M271346M271346
四、創作說明（1) 【新型所屬之技術領域】 本創作有關一種印刷電路板鑽孔用下墊板構造，、才匕 一種專供印刷電路板在鑽孔作業使用之下墊板構造改$ ^ 目前印刷電路板之製造流程中，其鋼绾其 〜，白暴扳上必須配 合預定電路設計而鑽設無數個貫穿通孔。 、 印刷電路板在鑽孔作業中’由於其鋼箔基板之产 限，因此銅猪基板底部必須放置一下墊板，以隔離；：機 之金屬床台’相對的增加鑽頭之可容許鑽孔行程距離， 免鑽頭鑽孔時碰撞到床台，而造成鑽頭損壞。 一般印刷電路板鑽孔用下墊板皆採用木漿纖維板，直 配合銅猪基板進行鑽孔後，即必須更換新的木漿纖維/。、 目前木漿纖維板可分為低密度、中密度及高密度纖維板材 ，但是其表層硬度有限，因此銅猪基板之鑽孔邊緣會殘留 較多之毛邊屑，影響鑽孔品質及後續處理流程。" 除此之外’習用木漿纖維板容易吸溼受潮，而產生彎 翹變形，相對的影響到銅箔基板鑽孔時之平整度，造成鑽 孔品質不佳。甚至於木漿纖維板受潮變形後根本無法使用 ，而必須直接廢棄不用。 •【新型内容】 而本創作之目的，即在提供一種印刷電路板鑽孔用下 塾板構造’其在木漿纖維板一側或兩側表面形成一硬度強 化層’旅且降低木漿纖維板之受潮變形程度，因而確保下 塾板之平整度’能夠提高印刷電路板之鑽孔品質，以及減4. Description of Creation (1) [Technical Field to which the New Type belongs] This creation relates to a structure of a base plate for drilling a printed circuit board, and a structure for a base plate of a printed circuit board for drilling. ^ At present, in the manufacturing process of printed circuit boards, the steel slabs of them must be drilled with numerous through-holes in accordance with the predetermined circuit design. 1. In the drilling operation of printed circuit boards, 'due to the production limit of the steel foil substrate, a bottom plate must be placed at the bottom of the copper pig substrate to isolate; the metal bed of the machine' relatively increases the allowable drilling stroke of the drill bit. Distance, to avoid the drill hitting the bed when drilling, causing the drill to be damaged. Generally, the bottom board for drilling printed circuit boards uses wood pulp fiber boards. After drilling directly with the copper pig substrate, the wood pulp fibers must be replaced with new ones. At present, wood pulp fiberboard can be divided into low-density, medium-density and high-density fiberboard, but its surface hardness is limited. Therefore, there will be more burrs on the edge of the drill hole of the copper pig substrate, which will affect the drilling quality and subsequent processing. " In addition, the conventional wood pulp fiberboard is prone to moisture absorption and moisture, resulting in warpage deformation, which relatively affects the flatness of the copper foil substrate during drilling, resulting in poor drilling quality. Even wood pulp fiberboard cannot be used after being deformed due to moisture, and must be discarded directly. • [New content] The purpose of this creation is to provide a lower fascia structure for drilling printed circuit boards, which forms a hardened layer on one or both sides of wood pulp fiber boards, and reduces the strength of wood pulp fiber boards. The degree of deformation due to moisture, so as to ensure the flatness of the bottom plate can improve the drilling quality of the printed circuit board, and reduce
M271346 四、創作說明（2) 少其孔緣之殘留毛邊屑，具備產業上利用價值。 為達上揭目的，本創作印刷電路板鑽孔用下墊板具有 一木漿纖維板，在該木漿纖維板其中一側表面上依序重疊 設有一熱固性樹脂層、一層平面紙及一紫外線塗料層，以 構成一硬度強化層。 在較佳實施例中，該下墊板在木漿纖維板兩侧表面皆 設有該硬度強化層。 上述硬度強化層之熱固性樹脂層硬度大於該木漿纖維 板。 φ【實施方式】 本創作之新穎性及其他特點將於配合以下附圖較佳實 施例之詳細說明而趨於明瞭。 首先，請參閱第1 、2圖，本創作印刷電路板鑽孔用 下墊板同樣採用木漿纖維板（1 〇 )作為基板，其主要在 木漿纖維板（1 0 )其中一側表面上設置結合一硬度強化 層（2 0 )。除此之外’更可如第5圖所示，在木漿纖維 板（1 0 )之兩側表面皆設置結合一硬度強化層（2 〇 ) 〇 木漿纖維板（1 0 )可採用低密度、中密度或高密度 攀規格，如第2、3圖所示，在預定尺寸大小之木漿纖維板 (1 0 ) —側表面上先塗佈一層熔融狀態之熱固性樹脂（ THERMOSETTING RESIN)，並且同時 在熱固性樹脂表面施壓貼合~層平面紙（4 0 )，以控制 整體平整度。於加工冷卻後，即在木漿纖維板（1 〇 ) —M271346 IV. Creation Instructions (2) Residual burr debris at the edge of pores, which has industrial utilization value. In order to achieve the purpose of disclosure, the bottom plate for drilling of the printed circuit board of the present invention has a wood pulp fiber board, and a thermosetting resin layer, a flat paper and an ultraviolet coating layer are sequentially stacked on one surface of the wood pulp fiber board in order. To form a hardness-enhancing layer. In a preferred embodiment, the underlayment plate is provided with the hardness-enhancing layers on both surfaces of the wood pulp fiberboard. The hardness of the thermosetting resin layer of the hardness reinforcing layer is greater than that of the wood pulp fiberboard. [Embodiment] The novelty and other features of this creation will become clear with the detailed description of the preferred embodiments of the following drawings. First of all, please refer to Figures 1 and 2. The bottom plate for drilling the printed circuit board also uses wood pulp fiber board (10) as the substrate, which is mainly provided on one side of the wood pulp fiber board (1 0). A hardness-enhancing layer (20). In addition, as shown in FIG. 5, both sides of the wood pulp fiberboard (1 0) are provided with a hardness strengthening layer (20). The wood pulp fiberboard (1 0) may be low-density, For medium-density or high-density climbing specifications, as shown in Figures 2 and 3, a layer of thermoset resin (THERMOSETTING RESIN) in a molten state is first coated on the side surface of a predetermined size wood pulp fiberboard (1 0), and at the same time The surface of the thermosetting resin is pressed and bonded to a layer of flat paper (40) to control the overall flatness. After processing and cooling, that is, in the wood pulp fiberboard (10)-
2241-0037.ptd 第7頁 M271346 四、創作說明（3) " 側表面結合成型一熱固性樹脂層（3 〇 )，及一重疊貼入 於熱固性树脂層（3 0 )之平面紙（4 0 )。在較佳實施 例中，該熱固性樹脂可採用三聚氰胺樹脂（Μ E L a Μ ^ NE RES I Ν)或酚醛樹脂（PHENOL I cs R E S I N )等種類。 進一步如第2、4圖所示，於已貼合之平面紙（4 〇 )上塗佈一層紫外線塗料，再經由紫外線照射程序，以成 型出一紫外線塗料層（5 0 )。 本實施例下墊板在木漿纖維板（1 〇 ) —側表面上依 _序重疊結合一熱固性樹脂層（3 〇 )、一層平面紙（4 〇 )及一紫外線塗料層（5 0 )，藉由該熱固性樹脂層（3 〇 )、平面紙（4 0 )及紫外線塗料層（5 0 )構成一硬 度強化層（2 0 )。其中該熱固性樹脂層（3 0 )之硬度 大於該木漿纖維板（1 〇 )，並且具有防水性。而紫外線 k料層（5 〇 )除了提高表面硬度之外，更可防止平面紙 (4 0 )吸溼受潮’以降低下塾板之受潮變形程度，而確 保下墊板之平整度。 由於下墊板硬度強化層（2 〇 )之硬度大於木漿纖維 板（10)，並且確保整體板面平整度，因此能夠提高印 刷電路板之鑽孔品質，以及減少其孔緣之殘留毛邊屑。 在第5圖所示之較佳實施例中，將木漿纖維板（1 〇 )兩側表面皆各依序重疊設有一熱固性樹脂層（3 〇 )、 一層平面紙（4 0 )及一紫外線塗料層（5 0 )，使下墊 板兩側表面皆構成一硬度強化層（2 〇 )。2241-0037.ptd Page 7 M271346 IV. Creative Instructions (3) " A thermosetting resin layer (3 0) is formed on the side surface, and a flat paper (4 0) is attached to the thermosetting resin layer (3 0). ). In a preferred embodiment, the thermosetting resin may be a melamine resin (M E L a M ^ NE RES IN) or a phenol resin (PHENOL I cs R E S I N). Further, as shown in Figs. 2 and 4, a layer of ultraviolet paint is coated on the laminated flat paper (40), and then an ultraviolet coating layer (50) is formed through the ultraviolet irradiation process. In this embodiment, the underlaying board overlaps and sequentially combines a thermosetting resin layer (30), a flat paper (40), and an ultraviolet coating layer (50) on the side surface of the wood pulp fiberboard (10). The thermosetting resin layer (30), the flat paper (40), and the ultraviolet coating layer (50) constitute a hardness-enhancing layer (20). The hardness of the thermosetting resin layer (30) is greater than that of the wood pulp fiberboard (100), and it is waterproof. In addition to improving the surface hardness, the UV k material layer (50) can prevent the flat paper (40) from absorbing moisture and reducing moisture 'to reduce the degree of moisture deformation of the lower fascia, and ensure the flatness of the lower pad. Because the hardness of the underlayer hardened layer (20) is greater than that of the wood pulp fiberboard (10), and the overall flatness of the board is ensured, the drilling quality of the printed circuit board can be improved, and the residual burr debris at the edge of the hole can be reduced. In the preferred embodiment shown in Fig. 5, a thermosetting resin layer (30), a layer of flat paper (40), and an ultraviolet paint are sequentially stacked on both sides of the wood pulp fiberboard (100) in order. Layer (50), so that both sides of the underlying plate constitute a hardness-enhancing layer (200).
2241-0037 第8頁 M2713462241-0037 p. 8 M271346
本創作下墊板一側或兩側表面形成一硬度強化層（2 ’並且降低木漿纖維板（1 〇 )之受潮變形程度，因 而確保下墊板之平整度，能夠提高印刷電路板之鑽孔品質 以及減少其孔緣之殘留毛邊屑，具備產業上利用價值。 以上所舉實施例僅用為方便舉例說明本創作，在不離 2作精神範•，…一行業技藝人士所可作之各種簡 易受形與修飾，均仍應含括於本創作以下申請專利範圍中In this creation, one or both surfaces of the underlaying board form a hardness strengthening layer (2 ') and reduce the moisture deformation of the wood pulp fiberboard (10), so as to ensure the flatness of the underlaying board and improve the drilling of printed circuit boards. The quality and the reduction of residual burrs on the edge of the pores have industrial value. The above examples are just for the convenience of illustrating this creation, and they can be used in the spirit of the spirit. Shape and modification should still be included in the scope of the patent application for this creation
— 2241-〇〇37.ptd M271346 圖式簡單說明 【圖示簡單說明】 第1圖係本創作實施例下墊板局部放大圖； 第2圖係第1圖之剖視圖； 第3圖係第2圖木漿纖維板結合熱固性樹脂層及平面紙之 斷面放大圖； 第4圖係接續第3圖塗佈紫外線塗料層之斷面圖；以及 第5圖係本創作較佳實施例下墊板之斷面放大圖。 【主要元件符號說明】 (1 0 )木漿纖維板 ( 2 0 )硬度強化層 (3 0 )熱固性樹脂層 (4 0 )平面紙 (5 0 )紫外線塗料層— 2241-〇〇37.ptd M271346 Schematic illustration [Simplified illustration] Figure 1 is a partial enlarged view of the bottom plate of this creative embodiment; Figure 2 is a sectional view of Figure 1; Figure 3 is the second Figure 4 is an enlarged cross-sectional view of a wood pulp fiberboard combined with a thermosetting resin layer and a flat paper; Figure 4 is a sectional view continuing from Figure 3 and coated with an ultraviolet coating layer; and Figure 5 is a bottom plate of a preferred embodiment of the present invention Enlarged section. [Description of main component symbols] (1 0) Wood pulp fiberboard (2 0) Hardened reinforced layer (3 0) Thermosetting resin layer (4 0) Flat paper (50) UV coating layer
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