JPWO2024101119A1 - - Google Patents

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Publication number
JPWO2024101119A1
JPWO2024101119A1 JP2024557281A JP2024557281A JPWO2024101119A1 JP WO2024101119 A1 JPWO2024101119 A1 JP WO2024101119A1 JP 2024557281 A JP2024557281 A JP 2024557281A JP 2024557281 A JP2024557281 A JP 2024557281A JP WO2024101119 A1 JPWO2024101119 A1 JP WO2024101119A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024557281A
Other languages
Japanese (ja)
Other versions
JP7751750B2 (ja
JPWO2024101119A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024101119A1 publication Critical patent/JPWO2024101119A1/ja
Publication of JPWO2024101119A5 publication Critical patent/JPWO2024101119A5/ja
Application granted granted Critical
Publication of JP7751750B2 publication Critical patent/JP7751750B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024557281A 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 Active JP7751750B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022179104 2022-11-08
JP2022179104 2022-11-08
PCT/JP2023/038081 WO2024101119A1 (ja) 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器

Publications (3)

Publication Number Publication Date
JPWO2024101119A1 true JPWO2024101119A1 (https=) 2024-05-16
JPWO2024101119A5 JPWO2024101119A5 (https=) 2025-01-30
JP7751750B2 JP7751750B2 (ja) 2025-10-08

Family

ID=91032614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024557281A Active JP7751750B2 (ja) 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器

Country Status (7)

Country Link
US (1) US20260075786A1 (https=)
EP (1) EP4618709A4 (https=)
JP (1) JP7751750B2 (https=)
KR (1) KR20250022789A (https=)
CN (1) CN119605322A (https=)
TW (1) TWI909240B (https=)
WO (1) WO2024101119A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140493U (ja) * 1983-03-11 1984-09-19 昭和ラミネ−ト印刷株式会社 電磁波遮蔽深絞りシ−ト
JP2018171741A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法
JP2021163789A (ja) * 2020-03-30 2021-10-11 Ｊｘ金属株式会社 電磁波シールド材
JP2022091579A (ja) * 2020-12-09 2022-06-21 Ｊｘ金属株式会社 電磁波シールド材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749625A (en) * 1986-03-31 1988-06-07 Hiraoka & Co., Ltd. Amorphous metal laminate sheet
EP0692840A1 (en) * 1994-07-11 1996-01-17 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JP2993889B2 (ja) * 1996-08-12 1999-12-27 平岡織染株式会社 電磁波シールド性積層シート
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
JP6341948B2 (ja) * 2016-03-31 2018-06-13 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
JP7679170B2 (ja) 2019-08-09 2025-05-19 ａｒｔｉｅｎｃｅ株式会社 ノイズ抑制シートおよび積層体
JP7391356B2 (ja) * 2019-09-04 2023-12-05 兵庫県公立大学法人 多層材及びその製造方法、多層材メッキ方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140493U (ja) * 1983-03-11 1984-09-19 昭和ラミネ−ト印刷株式会社 電磁波遮蔽深絞りシ−ト
JP2018171741A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法
JP2021163789A (ja) * 2020-03-30 2021-10-11 Ｊｘ金属株式会社 電磁波シールド材
JP2022091579A (ja) * 2020-12-09 2022-06-21 Ｊｘ金属株式会社 電磁波シールド材

Also Published As

Publication number Publication date
US20260075786A1 (en) 2026-03-12
JP7751750B2 (ja) 2025-10-08
TW202428116A (zh) 2024-07-01
CN119605322A (zh) 2025-03-11
EP4618709A1 (en) 2025-09-17
KR20250022789A (ko) 2025-02-17
WO2024101119A1 (ja) 2024-05-16
TWI909240B (zh) 2025-12-21
EP4618709A4 (en) 2026-03-04

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