TWM254651U - Heat dissipation device and thermal module - Google Patents

Description

M254651 V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a cooling device and a cooling module. [Previous technology] When the CPU chip is becoming smaller in size and functionally integrated, if the heat energy generated per unit area can be quickly and uniformly distributed to the heat sinks in contact with it through a heat pipe with high heat conduction characteristics, local hot spots are possible. Minimizing the component instability can effectively enhance the reliability and life of the component. Referring to the first figure, the current approach is mainly: the heating element 20 transmits the heat to the radiator 22 through the thermal interface material 21, and then exhausts the heat through the heat pipe 23 and the fan 24. The thermal interface material is used to fill the gap between the contact surface of the heating element and the heat sink to reduce thermal resistance and achieve the purpose of rapid heat transfer. It is worth noting that, for reducing the thermal resistance, generally only the reduction of the contact thermal resistance is paid attention to, but in order to achieve the purpose of rapid heat transfer, the mechanism of uniform heat dispersion is indispensable. In order to achieve the purpose of uniform heat dispersion, a method known in the industry is to add a thermal diffusion sheet between the thermal interface material and the heat sink, which is generally made of copper. Please refer to the second figure. Chinese Patent No. 00228676.9 announced on June 6, 2001 discloses a heat dissipation device including an aluminum extruded heat sink (not labeled) and a copper metal plate body 30. The plate body 30 is used as a heat diffusion sheet, which is fixed to the bottom surface 15 of the base 14 through the flange 18 of the heat sink, and a thermally conductive medium with a low thermal resistance is coated between the bottom surface 15 and the bottom surface 15 (not shown) . However, the flatness of the surface of the thermal diffusion sheet produced by the common processing method is relatively low, which will relatively increase the contact thermal resistance, resulting in a decrease in the heat conduction rate.

M254651 V. Creative Instructions (2) It is proper. It is necessary to provide a dispersing device with low contact thermal resistance and high heat conduction rate, and a cooling mode button. …, [Contents] The heat dissipation sheet of the heat dissipation device of the Sink technology has a high contact thermal resistance and it is innovative to provide a heat dissipation device with a low contact thermal resistance and a thermally connected base. The purpose of Mu Cang I is to provide a heat dissipation device with low contact thermal resistance and high thermal conductivity.詈, ί: 2 The purpose of this creation, the first heat sink Γ radiator provided by this creation, which includes a first surface and its phase, a metal base and a number of The first surface of the seat extends upward

Extending the heat dissipation fins; and, a strike M # 甘 ^ ^ ^ 衣 ¢ 7 Π 上 I Wherein, the heat diffusion sheet on the second surface of the heat diffusion sheet. A nano-gold film is formed on the moon. For the purpose of this book: I 5 The other type of heat-dissipating equipment provided by this creation is a base, and: the surface and the opposite second surface of the gold, where the base is from two: the surface extends upwards for heat dissipation The wrong film is to realize the original creation; = Yes: nano gold film. The set includes:-a heat-dissipating mold device for heating U, the radiator comprising a metal base with a heat-dissipating surface composed of a radiator and a number of second tables inclined from the first surface of the base. Among them, the heat source and the heat sink base are two, and the extended heat sink has a nano-gold film. The thickness of the nano-gold film may be 5 to 50 micrometers disposed between the surfaces.

M254651

Compared with I 2α and Yuan Ze Technology ’, this book is created on the bottom surface of the heat spreader or radiator base with a Feng Feng ^, which is applied to ΓΡΠ / gold film to improve the surface flatness. When creating a heat dissipation module of g; because of its excellent contact surface, iI = low contact thermal resistance. At the same time, based on the characteristics of the good thermal uniform diffusion characteristics of the gold material, the surface structure of τ meters can also quickly and uniformly diffuse the heat to the diffused f to improve its overall heat dissipation efficiency. [Implementation method] I will further explain this creation in detail with reference to the drawings.

As shown in the third figure, the heat dissipation device 6 provided in this creation includes: and heat & 60 ′ which is composed of a metal base 62 and a plurality of heat dissipation fins 64; ′ a heat diffusion sheet 70. Among them, the metal base 62 has a top surface 620 and a bottom surface = 2 ', and the heat dissipation fin 64 is extended upward from the top surface 6 2 0 of the base 62. The thermal diffusion sheet 70 is placed on the bottom surface 622 of the base 62, and a nano-gold film is formed. The thermal diffusion sheet 70 can be made of copper, copper, or gold, and has a thermal conductivity coefficient. The preferred range of its thickness is 50-200 microns, and most preferably 100 < meters. A thermal interface material may be applied between the base and the bottom surface 6 2 2 of the base to fill the gap of the contact surface.

The nano-gold film 72 is formed by depositing nano-gold particles on the surface of the thermal diffusion sheet 70 by sputtering, vapor deposition, or chemical vapor deposition. The preferred range of thickness is 5-50 microns, and the optimal thickness is 20 microns. It can be understood that it can be arranged on the surface of the heat diffusion sheet 70 facing away from the heat sink, or it can be distributed at the same time: the heat diffusion sheet 70 is facing and facing away from both surfaces of the heat sink. In addition, the heat radiation device may further include a fixing device for

M254651 V. Creative Instructions (4) The heat diffusion sheet is relatively fixed to the radiator. Referring to the fourth figure, the heat dissipation module 8 using the above heat dissipation device 6 includes a heat source 80 and a heat dissipation device 6 composed of a heat sink 60 and a heat diffusion sheet 70. The nano-gold film 72 formed on the heat diffusion sheet 70 is located between the heat source 80 and the heat diffusion sheet 70. Among them, the heat source 80 is a C P U chip. A thermal interface material layer (not shown) may be coated between the heat source 80 and the nano-gold film 72. It is mainly composed of heat-dissipating glue, phase-change heat-dissipating glue or heat-dissipating paste. In addition, the heat dissipation module may further include a heat pipe or a fan disposed on the heat sink 60 to improve heat dissipation efficiency. Please refer to the fifth figure. The main difference between the heat dissipation device 9 of another embodiment of the present invention and the previous embodiment is that the nano-gold film 92 is directly formed on the bottom surface 91 of the heat sink base (not shown). Similarly, the heat dissipation device 9 of this embodiment can also be used to form a corresponding heat dissipation module (not shown). In addition, those skilled in the art should know that other forms of radiators in the conventional technical field can also be used for this creation, and are not necessarily limited to the above embodiments. It can be understood that, when the heat dissipation module is working, it can further include other auxiliary devices, such as a buckle or a buckle design. Compared with the prior art, a nano-gold film is added to the bottom surface of the heat diffusion sheet or the base of the heat sink to improve the flatness of the surface. When this creation is applied to a CPU's heat sink module, it can significantly reduce contact thermal resistance due to its excellent contact surface. At the same time, based on the good thermal uniform diffusion characteristics of the gold material and the characteristics of the nano-surface structure, it can also quickly and uniformly diffuse the heat to the surface.

M254651 V. Creative Instructions (5) Heater to improve its overall heat dissipation efficiency. In summary, this creation has indeed met the requirements for invention patents, and a patent application has been filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with the skills of this case, and equivalent modifications or changes made in accordance with the spirit of this invention, should be included in the scope of patent application below.

The M254651 diagram on page 9 is a simple illustration. The first diagram is a schematic diagram of the conventional heat dissipation device and the composition of the heat sink module. The second diagram is a schematic diagram of the conventional heat dissipation device with a heat diffusion sheet. The third diagram is the original creation. A schematic diagram of the heat dissipation device of the first embodiment; a fourth diagram is a schematic diagram of the heat dissipation module using the heat dissipation device of the first embodiment; a fifth diagram is a schematic diagram of the heat dissipation device of the second embodiment of this creation. [Description of component symbols] Heat sink 6, 9 Heat sink 60 Metal base 62 Top surface 620 Bottom surface 622, 91 Radiating fins 64 Thermal diffusion sheet 70 Nano-gold film 72, 92 Radiating module 8 Heating source 80

Page 10

Claims (1)

M254651 6. Scope of patent application. 1. A heat dissipation device, comprising: a heat sink, comprising a metal base having a first surface and a second surface opposite to the metal base, and a plurality of upwardly extending from the first surface of the base A heat dissipation fin; and, a heat diffusion sheet disposed on the second surface of the base, wherein the heat diffusion sheet is formed with a nano-gold film. 2. The heat sink according to item 1 of the scope of patent application, wherein the thickness of the nano-gold film is 5-50 microns. 3. The heat sink according to item 1 of the scope of patent application, wherein the thickness of the nano-gold film is 20 microns. 4 4. The heat dissipation device according to item 1 of the scope of patent application, wherein the heat diffusion sheet is made of a metal having a high thermal conductivity such as copper, aluminum, or gold. 5. The heat dissipation device according to item 1 of the scope of patent application, wherein the thickness of the heat diffusion sheet is 50-200 microns. 6. The heat dissipation device according to item 1 of the scope of the patent application, wherein the thickness of the thermal diffusion sheet is 100 micrometers. 7. The heat dissipating device according to item 1 of the scope of patent application, wherein a thermal interface material is coated between the above-mentioned thermal diffusion sheet and the second surface of the base. 8. The heat dissipation device according to item 1 of the scope of the patent application, wherein the above-mentioned nano-gold film is formed on the surface of the heat diffusion sheet directly facing and facing away from the heat sink. 9. The heat dissipation device according to item 1 of the scope of the patent application, wherein the heat dissipation device further comprises a fixing means for fixing the heat diffusion sheet to the heat sink. Page 11 M254651 6. Scope of patent application, fixed device. 1 0. A heat dissipation device comprising: 'a heat sink including a metal base having a first surface and a second surface opposite thereto; and a plurality of extending upwardly from the first surface of the base A heat dissipation fin; wherein a nano gold film is formed on the second surface of the base. 11. The heat dissipating device according to item 10 of the scope of patent application, wherein the thickness of the nano-gold film is 5-50 microns. 1 2. The heat dissipation device according to item 10 of the scope of patent application, wherein the thickness of the nano-gold film is 20 micrometers. ¥ 1 3. A heat dissipation module comprising: a heat source; and, a heat dissipation device mainly composed of a heat sink, the heat sink including a metal base having a first surface and an opposite second surface And a plurality of heat dissipation fins extending upward from the first surface of the base, wherein a nano-gold film is disposed between the heat source and the second surface of the heat sink base. 1 4. The heat dissipation module according to item 13 of the scope of patent application, wherein the thickness of the nano-golden ray is 5-50 microns. 15. The heat dissipation module according to item 13 of the scope of patent application, wherein the thickness of the nano-gold film of ® is 20 microns. 16. The heat dissipation module according to item 13 of the scope of patent application, wherein the heat dissipation device further comprises a heat diffusion sheet disposed between the heat source and the second surface of the heat sink base, and The nano-gold film is formed on the Page 12 M254651 6. Scope of patent application Thermal diffusion sheet. 1 7. The heat dissipation module according to item 16 of the scope of patent application, wherein the heat diffusion sheet is made of a metal having a high thermal conductivity, such as copper, aluminum, or gold. 1 8. The heat dissipation module according to item 16 of the scope of patent application, wherein the thickness of the heat diffusion sheet is 50-200 microns. 19. The heat dissipation module according to item 16 of the scope of patent application, wherein the thickness of the heat diffusion sheet is 100 micrometers. 20. The heat dissipation module according to item 16 of the scope of patent application, wherein a thermal interface material is coated between the heat diffusion sheet and the second surface of the base. 2 1. The heat dissipation module according to item 16 of the scope of patent application, wherein the nano-gold film is formed on the surface of the heat diffusion sheet directly facing and facing away from the heat sink 0 2 2. The heat dissipation module according to item 13, wherein the nano-gold film is formed on a second surface of the heat sink base. 2 3. The heat dissipation module according to item 13 of the scope of the patent application, wherein a layer of a thermal interface material is provided between the heat source and the nano-gold film, which is mainly composed of heat dissipation glue, phase change heat dissipation glue or heat dissipation. Cream composition. 2 4. The heat dissipation module according to item 13 of the scope of patent application, wherein the heat dissipation module further comprises a heat pipe connected to the heat dissipation device. 25. The heat dissipation module according to item 13 of the scope of patent application, wherein the heat dissipation module further comprises a fan connected to the heat dissipation device. 2 6. The heat dissipation module according to item 13 of the scope of application for a patent, wherein the heat dissipation module further comprises a fastener connected to the heat dissipation device. Page 13