KR102763394B1 - 가스 분배기 및 플로우 검증기 - Google Patents

가스 분배기 및 플로우 검증기 Download PDF

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Publication number
KR102763394B1
KR102763394B1 KR1020217004928A KR20217004928A KR102763394B1 KR 102763394 B1 KR102763394 B1 KR 102763394B1 KR 1020217004928 A KR1020217004928 A KR 1020217004928A KR 20217004928 A KR20217004928 A KR 20217004928A KR 102763394 B1 KR102763394 B1 KR 102763394B1
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South Korea
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gas
outlets
nozzles
article
distributor
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KR1020217004928A
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Korean (ko)
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KR20210024200A (ko
Inventor
마크 타스카
이크발 에이. 샤리프
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H01L21/67017—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01L21/3065—
    • H01L21/6719—
    • H01L21/67253—
    • H01L21/67276—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Automation & Control Theory (AREA)
  • Gas Separation By Absorption (AREA)
KR1020217004928A 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기 Active KR102763394B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257003258A KR102932651B1 (ko) 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/040,326 US10943769B2 (en) 2018-07-19 2018-07-19 Gas distributor and flow verifier
US16/040,326 2018-07-19
PCT/US2019/042490 WO2020018850A1 (en) 2018-07-19 2019-07-18 Gas distributor and flow verifier

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257003258A Division KR102932651B1 (ko) 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기

Publications (2)

Publication Number Publication Date
KR20210024200A KR20210024200A (ko) 2021-03-04
KR102763394B1 true KR102763394B1 (ko) 2025-02-04

Family

ID=69162522

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217004928A Active KR102763394B1 (ko) 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기
KR1020257003258A Active KR102932651B1 (ko) 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257003258A Active KR102932651B1 (ko) 2018-07-19 2019-07-18 가스 분배기 및 플로우 검증기

Country Status (6)

Country Link
US (2) US10943769B2 (https=)
JP (2) JP7410120B2 (https=)
KR (2) KR102763394B1 (https=)
CN (2) CN112437976B (https=)
TW (2) TWI821336B (https=)
WO (1) WO2020018850A1 (https=)

Families Citing this family (6)

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US10256075B2 (en) * 2016-01-22 2019-04-09 Applied Materials, Inc. Gas splitting by time average injection into different zones by fast gas valves
US10943769B2 (en) 2018-07-19 2021-03-09 Lam Research Corporation Gas distributor and flow verifier
US11495486B2 (en) * 2019-03-01 2022-11-08 Lam Research Corporation Integrated tool lift
CN114121585B (zh) * 2020-08-26 2023-10-31 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及气体供应方法
US12068135B2 (en) 2021-02-12 2024-08-20 Applied Materials, Inc. Fast gas exchange apparatus, system, and method
KR102627141B1 (ko) * 2023-07-20 2024-01-23 (주)효진이앤하이 플라즈마 가스 변환 시스템

Citations (1)

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US20090272492A1 (en) * 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias

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JP3442604B2 (ja) * 1996-02-15 2003-09-02 株式会社フジキン 混合ガスの供給方法及び混合ガス供給装置並びにこれらを備えた半導体製造装置
JP4454725B2 (ja) * 1998-12-28 2010-04-21 株式会社オムニ研究所 ガス混合装置およびガス混合ブロック
JP4764574B2 (ja) * 2001-08-31 2011-09-07 東京エレクトロン株式会社 処理装置の運転方法
US7335396B2 (en) * 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7510624B2 (en) * 2004-12-17 2009-03-31 Applied Materials, Inc. Self-cooling gas delivery apparatus under high vacuum for high density plasma applications
US20080102011A1 (en) * 2006-10-27 2008-05-01 Applied Materials, Inc. Treatment of effluent containing chlorine-containing gas
CN101556904B (zh) * 2008-04-10 2010-12-01 北京北方微电子基地设备工艺研究中心有限责任公司 一种气体分配装置及应用该分配装置的半导体处理设备
WO2011159690A2 (en) * 2010-06-15 2011-12-22 Applied Materials, Inc. Multiple precursor showerhead with by-pass ports
KR101693673B1 (ko) 2010-06-23 2017-01-09 주성엔지니어링(주) 가스분배수단 및 이를 포함한 기판처리장치
US8528338B2 (en) * 2010-12-06 2013-09-10 General Electric Company Method for operating an air-staged diffusion nozzle
JP6123208B2 (ja) * 2012-09-28 2017-05-10 東京エレクトロン株式会社 成膜装置
US9157730B2 (en) * 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
TW201435138A (zh) 2012-12-21 2014-09-16 Applied Materials Inc 具高清洗效率的對稱氣體分配設備及方法
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Also Published As

Publication number Publication date
TW202407927A (zh) 2024-02-16
JP2021532581A (ja) 2021-11-25
TW202018888A (zh) 2020-05-16
WO2020018850A1 (en) 2020-01-23
JP7410120B2 (ja) 2024-01-09
KR102932651B1 (ko) 2026-02-27
CN120332666A (zh) 2025-07-18
US10943769B2 (en) 2021-03-09
US20200027702A1 (en) 2020-01-23
JP7686055B2 (ja) 2025-05-30
KR20250018563A (ko) 2025-02-06
CN112437976B (zh) 2025-04-22
US11532460B2 (en) 2022-12-20
KR20210024200A (ko) 2021-03-04
TWI821336B (zh) 2023-11-11
US20210183626A1 (en) 2021-06-17
CN112437976A (zh) 2021-03-02
TWI893498B (zh) 2025-08-11
JP2024029058A (ja) 2024-03-05

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