JP7319162B2 - 搬送異常予測システム - Google Patents

搬送異常予測システム Download PDF

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Publication number
JP7319162B2
JP7319162B2 JP2019181870A JP2019181870A JP7319162B2 JP 7319162 B2 JP7319162 B2 JP 7319162B2 JP 2019181870 A JP2019181870 A JP 2019181870A JP 2019181870 A JP2019181870 A JP 2019181870A JP 7319162 B2 JP7319162 B2 JP 7319162B2
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JP
Japan
Prior art keywords
transport
abnormality
substrate
data set
transfer
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JP2019181870A
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English (en)
Japanese (ja)
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JP2021054632A5 (enExample
JP2021054632A (ja
Inventor
顕 中村
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Ebara Corp
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Ebara Corp
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Filing date
Publication date
Priority to JP2019181870A priority Critical patent/JP7319162B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US17/765,374 priority patent/US12084288B2/en
Priority to PCT/JP2020/035501 priority patent/WO2021065576A1/ja
Priority to CN202080069453.3A priority patent/CN114503247A/zh
Priority to KR1020227014040A priority patent/KR20220074905A/ko
Priority to TW109133007A priority patent/TWI880957B/zh
Publication of JP2021054632A publication Critical patent/JP2021054632A/ja
Publication of JP2021054632A5 publication Critical patent/JP2021054632A5/ja
Application granted granted Critical
Publication of JP7319162B2 publication Critical patent/JP7319162B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/02—Control devices, e.g. for safety, warning or fault-correcting detecting dangerous physical condition of load carriers, e.g. for interrupting the drive in the event of overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/047—Probabilistic or stochastic networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/049—Temporal neural networks, e.g. delay elements, oscillating neurons or pulsed inputs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0266—Control or detection relating to the load carrier(s)
    • B65G2203/0275—Damage on the load carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0266—Control or detection relating to the load carrier(s)
    • B65G2203/0291—Speed of the load carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • B65G2203/044—Optical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • B65G2203/045—Thermic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computational Linguistics (AREA)
  • Computing Systems (AREA)
  • Molecular Biology (AREA)
  • Data Mining & Analysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Probability & Statistics with Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Control Of Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2019181870A 2019-10-02 2019-10-02 搬送異常予測システム Active JP7319162B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019181870A JP7319162B2 (ja) 2019-10-02 2019-10-02 搬送異常予測システム
PCT/JP2020/035501 WO2021065576A1 (ja) 2019-10-02 2020-09-18 搬送異常予測システム
CN202080069453.3A CN114503247A (zh) 2019-10-02 2020-09-18 搬送异常预测系统
KR1020227014040A KR20220074905A (ko) 2019-10-02 2020-09-18 반송 이상 예측 시스템
US17/765,374 US12084288B2 (en) 2019-10-02 2020-09-18 Conveyance abnormality prediction system
TW109133007A TWI880957B (zh) 2019-10-02 2020-09-24 搬送異常預測系統及搬送異常預測方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019181870A JP7319162B2 (ja) 2019-10-02 2019-10-02 搬送異常予測システム

Publications (3)

Publication Number Publication Date
JP2021054632A JP2021054632A (ja) 2021-04-08
JP2021054632A5 JP2021054632A5 (enExample) 2022-08-08
JP7319162B2 true JP7319162B2 (ja) 2023-08-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019181870A Active JP7319162B2 (ja) 2019-10-02 2019-10-02 搬送異常予測システム

Country Status (6)

Country Link
US (1) US12084288B2 (enExample)
JP (1) JP7319162B2 (enExample)
KR (1) KR20220074905A (enExample)
CN (1) CN114503247A (enExample)
TW (1) TWI880957B (enExample)
WO (1) WO2021065576A1 (enExample)

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JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
US12227847B2 (en) * 2021-03-31 2025-02-18 Applied Materials, Inc. Level monitoring and active adjustment of a substrate support assembly
JP7166395B1 (ja) 2021-06-23 2022-11-07 セイコーソリューションズ株式会社 監視システム、監視方法、及び監視プログラム
JP7501547B2 (ja) * 2021-06-30 2024-06-18 株式会社デンソー 設備状態監視システム
JP2024153954A (ja) * 2021-07-08 2024-10-30 株式会社Preferred Networks データ処理装置およびプログラム
JP2023023394A (ja) * 2021-08-05 2023-02-16 株式会社荏原製作所 基板支持装置、洗浄装置、基板の回転速度を算出する装置ならびに方法、および機械学習装置
JP7288486B2 (ja) * 2021-09-17 2023-06-07 株式会社Kokusai Electric 基板処理方法、基板処理装置、半導体装置の製造方法、及びプログラム
KR102709677B1 (ko) * 2021-11-26 2024-09-26 울랄라랩 주식회사 비전센서 기반의 컨베이어 장치에 대한 예지보전 장치 및 방법
CN114655655B (zh) * 2022-03-09 2024-07-26 南京北路软件技术有限公司 一种基于UNet网络的传送带跑偏检测方法
TWI804405B (zh) * 2022-08-04 2023-06-01 友達光電股份有限公司 振動偵測方法及振動偵測裝置
CN117302897B (zh) * 2023-11-23 2024-01-26 常州市传动输送机械有限公司 一种带式输送机智能监测防控方法及系统
KR102768348B1 (ko) * 2024-04-25 2025-02-19 슈어데이터랩 주식회사 머신러닝 기반의 냉동공조기용 고장 예측 시스템 및 이를 이용한 방법

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JP2017157652A (ja) 2016-03-01 2017-09-07 パナソニックＩｐマネジメント株式会社 部品実装用装置及び基板搬送方法

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JP2017157652A (ja) 2016-03-01 2017-09-07 パナソニックＩｐマネジメント株式会社 部品実装用装置及び基板搬送方法

Also Published As

Publication number Publication date
US20220363487A1 (en) 2022-11-17
CN114503247A (zh) 2022-05-13
US12084288B2 (en) 2024-09-10
TW202128533A (zh) 2021-08-01
JP2021054632A (ja) 2021-04-08
KR20220074905A (ko) 2022-06-03
TWI880957B (zh) 2025-04-21
WO2021065576A1 (ja) 2021-04-08

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