JPWO2022202659A1 - - Google Patents

Info

Publication number
JPWO2022202659A1
JPWO2022202659A1 JP2023509123A JP2023509123A JPWO2022202659A1 JP WO2022202659 A1 JPWO2022202659 A1 JP WO2022202659A1 JP 2023509123 A JP2023509123 A JP 2023509123A JP 2023509123 A JP2023509123 A JP 2023509123A JP WO2022202659 A1 JPWO2022202659 A1 JP WO2022202659A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509123A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202659A1 publication Critical patent/JPWO2022202659A1/ja
Priority to JP2025167406A priority Critical patent/JP2026005240A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2023509123A 2021-03-26 2022-03-18 Pending JPWO2022202659A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025167406A JP2026005240A (ja) 2021-03-26 2025-10-03 ワークの処理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021053554 2021-03-26
PCT/JP2022/012587 WO2022202659A1 (ja) 2021-03-26 2022-03-18 ワークの処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025167406A Division JP2026005240A (ja) 2021-03-26 2025-10-03 ワークの処理方法

Publications (1)

Publication Number Publication Date
JPWO2022202659A1 true JPWO2022202659A1 (https=) 2022-09-29

Family

ID=83397268

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023509123A Pending JPWO2022202659A1 (https=) 2021-03-26 2022-03-18
JP2025167406A Pending JP2026005240A (ja) 2021-03-26 2025-10-03 ワークの処理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025167406A Pending JP2026005240A (ja) 2021-03-26 2025-10-03 ワークの処理方法

Country Status (3)

Country Link
JP (2) JPWO2022202659A1 (https=)
TW (1) TWI891990B (https=)
WO (1) WO2022202659A1 (https=)

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005023188A (ja) * 2003-07-01 2005-01-27 Nitto Denko Corp ダイシング用粘着シート用粘着剤、ダイシング用粘着シート、半導体素子の製造方法、半導体素子
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法
JP2008244081A (ja) * 2007-03-27 2008-10-09 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2012124466A (ja) * 2010-11-18 2012-06-28 Nitto Denko Corp 半導体装置用接着フィルム、及び、半導体装置
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive
WO2014136687A1 (ja) * 2013-03-04 2014-09-12 日東電工株式会社 半導体装置の製造方法、シート状樹脂組成物、及び、ダイシングテープ一体型シート状樹脂組成物
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
WO2015190477A1 (ja) * 2014-06-13 2015-12-17 富士フイルム株式会社 仮止め接着剤、接着フィルム、接着性支持体、積層体およびキット
JP2019031608A (ja) * 2017-08-07 2019-02-28 日立化成株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート及びそれらの製造方法
JP2019046884A (ja) * 2017-08-30 2019-03-22 住友ベークライト株式会社 粘着テープ
JP2019056101A (ja) * 2017-06-13 2019-04-11 マクセルホールディングス株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
JP2019094478A (ja) * 2017-11-17 2019-06-20 Jsr株式会社 対象物の処理方法、半導体装置、その製造方法および剪断剥離用仮固定用組成物
WO2020217793A1 (ja) * 2019-04-26 2020-10-29 積水化学工業株式会社 粘着テープ
JP2021097074A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 半導体加工用粘着シート
WO2024219175A1 (ja) * 2023-04-18 2024-10-24 三井化学Ictマテリア株式会社 仮固定材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202112361PA (en) * 2019-05-10 2021-12-30 Showa Denko Materials Co Ltd Method for evaluating pickability, film for combined dicing and die bonding, method for evaluating and method for classifying film for combined dicing and die bonding, and method for manufacturing semiconductor device
JP7350534B2 (ja) * 2019-06-28 2023-09-26 日東電工株式会社 ダイシングテープ、及び、ダイシングダイボンドフィルム

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005023188A (ja) * 2003-07-01 2005-01-27 Nitto Denko Corp ダイシング用粘着シート用粘着剤、ダイシング用粘着シート、半導体素子の製造方法、半導体素子
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法
JP2008244081A (ja) * 2007-03-27 2008-10-09 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2012124466A (ja) * 2010-11-18 2012-06-28 Nitto Denko Corp 半導体装置用接着フィルム、及び、半導体装置
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive
WO2014136687A1 (ja) * 2013-03-04 2014-09-12 日東電工株式会社 半導体装置の製造方法、シート状樹脂組成物、及び、ダイシングテープ一体型シート状樹脂組成物
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
WO2015190477A1 (ja) * 2014-06-13 2015-12-17 富士フイルム株式会社 仮止め接着剤、接着フィルム、接着性支持体、積層体およびキット
JP2019056101A (ja) * 2017-06-13 2019-04-11 マクセルホールディングス株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
JP2019031608A (ja) * 2017-08-07 2019-02-28 日立化成株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート及びそれらの製造方法
JP2019046884A (ja) * 2017-08-30 2019-03-22 住友ベークライト株式会社 粘着テープ
JP2019094478A (ja) * 2017-11-17 2019-06-20 Jsr株式会社 対象物の処理方法、半導体装置、その製造方法および剪断剥離用仮固定用組成物
WO2020217793A1 (ja) * 2019-04-26 2020-10-29 積水化学工業株式会社 粘着テープ
JP2021097074A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 半導体加工用粘着シート
WO2024219175A1 (ja) * 2023-04-18 2024-10-24 三井化学Ictマテリア株式会社 仮固定材

Also Published As

Publication number Publication date
JP2026005240A (ja) 2026-01-15
TW202245030A (zh) 2022-11-16
TWI891990B (zh) 2025-08-01
WO2022202659A1 (ja) 2022-09-29

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