WO2024101119A1 - 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 - Google Patents

電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 Download PDF

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WO2024101119A1
WO2024101119A1 PCT/JP2023/038081 JP2023038081W WO2024101119A1 WO 2024101119 A1 WO2024101119 A1 WO 2024101119A1 JP 2023038081 W JP2023038081 W JP 2023038081W WO 2024101119 A1 WO2024101119 A1 WO 2024101119A1
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Prior art keywords
layer
magnetic
nonmagnetic
resin layer
electromagnetic wave
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PCT/JP2023/038081
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English (en)
French (fr)
Japanese (ja)
Inventor
友希 大理
浩平 横山
悠貴友 山本
迅 池川
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JX Advanced Metals Corp
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JX Metals Corp
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Priority to EP23888470.4A priority Critical patent/EP4618709A4/en
Priority to KR1020257000631A priority patent/KR20250022789A/ko
Priority to US19/101,119 priority patent/US20260075786A1/en
Priority to JP2024557281A priority patent/JP7751750B2/ja
Priority to CN202380050518.3A priority patent/CN119605322A/zh
Publication of WO2024101119A1 publication Critical patent/WO2024101119A1/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Definitions

  • the present invention relates to electromagnetic wave shielding materials, covering or exterior materials, and electrical and electronic devices.
  • the direct current generated by the secondary batteries is converted to alternating current via an inverter, and the necessary power is then supplied to an AC motor to obtain driving force. This causes electromagnetic waves to be generated due to the switching operation of the inverter.
  • Electromagnetic waves are not limited to automobiles; many electrical and electronic devices, including communication devices, displays, and medical equipment, also emit electromagnetic waves. Electromagnetic waves can cause precision equipment to malfunction, and there are also concerns about their effects on the human body.
  • a conductive layer such as copper is known to exhibit good shielding properties against electromagnetic waves.
  • a conductive layer such as copper alone has poor shielding properties against electromagnetic waves, so it is known that an electromagnetic wave shielding material consisting of alternating layers of magnetic layers with excellent magnetic permeability and conductive layers exhibits good shielding properties against electromagnetic waves.
  • Patent Document 1 proposes the following technique. "A noise suppression sheet used to suppress noise of 1 MHz or less, comprising n magnetic layers having a magnetic layer (A 1 ) and a magnetic layer (A n ), and a noise suppression layer having at least (n-1) conductive layers, the magnetic layers and the conductive layers are laminated alternately,
  • Xi represented by the following formula (1) is 1 or more
  • the sum of the Xi of each of the magnetic layers is 4 or more and 15 or less
  • a noise suppression sheet characterized in that each of the conductive layers has a proportionality constant of 4 or more obtained when the shielding property of 0.2 to 1 MHz is linearly approximated in a magnetic field shielding property measurement by the KEC method.
  • n is an integer of 2 or more, and i is an integer of 1 or more and n or less, ⁇ ′ i is the relative permeability of the magnetic layer (A i ) at 1 MHz, t i is the film thickness [mm] of the magnetic layer (A i ), It is.”
  • electromagnetic wave shielding materials are sometimes drawn to fit the shapes of housings, electronic components, and the like as exterior materials.
  • the material is formed into a shape with the desired height by drawing, there is a problem in that the formed body after processing is subject to a force (springback) that causes the formed body to return to the shape before processing, meaning that the height of the formed body cannot be maintained, i.e., the shape cannot be maintained.
  • the height may return to about half of the height immediately after processing, which is a problem in industrial production. Therefore, it would be extremely meaningful from an industrial perspective if the shape retention of electromagnetic wave shielding materials could be improved.
  • Patent Document 1 does not focus on the above-mentioned shape retention.
  • the objective is to provide an electromagnetic wave shielding material with excellent shape retention.
  • the electromagnetic wave shielding material includes a laminate having a nonmagnetic resin layer and a nonmagnetic metal layer and/or a ferromagnetic layer, and has an anisotropy at break (Rc) value of 0 or less or 1 or more, thereby exhibiting excellent shape retention. They then created the invention exemplified below.
  • An electromagnetic wave shielding material including a laminate having a nonmagnetic resin layer and a nonmagnetic metal layer and/or a ferromagnetic layer, An electromagnetic wave shielding material having a value of anisotropy at break (Rc) represented by the following formula (1) of 0 or less or 1 or more:
  • the laminate has the nonmagnetic metal layer, The electromagnetic wave shielding material according to [1], wherein the nonmagnetic resin layer is provided on both surfaces of the nonmagnetic metal layer.
  • the stack has the ferromagnetic layer, The electromagnetic wave shielding material according to [1] or [2], wherein the nonmagnetic resin layer is provided on both surfaces of the ferromagnetic layer.
  • a covering or exterior material for electric/electronic devices comprising the electromagnetic wave shielding material according to any one of [1] to [8].
  • Electromagnetic wave shielding material One embodiment of the electromagnetic wave shielding material according to the present invention includes a laminate having a nonmagnetic resin layer, and a nonmagnetic metal layer and/or a ferromagnetic layer. Each of the preferred embodiments will be described below.
  • the value of the anisotropy at break in the laminate is equal to or less than 0 or equal to or greater than 1.
  • the value of the anisotropy at break is defined by the following formula (1).
  • the anisotropy at break (Rc) indicates the degree of deformation in the thickness direction and width direction when a plate-shaped sample is uniformly stretched.
  • the width and thickness of the laminate before and after the tensile test are determined, and the ratio of width strain to thickness strain is determined based on the following formulas (3) and (4). This makes it possible to calculate the value of anisotropy at break (Rc).
  • the method for measuring the width strain and thickness strain in the tensile test is as follows.
  • the laminate is cut to a width of 12.7 mm using a precision cutter, and the length is 10 cm (100 mm) using a cutter, scissors, or the like.
  • the evaluation sample is fixed using a bench-top precision universal testing machine (Autograph AGS-X, manufactured by Shimadzu Corporation) so that each end of the evaluation sample in the longitudinal direction is clamped by a gripping tool (chuck) as a test jig to a length of 20 mm, and the initial chuck distance is 60 mm.
  • a gripping tool chuck
  • the evaluation sample is pulled in the longitudinal direction (longitudinal direction) at a tensile speed of 50 mm/min using the bench-top precision universal testing machine. Then, the tensile test is terminated when the evaluation sample breaks into two pieces. Based on the above formulas (3) and (4), the width strain and thickness strain of the evaluation sample are calculated from the width and thickness of the evaluation sample before and after the tensile test, and the value of Rc is calculated. As an example of a method for measuring the thickness required to calculate the value of Rc, it can be measured in accordance with Method A in JIS K 6250:2019 using a constant pressure thickness tester (THICKNESS METER B-1, manufactured by Toyo Seiki Seisakusho).
  • TICKNESS METER B-1 constant pressure thickness tester
  • the width can be measured with an indenter diameter of 5 mm and a pressure of 1.22 N on the indenter.
  • a method for measuring the width it can be measured using a vernier caliper after fixing the broken part with tape on a cardboard so that it does not curl.
  • the width after breaking the width is measured in the direction perpendicular to the longitudinal direction for the part of the neck occurring near the broken part that is visually considered to be the smallest width.
  • the laminate may have a structure in which a nonmagnetic metal layer and/or a ferromagnetic layer are closely laminated via a nonmagnetic resin layer.
  • a nonmagnetic metal layer it is preferable to have a non-magnetic resin layer on both surfaces of the non-magnetic metal layer. It is desirable to have a structure in which both surfaces of the non-magnetic metal layer are closely laminated with the non-magnetic resin layer in order to improve the ductility of the non-magnetic metal layer and increase the shape retention of the laminate.
  • non-magnetic metal layer Since metal foils such as copper and aluminum as the non-magnetic metal layer are prone to local elongation, local stress concentration can be alleviated by sandwiching them between non-magnetic resin layers that are relatively resistant to local elongation. This ensures excellent shape retention.
  • the laminate has a ferromagnetic layer, it is preferable to have a nonmagnetic resin layer on both surfaces of the ferromagnetic layer. The presence of the nonmagnetic resin layer can reduce localized stress concentration, thereby ensuring excellent shape retention.
  • a non-magnetic metal layer is provided on one surface of the ferromagnetic layer
  • the ferromagnetic layer is a composite sheet (an integrally molded product in which a magnetic metal material and a resin are mixed and dispersed). This ensures excellent shape retention.
  • Examples of the layer structure of the laminate include the following. (1) When the laminate has a two-layer structure, examples of the structure include a nonmagnetic resin layer/ferromagnetic layer and a nonmagnetic resin layer/nonmagnetic metal layer.
  • examples include nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer, nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer, nonmagnetic resin layer/ferromagnetic layer/nonmagnetic metal layer, nonmagnetic resin layer/nonmagnetic metal layer/ferromagnetic layer, ferromagnetic layer/nonmagnetic resin layer/ferromagnetic layer, and ferromagnetic layer/nonmagnetic resin layer/nonmagnetic metal layer.
  • examples include nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/ferromagnetic layer, nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer/nonmagnetic metal layer, nonmagnetic resin layer/nonmagnetic metal layer/ferromagnetic layer/nonmagnetic resin layer, nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer, nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer, nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/nonmagnetic metal layer, and nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer/ferromagnetic layer.
  • examples include nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer, nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer, nonmagnetic resin layer/nonmagnetic metal layer/ferromagnetic layer/nonmagnetic metal layer/nonmagnetic resin layer, nonmagnetic resin layer/nonmagnetic metal layer/ferromagnetic layer/nonmagnetic metal layer/nonmagnetic resin layer, and nonmagnetic metal layer/nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/nonmagnetic metal layer.
  • examples include nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/ferromagnetic layer, nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer/nonmagnetic metal layer, nonmagnetic resin layer/nonmagnetic metal layer/ferromagnetic layer/nonmagnetic metal layer/ferromagnetic layer/nonmagnetic resin layer, and nonmagnetic resin layer/nonmagnetic metal layer/nonmagnetic resin layer/ferromagnetic layer/nonmagnetic resin layer/nonmagnetic resin layer.
  • a single "nonmagnetic resin layer” may include a configuration in which multiple nonmagnetic resin layers are laminated without any ferromagnetic layers or nonmagnetic metal layers in between.
  • multiple nonmagnetic resin layers laminated without any ferromagnetic layers or nonmagnetic metal layers are regarded as a single nonmagnetic resin layer.
  • a non-magnetic resin layer on which an adhesive layer is laminated without a ferromagnetic layer or non-magnetic metal layer therebetween is regarded as one non-magnetic resin layer.
  • the electromagnetic wave shielding material should contain one or more non-magnetic resin layers, and one or more non-magnetic metal layers and/or ferromagnetic layers.
  • the RD breaking elongation of the laminate is preferably 10% or more, more preferably 30% or more, but considering the appropriate breaking elongation, the RD breaking elongation is typically 300% or less, more typically 250% or less.
  • the rupture elongation in the TD direction of the laminate is preferably 20% or more, more preferably 30% or more. However, in consideration of an appropriate rupture elongation, the rupture elongation in the TD direction is typically 300% or less, more typically 250% or less.
  • the RD direction means the direction in which the nonmagnetic resin layer and/or the nonmagnetic metal layer is conveyed by the rolls
  • the TD direction means the direction rotated by 90° from the RD direction.
  • the method for measuring the breaking elongation in each direction is as follows, in accordance with JIS K7127:1999.
  • the laminate is cut to a width of 12.7 mm using a precision cutter, and the length is 10 cm (100 mm) using a cutter, scissors, or the like.
  • the laminate is prepared so that the RD direction of the laminate is the longitudinal direction of the evaluation sample.
  • the laminate is prepared so that the TD direction of the laminate is the longitudinal direction of the evaluation sample.
  • the evaluation sample is fixed so that the length of each end of the evaluation sample in the longitudinal direction is clamped by the gripping tool (chuck) which is the test jig is 20 mm, and the initial chuck distance is 60 mm.
  • the evaluation sample is pulled in the longitudinal direction (longitudinal direction) at a tensile speed of 50 mm/min of the bench-top precision universal testing machine. Then, the tensile test is terminated when the evaluation sample is broken into two pieces.
  • the length change amount after deformation is divided by the length before deformation, and the value expressed as a percentage is defined as the breaking elongation (%).
  • the thickness of the laminate is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, and even more preferably 30 ⁇ m or more.
  • the thickness of the laminate is preferably 800 ⁇ m or less, more preferably 700 ⁇ m or less, and even more preferably 600 ⁇ m or less.
  • the thickness of the laminate can be measured using a constant pressure thickness tester (THICKNESS METER B-1, manufactured by Toyo Seiki Seisakusho) in accordance with Method A of JIS K 6250: 2019.
  • the diameter of the indenter is 5 mm, and the pressure applied to the indenter is 1.22 N.
  • the lamination method of the non-magnetic resin layer and the ferromagnetic layer or the non-magnetic metal layer may be performed by using an adhesive between the non-magnetic resin layer and the ferromagnetic layer or between the non-magnetic resin layer and the non-magnetic metal layer, or by thermocompression bonding of the non-magnetic resin layer to the ferromagnetic layer or the non-magnetic metal layer without using an adhesive.
  • an adhesive between the non-magnetic resin layer and the ferromagnetic layer or between the non-magnetic resin layer and the non-magnetic metal layer
  • thermocompression bonding of the non-magnetic resin layer to the ferromagnetic layer or the non-magnetic metal layer without using an adhesive.
  • an adhesive from the viewpoint of not applying excess heat to the ferromagnetic layer.
  • the adhesive includes acrylic resin-based, epoxy resin-based, urethane-based, polyester-based, silicone resin-based, vinyl acetate-based, styrene butadiene rubber-based, nitrile rubber-based, phenolic resin-based, and cyanoacrylate-based adhesives, and urethane-based, polyester-based, and vinyl acetate-based adhesives are preferred for reasons of ease of production and cost.
  • the non-magnetic resin layer includes a resin composition that does not exhibit diamagnetic or paramagnetic properties.
  • a layer having a large impedance difference with the ferromagnetic layer or the non-magnetic metal layer is preferable in terms of obtaining excellent electromagnetic wave shielding properties.
  • the relative dielectric constant cannot be smaller than 1.0.
  • the minimum is about 2.0, and even if it is lowered further to approach 1.0, the improvement of the shielding properties is limited, while the material itself becomes special and expensive.
  • the relative dielectric constant is preferably 2.0 or more, and more preferably 2.2 or more.
  • Synthetic resins are preferred as materials for the non-magnetic resin layer from the viewpoint of workability.
  • Film-like materials can also be used as materials for the non-magnetic resin layer.
  • Fiber reinforcement materials such as carbon fiber, glass fiber, and aramid fiber can also be mixed into the non-magnetic resin layer.
  • Synthetic resins include polyesters such as PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), and PBT (polybutylene terephthalate), olefin resins such as polyethylene and polypropylene, polyamide, polyimide, liquid crystal polymer, polyacetal, fluororesin, polyurethane, acrylic resin, epoxy resin, silicone resin, phenolic resin, melamine resin, ABS resin, polyvinyl alcohol, urea resin, polyvinyl chloride, polystyrene, and styrene butadiene rubber, and among these, PET, PC, polyamide, and polyimide are preferred from the viewpoint of tensile strength and ductility.
  • polyesters such as PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), and PBT (polybutylene terephthalate)
  • olefin resins such as polyethylene and poly
  • elastomers such as urethane rubber, chloroprene rubber, silicone rubber, fluororubber, styrene-based, olefin-based, PVC-based, urethane-based, and amide-based can also be used as synthetic resins.
  • polyimide, polybutylene terephthalate, polyamide, polyurethane, etc. which are easily bonded to metal foil by thermocompression, can be preferably used. All of the nonmagnetic resin layers used in the laminate may be made of the same resin material, or different resin materials may be used for each layer.
  • the non-magnetic resin layer may contain conductive particles and/or conductive fibers.
  • Any known metal species having good electrical conductivity may be used as the conductive particles or conductive fibers, and examples of such metal species include copper, copper alloys, aluminum, aluminum alloys, and carbon.
  • the mass ratio of the resin to the conductive particles or conductive fibers is, for example, 70:30 to 1:99.
  • the surface of the non-magnetic resin layer may be subjected to various surface treatments for the purpose of promoting adhesion with the non-magnetic metal layer or ferromagnetic layer.
  • the adhesion between the resin film as the non-magnetic resin layer and the metal foil as the non-magnetic metal layer can be improved by applying a primer coat or corona treatment to the bonding surface of the resin film as the non-magnetic resin layer and the metal foil as the non-magnetic metal layer.
  • the value of the anisotropy at break of the nonmagnetic resin layer is preferably 1.0 to 10 or -10 to 0, and more preferably 1.2 to 5 or -5 to -0.
  • the value of the anisotropy at break is defined by the following formula (2).
  • the methods for measuring the width strain (ln(W/W 0 )) and thickness strain (ln(t/t 0 )) are the same as the method for measuring the value of the anisotropy at break in the laminate described above.
  • the RD breaking elongation of the nonmagnetic resin layer is preferably 10% or more, more preferably 20% or more, and even more preferably 80% or more. However, in consideration of an appropriate breaking elongation, the RD breaking elongation is typically 500% or less, and more typically 400% or less. From the viewpoint of shape processability such as drawing, the non-magnetic resin layer preferably has a breaking elongation in the TD direction of 10% or more, more preferably 20% or more, and even more preferably 80% or more. However, in consideration of an appropriate breaking elongation, the breaking elongation in the TD direction is typically 500% or less, and more typically 400% or less. The method for measuring the breaking elongation in each direction is the same as the method for measuring the breaking elongation in each direction of the laminate described above.
  • the thickness of the non-magnetic resin layer is not particularly limited, but from the viewpoint of processability, the total thickness of the non-magnetic resin layer is preferably 40 ⁇ m or more, more preferably 50 ⁇ m or more, even more preferably 100 ⁇ m or more, and even more preferably 200 ⁇ m or more. However, from the viewpoint of cost reduction, the total thickness of the non-magnetic resin layer is preferably 500 ⁇ m or less, more preferably 400 ⁇ m or less, and even more preferably 300 ⁇ m or less.
  • the thickness of each nonmagnetic resin layer is preferably 5 ⁇ m or more, more preferably 20 ⁇ m or more, and even more preferably 25 ⁇ m or more.
  • the thickness is preferably 500 ⁇ m or less, and more preferably 300 ⁇ m or less.
  • the method for measuring the thickness of the nonmagnetic resin layer is the same as the method for measuring the thickness of the laminate described above.
  • the adhesive layer is laminated on the surface of the non-magnetic resin layer and contains an adhesive.
  • an adhesive with a lower strength than a resin film is often used. Therefore, if the thickness of the adhesive layer is too thick, laminating a non-magnetic resin layer having the adhesive layer may hinder the improvement of the ductility of the ferromagnetic layer or the non-magnetic metal layer. On the other hand, if the thickness of the adhesive layer is too thin, it is difficult to apply the adhesive to the entire interface between the ferromagnetic layer or the non-magnetic metal layer and the non-magnetic resin layer, and there is a risk of non-adhesive portions being formed.
  • the thickness of the adhesive layer is preferably 1 ⁇ m or more and 20 ⁇ m or less, more preferably 1 ⁇ m or more and 10 ⁇ m or less, and even more preferably 3 ⁇ m or more and 9 ⁇ m or less.
  • the adhesive layer may further contain conductive particles or conductive fibers within a range that does not hinder the present invention.
  • the method for measuring the thickness of the adhesive layer is the same as the method for measuring the thickness of the laminate described above.
  • the ferromagnetic layer has electromagnetic wave absorbing properties, and has a relative magnetic permeability at a frequency of 1 MHz of approximately 10 to 50000.
  • the ferromagnetic layer contains a magnetic metal material with high relative magnetic permeability, and examples of the ferromagnetic layer include a composite sheet and a metal foil in which the magnetic metal material is mixed and dispersed with a resin and molded into an integrated body, with the composite sheet being preferred from the viewpoints of workability and light weight.
  • a typical method for measuring the relative magnetic permeability is as follows: A measurement sample is processed into a toroidal shape (outer diameter 6.93 to 6.96 mm, inner diameter 3.06 to 3.10 mm) using a punching die or the like, and the relative magnetic permeability can be measured using a vector network analyzer (ENA E5071C, manufactured by Keysight).
  • E5071C vector network analyzer
  • the resin contained in the composite sheet may be a natural resin or a synthetic resin, and from the viewpoint of processability, a synthetic resin is preferable. These materials may also be mixed with fiber reinforcing materials such as carbon fiber, glass fiber, and aramid fiber.
  • polyesters such as PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate) and PBT (polybutylene terephthalate), olefin resins such as polyethylene and polypropylene, polyamide, PI (polyimide), LCP (liquid crystal polymer), polyacetal, fluororesin, polyurethane, acrylic resin, epoxy resin, silicone resin, phenol resin, melamine resin, ABS resin, polyvinyl alcohol, urea resin, polyvinyl chloride, polystyrene, styrene butadiene rubber, etc., from the viewpoint of ease of availability and processability.
  • polyesters such as PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate) and PBT (polybutylene terephthalate)
  • olefin resins such as polyethylene and polypropylene
  • PET, PC, PEN, polyamide, and PI are preferred for reasons of processability and cost.
  • synthetic resins elastomers such as urethane rubber, chloroprene rubber, silicone rubber, fluororubber, styrene-based, olefin-based, PVC-based, urethane-based, and amide-based elastomers can also be applied.
  • the synthetic resin itself may play the role of an adhesive.
  • the adhesive is not particularly limited, but examples thereof include acrylic resin-based, epoxy resin-based, urethane-based, polyester-based, silicone resin-based, vinyl acetate-based, styrene butadiene rubber-based, nitrile rubber-based, phenolic resin-based, cyanoacrylate-based, and the like. For reasons of ease of production and cost, urethane-based, polyester-based, and vinyl acetate-based adhesives are preferred.
  • the composite sheet can be laminated on the non-magnetic resin layer or the non-magnetic metal layer in the form of a film or fiber.
  • the composite sheet can be obtained by applying a mixed composition of an uncured magnetic metal material and a resin to a resin substrate having a release layer, curing the mixture, and then peeling the mixture from the resin substrate.
  • the composite sheet may be formed by applying a mixed composition of an uncured magnetic metal material and a resin to the surface of the non-magnetic resin layer, the surface of the non-magnetic metal layer, or a treatment film described later, and then curing the mixture.
  • the mass ratio of the resin to the magnetic metal material in the composite sheet is, for example, 70:30 to 1:99.
  • the composite sheet may further contain conductive particles and conductive fibers other than the magnetic metal material as long as they do not impair the present invention. Examples of the conductive particles and conductive fibers are the same as those in the non-magnetic resin layer described above.
  • the ferromagnetic layer is in the form of a metal foil
  • the ferromagnetic layer contains at least one selected from nickel, iron, permalloy (Ni-Fe alloy) and sendust (Fe-Si-Al alloy). These materials have a relatively high relative permeability, making it possible to collect magnetic flux components contained in noise and reduce the spatial magnetic field.
  • the rupture elongation in the RD direction of the ferromagnetic layer is preferably 5% or more, and more preferably 10% or more.
  • the rupture elongation in the RD direction is typically 100% or less, and more typically 70% or less.
  • the rupture elongation in the TD direction of the ferromagnetic layer is preferably 5% or more, more preferably 10% or more.
  • the rupture elongation in the TD direction is typically 100% or less, more typically 70% or less.
  • the method for measuring the breaking elongation in each direction is the same as the method for measuring the breaking elongation in each direction of the laminate described above.
  • the thickness of the ferromagnetic layers is not particularly limited, but from the viewpoint of electromagnetic wave shielding properties, the total thickness of the ferromagnetic layers is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, even more preferably 25 ⁇ m or more, and even more preferably 30 ⁇ m or more. However, from the viewpoint of cost reduction, the total thickness of the ferromagnetic layers is preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, and even more preferably 200 ⁇ m or less.
  • the thickness of each ferromagnetic layer is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 20 ⁇ m or more, even more preferably 25 ⁇ m or more, even more preferably 30 ⁇ m or more, and even more preferably 35 ⁇ m or more.
  • the thickness is 100 ⁇ m or less.
  • the method for measuring the thickness of the ferromagnetic layer is the same as the method for measuring the thickness of the laminate described above.
  • all the ferromagnetic layers when multiple ferromagnetic layers are formed, all the ferromagnetic layers may be made of the same material, or different materials may be used for each layer. In addition, all the ferromagnetic layers may have the same thickness, or the thickness may differ for each layer.
  • the non-magnetic metal layer is made of a metal material exhibiting diamagnetic or paramagnetic properties.
  • the material of the non-magnetic metal layer used is not particularly limited, but from the viewpoint of improving the shielding properties against AC magnetic fields and AC electric fields, it is preferable to use a metal material with excellent electrical conductivity.
  • non-magnetic metal layer contains at least one selected from copper, copper alloy, aluminum, and aluminum alloy. These are preferable in practical use.
  • the RD elongation at break in the nonmagnetic metal layer is preferably 2% or more, and more preferably 5% or more, but considering the appropriate rupture elongation, the RD elongation at break is typically 80% or less, and more typically 60% or less.
  • the non-magnetic metal layer preferably has a rupture elongation in the TD direction of 2% or more, more preferably 5% or more, but considering the appropriate rupture elongation, the rupture elongation in the TD direction is typically 80% or less, more typically 60% or less.
  • the method for measuring the breaking elongation in each direction is the same as the method for measuring the breaking elongation in each direction of the laminate described above.
  • the thickness of the nonmagnetic metal layers is not particularly limited, but from the viewpoint of shape retention, the total thickness of the nonmagnetic metal layers is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, even more preferably 25 ⁇ m or more, and even more preferably 30 ⁇ m or more. However, from the viewpoint of cost reduction, the total thickness of the nonmagnetic metal layers is preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, and even more preferably 100 ⁇ m or less.
  • the thickness of each nonmagnetic metal layer is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, and even more preferably 15 ⁇ m or more.
  • the thickness is preferably 200 ⁇ m or less, more preferably 160 ⁇ m or less, and even more preferably 100 ⁇ m or less.
  • the method for measuring the thickness of the nonmagnetic metal layer is the same as the method for measuring the thickness of the laminate described above.
  • all the non-magnetic metal layers may be made of the same material, or different materials may be used for each layer.
  • all the non-magnetic metal layers may have the same thickness, or the thickness may differ for each layer.
  • the treatment film described below is considered to be part of the non-magnetic metal layer.
  • the non-magnetic metal layer is not particularly limited in shape, but may be, for example, a metal foil.
  • copper foil it is preferable to use one with high purity, since it improves shielding properties, and the purity is preferably 99.5% by mass or more, more preferably 99.8% by mass or more.
  • the copper foil rolled copper foil, electrolytic copper foil, metallized copper foil, etc. can be used, but rolled copper foil, which has excellent bending properties and formability, is preferable.
  • alloy elements are added to the copper foil to make a copper alloy foil, the total content of these elements and unavoidable impurities may be less than 0.5% by mass.
  • a treatment film of an alloy containing copper may be further provided on one surface of the nonmagnetic metal layer, or the treatment film may be further provided on both surfaces of the nonmagnetic metal layer.
  • the ferromagnetic layer and the nonmagnetic metal layer are disposed via the treatment film.
  • the treatment film is formed, for example, on the surface of the nonmagnetic metal layer adjacent to the ferromagnetic layer on the ferromagnetic layer side.
  • the treated film is formed on at least one surface of the non-magnetic metal layer, and may further include at least one selected from an electromagnetic wave absorbing auxiliary film, a heat-resistant film, an anti-rust film, and a weather-resistant film, for example, an alloy containing copper.
  • Heat-resistant heat-resistant films include plating films and vapor deposition films containing cobalt and nickel
  • anti-rust films include inorganic plating films such as zinc and chromium
  • vapor deposition films and organic films such as benzotriazole
  • weather-resistant films include organic coating films containing silane coupling agents.
  • the treated film may further include at least one metal selected from cobalt, nickel, zinc, molybdenum, tin, phosphorus, tungsten, chromium, and silicon in addition to copper.
  • the treatment film interposed between the ferromagnetic layer and the non-magnetic metal layer can also increase the adhesion between the ferromagnetic layer and the non-magnetic metal layer.
  • the electromagnetic wave absorbing auxiliary film can be produced by a known method, for example, plating, metal vapor deposition, sputtering, etc. Among them, a method of forming an electromagnetic wave absorbing auxiliary film made of copper, an electromagnetic wave absorbing auxiliary film made of copper and nickel, or an electromagnetic wave absorbing auxiliary film made of copper, cobalt and nickel by plating the surface of a nonmagnetic metal layer will be described below as an example.
  • a particulate film made of copper, a particulate film made of copper and nickel, or a particulate film made of copper, cobalt and nickel is formed on at least one surface of the nonmagnetic metal layer.
  • Copper Plating Copper Plating
  • Liquid composition Copper 10-23g/L, sulfuric acid 45-110g/L
  • Liquid temperature 20-55°C
  • Current density 10 to 60
  • Coulomb amount 5 to 30 As/ dm2
  • Copper and Nickel Alloy Plating An example of the copper and nickel plating conditions is as follows. Liquid composition: Copper 10-20g/L, Nickel 5-15g/L pH: 2-3 Liquid temperature: 30-50°C Current density: 10 to 65 A/ dm2 Coulomb amount: 10 to 50 As/ dm2
  • An example of the plating conditions for copper, cobalt and nickel is as follows. Liquid composition: Copper 10-20g/L, Cobalt 5-15g/L, Nickel 5-15g/L pH: 2-3 Liquid temperature: 30-50°C Current density: 10 to 65 A/ dm2 Coulomb amount: 10 to 48 As/ dm2
  • the roughening plating process can be carried out in multiple stages under the above plating conditions 1 to 3.
  • At least one of the following heat-resistant films 1 to 8 can be formed on top of the electromagnetic wave absorbing auxiliary film described above.
  • the plating and deposition conditions for each film are shown below.
  • a nickel-chromium alloy vapor deposition film is formed using a sputtering target having a composition of 65 to 85 mass % nickel and 15 to 35 mass % chromium.
  • Target Nickel 65-85 mass%, Chromium 15-35 mass%
  • Equipment Sputtering equipment manufactured by ULVAC, Inc.
  • Output DC 50 W Argon pressure: 0.2 Pa
  • the following rust-proofing film and/or weather-resistant film can be formed on top of the electromagnetic wave absorbing auxiliary film or heat-resistant film described above. The conditions for each are shown below.
  • Liquid composition Potassium dichromate 1-10g/L, zinc 0.2-0.5g/L pH: 3-4 Liquid temperature: 50-70°C Current density: 0 to 2 A/dm2 (0 A/ dm2 is for immersion chromate treatment) Coulomb amount: 0 to 2 As/dm2 (0 As/ dm2 is for immersion chromate treatment)
  • aqueous solution of diaminosilane or epoxysilane can be applied.
  • a metal film such as a heat-resistant film or a plating film is formed by vapor deposition (dry plating) such as sputtering
  • a metal film such as a heat-resistant film or a plating film is formed by plating (wet plating) and the metal film such as a heat-resistant film or a plating film is normal plating (smooth plating, i.e., plating performed at a current density less than the limiting current density)
  • the metal film or plating film does not affect the surface shape of the non-magnetic metal layer.
  • the limiting current density varies depending on the metal concentration, pH, solution supply rate, electrode distance and plating solution temperature, but in the present invention, the limiting current density is defined as the current density at the boundary between normal plating (a state in which the plated metal is deposited in the form of a film) and roughened plating (burnt plating, a state in which the plated metal is deposited in the form of crystals (spherical, needle-like or frost-like, etc.), with unevenness), and the limiting current density is the current density (visual judgment) at the limit at which normal plating is obtained in a Hull cell test (just before burnt plating occurs).
  • the metal concentration, pH, and plating solution temperature are set as the plating production conditions, and a Hull Cell test is performed. Then, the state of metal layer formation (whether the plated metal is deposited in a layer or formed in a crystal form) at the plating solution composition and plating solution temperature is investigated. Then, based on a current density chart made by Yamamoto Plating Tester Co., Ltd., the current density at the boundary between normal plating and rough plating is obtained from the position of the test piece where the boundary exists. Then, the current density at the boundary is defined as the limiting current density. This allows the limiting current density at the plating solution composition and plating solution temperature to be determined. In general, the limiting current density tends to be higher when the electrode distance is shorter.
  • the method of the Hull Cell test is described, for example, in "Plating Practice Reader” by Kiyoshi Maruyama, published by Nikkan Kogyo Shimbun on June 30, 1983, pages 157 to 160.
  • the current density during the plating process is preferably 20 A/dm2 or less, more preferably 10 A/ dm2 or less, and even more preferably 8 A/ dm2 or less.
  • the anticorrosive film and weather-resistant film are extremely thin, they do not affect the surface shape of the nonmagnetic metal layer.
  • the magnetic shielding characteristic (how much the signal is attenuated on the receiving side) at 0.1 MHz can be 1 dB or more, preferably 5 dB or more, more preferably 10 dB or more, even more preferably 15 dB or more, and even more preferably 18 dB or more.
  • the magnetic shielding characteristic is measured by the KEC method.
  • the KEC method refers to the "electromagnetic shielding characteristic measurement method" of the Kansai Electronics Industry Development Center.
  • the composition can be used for various electromagnetic shielding applications, such as covering or exterior materials for electric and electronic devices (e.g., inverters, communication devices, resonators, electron tubes and discharge lamps, electric heating devices, electric motors, generators, electronic components, printed circuits, medical devices, etc.), covering materials for harnesses and communication cables connected to electric and electronic devices, electromagnetic shielding sheets, electromagnetic shielding panels, electromagnetic shielding bags, electromagnetic shielding boxes, and electromagnetic shielding rooms.
  • electric and electronic devices e.g., inverters, communication devices, resonators, electron tubes and discharge lamps, electric heating devices, electric motors, generators, electronic components, printed circuits, medical devices, etc.
  • covering materials for harnesses and communication cables connected to electric and electronic devices electromagnetic shielding sheets, electromagnetic shielding panels, electromagnetic shielding bags, electromagnetic shielding boxes, and electromagnetic shielding rooms.
  • Resin layer 1 PET film (thickness 98 to 103 ⁇ m, EMBLET SD100, manufactured by Unitika)
  • Resin layer 2 Teflon (registered trademark) sheet (thickness 99 ⁇ m, Nitoflon, manufactured by Nitto Denko)
  • Adhesive layer 1 Adhesive (thickness 18 ⁇ m, RU-80, manufactured by Rock Paint)
  • Resin layer 3 Teflon (registered trademark) sheet (thickness 99 ⁇ m, Nitoflon, manufactured by Nitto Denko) having an adhesive (thickness 18 ⁇ m, RU-80, manufactured by Rock Paint) on one surface.
  • Metal layer 1 rolled copper foil (thickness 17.5 ⁇ m (nominal value), manufactured by JX Metals)
  • Metal layer 2 rolled copper foil (thickness 18 ⁇ m (nominal value), manufactured by JX Metals)
  • Magnetic layer 1 Composite sheet (thickness 90-96 ⁇ m, GM010S, Takeuchi Kogyo Co., Ltd., relative permeability at a frequency of 1 MHz is approximately 24 (from the catalog table))
  • Magnetic layer 2 Composite sheet (thickness 43-48 ⁇ m, P100NH, Takeuchi Kogyo Co., Ltd., relative permeability at a frequency of 1 MHz is approximately 130 (from the catalog table))
  • molded bodies were produced at room temperature (approximately 22 to 26° C.) according to the following procedure. (1) Each material was clamped between the die and holder of the processing machine shown in FIG. 1(A). (2) As shown in Fig. 1(B), the punch was moved vertically downward along the die and holder and pushed into the die hole. The clearance between the die and punch was set to 0.5 mm. The punch movement distance at which no cracks were generated on the surface of the compact when each material was molded was defined as the moldable stroke shown in Table 1.
  • the stroke started from 3 mm, and the movement amount was increased by 1 mm each time the compact was molded and the appearance of the compact was confirmed.
  • the moldable stroke was 0 when the compact molded at 3 mm caused material fracture.
  • the punch was moved vertically upward and returned to its original position, thereby obtaining a compact having a bottomed shape.
  • the molded height of the obtained molded body was measured on the day after molding (after 12 hours or more had passed) using a confocal microscope (ONE-SHOT 3D VR-5000, manufactured by Keyence) under room temperature (approximately 22 to 26°C) to measure the shortest distance in the vertical direction from the height position of the surface on the holder side of the molded body clamped between the die and the holder to the height position of the inner surface of the bottom.
  • the ratio (B/A) of the "molded height of the molded article (B)" to the "moldable stroke (A)" was calculated.
  • the shielding properties of each material in Reference Examples 1 to 8 were measured. First, the outer periphery of each material was fixed with tape to prevent misalignment during measurement. Each material was evaluated for magnetic field shielding properties at a frequency of 0.1 MHz by the KEC method under room temperature (approximately 22 to 26° C.) conditions using a magnetic field measuring tool of a KEC method shielding effect measuring device (manufactured by Techno Science, JSE-KEC), a network analyzer (manufactured by Keysight Technologies, E5080), and an amplifier (manufactured by Anritsu, MH648A). The results are shown in Table 1.
  • Laminate 1 Magnetic shield sheet (thickness 120 ⁇ m, FM SHIELD (registered trademark), manufactured by Hitachi Metals) According to the catalog, the laminate 1 is laminated in the following order: resin layer (PET film (thickness 25 ⁇ m))/adhesive (hot melt adhesive (thickness 25 ⁇ m))/magnetic layer 3 (thickness 18 ⁇ m, Finemet (registered trademark), Hitachi Metals, relative permeability at a frequency of 1 MHz is approximately 5000 (according to the table in the catalog))/adhesive (hot melt adhesive (thickness 25 ⁇ m))/resin layer (PET film (thickness 25 ⁇ m)).
  • the laminate 1 has a configuration of non-magnetic resin layer/ferromagnetic layer/non-magnetic resin layer.
  • the materials in Reference Examples 1 to 8 and the adhesive layer 2 shown below were appropriately combined to prepare electromagnetic wave shielding materials.
  • the values of shape retention, breaking elongation, shielding properties, and anisotropy at break were measured in the same manner as in the Reference Examples. The results are shown in Table 2. The areas of the bonding surfaces of the resin layer 1, the metal layers 1 to 2, and the magnetic layers 1 to 2 were made the same, and they were laminated so as not to protrude from each other.
  • an adhesive two-liquid urethane resin adhesive, base: RU80, hardener: H-5, manufactured by Rock Paint
  • one resin layer is composed of a laminate of a PET film and an adhesive layer.
  • the resin layer 1 or the metal layer 1 or the metal layer 2 was bonded to the outer surface of the adhesive layer already formed on the magnetic layers 1 to 2.
  • the adhesive layer 2 is as follows. Adhesive layer 2: Adhesive (thickness 4.5 ⁇ m, RU-80, manufactured by Rock Paint)
  • Examples 1 to 13 (Consideration of Examples and Comparative Examples) In Examples 1 to 13, the shape retention was excellent and the shielding properties were also good. Therefore, in Examples 1 to 13, it can be said that an electromagnetic wave shielding material including a laminate having a nonmagnetic resin layer and a nonmagnetic metal layer and/or a ferromagnetic layer, in which the value of the anisotropy at break (Rc) represented by the above formula (1) is 0 or less or 1 or more, is useful.
  • metals other than copper can be used as the nonmagnetic metal layer. However, since aluminum has a lower tensile strength than copper and is more easily deformed, it is assumed that the effect of improving formability by laminating the layers can be obtained in a similar manner.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
PCT/JP2023/038081 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 Ceased WO2024101119A1 (ja)

Priority Applications (5)

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EP23888470.4A EP4618709A4 (en) 2022-11-08 2023-10-20 ELECTROMAGNETIC SHIELDING MATERIAL, COATING MATERIAL OR EXTERIOR MATERIAL, AND ELECTRICAL/ELECTRONIC DEVICE
KR1020257000631A KR20250022789A (ko) 2022-11-08 2023-10-20 전자파 차폐 재료, 피복재 또는 외장재 및 전기·전자 기기
US19/101,119 US20260075786A1 (en) 2022-11-08 2023-10-20 Electromagnetic Wave Shielding Material, Covering Material or Exterior Material, and Electric/Electronic Apparatus
JP2024557281A JP7751750B2 (ja) 2022-11-08 2023-10-20 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器
CN202380050518.3A CN119605322A (zh) 2022-11-08 2023-10-20 电磁波屏蔽材料、覆盖材料或外装材料以及电气设备或电子设备

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JP2018171741A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法
JP2021028940A (ja) 2019-08-09 2021-02-25 東洋インキＳｃホールディングス株式会社 ノイズ抑制シートおよび積層体

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EP0692840A1 (en) * 1994-07-11 1996-01-17 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JP2993889B2 (ja) * 1996-08-12 1999-12-27 平岡織染株式会社 電磁波シールド性積層シート
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
JP6341948B2 (ja) * 2016-03-31 2018-06-13 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材
JP6461414B1 (ja) * 2018-08-02 2019-01-30 清二 加川 電磁波吸収複合シート
JP7391356B2 (ja) * 2019-09-04 2023-12-05 兵庫県公立大学法人 多層材及びその製造方法、多層材メッキ方法
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JP2018171741A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法
JP2021028940A (ja) 2019-08-09 2021-02-25 東洋インキＳｃホールディングス株式会社 ノイズ抑制シートおよび積層体

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See also references of EP4618709A1

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EP4618709A1 (en) 2025-09-17
KR20250022789A (ko) 2025-02-17
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EP4618709A4 (en) 2026-03-04
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