TWI893498B - 氣體分配器及氣體混合器 - Google Patents

氣體分配器及氣體混合器

Info

Publication number
TWI893498B
TWI893498B TW112141223A TW112141223A TWI893498B TW I893498 B TWI893498 B TW I893498B TW 112141223 A TW112141223 A TW 112141223A TW 112141223 A TW112141223 A TW 112141223A TW I893498 B TWI893498 B TW I893498B
Authority
TW
Taiwan
Prior art keywords
gas
array
distributor
outlet
nozzles
Prior art date
Application number
TW112141223A
Other languages
English (en)
Chinese (zh)
Other versions
TW202407927A (zh
Inventor
馬克 塔斯卡
依柏 Ａ 雪瑞夫
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202407927A publication Critical patent/TW202407927A/zh
Application granted granted Critical
Publication of TWI893498B publication Critical patent/TWI893498B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Automation & Control Theory (AREA)
  • Gas Separation By Absorption (AREA)
TW112141223A 2018-07-19 2019-07-18 氣體分配器及氣體混合器 TWI893498B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/040,326 US10943769B2 (en) 2018-07-19 2018-07-19 Gas distributor and flow verifier
US16/040,326 2018-07-19

Publications (2)

Publication Number Publication Date
TW202407927A TW202407927A (zh) 2024-02-16
TWI893498B true TWI893498B (zh) 2025-08-11

Family

ID=69162522

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112141223A TWI893498B (zh) 2018-07-19 2019-07-18 氣體分配器及氣體混合器
TW108125382A TWI821336B (zh) 2018-07-19 2019-07-18 氣體分配器及氣體混合器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108125382A TWI821336B (zh) 2018-07-19 2019-07-18 氣體分配器及氣體混合器

Country Status (6)

Country Link
US (2) US10943769B2 (https=)
JP (2) JP7410120B2 (https=)
KR (2) KR102763394B1 (https=)
CN (2) CN120332666A (https=)
TW (2) TWI893498B (https=)
WO (1) WO2020018850A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10256075B2 (en) * 2016-01-22 2019-04-09 Applied Materials, Inc. Gas splitting by time average injection into different zones by fast gas valves
US10943769B2 (en) 2018-07-19 2021-03-09 Lam Research Corporation Gas distributor and flow verifier
KR20240166040A (ko) * 2019-03-01 2024-11-25 램 리써치 코포레이션 통합된 툴 리프트
CN114121585B (zh) * 2020-08-26 2023-10-31 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及气体供应方法
US12068135B2 (en) 2021-02-12 2024-08-20 Applied Materials, Inc. Fast gas exchange apparatus, system, and method
KR102627141B1 (ko) * 2023-07-20 2024-01-23 (주)효진이앤하이 플라즈마 가스 변환 시스템

Citations (6)

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US7335396B2 (en) * 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US20090272492A1 (en) * 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
US20140174362A1 (en) * 2012-12-21 2014-06-26 Chien-Teh Kao Apparatus And Methods For Symmetrical Gas Distribution With High Purge Efficiency
US20140329185A1 (en) * 2013-05-03 2014-11-06 Uop Llc Apparatus and method for minimizing smoke formation in a flaring stack
CN104737274A (zh) * 2012-10-26 2015-06-24 应用材料公司 Pecvd设备与工艺
US20180141018A1 (en) * 2015-06-30 2018-05-24 ExxonMobil Chemical Chemical Patents Inc. Gas Distribution in Oxidation Reactions

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JP3442604B2 (ja) * 1996-02-15 2003-09-02 株式会社フジキン 混合ガスの供給方法及び混合ガス供給装置並びにこれらを備えた半導体製造装置
JP4454725B2 (ja) * 1998-12-28 2010-04-21 株式会社オムニ研究所 ガス混合装置およびガス混合ブロック
JP4764574B2 (ja) * 2001-08-31 2011-09-07 東京エレクトロン株式会社 処理装置の運転方法
US7510624B2 (en) * 2004-12-17 2009-03-31 Applied Materials, Inc. Self-cooling gas delivery apparatus under high vacuum for high density plasma applications
US20080102011A1 (en) * 2006-10-27 2008-05-01 Applied Materials, Inc. Treatment of effluent containing chlorine-containing gas
CN101556904B (zh) * 2008-04-10 2010-12-01 北京北方微电子基地设备工艺研究中心有限责任公司 一种气体分配装置及应用该分配装置的半导体处理设备
WO2011159690A2 (en) 2010-06-15 2011-12-22 Applied Materials, Inc. Multiple precursor showerhead with by-pass ports
KR101693673B1 (ko) 2010-06-23 2017-01-09 주성엔지니어링(주) 가스분배수단 및 이를 포함한 기판처리장치
US8528338B2 (en) * 2010-12-06 2013-09-10 General Electric Company Method for operating an air-staged diffusion nozzle
JP6123208B2 (ja) 2012-09-28 2017-05-10 東京エレクトロン株式会社 成膜装置
US20140224175A1 (en) 2013-02-14 2014-08-14 Memc Electronic Materials, Inc. Gas distribution manifold system for chemical vapor deposition reactors and method of use
US20140329189A1 (en) * 2013-05-03 2014-11-06 Uop Llc Apparatus and method for minimizing smoke formation in a flaring stack
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US9679749B2 (en) * 2014-09-26 2017-06-13 Lam Research Corporation Gas distribution device with actively cooled grid
US10022689B2 (en) * 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10943769B2 (en) 2018-07-19 2021-03-09 Lam Research Corporation Gas distributor and flow verifier

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335396B2 (en) * 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US20090272492A1 (en) * 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
CN104737274A (zh) * 2012-10-26 2015-06-24 应用材料公司 Pecvd设备与工艺
US20140174362A1 (en) * 2012-12-21 2014-06-26 Chien-Teh Kao Apparatus And Methods For Symmetrical Gas Distribution With High Purge Efficiency
US20140329185A1 (en) * 2013-05-03 2014-11-06 Uop Llc Apparatus and method for minimizing smoke formation in a flaring stack
US20180141018A1 (en) * 2015-06-30 2018-05-24 ExxonMobil Chemical Chemical Patents Inc. Gas Distribution in Oxidation Reactions

Also Published As

Publication number Publication date
KR102932651B1 (ko) 2026-02-27
TW202407927A (zh) 2024-02-16
CN120332666A (zh) 2025-07-18
JP2024029058A (ja) 2024-03-05
TWI821336B (zh) 2023-11-11
US20210183626A1 (en) 2021-06-17
WO2020018850A1 (en) 2020-01-23
US11532460B2 (en) 2022-12-20
KR20210024200A (ko) 2021-03-04
CN112437976B (zh) 2025-04-22
JP2021532581A (ja) 2021-11-25
US10943769B2 (en) 2021-03-09
US20200027702A1 (en) 2020-01-23
TW202018888A (zh) 2020-05-16
JP7686055B2 (ja) 2025-05-30
CN112437976A (zh) 2021-03-02
JP7410120B2 (ja) 2024-01-09
KR20250018563A (ko) 2025-02-06
KR102763394B1 (ko) 2025-02-04

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