TWI877100B - 聚醯亞胺的製造方法 - Google Patents

聚醯亞胺的製造方法 Download PDF

Info

Publication number
TWI877100B
TWI877100B TW107129037A TW107129037A TWI877100B TW I877100 B TWI877100 B TW I877100B TW 107129037 A TW107129037 A TW 107129037A TW 107129037 A TW107129037 A TW 107129037A TW I877100 B TWI877100 B TW I877100B
Authority
TW
Taiwan
Prior art keywords
component
polyimide
diamine
dimer
dimer diamine
Prior art date
Application number
TW107129037A
Other languages
English (en)
Chinese (zh)
Other versions
TW201918504A (zh
Inventor
山田裕明
柿坂康太
須藤芳樹
西山哲平
平石克文
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW201918504A publication Critical patent/TW201918504A/zh
Application granted granted Critical
Publication of TWI877100B publication Critical patent/TWI877100B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW107129037A 2017-09-29 2018-08-21 聚醯亞胺的製造方法 TWI877100B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-191995 2017-09-29
JP2017191995A JP7486279B2 (ja) 2017-09-29 2017-09-29 ポリイミドの製造方法

Publications (2)

Publication Number Publication Date
TW201918504A TW201918504A (zh) 2019-05-16
TWI877100B true TWI877100B (zh) 2025-03-21

Family

ID=65919701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129037A TWI877100B (zh) 2017-09-29 2018-08-21 聚醯亞胺的製造方法

Country Status (4)

Country Link
JP (3) JP7486279B2 (enrdf_load_stackoverflow)
KR (1) KR102610515B1 (enrdf_load_stackoverflow)
CN (1) CN109575282A (enrdf_load_stackoverflow)
TW (1) TWI877100B (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7486279B2 (ja) * 2017-09-29 2024-05-17 日鉄ケミカル＆マテリアル株式会社 ポリイミドの製造方法
JP7271146B2 (ja) * 2017-12-28 2023-05-11 日鉄ケミカル＆マテリアル株式会社 ダイマージアミン組成物、その製造方法及び樹脂フィルム
JP2021070824A (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
CN112778522A (zh) * 2019-11-07 2021-05-11 住友化学株式会社 聚酰胺酰亚胺树脂、光学膜及柔性显示装置
JP2021147610A (ja) * 2020-03-17 2021-09-27 日鉄ケミカル＆マテリアル株式会社 ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板
JP7578408B2 (ja) * 2020-03-31 2024-11-06 日鉄ケミカル＆マテリアル株式会社 ポリイミド、ポリイミド組成物、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板
JP2023083146A (ja) * 2021-12-03 2023-06-15 住友化学株式会社 ポリイミド系樹脂の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201410739A (zh) * 2012-08-24 2014-03-16 Croda Int Plc 聚醯亞胺組合物
TW201710454A (zh) * 2015-03-31 2017-03-16 Arakawa Chemical Industries Ltd 黏著劑組成物、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂的銅箔、覆銅積層板、可撓性覆銅積層板、印刷線路板、可撓性印刷線路板、多層線路板、印刷電路板及可撓性印刷電路板
TW201805337A (zh) * 2016-03-30 2018-02-16 荒川化學工業股份有限公司 聚醯亞胺、聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂之銅箔、覆銅積層板及印刷線路板、以及多層線路板及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5777944B2 (ja) * 2011-06-13 2015-09-09 新日鉄住金化学株式会社 架橋ポリイミド樹脂、接着剤樹脂組成物及びその硬化物、カバーレイフィルム並びに回路基板
JP5902139B2 (ja) * 2013-11-01 2016-04-13 新日鉄住金化学株式会社 ポリイミド樹脂組成物
JP6635403B2 (ja) 2014-12-26 2020-01-22 荒川化学工業株式会社 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板
WO2016171101A1 (ja) * 2015-04-20 2016-10-27 宇部興産株式会社 ポリイミド、硬化性樹脂組成物、硬化物
KR102524336B1 (ko) * 2015-09-30 2023-04-20 아라까와 가가꾸 고교 가부시끼가이샤 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판
CN106947079B (zh) * 2015-09-30 2021-08-03 荒川化学工业株式会社 改性聚酰亚胺、胶粘剂组合物、带树脂的铜箔、覆铜层叠板、印刷布线板和多层基板
JP6790816B2 (ja) * 2015-12-28 2020-11-25 荒川化学工業株式会社 ポリイミド系接着剤
JP6679957B2 (ja) * 2016-02-01 2020-04-15 東洋インキＳｃホールディングス株式会社 接合剤、および該接合剤で接合されてなる物品
JP7486279B2 (ja) * 2017-09-29 2024-05-17 日鉄ケミカル＆マテリアル株式会社 ポリイミドの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201410739A (zh) * 2012-08-24 2014-03-16 Croda Int Plc 聚醯亞胺組合物
TW201710454A (zh) * 2015-03-31 2017-03-16 Arakawa Chemical Industries Ltd 黏著劑組成物、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂的銅箔、覆銅積層板、可撓性覆銅積層板、印刷線路板、可撓性印刷線路板、多層線路板、印刷電路板及可撓性印刷電路板
TW201805337A (zh) * 2016-03-30 2018-02-16 荒川化學工業股份有限公司 聚醯亞胺、聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂之銅箔、覆銅積層板及印刷線路板、以及多層線路板及其製造方法

Also Published As

Publication number Publication date
JP2019065181A (ja) 2019-04-25
JP7486279B2 (ja) 2024-05-17
TW201918504A (zh) 2019-05-16
CN109575282A (zh) 2019-04-05
JP7549724B2 (ja) 2024-09-11
KR20190038361A (ko) 2019-04-08
JP2022066412A (ja) 2022-04-28
JP2024003240A (ja) 2024-01-11
KR102610515B1 (ko) 2023-12-07

Similar Documents

Publication Publication Date Title
TWI877100B (zh) 聚醯亞胺的製造方法
CN110964319B (zh) 树脂膜、聚酰亚胺、粘接剂树脂组合物及其利用
JP7469537B2 (ja) ポリイミドの製造方法
CN114656874B (zh) 聚酰亚胺组合物、树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板及电路基板
TWI864246B (zh) 樹脂膜、覆金屬層疊板及電路基板
JP2018203959A (ja) ポリイミド及び感光性樹脂組成物
JP2021070824A (ja) ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
JP2022158993A (ja) ボンドプライ、これを用いる回路基板及びストリップライン
CN115141369A (zh) 树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板、电路基板及多层电路基板
TW202126128A (zh) 覆金屬層疊板及電路基板
JP7410716B2 (ja) 樹脂組成物及び樹脂フィルム
JP7398277B2 (ja) 樹脂組成物及び樹脂フィルム
JP7598756B2 (ja) 樹脂フィルム、金属張積層板及び回路基板
JP2024141762A (ja) 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
CN119677796A (zh) 聚酰亚胺树脂清漆的制造方法
KR20240162053A (ko) 중합체의 제조방법, 바니시, 및 바니시의 제조방법
WO2025121335A1 (ja) ポリイミドワニスの製造方法
JP2011074287A (ja) ポリイミド、その製造方法及びポリアミド酸