JP7751750B2 - 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 - Google Patents

電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器

Info

Publication number
JP7751750B2
JP7751750B2 JP2024557281A JP2024557281A JP7751750B2 JP 7751750 B2 JP7751750 B2 JP 7751750B2 JP 2024557281 A JP2024557281 A JP 2024557281A JP 2024557281 A JP2024557281 A JP 2024557281A JP 7751750 B2 JP7751750 B2 JP 7751750B2
Authority
JP
Japan
Prior art keywords
magnetic
layer
resin layer
electromagnetic wave
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024557281A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024101119A1 (https=
JPWO2024101119A5 (https=
Inventor
友希 大理
浩平 横山
悠貴友 山本
迅 池川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of JPWO2024101119A1 publication Critical patent/JPWO2024101119A1/ja
Publication of JPWO2024101119A5 publication Critical patent/JPWO2024101119A5/ja
Application granted granted Critical
Publication of JP7751750B2 publication Critical patent/JP7751750B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/025Electric or magnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024557281A 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 Active JP7751750B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022179104 2022-11-08
JP2022179104 2022-11-08
PCT/JP2023/038081 WO2024101119A1 (ja) 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器

Publications (3)

Publication Number Publication Date
JPWO2024101119A1 JPWO2024101119A1 (https=) 2024-05-16
JPWO2024101119A5 JPWO2024101119A5 (https=) 2025-01-30
JP7751750B2 true JP7751750B2 (ja) 2025-10-08

Family

ID=91032614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024557281A Active JP7751750B2 (ja) 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器

Country Status (7)

Country Link
US (1) US20260075786A1 (https=)
EP (1) EP4618709A4 (https=)
JP (1) JP7751750B2 (https=)
KR (1) KR20250022789A (https=)
CN (1) CN119605322A (https=)
TW (1) TWI909240B (https=)
WO (1) WO2024101119A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018171741A (ja) 2017-03-31 2018-11-08 Jx金属株式会社 積層体及び成形品の製造方法
JP2021163789A (ja) 2020-03-30 2021-10-11 Jx金属株式会社 電磁波シールド材
JP2022091579A (ja) 2020-12-09 2022-06-21 Jx金属株式会社 電磁波シールド材

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140493U (ja) * 1983-03-11 1984-09-19 昭和ラミネ−ト印刷株式会社 電磁波遮蔽深絞りシ−ト
US4749625A (en) * 1986-03-31 1988-06-07 Hiraoka & Co., Ltd. Amorphous metal laminate sheet
EP0692840A1 (en) * 1994-07-11 1996-01-17 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JP2993889B2 (ja) * 1996-08-12 1999-12-27 平岡織染株式会社 電磁波シールド性積層シート
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Jx金属株式会社 電磁波シールド材
JP6341948B2 (ja) * 2016-03-31 2018-06-13 Jx金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Jx金属株式会社 電磁波シールド材
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
JP7679170B2 (ja) 2019-08-09 2025-05-19 artience株式会社 ノイズ抑制シートおよび積層体
JP7391356B2 (ja) * 2019-09-04 2023-12-05 兵庫県公立大学法人 多層材及びその製造方法、多層材メッキ方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018171741A (ja) 2017-03-31 2018-11-08 Jx金属株式会社 積層体及び成形品の製造方法
JP2021163789A (ja) 2020-03-30 2021-10-11 Jx金属株式会社 電磁波シールド材
JP2022091579A (ja) 2020-12-09 2022-06-21 Jx金属株式会社 電磁波シールド材

Also Published As

Publication number Publication date
US20260075786A1 (en) 2026-03-12
TW202428116A (zh) 2024-07-01
CN119605322A (zh) 2025-03-11
EP4618709A1 (en) 2025-09-17
KR20250022789A (ko) 2025-02-17
WO2024101119A1 (ja) 2024-05-16
TWI909240B (zh) 2025-12-21
EP4618709A4 (en) 2026-03-04
JPWO2024101119A1 (https=) 2024-05-16

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