TWI883149B - 工件之化學機械研磨系統、演算系統、及化學機械研磨之模擬模式之作成方法 - Google Patents
工件之化學機械研磨系統、演算系統、及化學機械研磨之模擬模式之作成方法 Download PDFInfo
- Publication number
- TWI883149B TWI883149B TW110110227A TW110110227A TWI883149B TW I883149 B TWI883149 B TW I883149B TW 110110227 A TW110110227 A TW 110110227A TW 110110227 A TW110110227 A TW 110110227A TW I883149 B TWI883149 B TW I883149B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- grinding
- workpiece
- aforementioned
- model
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-052046 | 2020-03-24 | ||
| JP2020052046A JP7465498B2 (ja) | 2020-03-24 | 2020-03-24 | ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202140197A TW202140197A (zh) | 2021-11-01 |
| TWI883149B true TWI883149B (zh) | 2025-05-11 |
Family
ID=77850511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110110227A TWI883149B (zh) | 2020-03-24 | 2021-03-22 | 工件之化學機械研磨系統、演算系統、及化學機械研磨之模擬模式之作成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230043639A1 (enExample) |
| JP (1) | JP7465498B2 (enExample) |
| KR (1) | KR102869537B1 (enExample) |
| CN (1) | CN115397612B (enExample) |
| TW (1) | TWI883149B (enExample) |
| WO (1) | WO2021193063A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102624869B1 (ko) * | 2021-10-05 | 2024-01-15 | 울산대학교 산학협력단 | 디지털 트윈을 기반으로 하는 양면 연삭 공정 제어 시스템 및 그 방법 |
| JP2024067256A (ja) * | 2022-11-04 | 2024-05-17 | 株式会社荏原製作所 | 研磨装置、情報処理装置及びプログラム |
| TWI817853B (zh) * | 2022-11-29 | 2023-10-01 | 環球晶圓股份有限公司 | 晶圓研磨參數優化方法及電子裝置 |
| CN115771102B (zh) * | 2022-11-30 | 2024-02-27 | 大连理工大学 | 一种应用于双面研磨工艺的数字孪生系统 |
| CN116967926A (zh) * | 2023-09-11 | 2023-10-31 | 北京晶亦精微科技股份有限公司 | 基于修整器的扫描电机扭矩的抛光垫使用寿命监测方法 |
| JP2025103220A (ja) | 2023-12-27 | 2025-07-09 | 株式会社荏原製作所 | ワークピースの化学機械研磨システムおよび化学機械研磨方法 |
| CN119734161B (zh) * | 2024-12-19 | 2025-11-21 | 华海清科股份有限公司 | 防护装置、晶圆磨削模块、减薄设备及方法、处理设备 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200526358A (en) * | 2003-09-30 | 2005-08-16 | Advanced Micro Devices Inc | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| WO2008072300A1 (ja) * | 2006-12-11 | 2008-06-19 | Renesas Technology Corp. | 半導体装置の製造方法、およびウェハの研磨方法 |
| JP2010087135A (ja) * | 2008-09-30 | 2010-04-15 | Nec Corp | 半導体装置の製造方法およびcmp装置 |
| JP2013118404A (ja) * | 2002-03-14 | 2013-06-13 | Nikon Corp | 加工形状の予測方法、加工条件の決定方法、加工量予測方法、加工形状予測システム、加工条件決定システム、加工システム、加工形状予測計算機プログラム、加工条件決定計算機プログラム、プログラム記録媒体、及び半導体デバイスの製造方法 |
| TW201832872A (zh) * | 2016-10-18 | 2018-09-16 | 日商荏原製作所股份有限公司 | 基板處理控制系統、基板處理控制方法、以及程式 |
| TW201946136A (zh) * | 2018-03-13 | 2019-12-01 | 美商應用材料股份有限公司 | 用於半導體處理監視的機器學習系統 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910947B2 (en) * | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| TW200536662A (en) * | 2004-03-04 | 2005-11-16 | Trecenti Technologies Inc | Method and system of chemicalmechanical polishing and manufacturing method of semiconductor device |
| JP2007281026A (ja) * | 2006-04-03 | 2007-10-25 | Renesas Technology Corp | 半導体装置の研磨方法 |
| JP2011148036A (ja) * | 2010-01-21 | 2011-08-04 | Nec Corp | データ処理装置、研磨装置、研磨レートの推定方法およびプログラム |
| JP5511600B2 (ja) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| JP2012074574A (ja) * | 2010-09-29 | 2012-04-12 | Hitachi Ltd | 加工装置制御システムおよび加工装置制御方法 |
| CN102390036B (zh) * | 2011-10-28 | 2014-04-02 | 中国科学院微电子研究所 | 基于浅沟道隔离技术的化学机械研磨终点检测方法及系统 |
| JP6034717B2 (ja) * | 2013-02-22 | 2016-11-30 | 株式会社荏原製作所 | ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置 |
| JP6293519B2 (ja) * | 2014-03-05 | 2018-03-14 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6307428B2 (ja) * | 2014-12-26 | 2018-04-04 | 株式会社荏原製作所 | 研磨装置およびその制御方法 |
| JP6782145B2 (ja) * | 2016-10-18 | 2020-11-11 | 株式会社荏原製作所 | 基板処理制御システム、基板処理制御方法、およびプログラム |
| JP7046358B2 (ja) * | 2018-04-17 | 2022-04-04 | スピードファム株式会社 | 研磨装置 |
-
2020
- 2020-03-24 JP JP2020052046A patent/JP7465498B2/ja active Active
-
2021
- 2021-03-10 WO PCT/JP2021/009516 patent/WO2021193063A1/ja not_active Ceased
- 2021-03-10 US US17/911,947 patent/US20230043639A1/en active Pending
- 2021-03-10 CN CN202180022839.3A patent/CN115397612B/zh active Active
- 2021-03-10 KR KR1020227035590A patent/KR102869537B1/ko active Active
- 2021-03-22 TW TW110110227A patent/TWI883149B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013118404A (ja) * | 2002-03-14 | 2013-06-13 | Nikon Corp | 加工形状の予測方法、加工条件の決定方法、加工量予測方法、加工形状予測システム、加工条件決定システム、加工システム、加工形状予測計算機プログラム、加工条件決定計算機プログラム、プログラム記録媒体、及び半導体デバイスの製造方法 |
| TW200526358A (en) * | 2003-09-30 | 2005-08-16 | Advanced Micro Devices Inc | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| WO2008072300A1 (ja) * | 2006-12-11 | 2008-06-19 | Renesas Technology Corp. | 半導体装置の製造方法、およびウェハの研磨方法 |
| JP2010087135A (ja) * | 2008-09-30 | 2010-04-15 | Nec Corp | 半導体装置の製造方法およびcmp装置 |
| TW201832872A (zh) * | 2016-10-18 | 2018-09-16 | 日商荏原製作所股份有限公司 | 基板處理控制系統、基板處理控制方法、以及程式 |
| TW201946136A (zh) * | 2018-03-13 | 2019-12-01 | 美商應用材料股份有限公司 | 用於半導體處理監視的機器學習系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220155340A (ko) | 2022-11-22 |
| US20230043639A1 (en) | 2023-02-09 |
| JP7465498B2 (ja) | 2024-04-11 |
| CN115397612A (zh) | 2022-11-25 |
| JP2021146493A (ja) | 2021-09-27 |
| WO2021193063A1 (ja) | 2021-09-30 |
| KR102869537B1 (ko) | 2025-10-13 |
| TW202140197A (zh) | 2021-11-01 |
| CN115397612B (zh) | 2024-06-07 |
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