WO2021125121A1 - 樹脂シート、及びプリント配線板 - Google Patents

樹脂シート、及びプリント配線板 Download PDF

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Publication number
WO2021125121A1
WO2021125121A1 PCT/JP2020/046454 JP2020046454W WO2021125121A1 WO 2021125121 A1 WO2021125121 A1 WO 2021125121A1 JP 2020046454 W JP2020046454 W JP 2020046454W WO 2021125121 A1 WO2021125121 A1 WO 2021125121A1
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Prior art keywords
compound
resin
resin composition
less
mass
Prior art date
Application number
PCT/JP2020/046454
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English (en)
French (fr)
Japanese (ja)
Inventor
和晃 川下
平野　俊介
慎也 喜多村
憲明 杉本
晃樹 小松
Original Assignee
三菱瓦斯化学株式会社
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Application filed by 三菱瓦斯化学株式会社 filed Critical 三菱瓦斯化学株式会社
Priority to JP2021565567A priority Critical patent/JP7705609B2/ja
Priority to CN202080087628.3A priority patent/CN114845874B/zh
Priority to KR1020227017750A priority patent/KR20220116436A/ko
Publication of WO2021125121A1 publication Critical patent/WO2021125121A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • Patent Document 1 describes a resin sheet that has a support and an adhesive layer and whose warpage is reduced in a high temperature environment when applied to a printed wiring board.
  • Patent Document 1 since the warp is reduced by reducing the coefficient of thermal expansion, the warp of the printed wiring board cannot be sufficiently reduced. Therefore, further improvement is desired with respect to the reduction of warpage.
  • Patent Document 2 has good physical properties such as low water absorption and low coefficient of thermal expansion, but there is still room for improvement from the viewpoint of thermal conductivity. Therefore, when it is used as a resin sheet as an insulating material in a printed wiring board, its heat resistance is insufficient and it is difficult to apply it to an insulating material.
  • Patent Document 3 describes a build-up material that suppresses scratches on the surface, but the build-up material described in Patent Document 3 contains a large amount of an inorganic filler, so that the surface has a high hardness. (Vickers hardness (HV0.01) is 32.8 or more and 93.9 or less).
  • R 4a and R 5a each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms
  • R 4b each independently represents a hydrogen atom or a methyl group.
  • s represents an integer of 1 or more.
  • 1 g of resin powder collected from the layer containing the resin composition is used as a sample, and the minimum melt viscosity is measured with a rheometer (ARES-G2 (trade name) manufactured by TA Instruments).
  • a rheometer (trade name) manufactured by TA Instruments).
  • a disposable plate having a plate diameter of 25 mm is used, and the resin is used under the conditions of a heating rate of 2 ° C./min, a frequency of 10.0 rad / sec, and a strain of 0.1% in a range of 40 ° C. or higher and 180 ° C. or lower. Measure the minimum melt viscosity of the powder.
  • the Vickers hardness (HV0.01) of the cured product (C stage) when the resin composition is cured is 10 or more and 19 or less, and since it has more appropriate rigidity, it is 11 or more. It is preferably 19 or less, and more preferably 12 or more and 19 or less.
  • Examples of the novolak type cyanate ester compound include a compound represented by the following formula (1).
  • the aralkyl-type cyanate ester compound is not particularly limited, and examples thereof include ⁇ -naphthol aralkyl-type cyanate ester compound and biphenyl aralkyl-type cyanate ester compound.
  • the ⁇ -naphthol aralkyl type cyanate ester compound is a compound having a polycyclic aromatic compound.
  • the biphenyl aralkyl type cyanate ester compound is a compound having a biphenyl skeleton.
  • diallyl bisphenol E, diallyl bisphenol F, diallyl bisphenol S, etc. bisphenol type phenol resin
  • bisphenol type phenol resin for example, bisphenol A type resin, bisphenol E type resin, bisphenol F type resin, bisphenol S type resin, etc.
  • phenols Novorak Resins eg, phenol novolac resin, naphthol novolac resin, cresol novolac resin, etc.
  • glycidyl ester type phenol resin eg, phenol novolac resin, naphthol novolac resin, cresol novolac resin, etc.
  • glycidyl ester type phenol resin glycidyl ester type phenol resin
  • naphthalene type phenol resin, anthracene type phenol resin dicyclopentadiene type phenol resin
  • biphenyl type phenol resin alicyclic type Examples thereof include phenol resins, polyol-type phenol resins, aralkyl-type phenol resins, and
  • phenol compounds may be used alone or in combination of two or more.
  • examples of such a compound include a biphenyl type phenol resin.
  • the phenolic compound contains a compound having a polycyclic aromatic, such compounds include, for example, naphthol novolac resin, cresol novolac resin, naphthalene type phenol resin, and anthracene type phenol resin.
  • phenol-modified aromatic hydrocarbon formaldehyde resin refers to heating an aromatic hydrocarbon formaldehyde resin and phenols in the presence of an acidic catalyst (for example, paratoluenesulfonic acid, oxalic acid, etc.).
  • an acidic catalyst for example, paratoluenesulfonic acid, oxalic acid, etc.
  • a resin obtained by subjecting formaldehyde to a condensation reaction modification condensation reaction
  • aralkyl type epoxy resin naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, bisphenol A type structural unit and hydrocarbon-based structure It is preferably one or more selected from the group consisting of epoxy resins consisting of units.
  • epoxy resins consisting of units.
  • two or more types of epoxy compounds can be used.
  • the biphenyl aralkyl type epoxy resin is preferably a compound represented by the following formula (3b) from the viewpoint of further excellent heat resistance and low water absorption of the obtained cured product.
  • kz is synonymous with kz in the above formula (3d).
  • k1 represents an integer of 0 or more and 10 or less, and preferably represents an integer of 0 or more and 6 or less from the viewpoint of more effectively and surely performing the action and effect of the present embodiment. It is more preferable to represent the following integer, and it is further preferable that it is 2 or 3.
  • the naphthylene ether type epoxy resin contains the compound represented by the above formula (3 g), it may contain a plurality of types of compounds having the same k1 or may contain a plurality of types of compounds having different k1s.
  • the naphthylene ether type epoxy resin contains a plurality of types of compounds having different k1
  • it is preferable that the naphthylene ether type epoxy resin contains a compound in which k1 is an integer of 0 or more and 4 or less in the above formula (3 g), and a compound having 2 or 3 is used. It is more preferable to include it.
  • dicyclopentadiene type epoxy resin examples include compounds represented by the following formula (3i). It is preferable that the resin composition contains a dicyclopentadiene type epoxy resin because a resin layer having a more appropriate hardness can be obtained.
  • the above-mentioned phenol group amount means the total value of the phenol group amounts of each phenol compound, and when there are a plurality of types of cyanate ester compounds, the above cyanate.
  • the group amount refers to the total value of the cyanate group amounts of each cyanate ester compound, and when there are a plurality of types of epoxy compounds, the above epoxy group amount is the total value of the epoxy group amounts of each epoxy compound.
  • polymaleimide compound examples include a compound represented by the following formula (4a); 2,2-bis (4- (4-maleimidephenoxy) -phenyl) propane, and 1,6-bismaleimide- (2,2). , 4-trimethyl)
  • a maleimide group is bonded to both ends of a linear or branched alkyl chain such as hexane (however, a compound other than the compound represented by the following formula (4a)); bis (4-maleimide phenoxy).
  • the resin composition according to the present embodiment is not particularly limited, but may contain other resins.
  • other resins include alkenyl-substituted nadiimide compounds, oxetane resins, benzoxazine compounds, and compounds having a polymerizable unsaturated group. These resins may be used alone or in combination of two or more.
  • the core-shell rubber examples include methacrylic acid ester / styrene / butadiene rubber graft copolymer, acrylonitrile / styrene / butadiene rubber graft copolymer, acrylonitrile / styrene / ethylene / propylene rubber graft copolymer, and acrylonitrile / styrene / acrylic acid.
  • ester graft copolymers methacrylic acid ester / acrylic acid ester rubber graft copolymers, and methacrylic acid ester / acrylonitrile / acrylic acid ester rubber graft copolymers.
  • the warp of the printed wiring board can be reduced, cracks are less likely to occur in the insulating layer of the printed wiring board, and cracks and circuit distortion of the insulating layer are less likely to occur.
  • the content of the inorganic filler is 60 parts by mass or less, preferably 55 parts by mass or less, and more preferably 45 parts by mass or less with respect to 100 parts by mass of the resin solid content in the resin composition. ..
  • the lower limit is not particularly limited, but is preferably 1 part by mass or more from the viewpoint of further suppressing the warp of the printed wiring board.
  • the inorganic filler examples include metal oxides (eg, silica, alumina, titanium white, zinc oxide, magnesium oxide, and zirconium oxide); metal nitrides (eg, boron nitride, coagulated boron nitride, silicon nitride, and the like). (Aluminum nitride, etc.); Metal sulfated product (for example, barium sulfate, etc.); Metal hydroxide (for example, aluminum hydroxide, aluminum hydroxide heat-treated product (for example, aluminum hydroxide is heat-treated to remove a part of crystalline water).
  • metal oxides eg, silica, alumina, titanium white, zinc oxide, magnesium oxide, and zirconium oxide
  • metal nitrides eg, boron nitride, coagulated boron nitride, silicon nitride, and the like.
  • Metal sulfated product for example, barium sulf
  • the resin composition according to this embodiment preferably contains a silane coupling agent.
  • a silane coupling agent by containing the silane coupling agent, the adhesive strength between the components of the resin composition according to the present embodiment and the substrate in the support and the printed wiring board tends to be further improved.
  • the content of the wet dispersant is preferably 1 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the resin solid content.
  • the lower limit of the content is more preferably 1.5 parts by mass and further preferably 2 parts by mass.
  • the resin composition according to this embodiment may contain a solvent.
  • the viscosity of the resin composition at the time of preparation is lowered, the handleability (handleability) is further improved, and the impregnation property to the support tends to be further improved. ..
  • the solvent is not particularly limited as long as it can dissolve a part or all of the resin component in the resin composition.
  • Solvents include, for example, ketones (eg, acetone, methyl ethyl ketone, and methyl cellsolve); aromatic hydrocarbons (eg, toluene, and xylene, etc.); amides (eg, dimethyl formaldehyde, etc.); propylene glycol monomethyl. Examples thereof include ether and its acetate. These solvents may be used alone or in combination of two or more.
  • a method for producing the resin composition according to the present embodiment for example, a method obtained by mixing each component collectively or sequentially, or a method in which each component is collectively or sequentially blended with a solvent is used.
  • examples thereof include a method of obtaining the varnish in the form of a varnish dissolved or dispersed in a solvent by stirring.
  • known treatments such as stirring, mixing, and kneading are used.
  • the solvent is as described above. Examples can be referred to for specific manufacturing methods.
  • the resin sheet of the present embodiment may be used for the laminated board.
  • the laminated board contains one or more layers containing a cured product of the resin composition in the resin sheet of the present embodiment, and when a plurality of layers are contained, the layer containing the cured product is laminated or a metal. It has a form of being laminated via a conductive layer such as a foil.
  • the laminated board has sufficiently reduced warpage, and cracks are less likely to occur in the layer containing the cured product, so that the layer containing the cured product is less likely to be cracked and has excellent heat resistance. And has high peel strength.
  • the resin sheet of the present embodiment may be used for the metal leaf-clad laminate.
  • the metal foil-clad laminate includes a layer containing a cured product of the resin composition and metal foils arranged on one or both sides of the layer containing the cured product.
  • the metal leaf-clad laminate includes one or more layers containing a cured product of the resin composition in the resin sheet of the present embodiment.
  • the metal foil-clad laminate has a form in which the metal foil is arranged on one side or both sides of the layer containing the cured product.
  • the printed wiring board of the present embodiment includes, in the resin sheet of the present embodiment, a layer containing a cured product of the resin composition and a conductor layer arranged on the surface of the layer containing the cured product.
  • the printed wiring board of the present embodiment can be formed, for example, by etching the metal foil of the metal foil-clad laminate into a predetermined wiring pattern to form a conductor layer.
  • the printed wiring board of the present embodiment is sufficiently reduced in warpage, and cracks are less likely to occur in the layer containing the cured product, so that the layer containing the cured product is less likely to be cracked and has excellent heat resistance. Has sex and high peel strength.
  • the metal plating step of forming a conductor layer on a layer containing a resin composition is, for example, a method of combining electroless plating and electrolytic plating on the surface of a layer containing a resin composition having irregularities formed by roughening treatment. It is done by forming a layer or by forming a conductor layer only by electroless plating.
  • the conductor layer can be formed of a metal such as copper, aluminum, nickel, silver, and gold, an alloy of these metals, and the like, but copper is more preferable.
  • the copper plating layer can be formed by a method combining electroless copper plating and electrolytic copper plating, or by forming a plating resist having a pattern opposite to that of the conductor layer, and forming the conductor layer only by electroless copper plating.
  • the resin sheet of the present embodiment may be used for the multilayer printed wiring board.
  • the multilayer printed wiring board is, for example, a plurality of insulating layers composed of a first insulating layer and one or a plurality of second insulating layers laminated on one side of the first insulating layer, and a plurality of insulating layers.
  • the first insulating layer has a plurality of conductor layers composed of a first conductor layer arranged between each of the above and a second conductor layer arranged on the surface of the outermost layer of the plurality of insulating layers.
  • the second insulating layer is an insulating layer formed of a cured product of the resin composition in the resin sheet of the present embodiment, respectively.
  • the multilayer printed wiring board examples include a so-called coreless type multilayer printed wiring board (multilayer coreless substrate) in which a second insulating layer is laminated only in one side direction of the first insulating layer.
  • the warp of the multilayer printed wiring board is sufficiently reduced, and cracks occur in the layer containing the cured product. Is unlikely to occur, so that the layer containing the cured product is less likely to crack, and has excellent heat resistance and high peel strength. Therefore, in the present embodiment, it can be effectively used as a multilayer coreless substrate for a semiconductor package.
  • Biphenyl aralkyl type phenol compound (KAYAHARD (registered trademark) GPH-103 (trade name), manufactured by Nippon Kayaku Co., Ltd., hydroxyl group equivalent: 231 g / eq., Represented by the above formula (2c), R 2b in the formula All are hydrogen atoms, and the number of repeating units m1 is 1 or more and 6 or less) 36 parts by mass, biphenyl aralkyl type epoxy resin (NC-3000FH (trade name), epoxy equivalent: 320 g / eq., Nippon Kayaku Co., Ltd.
  • NC-3000FH trade name
  • Example 1 In Example 1, 80 parts by mass of slurry silica (SC2050-MB (trade name), average particle size 0.7 ⁇ m) was further added to obtain a varnish (resin composition) in the same manner as in Example 1. A resin sheet having a B-staged layer containing the resin composition and having a thickness of the layer containing the resin composition of 5 ⁇ m or 20 ⁇ m was obtained.
  • SC2050-MB trade name
  • average particle size 0.7 ⁇ m

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
PCT/JP2020/046454 2019-12-17 2020-12-14 樹脂シート、及びプリント配線板 WO2021125121A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021565567A JP7705609B2 (ja) 2019-12-17 2020-12-14 樹脂シート、及びプリント配線板
CN202080087628.3A CN114845874B (zh) 2019-12-17 2020-12-14 树脂片和印刷电路板
KR1020227017750A KR20220116436A (ko) 2019-12-17 2020-12-14 수지 시트, 및 프린트 배선판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019227427 2019-12-17
JP2019-227427 2019-12-17

Publications (1)

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WO2021125121A1 true WO2021125121A1 (ja) 2021-06-24

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KR (1) KR20220116436A (enrdf_load_stackoverflow)
CN (1) CN114845874B (enrdf_load_stackoverflow)
TW (1) TWI879847B (enrdf_load_stackoverflow)
WO (1) WO2021125121A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025009705A (ja) * 2023-06-29 2025-01-20 南亞塑膠工業股▲分▼有限公司 変性ナフトール樹脂およびその製造方法およびそれを含む樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
WO2012099162A1 (ja) * 2011-01-20 2012-07-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
JP2017075221A (ja) * 2015-10-14 2017-04-20 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
WO2019131574A1 (ja) * 2017-12-27 2019-07-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
WO2019203291A1 (ja) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 熱硬化性組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126817A1 (ja) * 2007-04-11 2008-10-23 Hitachi Chemical Company, Ltd. 金属箔張り積層板およびプリント配線板
KR102002178B1 (ko) * 2010-03-02 2019-10-21 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
CN103347930B (zh) 2011-02-04 2015-06-24 三菱瓦斯化学株式会社 固化性树脂组合物及其固化物
JP6123277B2 (ja) * 2011-12-28 2017-05-10 日立化成株式会社 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、ｂステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、ｌｅｄ光源部材、並びにパワー半導体装置
KR101528444B1 (ko) * 2012-03-16 2015-06-11 스미토모 베이클리트 컴퍼니 리미티드 적층판 및 프린트 배선판의 제조 방법
CN104736589B (zh) * 2012-10-19 2017-05-24 三菱瓦斯化学株式会社 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷电路板
JP6398824B2 (ja) 2015-03-23 2018-10-03 味の素株式会社 樹脂シート
JP6471622B2 (ja) 2015-06-18 2019-02-20 住友ベークライト株式会社 ビルドアップ材、積層板、プリント配線基板、半導体装置および積層板の製造方法
KR102431012B1 (ko) * 2016-12-28 2022-08-10 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판용 수지 조성물, 프리프레그, 레진 시트, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판
JP6999459B2 (ja) * 2018-03-22 2022-01-18 太陽インキ製造株式会社 ドライフィルム、硬化物、および、電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
WO2012099162A1 (ja) * 2011-01-20 2012-07-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
JP2017075221A (ja) * 2015-10-14 2017-04-20 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
WO2019131574A1 (ja) * 2017-12-27 2019-07-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
WO2019203291A1 (ja) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 熱硬化性組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025009705A (ja) * 2023-06-29 2025-01-20 南亞塑膠工業股▲分▼有限公司 変性ナフトール樹脂およびその製造方法およびそれを含む樹脂組成物

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