JP7465498B2 - ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 - Google Patents

ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 Download PDF

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Publication number
JP7465498B2
JP7465498B2 JP2020052046A JP2020052046A JP7465498B2 JP 7465498 B2 JP7465498 B2 JP 7465498B2 JP 2020052046 A JP2020052046 A JP 2020052046A JP 2020052046 A JP2020052046 A JP 2020052046A JP 7465498 B2 JP7465498 B2 JP 7465498B2
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Japan
Prior art keywords
polishing
model
workpiece
torque
estimated
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JP2020052046A
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English (en)
Japanese (ja)
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JP2021146493A5 (enExample
JP2021146493A (ja
Inventor
教和 鈴木
穂積 安田
宣宏 望月
洋平 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Kanazawa University NUC
Tokai National Higher Education and Research System NUC
Original Assignee
Ebara Corp
Kanazawa University NUC
Tokai National Higher Education and Research System NUC
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Priority to JP2020052046A priority Critical patent/JP7465498B2/ja
Application filed by Ebara Corp, Kanazawa University NUC, Tokai National Higher Education and Research System NUC filed Critical Ebara Corp
Priority to US17/911,947 priority patent/US20230043639A1/en
Priority to PCT/JP2021/009516 priority patent/WO2021193063A1/ja
Priority to KR1020227035590A priority patent/KR102869537B1/ko
Priority to CN202180022839.3A priority patent/CN115397612B/zh
Priority to TW110110227A priority patent/TWI883149B/zh
Publication of JP2021146493A publication Critical patent/JP2021146493A/ja
Publication of JP2021146493A5 publication Critical patent/JP2021146493A5/ja
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Publication of JP7465498B2 publication Critical patent/JP7465498B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2020052046A 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 Active JP7465498B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020052046A JP7465498B2 (ja) 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
PCT/JP2021/009516 WO2021193063A1 (ja) 2020-03-24 2021-03-10 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
KR1020227035590A KR102869537B1 (ko) 2020-03-24 2021-03-10 워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법
CN202180022839.3A CN115397612B (zh) 2020-03-24 2021-03-10 工件的化学机械研磨系统、演算系统、及化学机械研磨的模拟模型的制作方法
US17/911,947 US20230043639A1 (en) 2020-03-24 2021-03-10 Chemical mechanical polishing system for a workpiece, arithmetic system, and method of producing simulation model for chemical mechanical polishing
TW110110227A TWI883149B (zh) 2020-03-24 2021-03-22 工件之化學機械研磨系統、演算系統、及化學機械研磨之模擬模式之作成方法

Applications Claiming Priority (1)

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JP2020052046A JP7465498B2 (ja) 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法

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JP2021146493A JP2021146493A (ja) 2021-09-27
JP2021146493A5 JP2021146493A5 (enExample) 2023-03-28
JP7465498B2 true JP7465498B2 (ja) 2024-04-11

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US (1) US20230043639A1 (enExample)
JP (1) JP7465498B2 (enExample)
KR (1) KR102869537B1 (enExample)
CN (1) CN115397612B (enExample)
TW (1) TWI883149B (enExample)
WO (1) WO2021193063A1 (enExample)

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KR102624869B1 (ko) * 2021-10-05 2024-01-15 울산대학교 산학협력단 디지털 트윈을 기반으로 하는 양면 연삭 공정 제어 시스템 및 그 방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム
TWI817853B (zh) * 2022-11-29 2023-10-01 環球晶圓股份有限公司 晶圓研磨參數優化方法及電子裝置
CN115771102B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种应用于双面研磨工艺的数字孪生系统
CN116967926A (zh) * 2023-09-11 2023-10-31 北京晶亦精微科技股份有限公司 基于修整器的扫描电机扭矩的抛光垫使用寿命监测方法
JP2025103220A (ja) 2023-12-27 2025-07-09 株式会社荏原製作所 ワークピースの化学機械研磨システムおよび化学機械研磨方法
CN119734161B (zh) * 2024-12-19 2025-11-21 华海清科股份有限公司 防护装置、晶圆磨削模块、减薄设备及方法、处理设备

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JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

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TW200536662A (en) * 2004-03-04 2005-11-16 Trecenti Technologies Inc Method and system of chemicalmechanical polishing and manufacturing method of semiconductor device
JP2007281026A (ja) * 2006-04-03 2007-10-25 Renesas Technology Corp 半導体装置の研磨方法
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JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

Also Published As

Publication number Publication date
KR20220155340A (ko) 2022-11-22
US20230043639A1 (en) 2023-02-09
CN115397612A (zh) 2022-11-25
JP2021146493A (ja) 2021-09-27
WO2021193063A1 (ja) 2021-09-30
KR102869537B1 (ko) 2025-10-13
TWI883149B (zh) 2025-05-11
TW202140197A (zh) 2021-11-01
CN115397612B (zh) 2024-06-07

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