TWI885183B - 光酸產生劑、光硬化性組成物、硬化體及化學增幅型負型光阻組成物 - Google Patents

光酸產生劑、光硬化性組成物、硬化體及化學增幅型負型光阻組成物 Download PDF

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Publication number
TWI885183B
TWI885183B TW110125382A TW110125382A TWI885183B TW I885183 B TWI885183 B TW I885183B TW 110125382 A TW110125382 A TW 110125382A TW 110125382 A TW110125382 A TW 110125382A TW I885183 B TWI885183 B TW I885183B
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TW
Taiwan
Prior art keywords
compound
photoacid generator
preparation example
anion
replaced
Prior art date
Application number
TW110125382A
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English (en)
Chinese (zh)
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TW202206411A (zh
Inventor
木村秀基
白石篤志
Original Assignee
日商三亞普羅股份有限公司
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Publication of TW202206411A publication Critical patent/TW202206411A/zh
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Publication of TWI885183B publication Critical patent/TWI885183B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW110125382A 2020-08-05 2021-07-09 光酸產生劑、光硬化性組成物、硬化體及化學增幅型負型光阻組成物 TWI885183B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020132821 2020-08-05
JP2020-132821 2020-08-05

Publications (2)

Publication Number Publication Date
TW202206411A TW202206411A (zh) 2022-02-16
TWI885183B true TWI885183B (zh) 2025-06-01

Family

ID=80117935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110125382A TWI885183B (zh) 2020-08-05 2021-07-09 光酸產生劑、光硬化性組成物、硬化體及化學增幅型負型光阻組成物

Country Status (5)

Country Link
JP (1) JP7783165B2 (https=)
KR (1) KR102792755B1 (https=)
CN (1) CN114402260A (https=)
TW (1) TWI885183B (https=)
WO (1) WO2022030139A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116008458B (zh) * 2022-12-26 2026-03-17 衢州康鹏化学有限公司 一种全氟芳基硼酸盐溶液中有效成分含量的检测方法

Citations (3)

* Cited by examiner, † Cited by third party
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TW201038519A (en) * 2009-02-20 2010-11-01 San Apro Ltd Sulfonium salt, photoacidgenerator and photosensitive resin composition
JP2010254654A (ja) * 2009-04-28 2010-11-11 San Apro Kk スルホニウム塩，光酸発生剤，光硬化性組成物，及びその硬化体

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US4197174A (en) 1979-03-14 1980-04-08 American Can Company Method for producing bis-[4-(diphenylsulfonio) phenyl] sulfide bis-MX6
JPS61190524A (ja) 1985-01-25 1986-08-25 Asahi Denka Kogyo Kk エネルギ−線硬化性組成物
JPS61212554A (ja) * 1985-03-15 1986-09-20 Asahi Denka Kogyo Kk 芳香族ジスルホニウム塩の製法
JP3567984B2 (ja) 1999-11-01 2004-09-22 日本電気株式会社 スルホニウム塩化合物、フォトレジスト組成物、およびそれを用いたパターン形成方法
JP4023086B2 (ja) 1999-12-27 2007-12-19 和光純薬工業株式会社 スルホニウム塩化合物
JP3351424B2 (ja) 1999-12-28 2002-11-25 日本電気株式会社 スルホニウム塩化合物及びレジスト組成物、並びにそれを用いたパターン形成方法
JP5081627B2 (ja) * 2005-11-25 2012-11-28 サンアプロ株式会社 フッ素化アルキルフルオロリン酸スルホニウムの製造方法
JP2011016425A (ja) * 2009-07-08 2011-01-27 Toyota Motor Corp ハイブリッド車両
WO2011016425A1 (ja) * 2009-08-03 2011-02-10 サンアプロ株式会社 光酸発生剤，光硬化性組成物，及びその硬化体
JP2011039411A (ja) * 2009-08-17 2011-02-24 San Apro Kk 化学増幅型ポジ型フォトレジスト組成物及びレジストパターンの作製方法
JP5517658B2 (ja) * 2010-02-09 2014-06-11 サンアプロ株式会社 スルホニウム塩，光酸発生剤，硬化性組成物及びポジ型フォトレジスト組成物
JP5828679B2 (ja) * 2011-05-31 2015-12-09 サンアプロ株式会社 フッ素化アルキルリン酸オニウム塩系酸発生剤
KR101959107B1 (ko) * 2012-10-18 2019-03-15 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
WO2015046502A1 (ja) * 2013-09-30 2015-04-02 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置
JP6708382B2 (ja) * 2015-09-03 2020-06-10 サンアプロ株式会社 硬化性組成物及びそれを用いた硬化体
KR102272225B1 (ko) * 2016-06-09 2021-07-01 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
JP7048248B2 (ja) * 2017-10-16 2022-04-05 サンアプロ株式会社 光酸発生剤、硬化性組成物及びレジスト組成物
JP2019086559A (ja) * 2017-11-02 2019-06-06 サンアプロ株式会社 ネガ型フォトレジスト用樹脂組成物及び硬化膜
JP2019212554A (ja) * 2018-06-07 2019-12-12 株式会社豊田自動織機 電池モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005000801A1 (ja) * 2003-06-25 2005-01-06 San-Apro Limited モノスルホニウム塩の製造方法、カチオン重合開始剤、硬化性組成物および硬化物
TW201038519A (en) * 2009-02-20 2010-11-01 San Apro Ltd Sulfonium salt, photoacidgenerator and photosensitive resin composition
JP2010254654A (ja) * 2009-04-28 2010-11-11 San Apro Kk スルホニウム塩，光酸発生剤，光硬化性組成物，及びその硬化体

Also Published As

Publication number Publication date
TW202206411A (zh) 2022-02-16
JPWO2022030139A1 (https=) 2022-02-10
KR102792755B1 (ko) 2025-04-07
WO2022030139A1 (ja) 2022-02-10
JP7783165B2 (ja) 2025-12-09
KR20230047050A (ko) 2023-04-06
CN114402260A (zh) 2022-04-26

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