TWI895587B - 樹脂組成物、附有樹脂銅箔及印刷配線板 - Google Patents

樹脂組成物、附有樹脂銅箔及印刷配線板

Info

Publication number
TWI895587B
TWI895587B TW111104504A TW111104504A TWI895587B TW I895587 B TWI895587 B TW I895587B TW 111104504 A TW111104504 A TW 111104504A TW 111104504 A TW111104504 A TW 111104504A TW I895587 B TWI895587 B TW I895587B
Authority
TW
Taiwan
Prior art keywords
resin
copper foil
weight
group
styrene
Prior art date
Application number
TW111104504A
Other languages
English (en)
Chinese (zh)
Other versions
TW202242025A (zh
Inventor
大澤和弘
立岡歩
小川国春
Haruka MAKINO
Original Assignee
日商三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司
Publication of TW202242025A publication Critical patent/TW202242025A/zh
Application granted granted Critical
Publication of TWI895587B publication Critical patent/TWI895587B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D153/00—Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D153/02—Vinyl aromatic monomers and conjugated dienes
    • C09D153/025—Vinyl aromatic monomers and conjugated dienes modified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/04—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
    • C08F297/046—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes polymerising vinyl aromatic monomers and isoprene, optionally with other conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/08—Copolymers of styrene
    • C09D125/12—Copolymers of styrene with unsaturated nitriles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2810/00—Chemical modification of a polymer
    • C08F2810/20—Chemical modification of a polymer leading to a crosslinking, either explicitly or inherently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111104504A 2021-02-10 2022-02-08 樹脂組成物、附有樹脂銅箔及印刷配線板 TWI895587B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-019760 2021-02-10
JP2021019760 2021-02-10

Publications (2)

Publication Number Publication Date
TW202242025A TW202242025A (zh) 2022-11-01
TWI895587B true TWI895587B (zh) 2025-09-01

Family

ID=82838706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111104504A TWI895587B (zh) 2021-02-10 2022-02-08 樹脂組成物、附有樹脂銅箔及印刷配線板

Country Status (6)

Country Link
US (1) US12331212B2 (https=)
JP (1) JP7550248B2 (https=)
KR (1) KR20230110598A (https=)
CN (1) CN116724066B (https=)
TW (1) TWI895587B (https=)
WO (1) WO2022172759A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053749A1 (ja) * 2021-09-30 2023-04-06 ナミックス株式会社 樹脂組成物、接着フィルム、層間接着用ボンディングシート、アンテナ付き半導体パッケージ用樹脂組成物及びアンテナ付き半導体パッケージ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345537A (ja) * 2000-03-31 2001-12-14 Toshiba Corp 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ
JP2016196563A (ja) * 2015-04-03 2016-11-24 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物および成形品
JP2017157783A (ja) * 2016-03-04 2017-09-07 三菱瓦斯化学株式会社 プリント配線基板

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US6709806B2 (en) 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
JP4867217B2 (ja) * 2004-08-19 2012-02-01 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムおよびフィルム
JP2011225639A (ja) 2010-04-15 2011-11-10 Hitachi Chem Co Ltd 熱硬化性樹脂組成物並びにこれを用いた樹脂ワニス、プリプレグ及び金属張積層板
KR20120053921A (ko) * 2010-11-18 2012-05-29 삼성전기주식회사 인쇄 회로 기판 및 그 제조 방법
WO2013105650A1 (ja) 2012-01-11 2013-07-18 三井金属鉱業株式会社 接着剤層付銅箔、銅張積層板及びプリント配線板
WO2016104748A1 (ja) 2014-12-26 2016-06-30 新日鉄住金化学株式会社 末端変性可溶性多官能ビニル芳香族共重合体、硬化性樹脂組成物及びこれを用いた光導波路
EP3290480B1 (en) 2015-04-30 2020-12-09 Showa Denko Materials Co., Ltd. Resin composition, prepreg, laminate and multilayer printed wiring board
CN106609031B (zh) 2015-10-22 2018-11-27 广东生益科技股份有限公司 一种聚苯醚树脂组合物以及含有它的预浸料、层压板和印制电路板
US10233365B2 (en) * 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
CN110366569B (zh) * 2017-03-02 2022-07-22 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN110461891B (zh) 2017-03-30 2022-08-30 日铁化学材料株式会社 可溶性多官能乙烯基芳香族共聚合物、其制造方法以及硬化性树脂组合物及其应用
JP7051333B2 (ja) * 2017-08-25 2022-04-11 日鉄ケミカル＆マテリアル株式会社 硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス
JP2020200427A (ja) * 2019-06-13 2020-12-17 旭化成株式会社 ポリフェニレンエーテル含有樹脂組成物
CN114502652A (zh) * 2019-09-30 2022-05-13 太阳控股株式会社 包含聚苯醚的固化性组合物、干膜、预制品、固化物、层叠板和电子部件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345537A (ja) * 2000-03-31 2001-12-14 Toshiba Corp 複合部材の製造方法、感光性組成物、複合部材製造用の絶縁体、複合部材、多層配線基板及び電子パッケージ
JP2016196563A (ja) * 2015-04-03 2016-11-24 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物および成形品
JP2017157783A (ja) * 2016-03-04 2017-09-07 三菱瓦斯化学株式会社 プリント配線基板

Also Published As

Publication number Publication date
CN116724066B (zh) 2026-04-14
US12331212B2 (en) 2025-06-17
JPWO2022172759A1 (https=) 2022-08-18
CN116724066A (zh) 2023-09-08
JP7550248B2 (ja) 2024-09-12
WO2022172759A1 (ja) 2022-08-18
TW202242025A (zh) 2022-11-01
US20240101858A1 (en) 2024-03-28
KR20230110598A (ko) 2023-07-24

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