TWI891990B - 工件的處理方法 - Google Patents

工件的處理方法

Info

Publication number
TWI891990B
TWI891990B TW111111165A TW111111165A TWI891990B TW I891990 B TWI891990 B TW I891990B TW 111111165 A TW111111165 A TW 111111165A TW 111111165 A TW111111165 A TW 111111165A TW I891990 B TWI891990 B TW I891990B
Authority
TW
Taiwan
Prior art keywords
workpiece
temporary fixing
fixing material
support
peeling
Prior art date
Application number
TW111111165A
Other languages
English (en)
Chinese (zh)
Other versions
TW202245030A (zh
Inventor
畦崇
春田佳一郎
谷本周穂
鈴木孝
木下仁
Original Assignee
日商三井化學艾喜緹瑪蒂莉亞股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井化學艾喜緹瑪蒂莉亞股份有限公司 filed Critical 日商三井化學艾喜緹瑪蒂莉亞股份有限公司
Publication of TW202245030A publication Critical patent/TW202245030A/zh
Application granted granted Critical
Publication of TWI891990B publication Critical patent/TWI891990B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW111111165A 2021-03-26 2022-03-24 工件的處理方法 TWI891990B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021053554 2021-03-26
JP2021-053554 2021-03-26

Publications (2)

Publication Number Publication Date
TW202245030A TW202245030A (zh) 2022-11-16
TWI891990B true TWI891990B (zh) 2025-08-01

Family

ID=83397268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111111165A TWI891990B (zh) 2021-03-26 2022-03-24 工件的處理方法

Country Status (3)

Country Link
JP (2) JPWO2022202659A1 (https=)
TW (1) TWI891990B (https=)
WO (1) WO2022202659A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019046884A (ja) * 2017-08-30 2019-03-22 住友ベークライト株式会社 粘着テープ
JP2019056101A (ja) * 2017-06-13 2019-04-11 マクセルホールディングス株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
TW202104870A (zh) * 2019-05-10 2021-02-01 日商日立化成股份有限公司 拾取性的評估方法、切晶-黏晶一體型膜、切晶-黏晶一體型膜的評估方法和選別方法以及半導體裝置的製造方法
TW202106831A (zh) * 2019-04-26 2021-02-16 日商積水化學工業股份有限公司 黏著帶
TW202111050A (zh) * 2019-06-28 2021-03-16 日商日東電工股份有限公司 切晶帶及切晶黏晶膜

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4518535B2 (ja) * 2003-07-01 2010-08-04 日東電工株式会社 ダイシング用粘着シート用粘着剤、ダイシング用粘着シート、半導体素子の製造方法、半導体素子
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4754278B2 (ja) * 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP4841483B2 (ja) * 2007-03-27 2011-12-21 新光電気工業株式会社 配線基板の製造方法
JP2012124466A (ja) * 2010-11-18 2012-06-28 Nitto Denko Corp 半導体装置用接着フィルム、及び、半導体装置
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive
CN105027266A (zh) * 2013-03-04 2015-11-04 日东电工株式会社 半导体装置的制造方法、片状树脂组合物及切割胶带一体型片状树脂组合物
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
TWI667311B (zh) * 2014-06-13 2019-08-01 日商富士軟片股份有限公司 Temporary fixing of the adhesive, adhesive film, adhesive support, laminate and adhesive kit
JP6958089B2 (ja) * 2017-08-07 2021-11-02 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート及びそれらの製造方法
JP2019094478A (ja) * 2017-11-17 2019-06-20 Jsr株式会社 対象物の処理方法、半導体装置、その製造方法および剪断剥離用仮固定用組成物
JP7653762B2 (ja) * 2019-12-13 2025-03-31 日東電工株式会社 半導体加工用粘着シート
JPWO2024219175A1 (https=) * 2023-04-18 2024-10-24

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019056101A (ja) * 2017-06-13 2019-04-11 マクセルホールディングス株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
JP2019046884A (ja) * 2017-08-30 2019-03-22 住友ベークライト株式会社 粘着テープ
TW202106831A (zh) * 2019-04-26 2021-02-16 日商積水化學工業股份有限公司 黏著帶
TW202104870A (zh) * 2019-05-10 2021-02-01 日商日立化成股份有限公司 拾取性的評估方法、切晶-黏晶一體型膜、切晶-黏晶一體型膜的評估方法和選別方法以及半導體裝置的製造方法
TW202111050A (zh) * 2019-06-28 2021-03-16 日商日東電工股份有限公司 切晶帶及切晶黏晶膜

Also Published As

Publication number Publication date
JP2026005240A (ja) 2026-01-15
TW202245030A (zh) 2022-11-16
JPWO2022202659A1 (https=) 2022-09-29
WO2022202659A1 (ja) 2022-09-29

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