TWI893895B - 基板處理裝置 - Google Patents

基板處理裝置

Info

Publication number
TWI893895B
TWI893895B TW113125968A TW113125968A TWI893895B TW I893895 B TWI893895 B TW I893895B TW 113125968 A TW113125968 A TW 113125968A TW 113125968 A TW113125968 A TW 113125968A TW I893895 B TWI893895 B TW I893895B
Authority
TW
Taiwan
Prior art keywords
liquid
nozzle
substrate
dry area
gas
Prior art date
Application number
TW113125968A
Other languages
English (en)
Chinese (zh)
Other versions
TW202443757A (zh
Inventor
犬飼美成子
寺山正敏
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202443757A publication Critical patent/TW202443757A/zh
Application granted granted Critical
Publication of TWI893895B publication Critical patent/TWI893895B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW113125968A 2021-09-22 2022-01-25 基板處理裝置 TWI893895B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-154588 2021-09-22
JP2021154588A JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW202443757A TW202443757A (zh) 2024-11-01
TWI893895B true TWI893895B (zh) 2025-08-11

Family

ID=85571568

Family Applications (3)

Application Number Title Priority Date Filing Date
TW113125968A TWI893895B (zh) 2021-09-22 2022-01-25 基板處理裝置
TW114110793A TW202529232A (zh) 2021-09-22 2022-01-25 基板處理裝置
TW111103056A TWI850623B (zh) 2021-09-22 2022-01-25 基板處理裝置及基板處理方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW114110793A TW202529232A (zh) 2021-09-22 2022-01-25 基板處理裝置
TW111103056A TWI850623B (zh) 2021-09-22 2022-01-25 基板處理裝置及基板處理方法

Country Status (4)

Country Link
US (2) US11833550B2 (enExample)
JP (1) JP7781577B2 (enExample)
CN (1) CN115889281A (enExample)
TW (3) TWI893895B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230010693A (ko) * 2020-05-15 2023-01-19 가부시키가이샤 에바라 세이사꾸쇼 세정 장치 및 세정 방법
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法
US20250085053A1 (en) * 2023-08-24 2025-03-13 Tokyo Electron Limited Flow stability control in drying liquid between plates

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200623246A (en) * 2004-09-09 2006-07-01 Tokyo Electron Ltd Substrate cleaning method and developing apparatus
US20090250079A1 (en) * 2008-04-03 2009-10-08 Tokyo Electron Limited Substrate cleaning method and substrate cleaning apparatus
US20120006361A1 (en) * 2010-07-07 2012-01-12 Tadashi Miyagi Substrate cleaning method and substrate cleaning device
US20150194301A1 (en) * 2014-01-09 2015-07-09 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium
US20190013217A1 (en) * 2017-07-04 2019-01-10 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and recording medium
TW201937552A (zh) * 2016-08-24 2019-09-16 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW202033285A (zh) * 2019-02-28 2020-09-16 日商荏原製作所股份有限公司 基板處理裝置、半導體製造裝置及基板處理方法
TW202105501A (zh) * 2019-05-31 2021-02-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW202121521A (zh) * 2019-09-27 2021-06-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP6117041B2 (ja) 2013-07-19 2017-04-19 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
JP6386769B2 (ja) 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200623246A (en) * 2004-09-09 2006-07-01 Tokyo Electron Ltd Substrate cleaning method and developing apparatus
US20090250079A1 (en) * 2008-04-03 2009-10-08 Tokyo Electron Limited Substrate cleaning method and substrate cleaning apparatus
US20120006361A1 (en) * 2010-07-07 2012-01-12 Tadashi Miyagi Substrate cleaning method and substrate cleaning device
US20150194301A1 (en) * 2014-01-09 2015-07-09 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium
TW201937552A (zh) * 2016-08-24 2019-09-16 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
US20190013217A1 (en) * 2017-07-04 2019-01-10 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and recording medium
TW201919776A (zh) * 2017-07-04 2019-06-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記憶媒體
TW202033285A (zh) * 2019-02-28 2020-09-16 日商荏原製作所股份有限公司 基板處理裝置、半導體製造裝置及基板處理方法
TW202105501A (zh) * 2019-05-31 2021-02-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
TW202121521A (zh) * 2019-09-27 2021-06-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TWI850623B (zh) 2024-08-01
US20230090997A1 (en) 2023-03-23
TW202314899A (zh) 2023-04-01
US20240058847A1 (en) 2024-02-22
JP2023045958A (ja) 2023-04-03
JP7781577B2 (ja) 2025-12-08
TW202443757A (zh) 2024-11-01
US12172194B2 (en) 2024-12-24
CN115889281A (zh) 2023-04-04
US11833550B2 (en) 2023-12-05
TW202529232A (zh) 2025-07-16

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