JPWO2022030139A1 - - Google Patents
Info
- Publication number
- JPWO2022030139A1 JPWO2022030139A1 JP2022514259A JP2022514259A JPWO2022030139A1 JP WO2022030139 A1 JPWO2022030139 A1 JP WO2022030139A1 JP 2022514259 A JP2022514259 A JP 2022514259A JP 2022514259 A JP2022514259 A JP 2022514259A JP WO2022030139 A1 JPWO2022030139 A1 JP WO2022030139A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020132821 | 2020-08-05 | ||
| JP2020132821 | 2020-08-05 | ||
| PCT/JP2021/024283 WO2022030139A1 (ja) | 2020-08-05 | 2021-06-28 | 光酸発生剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022030139A1 true JPWO2022030139A1 (https=) | 2022-02-10 |
| JP7783165B2 JP7783165B2 (ja) | 2025-12-09 |
Family
ID=80117935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022514259A Active JP7783165B2 (ja) | 2020-08-05 | 2021-06-28 | 光酸発生剤 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7783165B2 (https=) |
| KR (1) | KR102792755B1 (https=) |
| CN (1) | CN114402260A (https=) |
| TW (1) | TWI885183B (https=) |
| WO (1) | WO2022030139A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116008458B (zh) * | 2022-12-26 | 2026-03-17 | 衢州康鹏化学有限公司 | 一种全氟芳基硼酸盐溶液中有效成分含量的检测方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212554A (ja) * | 1985-03-15 | 1986-09-20 | Asahi Denka Kogyo Kk | 芳香族ジスルホニウム塩の製法 |
| WO2005000801A1 (ja) * | 2003-06-25 | 2005-01-06 | San-Apro Limited | モノスルホニウム塩の製造方法、カチオン重合開始剤、硬化性組成物および硬化物 |
| WO2007061024A1 (ja) * | 2005-11-25 | 2007-05-31 | San-Apro Limited | フッ素化アルキルフルオロリン酸スルホニウムの製造方法 |
| JP2010254654A (ja) * | 2009-04-28 | 2010-11-11 | San Apro Kk | スルホニウム塩，光酸発生剤，光硬化性組成物，及びその硬化体 |
| WO2011016425A1 (ja) * | 2009-08-03 | 2011-02-10 | サンアプロ株式会社 | 光酸発生剤，光硬化性組成物，及びその硬化体 |
| JP2012246456A (ja) * | 2011-05-31 | 2012-12-13 | San Apro Kk | フッ素化アルキルリン酸オニウム塩系酸発生剤 |
| JP2017048325A (ja) * | 2015-09-03 | 2017-03-09 | サンアプロ株式会社 | 硬化性組成物及びそれを用いた硬化体 |
| JP2019086559A (ja) * | 2017-11-02 | 2019-06-06 | サンアプロ株式会社 | ネガ型フォトレジスト用樹脂組成物及び硬化膜 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197174A (en) | 1979-03-14 | 1980-04-08 | American Can Company | Method for producing bis-[4-(diphenylsulfonio) phenyl] sulfide bis-MX6 |
| JPS61190524A (ja) | 1985-01-25 | 1986-08-25 | Asahi Denka Kogyo Kk | エネルギ−線硬化性組成物 |
| JP3567984B2 (ja) | 1999-11-01 | 2004-09-22 | 日本電気株式会社 | スルホニウム塩化合物、フォトレジスト組成物、およびそれを用いたパターン形成方法 |
| JP4023086B2 (ja) | 1999-12-27 | 2007-12-19 | 和光純薬工業株式会社 | スルホニウム塩化合物 |
| JP3351424B2 (ja) | 1999-12-28 | 2002-11-25 | 日本電気株式会社 | スルホニウム塩化合物及びレジスト組成物、並びにそれを用いたパターン形成方法 |
| CN102317258B (zh) * | 2009-02-20 | 2014-06-04 | 三亚普罗股份有限公司 | 锍盐、光酸产生剂及光敏性树脂组合物 |
| JP2011016425A (ja) * | 2009-07-08 | 2011-01-27 | Toyota Motor Corp | ハイブリッド車両 |
| JP2011039411A (ja) * | 2009-08-17 | 2011-02-24 | San Apro Kk | 化学増幅型ポジ型フォトレジスト組成物及びレジストパターンの作製方法 |
| JP5517658B2 (ja) * | 2010-02-09 | 2014-06-11 | サンアプロ株式会社 | スルホニウム塩，光酸発生剤，硬化性組成物及びポジ型フォトレジスト組成物 |
| KR101959107B1 (ko) * | 2012-10-18 | 2019-03-15 | 산아프로 가부시키가이샤 | 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물 |
| WO2015046502A1 (ja) * | 2013-09-30 | 2015-04-02 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置 |
| KR102272225B1 (ko) * | 2016-06-09 | 2021-07-01 | 산아프로 가부시키가이샤 | 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물 |
| JP7048248B2 (ja) * | 2017-10-16 | 2022-04-05 | サンアプロ株式会社 | 光酸発生剤、硬化性組成物及びレジスト組成物 |
| JP2019212554A (ja) * | 2018-06-07 | 2019-12-12 | 株式会社豊田自動織機 | 電池モジュール |
-
2021
- 2021-06-28 CN CN202180005348.8A patent/CN114402260A/zh active Pending
- 2021-06-28 KR KR1020227007502A patent/KR102792755B1/ko active Active
- 2021-06-28 JP JP2022514259A patent/JP7783165B2/ja active Active
- 2021-06-28 WO PCT/JP2021/024283 patent/WO2022030139A1/ja not_active Ceased
- 2021-07-09 TW TW110125382A patent/TWI885183B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61212554A (ja) * | 1985-03-15 | 1986-09-20 | Asahi Denka Kogyo Kk | 芳香族ジスルホニウム塩の製法 |
| WO2005000801A1 (ja) * | 2003-06-25 | 2005-01-06 | San-Apro Limited | モノスルホニウム塩の製造方法、カチオン重合開始剤、硬化性組成物および硬化物 |
| WO2007061024A1 (ja) * | 2005-11-25 | 2007-05-31 | San-Apro Limited | フッ素化アルキルフルオロリン酸スルホニウムの製造方法 |
| JP2010254654A (ja) * | 2009-04-28 | 2010-11-11 | San Apro Kk | スルホニウム塩，光酸発生剤，光硬化性組成物，及びその硬化体 |
| WO2011016425A1 (ja) * | 2009-08-03 | 2011-02-10 | サンアプロ株式会社 | 光酸発生剤，光硬化性組成物，及びその硬化体 |
| JP2012246456A (ja) * | 2011-05-31 | 2012-12-13 | San Apro Kk | フッ素化アルキルリン酸オニウム塩系酸発生剤 |
| JP2017048325A (ja) * | 2015-09-03 | 2017-03-09 | サンアプロ株式会社 | 硬化性組成物及びそれを用いた硬化体 |
| JP2019086559A (ja) * | 2017-11-02 | 2019-06-06 | サンアプロ株式会社 | ネガ型フォトレジスト用樹脂組成物及び硬化膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202206411A (zh) | 2022-02-16 |
| KR102792755B1 (ko) | 2025-04-07 |
| WO2022030139A1 (ja) | 2022-02-10 |
| TWI885183B (zh) | 2025-06-01 |
| JP7783165B2 (ja) | 2025-12-09 |
| KR20230047050A (ko) | 2023-04-06 |
| CN114402260A (zh) | 2022-04-26 |
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