TWI924659B - 感光性組成物、複合體及電子零件的製造方法 - Google Patents

感光性組成物、複合體及電子零件的製造方法

Info

Publication number
TWI924659B
TWI924659B TW110107583A TW110107583A TWI924659B TW I924659 B TWI924659 B TW I924659B TW 110107583 A TW110107583 A TW 110107583A TW 110107583 A TW110107583 A TW 110107583A TW I924659 B TWI924659 B TW I924659B
Authority
TW
Taiwan
Prior art keywords
mass
meth
photosensitive composition
cellulose
organic binder
Prior art date
Application number
TW110107583A
Other languages
English (en)
Chinese (zh)
Other versions
TW202140576A (zh
Inventor
高田重治
長江省吾
佐合佑一朗
Original Assignee
日商則武股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商則武股份有限公司 filed Critical 日商則武股份有限公司
Publication of TW202140576A publication Critical patent/TW202140576A/zh
Application granted granted Critical
Publication of TWI924659B publication Critical patent/TWI924659B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
TW110107583A 2020-03-31 2021-03-03 感光性組成物、複合體及電子零件的製造方法 TWI924659B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020062834A JP7309651B2 (ja) 2020-03-31 2020-03-31 感光性組成物とその利用
JP2020-062834 2020-03-31

Publications (2)

Publication Number Publication Date
TW202140576A TW202140576A (zh) 2021-11-01
TWI924659B true TWI924659B (zh) 2026-05-11

Family

ID=77868555

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110107583A TWI924659B (zh) 2020-03-31 2021-03-03 感光性組成物、複合體及電子零件的製造方法

Country Status (4)

Country Link
JP (2) JP7309651B2 (enExample)
KR (1) KR102882060B1 (enExample)
CN (1) CN113467185B (enExample)
TW (1) TWI924659B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115185160B (zh) * 2022-09-09 2023-06-27 之江实验室 基于纤维素衍生物的激光直写光刻胶组合物及图案化方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010015992A (ja) * 2008-07-07 2010-01-21 Samsung Sdi Co Ltd アルミニウムを含むプラズマディスプレイ・パネルの電極用ペースト、該ペーストを利用してプラズマディスプレイ・パネルの電極を形成する方法、及び該方法によって形成したプラズマディスプレイ・パネルの電極
TW201229192A (en) * 2010-11-24 2012-07-16 Cheil Ind Inc Composition for anisotropic conductive film, anisotropic conductive film and semiconductor device
CN103474126A (zh) * 2013-09-16 2013-12-25 东莞市贝特利新材料有限公司 可快速uv表面固化的导电浆料及其导电薄膜线路生产方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1124520C (zh) * 1999-10-14 2003-10-15 财团法人工业技术研究院 一种水分散性负型感光性组合物
KR100927611B1 (ko) 2005-01-05 2009-11-23 삼성에스디아이 주식회사 감광성 페이스트 조성물, 이를 이용하여 제조된 pdp전극, 및 이를 포함하는 pdp
JP4197177B2 (ja) 2005-03-18 2008-12-17 東京応化工業株式会社 ブラックマトリックス形成用光硬化性樹脂組成物、これを用いた感光性フィルム、ブラックマトリックスの形成方法、ブラックマトリックス及びそのブラックマトリックスを有するプラズマディスプレイパネル
KR101142631B1 (ko) * 2007-12-14 2012-05-10 코오롱인더스트리 주식회사 샌드블라스트 레지스트용 감광성 수지 조성물 및 드라이필름 포토레지스트
JP2011007864A (ja) 2009-06-23 2011-01-13 Jsr Corp 感光性ペースト組成物およびパターン形成方法
TW201539483A (zh) 2014-04-02 2015-10-16 Toyo Boseki 感光性導電糊劑、導電性薄膜、電路及觸控面板
JP2017182901A (ja) 2016-03-28 2017-10-05 東レ株式会社 感光性導電ペースト及び、それを用いた電子部品の製造方法
JP7043306B2 (ja) 2018-03-23 2022-03-29 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
JP6814237B2 (ja) * 2018-03-23 2021-01-13 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010015992A (ja) * 2008-07-07 2010-01-21 Samsung Sdi Co Ltd アルミニウムを含むプラズマディスプレイ・パネルの電極用ペースト、該ペーストを利用してプラズマディスプレイ・パネルの電極を形成する方法、及び該方法によって形成したプラズマディスプレイ・パネルの電極
TW201229192A (en) * 2010-11-24 2012-07-16 Cheil Ind Inc Composition for anisotropic conductive film, anisotropic conductive film and semiconductor device
CN103474126A (zh) * 2013-09-16 2013-12-25 东莞市贝特利新材料有限公司 可快速uv表面固化的导电浆料及其导电薄膜线路生产方法

Also Published As

Publication number Publication date
CN113467185B (zh) 2025-07-25
JP2021162674A (ja) 2021-10-11
TW202140576A (zh) 2021-11-01
JP2022103158A (ja) 2022-07-07
JP7309651B2 (ja) 2023-07-18
KR102882060B1 (ko) 2025-11-07
CN113467185A (zh) 2021-10-01
KR20210122119A (ko) 2021-10-08
JP7446355B2 (ja) 2024-03-08

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