JP2001259911A - Backup board for drill machining - Google Patents

Backup board for drill machining

Info

Publication number
JP2001259911A
JP2001259911A JP2000078380A JP2000078380A JP2001259911A JP 2001259911 A JP2001259911 A JP 2001259911A JP 2000078380 A JP2000078380 A JP 2000078380A JP 2000078380 A JP2000078380 A JP 2000078380A JP 2001259911 A JP2001259911 A JP 2001259911A
Authority
JP
Japan
Prior art keywords
drill
thermosetting resin
drilling
board
backup board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000078380A
Other languages
Japanese (ja)
Other versions
JP4527835B2 (en
Inventor
Suehiro Sakanishi
末廣 阪西
Yukito Takahashi
幸人 高橋
Tomoji Sakata
知司 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP2000078380A priority Critical patent/JP4527835B2/en
Publication of JP2001259911A publication Critical patent/JP2001259911A/en
Application granted granted Critical
Publication of JP4527835B2 publication Critical patent/JP4527835B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PROBLEM TO BE SOLVED: To suppress wear of a drill cutting edge when a drill enters a backup board for drill machining used for drilling in a manufacturing process of a printed wiring board. SOLUTION: A mixture prepared by evenly mixing crushed articles of paper base material thermosetting resin hardened material and uncured phenolic resin is put between pre-impregnations with thermosetting resin impregnated in the paper base material and a backup board for drill machining is composed of laminating plates molded by heating and pressurizing.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】プリント配線板の製造工程で
行われるドリル穴明け加工時に使用されるドリル加工用
バックアップボードに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup board for drilling used in drilling in a printed wiring board manufacturing process.

【0002】[0002]

【従来の技術】プリント配線板の製造工程の一つである
ドリル穴明け工程では、プリント配線板となる基板のド
リル侵入側にエントリーボード、反対側にバックアップ
ボードと言われるドリル加工用積層板を置いて穴加工が
行われている。
2. Description of the Related Art In a drilling process, which is one of the manufacturing processes of a printed wiring board, an entry board is provided on a drill entry side of a substrate to be a printed wiring board, and a drilling laminated board called a backup board is provided on the opposite side. Hole processing has been performed.

【0003】ドリル穴明け工程で使用されるドリル加工
用バックアップボードとしては、紙基材熱硬化性樹脂積
層板が最も多く使用されているが、ドリルの磨耗、ドリ
ルの直進性を考慮した物は未だない。
As a back-up board for drilling used in a drilling process, a thermosetting resin laminate of a paper base material is most often used. Not yet.

【0004】また、ドリル穴明け工程ではプリント配線
板の銅箔を平坦に保持する必要が有るので、ドリル加工
用バックアップボードの表面はできるだけ堅くて平滑で
あることが望ましいが、ドリル加工用バックアップボー
ドの内部は、ドリル磨耗、ドリルの直進性を考えると、
できるだけドリルヘの負荷が少ないものが望ましい。
In the drilling process, it is necessary to keep the copper foil of the printed wiring board flat. Therefore, it is desirable that the surface of the backup board for drilling be as hard and smooth as possible. Considering the wear of the drill and the straightness of the drill,
It is desirable that the load on the drill is as small as possible.

【0005】しかし、従来の紙基材熱硬化性樹脂積層板
からなるドリル加工用バックアップボードは、ドリル侵
入時における表面の平滑性が重視される傾向が強く、ド
リルの進行方向に対し均一な積層構造となっているた
め、積層板の内部の組成も固い材質で構成され、ドリル
侵入時におけるドリル刃先の磨耗という問題があった。
[0005] However, in the conventional backup board for drilling comprising a thermosetting resin laminate of a paper base material, there is a strong tendency that the smoothness of the surface when the drill enters is emphasized, and the lamination is uniform in the traveling direction of the drill. Due to the structure, the internal composition of the laminate is also made of a hard material, and there is a problem that the drill bit is worn when the drill enters.

【0006】そこで、この発明は、ドリル侵入時におけ
るドリル刃先の磨耗という問題を解決しようとするもの
である。
[0006] Therefore, the present invention is to solve the problem of wear of the drill bit when the drill enters.

【0007】[0007]

【課題を解決するための手段】この発明は、上記の課題
を解決するために、紙基材熱硬化性樹脂硬化物の粉砕物
と未硬化フェノール樹脂とを均一に混合した混合物を、
紙基材に熱硬化性樹脂を含浸したプリプレグの間に入れ
て、加熱加圧成形した積層板によって、ドリル加工用バ
ックアップボードを構成したのである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a mixture of a pulverized cured paper-based thermosetting resin and an uncured phenolic resin,
A back-up board for drilling was formed by a laminated plate that was inserted between prepregs in which a paper base material was impregnated with a thermosetting resin and was heated and pressed.

【0008】上記ドリル加工用バックアップボードの両
面の表面層1は、紙基材に熱硬化性樹脂を含浸したプリ
プレグを加熱加圧成形して形成されるので、堅くて平滑
な、基板銅箔のカエリ抑制効果が高い層になる。
The surface layers 1 on both sides of the drilling backup board are formed by heating and pressing a prepreg in which a paper base material is impregnated with a thermosetting resin. It becomes a layer with high burrs suppressing effect.

【0009】そして、上記ドリル加工用バックアップボ
ードの内部の中間層2は、硬化した紙基材熱硬化性樹脂
硬化物の粉砕物と未硬化フェノール樹脂とを均一に混合
した混合物からなるので、紙繊維の方向性がない。これ
により、積層板にした際に反りの発生が非常に少なく、
また、ドリル侵入時におけるドリル刃先の磨耗も少な
く、ドリルの曲がりもなく、加工精度も向上する。
The intermediate layer 2 inside the drilling backup board is made of a mixture obtained by uniformly mixing a pulverized hardened paper base thermosetting resin and an unhardened phenol resin. No fiber orientation. Due to this, the occurrence of warpage when made into a laminate is extremely small,
Further, the wear of the drill bit at the time of drill penetration is small, the drill is not bent, and the processing accuracy is improved.

【0010】上記中間層2を形成する紙基材熱硬化性樹
脂硬化物の粉砕物は、紙基材を使用した成形品や積層板
が使用できる。また、この中間層2に使用済みのドリル
加工用バックアップボードを粉砕した物を使用すると、
低価格で得ることができると共に、資源の再利用が図れ
る。
As the pulverized product of the cured thermosetting resin of the paper base material for forming the intermediate layer 2, a molded article or a laminate using the paper base material can be used. In addition, when a material obtained by crushing a used backup board for drilling is used for the intermediate layer 2,
It can be obtained at a low price and resources can be reused.

【0011】上記紙基材熱硬化性樹脂硬化物の粉砕物の
粒度は、50メッシュアンダーとする。
The particle size of the pulverized product of the cured paper base thermosetting resin is 50 mesh under.

【0012】50メッシュアンダーの粉砕物を使用する
ことにより、中間層2が微細均一構造となり、ドリルヘ
の負荷を小さくすることができる。又50メッシュアン
ダーよりも粒径が大きいものを使用した場合、粉砕物の
剛性が大きくなり、ドリル刃先が接触したときに直進性
が損なわれやすい。
By using a pulverized material having a mesh size of less than 50, the intermediate layer 2 has a fine and uniform structure, and the load on the drill can be reduced. In addition, when a material having a particle size larger than 50 mesh under is used, the rigidity of the pulverized material is increased, and the straightness is likely to be impaired when the drill bit comes into contact.

【0013】又、上記紙基材熱硬化性樹脂硬化物の粉砕
物と未硬化のフェノール樹脂との比率は、その後の加熱
加圧成形時に均一に硬化させるために、重量比で80〜
95/20〜5が最も良い。上記紙基材熱硬化性樹脂硬
化物の粉砕物の比率が多いと、粉砕物の接着が不十分と
なり、粉砕物の粉が落ちてくる場合がある。又、逆に比
率が少なくなると、未硬化のフェノール樹脂は流れ易
く、板端部の厚みが薄くなり、均一な厚みの物を成形す
ることが難しくなる。
Further, the ratio of the pulverized product of the cured paper base thermosetting resin to the uncured phenolic resin is preferably 80 to 80% by weight in order to uniformly cure at the time of subsequent heat and pressure molding.
95 / 20-5 is the best. If the ratio of the pulverized product of the cured paper base thermosetting resin is large, the adhesion of the pulverized product becomes insufficient, and powder of the pulverized product may fall. On the other hand, when the ratio is low, the uncured phenol resin flows easily, the thickness of the end of the plate becomes thin, and it becomes difficult to form a product having a uniform thickness.

【0014】上記熱硬化性樹脂を紙基材に含浸したプリ
プレグに、紙基材熱硬化性樹脂硬化物の粉砕物と、未硬
化のフェノール樹脂との混合物を、所定量粉体のまま容
易に載せることができるため、プリプレグ/混合粉体/
プリプレグを一度に一体成形することができる。
In a prepreg obtained by impregnating a paper base material with the above-mentioned thermosetting resin, a mixture of a pulverized product of a cured paper-based thermosetting resin and an uncured phenol resin can be easily used as a powder in a predetermined amount. Prepreg / mixed powder /
The prepreg can be integrally molded at one time.

【0015】上記表面層1を構成するプリプレグは、紙
基材に含浸する熱硬化性樹脂であれば特に限定はされ
ず、フェノール樹脂、メラミン樹脂、ユリア樹脂、エポ
キシ樹脂、等を使用することができる。
The prepreg constituting the surface layer 1 is not particularly limited as long as it is a thermosetting resin impregnated in a paper substrate, and a phenol resin, a melamine resin, a urea resin, an epoxy resin, or the like may be used. it can.

【0016】[0016]

【実施例】[実施例1]坪量200g/m2、密度0.
65の紙基材に、フェノール樹脂を含浸させ、これを、
乾燥機にて加熱し、R.C.45%のプリプレグAを作
成する。
EXAMPLES Example 1 Basis weight 200 g / m 2, density 0.
65 paper substrates were impregnated with phenolic resin,
Heat in a dryer, C. Make 45% prepreg A.

【0017】次に、上記プリプレグAを予め硬化させた
紙基材熱硬化性樹脂硬化物を、50メッシュアンダーに
微粉砕し、この粉砕物と未硬化フェノール樹脂を比率9
0/10の割合で均一に混合したものを、上記プリプレ
グAの上に、2kg/m2載せ、さらに、その上に上記
プリプレグAを載せて、プレスにて温度160℃、圧力
1000N/cm2で1時間加熱加圧し、ドリル加工用
バックアップボードを製造し、このバックアップボード
としてのドリル加工性を確認した。結果は、表1の通り
である。 [比較例1]坪量200g/m2、密度0.65の紙基
材に、フェノール樹脂を含浸させ、これを、乾燥機にて
加熱し、R.C.45%のプリプレグAを作成する。
Next, the cured paper base thermosetting resin obtained by pre-curing the prepreg A is finely pulverized to 50 mesh under, and the pulverized substance and the uncured phenol resin are mixed at a ratio of 9%.
A mixture uniformly mixed at a ratio of 0/10 was placed on the prepreg A at 2 kg / m2, and the prepreg A was further placed on the prepreg A. After heating and pressurizing for a time, a backup board for drilling was manufactured, and the drillability of this backup board was confirmed. The results are as shown in Table 1. [Comparative Example 1] A paper base material having a basis weight of 200 g / m2 and a density of 0.65 was impregnated with a phenol resin, and this was heated with a dryer. C. Make 45% prepreg A.

【0018】このプリプレグAを、8枚積層し、プレス
にて温度160℃、圧力1000N/cm2で1時間加
熱加圧し、ドリル加工用バックアップボードを製造し、
このバックアップボードとしてのドリル加工性を確認し
た。結果は、表1の通りである。
Eight of the prepregs A are laminated and heated and pressed by a press at a temperature of 160 ° C. and a pressure of 1000 N / cm 2 for 1 hour to produce a backup board for drilling.
The drill workability of this backup board was confirmed. The results are as shown in Table 1.

【0019】表1の試験データ並びに評価方法は、次の
通りである。
The test data and evaluation method in Table 1 are as follows.

【0020】加工基板:FR−4 1.6mm、2枚 ドリル:0.3mm径、 加工ショット数:4,000ショット [ドリル加工性評価方法] ドリル刃摩耗:ドリル加工を行った後、使用したドリル
刃の幅を測定し加工前と比較した 銅箔バリ量:ドリル加工を行った後、エントリーボード
と接する基板のドリル加工開始から5穴と、加工終了穴
から前5穴の加工された穴周囲に発生する銅箔バリ量を
測定し、その平均値を求めた 反り量:300×500mmサイズに切断した板を定盤
上に乗せ、最大浮き上がり量を測定した
Working substrate: FR-4 1.6 mm, 2 pieces Drill: 0.3 mm diameter, Number of working shots: 4,000 shots [Drilling workability evaluation method] Drill blade wear: Used after drilling. Measured the width of the drill blade and compared it with before processing Copper foil burr: After drilling, 5 holes from the start of drilling of the board in contact with the entry board, and 5 holes before the end of processing The amount of burr generated around the copper foil was measured, and the average value was calculated. Warp amount: A plate cut to a size of 300 × 500 mm was placed on a surface plate, and the maximum lift amount was measured.

【0021】[0021]

【表1】 [Table 1]

【0022】[0022]

【発明の効果】この発明に係るドリル加工用バックアッ
プボードは、表面は堅くて平滑であるため、銅箔を平坦
に保持することができ、内部はドリルヘの負荷が少ない
ように構成されているので、ドリル侵入時におけるドリ
ル刃先の磨耗が少なく、ドリルの直進性もよい。
The back-up board for drilling according to the present invention has a hard and smooth surface, so that the copper foil can be held flat and the inside is configured so that the load on the drill is small. Also, the wear of the drill bit at the time of penetration of the drill is small and the straightness of the drill is good.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明に係るドリル加工用バックアップボー
ドの拡大断面図
FIG. 1 is an enlarged sectional view of a backup board for drilling according to the present invention.

【符号の説明】[Explanation of symbols]

1 表面層 2 中間層 1 surface layer 2 intermediate layer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 坂田 知司 大阪市北区堂島2丁目1番9号 利昌工業 株式会社内 Fターム(参考) 3C036 AA01 GG00  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tomoji Sakata 2-9-1 Dojima, Kita-ku, Osaka-shi Risho Kogyo Co., Ltd. F-term (reference) 3C036 AA01 GG00

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 紙基材熱硬化性樹脂硬化物の粉砕物と未
硬化フェノール樹脂とを均一に混合した混合物を、紙基
材に熱硬化性樹脂を含浸したプリプレグの間に入れて、
加熱加圧成形した積層板からなるドリル加工用バックア
ップボード。
1. A mixture obtained by uniformly mixing a crushed product of a cured paper-based thermosetting resin and an uncured phenolic resin is placed between prepregs in which a paper-based material is impregnated with a thermosetting resin.
Drilling backup board made of heat-pressed laminated board.
【請求項2】 上記プリプレグの間に入れる紙基材熱硬
化性樹脂硬化物の粉砕物の粒径を、50メッシュアンダ
ーとし、粉砕物と未硬化フェノール樹脂との混合比率が
80〜95/20〜5の範囲にある請求項1記載のドリ
ル加工用バックアップボード。
2. The particle size of the pulverized product of the cured paper base thermosetting resin put between the prepregs is set to 50 mesh under, and the mixing ratio of the pulverized product and the uncured phenol resin is 80 to 95/20. The backup board for drilling according to claim 1, wherein the backup board is in the range of ~ 5.
JP2000078380A 2000-03-21 2000-03-21 Backup board for drilling Expired - Fee Related JP4527835B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000078380A JP4527835B2 (en) 2000-03-21 2000-03-21 Backup board for drilling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000078380A JP4527835B2 (en) 2000-03-21 2000-03-21 Backup board for drilling

Publications (2)

Publication Number Publication Date
JP2001259911A true JP2001259911A (en) 2001-09-25
JP4527835B2 JP4527835B2 (en) 2010-08-18

Family

ID=18595800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000078380A Expired - Fee Related JP4527835B2 (en) 2000-03-21 2000-03-21 Backup board for drilling

Country Status (1)

Country Link
JP (1) JP4527835B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307651A (en) * 2007-06-15 2008-12-25 Rp Topla Ltd Backup board for drilling printed board
KR100922109B1 (en) 2003-02-06 2009-10-16 김하수 Mthod for manufacturing the urethane board for printed circuit board drilling
KR101021489B1 (en) 2011-01-07 2011-03-16 전두표 A backup board for manufacturing via holes of a printed circuit board
CN103029169A (en) * 2012-12-21 2013-04-10 深圳市柳鑫实业有限公司 Novel cover plate for PCB (Printed Circuit Board) drilling and manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338910U (en) * 1986-08-29 1988-03-12
JPH0516028U (en) * 1991-08-26 1993-03-02 三菱アルミニウム株式会社 Board for drilling holes in printed circuit boards
JPH06143017A (en) * 1992-10-30 1994-05-24 Risho Kogyo Co Ltd Back-up board for drilling
JPH08118296A (en) * 1994-10-25 1996-05-14 Risho Kogyo Co Ltd Back-up board for drilling
JPH106299A (en) * 1996-06-21 1998-01-13 Risho Kogyo Co Ltd Backup board for drilling work

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338910U (en) * 1986-08-29 1988-03-12
JPH0516028U (en) * 1991-08-26 1993-03-02 三菱アルミニウム株式会社 Board for drilling holes in printed circuit boards
JPH06143017A (en) * 1992-10-30 1994-05-24 Risho Kogyo Co Ltd Back-up board for drilling
JPH08118296A (en) * 1994-10-25 1996-05-14 Risho Kogyo Co Ltd Back-up board for drilling
JPH106299A (en) * 1996-06-21 1998-01-13 Risho Kogyo Co Ltd Backup board for drilling work

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100922109B1 (en) 2003-02-06 2009-10-16 김하수 Mthod for manufacturing the urethane board for printed circuit board drilling
JP2008307651A (en) * 2007-06-15 2008-12-25 Rp Topla Ltd Backup board for drilling printed board
KR101021489B1 (en) 2011-01-07 2011-03-16 전두표 A backup board for manufacturing via holes of a printed circuit board
CN103029169A (en) * 2012-12-21 2013-04-10 深圳市柳鑫实业有限公司 Novel cover plate for PCB (Printed Circuit Board) drilling and manufacturing method

Also Published As

Publication number Publication date
JP4527835B2 (en) 2010-08-18

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