TWI909240B - 電磁波屏蔽材料、覆蓋材料或外裝材料以及電氣設備或電子設備 - Google Patents

電磁波屏蔽材料、覆蓋材料或外裝材料以及電氣設備或電子設備

Info

Publication number
TWI909240B
TWI909240B TW112142065A TW112142065A TWI909240B TW I909240 B TWI909240 B TW I909240B TW 112142065 A TW112142065 A TW 112142065A TW 112142065 A TW112142065 A TW 112142065A TW I909240 B TWI909240 B TW I909240B
Authority
TW
Taiwan
Prior art keywords
magnetic
layer
resin layer
thickness
laminate
Prior art date
Application number
TW112142065A
Other languages
English (en)
Chinese (zh)
Other versions
TW202428116A (zh
Inventor
大理友希
横山浩平
山本悠貴友
池川迅
Original Assignee
日商Jx金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Jx金屬股份有限公司 filed Critical 日商Jx金屬股份有限公司
Publication of TW202428116A publication Critical patent/TW202428116A/zh
Application granted granted Critical
Publication of TWI909240B publication Critical patent/TWI909240B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/025Electric or magnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW112142065A 2022-11-08 2023-11-01 電磁波屏蔽材料、覆蓋材料或外裝材料以及電氣設備或電子設備 TWI909240B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-179104 2022-11-08
JP2022179104 2022-11-08

Publications (2)

Publication Number Publication Date
TW202428116A TW202428116A (zh) 2024-07-01
TWI909240B true TWI909240B (zh) 2025-12-21

Family

ID=91032614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112142065A TWI909240B (zh) 2022-11-08 2023-11-01 電磁波屏蔽材料、覆蓋材料或外裝材料以及電氣設備或電子設備

Country Status (7)

Country Link
US (1) US20260075786A1 (https=)
EP (1) EP4618709A4 (https=)
JP (1) JP7751750B2 (https=)
KR (1) KR20250022789A (https=)
CN (1) CN119605322A (https=)
TW (1) TWI909240B (https=)
WO (1) WO2024101119A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749625A (en) * 1986-03-31 1988-06-07 Hiraoka & Co., Ltd. Amorphous metal laminate sheet
JPH09121094A (ja) * 1996-08-12 1997-05-06 Hiraoka & Co Ltd 電磁波シールド性積層シート
US5770304A (en) * 1994-07-11 1998-06-23 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JP2018171741A (ja) * 2017-03-31 2018-11-08 Jx金属株式会社 積層体及び成形品の製造方法
TW202007527A (zh) * 2018-08-02 2020-02-16 加川清二 電磁波吸收複合薄片
JP2021038445A (ja) * 2019-09-04 2021-03-11 公立大学法人兵庫県立大学 多層材及びその製造方法、多層材メッキ方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140493U (ja) * 1983-03-11 1984-09-19 昭和ラミネ−ト印刷株式会社 電磁波遮蔽深絞りシ−ト
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Jx金属株式会社 電磁波シールド材
JP6341948B2 (ja) * 2016-03-31 2018-06-13 Jx金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Jx金属株式会社 電磁波シールド材
JP7679170B2 (ja) 2019-08-09 2025-05-19 artience株式会社 ノイズ抑制シートおよび積層体
JP6805382B1 (ja) 2020-03-30 2020-12-23 Jx金属株式会社 電磁波シールド材
JP7008121B1 (ja) 2020-12-09 2022-01-25 Jx金属株式会社 電磁波シールド材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749625A (en) * 1986-03-31 1988-06-07 Hiraoka & Co., Ltd. Amorphous metal laminate sheet
US5770304A (en) * 1994-07-11 1998-06-23 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JPH09121094A (ja) * 1996-08-12 1997-05-06 Hiraoka & Co Ltd 電磁波シールド性積層シート
JP2018171741A (ja) * 2017-03-31 2018-11-08 Jx金属株式会社 積層体及び成形品の製造方法
TW202007527A (zh) * 2018-08-02 2020-02-16 加川清二 電磁波吸收複合薄片
JP2021038445A (ja) * 2019-09-04 2021-03-11 公立大学法人兵庫県立大学 多層材及びその製造方法、多層材メッキ方法

Also Published As

Publication number Publication date
US20260075786A1 (en) 2026-03-12
JP7751750B2 (ja) 2025-10-08
TW202428116A (zh) 2024-07-01
CN119605322A (zh) 2025-03-11
EP4618709A1 (en) 2025-09-17
KR20250022789A (ko) 2025-02-17
WO2024101119A1 (ja) 2024-05-16
EP4618709A4 (en) 2026-03-04
JPWO2024101119A1 (https=) 2024-05-16

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