CN115889281A - 基板处理装置以及基板处理方法 - Google Patents

基板处理装置以及基板处理方法 Download PDF

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Publication number
CN115889281A
CN115889281A CN202210159690.XA CN202210159690A CN115889281A CN 115889281 A CN115889281 A CN 115889281A CN 202210159690 A CN202210159690 A CN 202210159690A CN 115889281 A CN115889281 A CN 115889281A
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CN
China
Prior art keywords
substrate
nozzle
liquid
cleaning liquid
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210159690.XA
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English (en)
Chinese (zh)
Inventor
犬饲美成子
寺山正敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Publication of CN115889281A publication Critical patent/CN115889281A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202210159690.XA 2021-09-22 2022-02-22 基板处理装置以及基板处理方法 Pending CN115889281A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021154588A JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法
JP2021-154588 2021-09-22

Publications (1)

Publication Number Publication Date
CN115889281A true CN115889281A (zh) 2023-04-04

Family

ID=85571568

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210159690.XA Pending CN115889281A (zh) 2021-09-22 2022-02-22 基板处理装置以及基板处理方法

Country Status (4)

Country Link
US (2) US11833550B2 (enExample)
JP (1) JP7781577B2 (enExample)
CN (1) CN115889281A (enExample)
TW (3) TWI893895B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115605981A (zh) * 2020-05-15 2023-01-13 株式会社荏原制作所（Jp） 清洗装置及清洗方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法
US20250085053A1 (en) * 2023-08-24 2025-03-13 Tokyo Electron Limited Flow stability control in drying liquid between plates

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
WO2006137202A1 (ja) * 2005-06-23 2006-12-28 Tokyo Electron Limited 基板処理方法および基板処理装置
CN101551602A (zh) * 2008-04-03 2009-10-07 东京毅力科创株式会社 基板洗净方法和基板洗净装置
JP2014123773A (ja) * 2014-03-17 2014-07-03 Tokyo Electron Ltd 基板洗浄方法
JP2015023182A (ja) * 2013-07-19 2015-02-02 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
US20150194301A1 (en) * 2014-01-09 2015-07-09 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP4324527B2 (ja) 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP6386769B2 (ja) 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
JP6817748B2 (ja) * 2016-08-24 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6938248B2 (ja) * 2017-07-04 2021-09-22 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2020141052A (ja) * 2019-02-28 2020-09-03 株式会社荏原製作所 基板処理装置、半導体製造装置、および基板処理方法
JP7194645B2 (ja) * 2019-05-31 2022-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
WO2006137202A1 (ja) * 2005-06-23 2006-12-28 Tokyo Electron Limited 基板処理方法および基板処理装置
CN101551602A (zh) * 2008-04-03 2009-10-07 东京毅力科创株式会社 基板洗净方法和基板洗净装置
JP2015023182A (ja) * 2013-07-19 2015-02-02 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
US20150194301A1 (en) * 2014-01-09 2015-07-09 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium
JP2014123773A (ja) * 2014-03-17 2014-07-03 Tokyo Electron Ltd 基板洗浄方法
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Also Published As

Publication number Publication date
US12172194B2 (en) 2024-12-24
JP7781577B2 (ja) 2025-12-08
TWI893895B (zh) 2025-08-11
TW202314899A (zh) 2023-04-01
US20230090997A1 (en) 2023-03-23
US20240058847A1 (en) 2024-02-22
US11833550B2 (en) 2023-12-05
TW202529232A (zh) 2025-07-16
JP2023045958A (ja) 2023-04-03
TW202443757A (zh) 2024-11-01
TWI850623B (zh) 2024-08-01

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