TWI879847B - 樹脂片以及印刷電路板 - Google Patents

樹脂片以及印刷電路板 Download PDF

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Publication number
TWI879847B
TWI879847B TW109144151A TW109144151A TWI879847B TW I879847 B TWI879847 B TW I879847B TW 109144151 A TW109144151 A TW 109144151A TW 109144151 A TW109144151 A TW 109144151A TW I879847 B TWI879847 B TW I879847B
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TW
Taiwan
Prior art keywords
compound
resin composition
resin
mass
parts
Prior art date
Application number
TW109144151A
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English (en)
Chinese (zh)
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TW202130509A (zh
Inventor
川下和晃
平野俊介
喜多村慎也
杉本憲明
小松晃樹
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日商三菱瓦斯化學股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
TW109144151A 2019-12-17 2020-12-15 樹脂片以及印刷電路板 TWI879847B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019227427 2019-12-17
JP2019-227427 2019-12-17

Publications (2)

Publication Number Publication Date
TW202130509A TW202130509A (zh) 2021-08-16
TWI879847B true TWI879847B (zh) 2025-04-11

Family

ID=76477548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109144151A TWI879847B (zh) 2019-12-17 2020-12-15 樹脂片以及印刷電路板

Country Status (5)

Country Link
JP (1) JP7705609B2 (enrdf_load_stackoverflow)
KR (1) KR20220116436A (enrdf_load_stackoverflow)
CN (1) CN114845874B (enrdf_load_stackoverflow)
TW (1) TWI879847B (enrdf_load_stackoverflow)
WO (1) WO2021125121A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845363B (zh) * 2023-06-29 2024-06-11 南亞塑膠工業股份有限公司 改質萘酚樹脂及其製備方法及包含其的樹脂組合物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
TW201233702A (en) * 2011-01-20 2012-08-16 Mitsubishi Gas Chemical Co Resin composition, prepreg and laminate
CN102844350A (zh) * 2010-03-02 2012-12-26 三菱瓦斯化学株式会社 树脂组合物、预浸料及层压板
CN103183926A (zh) * 2011-12-28 2013-07-03 日立化成工业株式会社 树脂组合物及其片材和片材制法、布线板材料、布线板、光源部件及半导体装置
TW201422725A (zh) * 2012-10-19 2014-06-16 Mitsubishi Gas Chemical Co 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板及印刷電路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126817A1 (ja) * 2007-04-11 2008-10-23 Hitachi Chemical Company, Ltd. 金属箔張り積層板およびプリント配線板
CN103347930B (zh) 2011-02-04 2015-06-24 三菱瓦斯化学株式会社 固化性树脂组合物及其固化物
KR101528444B1 (ko) * 2012-03-16 2015-06-11 스미토모 베이클리트 컴퍼니 리미티드 적층판 및 프린트 배선판의 제조 방법
JP6398824B2 (ja) 2015-03-23 2018-10-03 味の素株式会社 樹脂シート
JP6471622B2 (ja) 2015-06-18 2019-02-20 住友ベークライト株式会社 ビルドアップ材、積層板、プリント配線基板、半導体装置および積層板の製造方法
JP6750202B2 (ja) 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
KR102431012B1 (ko) * 2016-12-28 2022-08-10 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판용 수지 조성물, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판
JP6681055B2 (ja) 2017-12-27 2020-04-15 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
JP6999459B2 (ja) * 2018-03-22 2022-01-18 太陽インキ製造株式会社 ドライフィルム、硬化物、および、電子部品
CN112004855B (zh) 2018-04-20 2024-01-12 三菱瓦斯化学株式会社 热固化性组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
CN102844350A (zh) * 2010-03-02 2012-12-26 三菱瓦斯化学株式会社 树脂组合物、预浸料及层压板
TW201233702A (en) * 2011-01-20 2012-08-16 Mitsubishi Gas Chemical Co Resin composition, prepreg and laminate
CN103183926A (zh) * 2011-12-28 2013-07-03 日立化成工业株式会社 树脂组合物及其片材和片材制法、布线板材料、布线板、光源部件及半导体装置
TW201422725A (zh) * 2012-10-19 2014-06-16 Mitsubishi Gas Chemical Co 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板及印刷電路板

Also Published As

Publication number Publication date
JP7705609B2 (ja) 2025-07-10
JPWO2021125121A1 (enrdf_load_stackoverflow) 2021-06-24
TW202130509A (zh) 2021-08-16
WO2021125121A1 (ja) 2021-06-24
CN114845874A (zh) 2022-08-02
KR20220116436A (ko) 2022-08-23
CN114845874B (zh) 2024-08-23

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