TWI880957B - 搬送異常預測系統及搬送異常預測方法 - Google Patents
搬送異常預測系統及搬送異常預測方法 Download PDFInfo
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- TWI880957B TWI880957B TW109133007A TW109133007A TWI880957B TW I880957 B TWI880957 B TW I880957B TW 109133007 A TW109133007 A TW 109133007A TW 109133007 A TW109133007 A TW 109133007A TW I880957 B TWI880957 B TW I880957B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/02—Control devices, e.g. for safety, warning or fault-correcting detecting dangerous physical condition of load carriers, e.g. for interrupting the drive in the event of overheating
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/044—Recurrent networks, e.g. Hopfield networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/044—Recurrent networks, e.g. Hopfield networks
- G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/047—Probabilistic or stochastic networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/049—Temporal neural networks, e.g. delay elements, oscillating neurons or pulsed inputs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/09—Supervised learning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0266—Control or detection relating to the load carrier(s)
- B65G2203/0275—Damage on the load carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0266—Control or detection relating to the load carrier(s)
- B65G2203/0291—Speed of the load carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
- B65G2203/044—Optical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
- B65G2203/045—Thermic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Artificial Intelligence (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Software Systems (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computational Linguistics (AREA)
- Computing Systems (AREA)
- Molecular Biology (AREA)
- Data Mining & Analysis (AREA)
- General Health & Medical Sciences (AREA)
- Automation & Control Theory (AREA)
- Probability & Statistics with Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Control Of Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019181870A JP7319162B2 (ja) | 2019-10-02 | 2019-10-02 | 搬送異常予測システム |
| JP2019-181870 | 2019-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202128533A TW202128533A (zh) | 2021-08-01 |
| TWI880957B true TWI880957B (zh) | 2025-04-21 |
Family
ID=75272192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109133007A TWI880957B (zh) | 2019-10-02 | 2020-09-24 | 搬送異常預測系統及搬送異常預測方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12084288B2 (enExample) |
| JP (1) | JP7319162B2 (enExample) |
| KR (1) | KR20220074905A (enExample) |
| CN (1) | CN114503247A (enExample) |
| TW (1) | TWI880957B (enExample) |
| WO (1) | WO2021065576A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7246256B2 (ja) * | 2019-05-29 | 2023-03-27 | 東京エレクトロン株式会社 | 搬送方法及び搬送システム |
| US12227847B2 (en) * | 2021-03-31 | 2025-02-18 | Applied Materials, Inc. | Level monitoring and active adjustment of a substrate support assembly |
| JP7166395B1 (ja) | 2021-06-23 | 2022-11-07 | セイコーソリューションズ株式会社 | 監視システム、監視方法、及び監視プログラム |
| JP7501547B2 (ja) * | 2021-06-30 | 2024-06-18 | 株式会社デンソー | 設備状態監視システム |
| JP2024153954A (ja) * | 2021-07-08 | 2024-10-30 | 株式会社Preferred Networks | データ処理装置およびプログラム |
| JP2023023394A (ja) * | 2021-08-05 | 2023-02-16 | 株式会社荏原製作所 | 基板支持装置、洗浄装置、基板の回転速度を算出する装置ならびに方法、および機械学習装置 |
| JP7288486B2 (ja) * | 2021-09-17 | 2023-06-07 | 株式会社Kokusai Electric | 基板処理方法、基板処理装置、半導体装置の製造方法、及びプログラム |
| KR102709677B1 (ko) * | 2021-11-26 | 2024-09-26 | 울랄라랩 주식회사 | 비전센서 기반의 컨베이어 장치에 대한 예지보전 장치 및 방법 |
| CN114655655B (zh) * | 2022-03-09 | 2024-07-26 | 南京北路软件技术有限公司 | 一种基于UNet网络的传送带跑偏检测方法 |
| TWI804405B (zh) * | 2022-08-04 | 2023-06-01 | 友達光電股份有限公司 | 振動偵測方法及振動偵測裝置 |
| CN117302897B (zh) * | 2023-11-23 | 2024-01-26 | 常州市传动输送机械有限公司 | 一种带式输送机智能监测防控方法及系统 |
| KR102768348B1 (ko) * | 2024-04-25 | 2025-02-19 | 슈어데이터랩 주식회사 | 머신러닝 기반의 냉동공조기용 고장 예측 시스템 및 이를 이용한 방법 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154900A (ja) * | 1996-11-25 | 1998-06-09 | Hitachi Ltd | 電子部品実装用プリント基板の故障解析方法およびシステム |
| JP2016045852A (ja) * | 2014-08-26 | 2016-04-04 | 株式会社日立パワーソリューションズ | 異常診断装置及び異常診断方法 |
| JP2017157652A (ja) * | 2016-03-01 | 2017-09-07 | パナソニックIpマネジメント株式会社 | 部品実装用装置及び基板搬送方法 |
| WO2018041378A1 (en) * | 2016-08-29 | 2018-03-08 | Siemens Aktiengesellschaft | Method and system for anomaly detection in a manufacturing system |
| WO2018230645A1 (ja) * | 2017-06-14 | 2018-12-20 | 株式会社東芝 | 異常検知装置、異常検知方法、およびプログラム |
| TW201915727A (zh) * | 2017-09-18 | 2019-04-16 | 元智大學 | 多元感測器之錯誤偵測與分類方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000191136A (ja) * | 1998-12-25 | 2000-07-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置およびその保守方法 |
| TW469483B (en) * | 1999-04-19 | 2001-12-21 | Applied Materials Inc | Method and apparatus for aligning a cassette |
| US7490010B2 (en) * | 2006-08-08 | 2009-02-10 | Tokyo Electron Limited | Data collection method, substrate processing apparatus, and substrate processing system |
| US7486878B2 (en) * | 2006-09-29 | 2009-02-03 | Lam Research Corporation | Offset correction methods and arrangement for positioning and inspecting substrates |
| US8135485B2 (en) * | 2007-09-28 | 2012-03-13 | Lam Research Corporation | Offset correction techniques for positioning substrates within a processing chamber |
| US8225683B2 (en) * | 2007-09-28 | 2012-07-24 | Lam Research Corporation | Wafer bow metrology arrangements and methods thereof |
| US8060330B2 (en) * | 2008-12-12 | 2011-11-15 | Lam Research Corporation | Method and system for centering wafer on chuck |
| US9442482B2 (en) | 2013-04-29 | 2016-09-13 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
| JP6825398B2 (ja) * | 2016-03-25 | 2021-02-03 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
| US10714364B2 (en) * | 2017-08-31 | 2020-07-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting wafer carriers |
| US10802475B2 (en) * | 2018-07-16 | 2020-10-13 | Elite Robotics | Positioner for a robotic workcell |
| US11328947B1 (en) * | 2021-01-26 | 2022-05-10 | Kawasaki Jukogyo Kabushiki Kaisha | Aligner apparatus and alignment method |
-
2019
- 2019-10-02 JP JP2019181870A patent/JP7319162B2/ja active Active
-
2020
- 2020-09-18 CN CN202080069453.3A patent/CN114503247A/zh active Pending
- 2020-09-18 US US17/765,374 patent/US12084288B2/en active Active
- 2020-09-18 WO PCT/JP2020/035501 patent/WO2021065576A1/ja not_active Ceased
- 2020-09-18 KR KR1020227014040A patent/KR20220074905A/ko active Pending
- 2020-09-24 TW TW109133007A patent/TWI880957B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154900A (ja) * | 1996-11-25 | 1998-06-09 | Hitachi Ltd | 電子部品実装用プリント基板の故障解析方法およびシステム |
| JP2016045852A (ja) * | 2014-08-26 | 2016-04-04 | 株式会社日立パワーソリューションズ | 異常診断装置及び異常診断方法 |
| JP2017157652A (ja) * | 2016-03-01 | 2017-09-07 | パナソニックIpマネジメント株式会社 | 部品実装用装置及び基板搬送方法 |
| WO2018041378A1 (en) * | 2016-08-29 | 2018-03-08 | Siemens Aktiengesellschaft | Method and system for anomaly detection in a manufacturing system |
| WO2018230645A1 (ja) * | 2017-06-14 | 2018-12-20 | 株式会社東芝 | 異常検知装置、異常検知方法、およびプログラム |
| TW201915727A (zh) * | 2017-09-18 | 2019-04-16 | 元智大學 | 多元感測器之錯誤偵測與分類方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220363487A1 (en) | 2022-11-17 |
| JP7319162B2 (ja) | 2023-08-01 |
| CN114503247A (zh) | 2022-05-13 |
| US12084288B2 (en) | 2024-09-10 |
| TW202128533A (zh) | 2021-08-01 |
| JP2021054632A (ja) | 2021-04-08 |
| KR20220074905A (ko) | 2022-06-03 |
| WO2021065576A1 (ja) | 2021-04-08 |
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