TWI904352B - 熱硬化性樹脂組成物、乾膜、硬化物、印刷線路板及電氣電子元件 - Google Patents

熱硬化性樹脂組成物、乾膜、硬化物、印刷線路板及電氣電子元件

Info

Publication number
TWI904352B
TWI904352B TW111110827A TW111110827A TWI904352B TW I904352 B TWI904352 B TW I904352B TW 111110827 A TW111110827 A TW 111110827A TW 111110827 A TW111110827 A TW 111110827A TW I904352 B TWI904352 B TW I904352B
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
resin composition
resins
film
mass
Prior art date
Application number
TW111110827A
Other languages
English (en)
Chinese (zh)
Other versions
TW202248360A (zh
Inventor
金沢康代
管衆
中居弘進
仲田和貴
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202248360A publication Critical patent/TW202248360A/zh
Application granted granted Critical
Publication of TWI904352B publication Critical patent/TWI904352B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
TW111110827A 2021-03-24 2022-03-23 熱硬化性樹脂組成物、乾膜、硬化物、印刷線路板及電氣電子元件 TWI904352B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021049808 2021-03-24
JP2021-049808 2021-03-24

Publications (2)

Publication Number Publication Date
TW202248360A TW202248360A (zh) 2022-12-16
TWI904352B true TWI904352B (zh) 2025-11-11

Family

ID=83395130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110827A TWI904352B (zh) 2021-03-24 2022-03-23 熱硬化性樹脂組成物、乾膜、硬化物、印刷線路板及電氣電子元件

Country Status (4)

Country Link
JP (1) JP7417008B2 (https=)
CN (1) CN117120551B (https=)
TW (1) TWI904352B (https=)
WO (1) WO2022202427A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102886060B1 (ko) * 2022-11-22 2025-11-12 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 패키지
JP7552944B1 (ja) 2023-12-27 2024-09-18 ａｒｔｉｅｎｃｅ株式会社 ドライフィルム、その硬化物および、電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201730300A (zh) * 2015-10-28 2017-09-01 味之素股份有限公司 接著薄膜

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JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JPH10178053A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2002146310A (ja) * 2000-08-07 2002-05-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びにフレキシブル印刷回路基板
JP4172179B2 (ja) * 2002-01-30 2008-10-29 日立化成工業株式会社 熱硬化性樹脂組成物、接着フィルム、銅張り積層板及びプリント配線板
JP5735029B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP6356458B2 (ja) * 2014-03-31 2018-07-11 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
CN105467752A (zh) * 2014-06-23 2016-04-06 太阳油墨（苏州）有限公司 用于制造印刷电路板的光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
JP6268310B2 (ja) * 2015-01-21 2018-01-24 太陽インキ製造株式会社 絶縁性熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6724930B2 (ja) * 2015-12-24 2020-07-15 コニカミノルタ株式会社 偏光板保護フィルム、その製造方法及び偏光板
CN110520475B (zh) * 2017-03-31 2023-02-28 太阳控股株式会社 固化性树脂组合物、干膜、固化物、电子部件及印刷电路板
KR102505321B1 (ko) * 2017-04-28 2023-03-06 레조낙 가부시끼가이샤 봉지용 필름, 봉지 구조체 및 봉지 구조체의 제조 방법
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR20200124700A (ko) * 2018-02-22 2020-11-03 다이요 잉키 세이조 가부시키가이샤 적층형 전자 부품용 수지 조성물, 드라이 필름, 경화물, 적층형 전자 부품 및 프린트 배선판
WO2019187904A1 (ja) * 2018-03-30 2019-10-03 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201730300A (zh) * 2015-10-28 2017-09-01 味之素股份有限公司 接著薄膜

Also Published As

Publication number Publication date
WO2022202427A1 (ja) 2022-09-29
TW202248360A (zh) 2022-12-16
CN117120551A (zh) 2023-11-24
CN117120551B (zh) 2026-03-20
JP7417008B2 (ja) 2024-01-17
JPWO2022202427A1 (https=) 2022-09-29

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