜上所述，本創作上述記憶體之散熱裝置於使用時，為確實 =達到其功效及目的，故本創作誠為—實雜優異之創作，為符 D新型專利之申請要件，爰依法提出申請，盼料早日賜准案 撕早創作人之辛苦創作’偶若肖局審委有任何本稽疑，請 不吝來函指示，創作人定當竭力配合，實感德便。 。月 Μ3Ό3419 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作組裝前之側視剖面圖。 第四圖係為本創作組裝後之侧視剖面圖。 第五圖係為本創作較佳實施例之立體外觀圖。 第六圖係為本創作再一實施例之立體外觀圖。 第七圖係為本創作又一實施例之立體外觀圖。 第八圖係為習用散熱模組之立體分解圖。 【主要元件符號說明】 1、散熱模組 11、散熱片 1 1 1、散熱孔 1 2、散熱片 1 2 1、散熱孔 1 3、扣接部 1 3 1、卡扣桿 13 2、嵌合孔 14、 抵持體 15、 夾持部 151、卡槽 1 5 2、止擋體 16、 連接部 2、扣具 12 Μ3Ό3419 21、夾扣桿 212、夾扣部 2 1 1、抵壓部 3、記憶體 A、 散熱單元 A1、散熱片 A1 1、凸塊 B、 夾具單元 B1、夾具 B1 1、切溝^; Clip #212 generates a large clamping force to make the two heat sinks 1 1 and 12 tightly and tightly clamped on the outside of the memory 3 to be easily separated. a, the heat dissipation module 1 is provided with a plurality of heat dissipation holes 1 1 1 and 1 2 1 respectively on the surface of the secret heat sheets 1 1 and 1 2 to assist the heat dissipation by using a plurality of heat dissipation holes 1 1 1 , ]L 2 Improve the heat dissipation function of the two scattered 11 and 12. The top of the two heat sheets 11, 12 can be combined into a connecting portion 16' and the connecting portion 16 has an elastic force, so that the two heat dissipating η ii 2 are elastically bent, so that the two thin portions 11, 12 are more easily covered. Outside the memory 3. Please refer to the seventh figure, which is a three-dimensional appearance of the creation and the embodiment. It can be clearly seen from the figure that the heat dissipation module i of the present invention is for the two heat sinks and the clamping portion of the 12 i 5 is provided with a card slot i 5 i, respectively, and a Wei bulge is arranged around the card slot 丄 5, and the number of stops around the _ card slot 151 is a limit, which prevents the clip from being pinched. , the clip part 2 work 2 is separated from the card slot 1 5 1, so that the clip 2_ is clamped to the two heat sinks i ii 2 , so that the touch is made by the field _ _ _ this brown limit 9 Μ3Ό3419 The patent scope of the present invention, the heat dissipation module i of the present invention is provided with a card slot (5) in the clamping portion 15 of the two squeezing corrections 2, whereby the buckle 2 is buckled at the clamping portion 15 with the clamping lever 21 'And the clip portion 2 below the buckle 2 1 is inserted into the card slot i 51 of the missing portion 15 while forming a limit by using the stop body 丄 5 2 around the card slot i 5 i to prevent the clip from being caught The portion 212 is separated from the card slot i 5 i to achieve the purpose of firmly holding the two heat sinks 11 and 12, and the plurality of heat dissipation holes Η 1 and 12 i are disposed on the two heat sinks U and 12, and the auxiliary heat dissipation can be achieved. Chips, 1 2 fast The object of the heat 'may be Dasi said structure so that whenever the effect, the creation of this device are to be subject to the cap, this structure than _ · New classification, should contain in the same way within the scope of the present writing, the engagement to Chen. The above-mentioned crease of the present invention is placed in the actual system, and has the following advantages, such as: _ The two heat sinks 11 and 12 of the political thermonuclear group 1 are clamped to the outside of the memory 3, and the buckle is used. 2, the clip portion 2 i 2 at the bottom of the smashing rod 21 is inserted into the card slot 151 of the clamping jaw 15 , and the clip portion 212 is pressed against the memory 3 ′ to securely hold the two heat sinks 11 and 12 . On the memory 3. (2) The heat dissipation module 1 is respectively provided with a convex stop body 15 2 around the card slot i 5 i of the two heat sinks i ii 2 , and the clip portion 212 at the bottom of the clip rod 21 is embedded in the card slot 151 And being restrained by the stopper body 15 2, it can be ensured that the buckle 2 is not easily detached and separated from the two fins 11 and 12. Therefore, this creation is mainly for the two heat sinks of the heat dissipation module and the clips of the clamps 3Μ3419, and the two heat sinks can be firmly clamped on the memory to prevent the two heat sinks from being separated from the memory as the main protection. The key point is that only the slot and the stop body provided by the two heat sinks on the clamping portion are embedded in the clip portion at the bottom of the clip clamp rod, and have the advantage of a stable clip, but only the above 4 The preferred embodiment of the present invention is not limited to the creation of the patent Fanyuan's stipulations of the creation of the syllabus and the content of the graphic (4) modification and equivalent observation, all of which should be included in the creation. Within the scope of the patent, it is given to Chen Ming. In summary, when the heat sink of the above-mentioned memory is used, it is true = to achieve its efficacy and purpose, so the creation is sincerely - the creation of the excellent and excellent, the application requirements of the new patent of the D, Applying, I hope that the early creation of the case will tear up the hard work of the early creator. If there is any doubt in the audit committee, please do not hesitate to give instructions, the creator will try his best to cooperate, and feel really good. .月 Μ3Ό3419 [Simple description of the diagram] The first picture is the three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The third figure is a side cross-sectional view of the original assembly. The fourth figure is a side cross-sectional view of the original assembly. The fifth drawing is a three-dimensional appearance of the preferred embodiment of the present invention. The sixth drawing is a perspective view of another embodiment of the present creation. The seventh drawing is a three-dimensional appearance of another embodiment of the present invention. The eighth figure is an exploded view of the conventional heat dissipation module. [Main component symbol description] 1. Heat dissipation module 11, heat sink 1 1 1 , heat dissipation hole 1 2, heat sink 1 2 1, heat dissipation hole 1 3, fastening portion 1 3 1 , snap lever 13 2, fitting The hole 14, the abutting body 15, the clamping portion 151, the card slot 1 5, the stopper body 16, the connecting portion 2, the buckle 12 Μ3Ό3419 21, the clamping rod 212, the clamping portion 2 1 1 , the pressing portion 3 , memory A, heat sink unit A1, heat sink A1 1, bump B, clamp unit B1, clamp B1 1, cut groove
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