TW202007527A - 電磁波吸收複合薄片 - Google Patents

電磁波吸收複合薄片 Download PDF

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TW202007527A
TW202007527A TW108119124A TW108119124A TW202007527A TW 202007527 A TW202007527 A TW 202007527A TW 108119124 A TW108119124 A TW 108119124A TW 108119124 A TW108119124 A TW 108119124A TW 202007527 A TW202007527 A TW 202007527A
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Taiwan
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electromagnetic wave
film
magnetic
composite sheet
absorption
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TW108119124A
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English (en)
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加川清二
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加川清二
加川敦子
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Publication of TW202007527A publication Critical patent/TW202007527A/zh

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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/048—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/048—Natural or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/72—Density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties

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Abstract

一種電磁波吸收複合薄片，其由磁性電磁波吸收膜與電磁波屏蔽膜所構成，該電磁波屏蔽膜積層於前述磁性電磁波吸收膜之上；前述磁性電磁波吸收膜包含均勻地分散於黏合劑樹脂中的磁性粉；前述電磁波屏蔽膜為導電性金屬的箔、具有導電性金屬的薄膜或塗膜之塑膠膜、或碳薄片；並且，前述電磁波屏蔽膜相對於前述磁性電磁波吸收膜的面積率為10～80%。

Description

電磁波吸收複合薄片
本發明關於一種電磁波吸收複合薄片，其對於希望的頻率帶的電磁波雜訊具有高吸收能力，並且能夠使得電磁波雜訊吸收能力極大化的頻率帶偏移。
自電動機器和電子機器不僅會放射出電磁波雜訊，也會有周圍的電磁波雜訊侵入而在訊號中混入雜訊。為了防止電磁波雜訊的放射和侵入，先前所進行的方式是藉由金屬薄片來屏蔽電動機器和電子機器。又，亦提案有一種在電動機器和電子機器內設置磁性電磁波吸收膜來吸收電磁波雜訊的技術。
例如，日本特開2013-42026號公報中，揭示有一種電磁波吸收性熱傳導薄片，其被配置於電子機器內部的高頻訊號傳送部的附近，且其中在可撓性樹脂材料中含有第一磁性金屬粒子與第二磁性金屬粒子，該第二磁性金屬粒子的平均粒徑和電阻率小於第一磁性金屬粒子。該電磁波吸收性熱傳導薄片對於寬廣頻率的電磁波雜訊具有高吸收能力，但不具有對特定頻率的電磁波雜訊發揮特別大吸收能力的功能，也不具有使得電磁波雜訊吸收能力極大化的頻率帶偏移的功能。 (發明的目的) 因此，本發明的目的是要提供一種電磁波吸收複合薄片，其對於希望的頻率帶的電磁波雜訊具有高吸收能力，並且能夠使得電磁波雜訊吸收能力極大化的頻率帶偏移。
鑑於上述目的而精心研究的結果，本發明人發現到，藉由將電磁波屏蔽膜積層於磁性電磁波吸收膜上，該磁性電磁波吸收膜包含均勻地分散於黏合劑樹脂中的磁性粉，並且將前述電磁波屏蔽膜相對於前述磁性電磁波吸收膜的面積率設定為10～80%，便可得到對於希望的頻率帶的電磁波雜訊具有高吸收能力的電磁波吸收複合薄片，而想到了本發明。
亦即，本發明的電磁波吸收複合薄片，其特徵在於：由磁性電磁波吸收膜與電磁波屏蔽膜所構成，該電磁波屏蔽膜積層於該磁性電磁波吸收膜之上；前述磁性電磁波吸收膜包含均勻地分散於黏合劑樹脂中的磁性粉；並且，前述電磁波屏蔽膜相對於磁性電磁波吸收膜的面積率為10～80%。
前述電磁波屏蔽膜相對於磁性電磁波吸收膜的面積率較佳為20～80%，更佳為30～70%，最佳為40～60%。
前述電磁波屏蔽膜，較佳為導電性金屬的箔、具有導電性金屬的薄膜或塗膜之塑膠膜、或碳薄片。
前述電磁波屏蔽膜中的前述導導電性金屬，較佳為選自由鋁、銅、銀、錫、鎳、鈷、鉻及該等的合金所組成之群組中的至少一種。
前述磁性電磁波吸收膜和前述電磁波屏蔽膜較佳為均為長方形或正方形。
參照附隨圖式來詳細說明本發明的實施型態，若未特別註明，則關於一個實施型態的說明亦適用於其他實施型態。又，以下說明並不具有限定性，在本發明的技術性思想的範圍內可進行各種變更。
第1(a)圖表示構成本發明的電磁波吸收複合薄片10的磁性電磁波吸收膜1、及積層於磁性電磁波吸收膜1上的電磁波屏蔽膜2，第1(b)圖表示由磁性電磁波吸收膜1與電磁波屏蔽膜2所構成之本發明的電磁波吸收複合薄片10的一例。
[1] 磁性電磁波吸收膜 如第2圖所示，磁性電磁波吸收膜1，包含均勻地分散於黏合劑樹脂12中的磁性粉11。
(1) 磁性粉 磁性粉11，是軟磁性金屬粉末或是軟磁性鐵氧體粉末。
作為軟磁性金屬，可舉出：高導磁合金(Fe-Ni合金)、超級導磁合金(Fe-Ni-Mo合金)、鐵矽鋁合金(Fe-Si-Al合金)、Fe-Si合金、Fe-Co合金、Fe-Cr合金、Fe-Cr-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Ni-Cr-Si合金、Fe-Si-Al-Ni-Cr合金、Fe系非晶質合金、Co系非晶質合金等。
較磁性金屬粉較佳為扁平狀。扁平狀軟磁性金屬粉的縱橫比較佳為10～100，更佳為10～50。扁平狀軟磁性金屬粉的平均粒徑(面方向)較佳為30～100μm，更佳為50～90μm。又，扁平狀軟磁性金屬粉的平均厚度較佳為0.1～1μm。
作為軟磁性鐵氧體，可舉出：Ni-Zn系鐵氧體、Cu-Zn系鐵氧體、Mn-Zn系鐵氧體等。軟磁性鐵氧體粉的平均粒徑較佳為0.1～30μm。
(2)黏合劑樹脂 作為具有優異可撓性的黏合劑樹脂12，可舉出：聚乙烯、聚丙烯等的聚烯烴、聚對苯二甲酸乙二酯等的聚酯、聚苯乙烯、聚氯乙烯、丙烯酸樹脂、聚氨酯、聚碳酸酯、聚醯胺、聚醯亞胺、矽樹脂、合成橡膠、天然橡膠等。
(3)磁性粉的含量 磁性電磁波吸收膜1中的磁性粉11的含量，較佳為30體積%以上，更佳為30～60體積%。
(4)磁性電磁波吸收膜的厚度 磁性電磁波吸收膜1的厚度較佳為0.05～2mm，更佳為0.1～1mm。若磁性電磁波吸收膜的厚度未滿0.05mm，則無法充分獲得由磁性粉所產生的電磁波吸收能力，又若超過2mm，則電磁波吸收複合薄片整體會變得太厚。
[2]電磁波屏蔽膜 為了將透射過磁性電磁波吸收膜1的電磁波雜訊加以反射並使其再次進入磁性電磁波吸收膜1，電磁波屏蔽膜2必須具有反射電磁波雜訊的功能。為了有效地發揮這樣的功能，電磁波屏蔽膜2較佳為導電性金屬的箔、具有導電性金屬的薄膜或塗膜之塑膠膜、或碳薄片。磁性電磁性吸收膜1與電磁波屏蔽膜2的積層，較佳為隔著非導電性黏著劑來進行。黏著劑可為習知的黏著劑。
(1)導電性金屬的箔 前述導電性金屬較佳為選自由鋁、銅、銀、錫、鎳、鈷、鉻及該等的合金所組成之群組中的至少一種。導電性金屬的箔較佳為具有5～50μm的厚度。
(2)導電性金屬的薄膜或塗膜 前述導電性金屬的薄膜較佳為前述導電性金屬的蒸鍍膜。金屬蒸鍍膜的厚度有數十nm～數十μm即可。對於形成有前述導電性金屬的蒸鍍膜之塑膠膜，用來形成該塑膠膜的樹脂只要具有絕緣性以及足夠的強度、可撓性和加工性，則並未特別限制，例如可舉出：聚酯(聚對苯二甲酸乙二酯等)、聚芳硫醚(聚苯硫醚等)、聚醯胺、聚醯亞胺、聚醯胺-醯亞胺、聚醚碸、聚醚醚酮、聚碳酸酯、丙烯酸樹脂、聚苯乙烯、聚烯烴(聚乙烯、聚丙烯等)等。自強度和成本的觀點來看，較佳為聚對苯二甲酸乙二酯(PET)。塑膠膜的厚度可為8～30μm程度。
(3)導電性金屬的塗膜 前述導電性金屬的塗膜，能夠藉由以下方法來形成：將墨(糊料)塗佈於塑膠膜上並使其乾燥後，再根據需要進行紫外線照射，其中該墨是使銀粉等的導電性金屬粉高度分散於熱可塑樹脂或光硬化性樹脂中而成。導電性墨(糊料)可為習知的墨，例如能夠使用日本特開2016-14111號公報的光硬化型導電性墨組成物，其含有導電性填料、光聚合起始劑及高分子分散劑，該導電性填料的比例為70～90質量%，導電性填料的50質量%以上為鱗片狀、箔狀或薄片狀且D50 的粒徑為0.3～3.0μm的銀粉。形成有前述導電性金屬的塗膜之塑膠膜，可與形成有導電性金屬的薄膜之塑膠膜相同。
(4)碳薄片 作為電磁波屏蔽膜來使用的碳薄片，有市售的PGS(登錄商標)石墨薄片(Panasonic(松下電器)股份有限公司)、由石墨粉末與碳黑所構成之碳薄片(散熱薄片)等，其中該PGS是將聚醯亞胺膜在惰性氣體中施加超高溫加熱處理而形成。
作為石墨粉末/碳黑的碳薄片，能夠使用日本特開2015-170660號公報的散熱薄片，其具有碳黑均勻地分散於石墨微粒間之結構，石墨微粒/碳黑的質量比為75/25～95/5，具有1.9g/cm3 以上的密度，且在面內方向具有570W/mK以上的熱傳導率。石墨微粒較佳為具有5～100μm的平均徑和200nm以上的平均厚度。該散熱薄片較佳為具有25～250μm的厚度。
該散熱薄片，能夠藉由以下方法來形成：(1)調配有機溶劑分散液，其中含有合計5～25質量%的石墨微粒和碳黑、及0.05～2.5質量%的黏合劑樹脂，並且前述石墨微粒與前述碳黑的質量比為75/25～95/5；(2)反覆進行複數次將前述分散液塗佈於支持板的一面上後再使其乾燥的步驟，藉此形成由前述石墨微粒、前述碳黑及前述黏合劑樹脂所構成之含樹脂複合薄片；(3)對前述含樹脂複合薄片進行煅燒，藉此除去前述黏合劑樹脂；(4)對已得到的石墨微粒/碳黑複合薄片進行壓製(pressing)，藉此使其緻密化。
[3]磁性電磁波吸收膜與電磁波屏蔽膜的配置 (1)面積比 電磁波屏蔽膜2相對於磁性電磁波吸收膜1的面積率為10～80%。若面積率未滿10%或是超過80%，則無法使得對於希望的頻率帶的電磁波雜訊的吸收能力充分達到極大化。這是無法預期的結果，因此電磁波屏蔽膜2相對於磁性電磁波吸收膜1的面積率為10～80%是本發明的重要特徵。面積率的下限較佳為20%，更佳為30%，進一步更佳為40%，最佳為45%。又，面積率的上限較佳為70%，更佳為65%，最佳為60%。電磁波屏蔽膜2相對於磁性電磁波吸收膜1的面積率的範圍，例如較佳為20～80%，更佳為30～70%，進一步更佳為40～65%，最佳為45～60%。
(2)位置 較佳為使電磁波屏蔽膜2的中心位於磁性電磁波吸收膜1的中心，但為了要改變電磁波吸收能力的峰值頻率，亦可使兩者的中心偏離。關於電磁波屏蔽膜2的位置偏離，有如第3(a)圖所示將電磁波屏蔽膜2相對於磁性電磁波吸收膜1朝一個方向偏離的情況、及如第3(b)圖所示以使電磁波屏蔽膜2的四邊自磁性電磁波吸收膜1的四邊向內側分離的方式，來縮小電磁波屏蔽膜2的尺寸的情況。在任一情況中均會對電磁波吸收能力的峰值頻率造成影響，因此較佳為：對應於要使電磁波吸收能力極大化的頻率帶，來適當設定電磁波屏蔽膜2的偏離方式和尺寸。此外，在第3(a)圖的情況和第3(b)圖的情況的任一者中，電磁波屏蔽膜2相對於磁性電磁波吸收膜1的面積率均須滿足上述條件。
藉由以下實施例來更詳細說明本發明，但本發明不限定於該等實施例。
(實施例1) 自市售的雜訊吸收薄片(股份有限公司WIDE WORK的「雜訊阻擋片 10S」，WW-GM10-S，厚度1mm)切割出50mm×50mm的磁性電磁波吸收膜片1，並隔著非導電性黏著劑分別將L(10mm、20mm、25mm、30mm、40mm、50mm)×50mm的鋁箔片(厚度：15μm)積層於各磁性電磁波吸收膜片1上，而製作出樣本1～6。各樣本中，鋁箔片2的中心與磁性電磁波吸收膜片1的中心一致。
如第4(a)圖和第4(b)圖所示，使用由50Ω的微帶線MSL(64.4mm×4.4mm)、支持微帶線MSL之絕緣基板300、接合於絕緣基板300的下表面上之接地電極301、連接於微帶線MSL的兩端之導電性針腳302、302、網路分析儀NA、將網路分析儀NA連接至導電性針腳302、302之同軸纜線303、303所構成之系統，如第5圖所示，以使各樣本的中心與微帶線MSL的中心一致的方式，藉由黏著劑將各樣本貼附於絕緣基板300的上表面，並測量相對於0.1～6GHz的入射波之反射波的電力S11 和透射波的電力S12 。
藉由自入射進第4(a)圖和第4(b)圖所示的系統的電力Pin 減去反射波的電力S11 和透射波的電力S12 ，求出電力損耗Ploss ，並將Ploss 除以入射電力Pin 以求出雜訊吸收率Ploss /Pin 。結果表示於第6圖～第11圖和表1。
[表1]
Figure 108119124-A0304-0001
 註：(1) 鋁箔片相對於磁性電磁波吸收膜片的面積率。 具有*印的樣本是比較例。
在磁性電磁波吸收膜片上積層了同樣尺寸鋁箔片之樣本6中，最大雜訊吸收率Ploss /Pin 局部性地較高，但以整個頻率帶來看則雜訊吸收率Ploss /Pin 較低。相對於此，在磁性電磁波吸收膜片上積層了面積率20～80%的鋁箔片之樣本1～5中，最大雜訊吸收率Ploss /Pin 高達0.92～1.00，且此時的頻率在3GHz附近。因此可知，若要在3GHz附近的頻率帶中將雜訊吸收率Ploss /Pin 最大化，應該要將鋁箔片(電磁波屏蔽膜)相對於磁性電磁波吸收膜片的面積率設在10～80%的範圍內，且較佳為設在20～80%的範圍內。
(實施例2) 隔著非導電性黏著劑，將25mm×50mm的鋁箔片(厚度：15μm)積層於在實施例1中所使用的50mm×50mm的磁性電磁波吸收膜片上，製作出樣本11～15，此時如第3圖(a)所示，使磁性電磁波吸收膜片的一邊X1 與鋁箔片的一邊X2 (與X1 平行)間的距離D成為0mm、5mm、10mm、15mm、20mm。將各樣本如第5圖所示載置於絕緣基板300上的微帶線MSL上，並測量0.1～6GHz中的雜訊吸收率Ploss /Pin 。結果表示於第12圖～第16圖。又，求出各樣本的距離D、2GHz中的雜訊吸收率Ploss /Pin 、以及最大雜訊吸收率Ploss /Pin 和此時的頻率。結果表示於表2。
[表2]
Figure 108119124-A0304-0002
 註：(1)D表示磁性電磁波吸收膜片的一邊X1 與鋁箔片的一邊X2 間的距離。
根據第12圖～第16圖和表2可明顯看出，若鋁箔片相對於磁性電磁波吸收膜片有所偏離，則2GHz中的Ploss /Pin 和最大Ploss /Pin 會大幅變化。因此可知，若要將希望的頻率帶中的雜訊吸收率Ploss /Pin 極大化，只要使鋁箔片的中心自磁性電磁波吸收膜片的中心偏離即可。
(實施例3) 如第17圖所示，將面積率50%的正方形鋁箔片和面積率50%的正方形框形鋁箔片，分別以中心一致的方式積層於與實施例1相同的50mm×50mm的磁性電磁波吸收膜片上，製作出樣本21和22。測量各樣本的雜訊吸收率Ploss /Pin 。測量結果表示於第18(a)圖和第18(b)圖。
根據第18(a)圖、第18(b)圖可明顯看出，積層了面積率50%的正方形鋁箔片之樣本21，相較於積層了面積率同為50%但為正方形框形鋁箔片之樣本22，表示出更為顯著良好的雜訊吸收率Ploss /Pin 。因此可知，鋁箔片較佳為位於磁性電磁波吸收膜片的中央部。
(實施例4) 以與亞馬遜的Fire Stick TV的IC晶片相同大小的正方形，製作出具有與實施例1相同構成之電磁波吸收複合薄片。長方形鋁箔片相對於磁性電磁波吸收膜片的面積率為50%。又，鋁箔片的一方的對向邊與磁性電磁波吸收膜片的一方的對向邊一致，且積層上去的鋁箔片的中心與磁性電磁波吸收膜片的中心一致。亦即，實施例4的電磁波吸收複合薄片，具有第1(b)圖所示的形狀。
拆下Fire Stick TV的蓋子，將實施例4的電磁波吸收複合薄片配置於Fire Stick TV的IC晶片上，利用量測技術研究所股份有限公司的頻譜分析儀VSA6G2A來量測自Fire Stick TV洩漏出的電磁波雜訊。結果表示於第19(a)圖。又，針對不將實施例4的電磁波吸收複合薄片配置於已拆下蓋子的Fire Stick TV的IC晶片上的情況，量測自Fire Stick TV洩漏出的電磁波雜訊。結果表示於第19(b)圖。根據第19(a)圖和第19(b)圖可明顯看出，藉由將本發明的電磁波吸收複合薄片配置於IC晶片上，相較於未配置電磁波吸收複合薄片的情況，使得自Fire Stick TV洩漏出的頻率3GHz附近的電磁波雜訊顯著減少。
上述實施例中，是使用一種對磁性電磁波吸收膜積層了鋁箔來作為電磁波屏蔽膜之電磁波吸收複合薄片，但本發明不限定於該等電磁波吸收複合薄片，而在本發明的範圍內可作各種變更。除了鋁箔以外，銅箔或是分散有鋁、銅、銀等的粉末之導電性墨的塗膜等，也同樣可用來作為電磁波屏蔽膜。
(發明的功效) 具有上述構成之本發明的電磁波吸收複合薄片，具有優異的電磁波吸收能力，並且藉由將電磁波屏蔽膜相對於磁性電磁波吸收膜的面積率在10～80%的範圍內進行變更，能夠將對於希望的頻率帶的電磁波雜訊的吸收能力最大化。這樣的電磁波吸收複合薄片，能夠藉由使用於會發出特定頻率的電磁波雜訊的電子機器或電子零件，而有效地吸收該電磁波雜訊。
1‧‧‧磁性電磁波吸收膜(磁性電磁波吸收膜片) 2‧‧‧電磁波屏蔽膜 10‧‧‧電磁波吸收複合薄片 11‧‧‧磁性粉 12‧‧‧黏合劑樹脂 300‧‧‧絕緣基板 301‧‧‧接地電極 302‧‧‧導電性針腳 303‧‧‧同軸纜線 D‧‧‧磁性電磁波吸收膜片的一邊X1與鋁箔片(電磁波屏蔽膜)的一邊X2間的距離 MSL‧‧‧微帶線 NA‧‧‧網路分析儀
第1(a)圖是表示本發明的電磁波吸收複合薄片的一例的分解平面圖。 第1(b)圖是表示本發明的電磁波吸收複合薄片的一例的平面圖。 第2圖是表示構成本發明的電磁波吸收複合薄片的磁性電磁波吸收膜的一例的剖面圖。 第3(a)圖是表示本發明的電磁波吸收複合薄片的另一例的平面圖。 第3(b)圖是表示本發明的電磁波吸收複合薄片的又一例的平面圖。 第4(a)圖是表示用來測量相對於入射波之反射波電力和透射波電力之系統的部分平面圖。 第4(b)圖是表示第4(a)圖的系統的剖面圖。 第5圖是表示配置於微帶線MSL上的樣本的一例的平面圖。 第6圖是表示電磁波吸收複合薄片的樣本1(鋁箔片的面積率=20%)的雜訊吸收率Ploss /Pin 的圖表。 第7圖是表示電磁波吸收複合薄片的樣本2(鋁箔片的面積率=40%)的雜訊吸收率Ploss /Pin 的圖表。 第8圖是表示電磁波吸收複合薄片的樣本3(鋁箔片的面積率=50%)的雜訊吸收率Ploss /Pin 的圖表。 第9圖是表示電磁波吸收複合薄片的樣本4(鋁箔片的面積率=60%)的雜訊吸收率Ploss /Pin 的圖表。 第10圖是表示電磁波吸收複合薄片的樣本5(鋁箔片的面積率=80%)的雜訊吸收率Ploss /Pin 的圖表。 第11圖是表示電磁波吸收複合薄片的樣本6(鋁箔片的面積率=100%)的雜訊吸收率Ploss /Pin 的圖表。 第12圖是表示電磁波吸收複合薄片的樣本11(D=0mm)的雜訊吸收率Ploss /Pin 的圖表。 第13圖是表示電磁波吸收複合薄片的樣本12(D=5mm)的雜訊吸收率Ploss /Pin 的圖表。 第14圖是表示電磁波吸收複合薄片的樣本13(D=10mm)的雜訊吸收率Ploss /Pin 的圖表。 第15圖是表示電磁波吸收複合薄片的樣本14(D=15mm)的雜訊吸收率Ploss /Pin 的圖表。 第16圖是表示電磁波吸收複合薄片的樣本15(D=20mm)的雜訊吸收率Ploss /Pin 的圖表。 第17圖是表示電磁波吸收複合薄片的樣本21和22的平面圖。 第18(a)圖是表示電磁波吸收複合薄片的樣本21的雜訊吸收率Ploss /Pin 的圖表，該樣本21是在磁性電磁波吸收膜片的中央部積層正方形的鋁箔片而成。 第18(b)圖是表示電磁波吸收複合薄片的樣本22的雜訊吸收率Ploss /Pin 的圖表，該樣本22是在磁性電磁波吸收膜片上積層正方形的框形鋁箔片而成。 第19(a)圖是表示當以實施例4的電磁波吸收複合薄片來披覆Fire Stick TV的IC(積體電路)晶片時，自Fire Stick TV洩漏出的電磁波雜訊的圖表。 第19(b)圖是表示未以實施例4的電磁波吸收複合薄片來披覆Fire Stick TV的IC晶片時，自Fire Stick TV洩漏出的電磁波雜訊的圖表。
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無
1‧‧‧磁性電磁波吸收膜(磁性電磁波吸收膜片)
2‧‧‧電磁波屏蔽膜
10‧‧‧電磁波吸收複合薄片

Claims (4)

  1. 一種電磁波吸收複合薄片，其特徵在於： 由磁性電磁波吸收膜與電磁波屏蔽膜所構成，該電磁波屏蔽膜積層於前述磁性電磁波吸收膜之上；前述磁性電磁波吸收膜包含均勻地分散於黏合劑樹脂中的磁性粉；並且，前述電磁波屏蔽膜相對於前述磁性電磁波吸收膜的面積率為10～80%。
  2. 如請求項1所述之電磁波吸收複合薄片，其中，前述電磁波屏蔽膜相對於前述磁性電磁波吸收膜的面積率為20～80%。
  3. 如請求項1所述之電磁波吸收複合薄片，其中，前述電磁波屏蔽膜為導電性金屬的箔、具有導電性金屬的薄膜或塗膜之塑膠膜、或碳薄片。
  4. 如請求項1～3中任一項所述之電磁波吸收複合薄片，其中，前述磁性電磁波吸收膜和前述電磁波屏蔽膜均為長方形或正方形。
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