TWI874778B - 陶瓷加熱器及保持構件 - Google Patents

陶瓷加熱器及保持構件 Download PDF

Info

Publication number
TWI874778B
TWI874778B TW111121800A TW111121800A TWI874778B TW I874778 B TWI874778 B TW I874778B TW 111121800 A TW111121800 A TW 111121800A TW 111121800 A TW111121800 A TW 111121800A TW I874778 B TWI874778 B TW I874778B
Authority
TW
Taiwan
Prior art keywords
pair
heating
heating element
folded
aforementioned
Prior art date
Application number
TW111121800A
Other languages
English (en)
Chinese (zh)
Other versions
TW202315458A (zh
Inventor
鈴木佳祐
Original Assignee
日商日本特殊陶業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本特殊陶業股份有限公司 filed Critical 日商日本特殊陶業股份有限公司
Publication of TW202315458A publication Critical patent/TW202315458A/zh
Application granted granted Critical
Publication of TWI874778B publication Critical patent/TWI874778B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111121800A 2021-06-17 2022-06-13 陶瓷加熱器及保持構件 TWI874778B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-100825 2021-06-17
JP2021100825A JP2023000165A (ja) 2021-06-17 2021-06-17 セラミックスヒータおよび保持部材

Publications (2)

Publication Number Publication Date
TW202315458A TW202315458A (zh) 2023-04-01
TWI874778B true TWI874778B (zh) 2025-03-01

Family

ID=84526180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111121800A TWI874778B (zh) 2021-06-17 2022-06-13 陶瓷加熱器及保持構件

Country Status (6)

Country Link
US (1) US20240244719A1 (https=)
JP (1) JP2023000165A (https=)
KR (1) KR20230156397A (https=)
CN (1) CN117296448A (https=)
TW (1) TWI874778B (https=)
WO (1) WO2022264729A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040108308A1 (en) * 2002-09-13 2004-06-10 Ngk Insulators, Ltd. Ceramic heater having a resistant heater element
TW201703581A (zh) * 2015-04-20 2017-01-16 日本特殊陶業股份有限公司 陶瓷加熱器及靜電夾頭
US20170032935A1 (en) * 2015-07-27 2017-02-02 Lam Research Corporation Electrostatic Chuck Including Embedded Faraday Cage for RF Delivery and Associated Methods for Operation, Monitoring, and Control
US20200006095A1 (en) * 2017-02-01 2020-01-02 Ngk Spark Plug Co., Ltd. Holding apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002015841A (ja) * 2000-04-29 2002-01-18 Ibiden Co Ltd セラミックヒータ
JP2003249330A (ja) * 2002-02-27 2003-09-05 Toshiba Ceramics Co Ltd 箔状抵抗発熱素子、その製造方法及び面状ヒーター
JP7025278B2 (ja) * 2018-05-01 2022-02-24 日本特殊陶業株式会社 セラミックスヒータ
WO2020170682A1 (ja) * 2019-02-22 2020-08-27 住友電気工業株式会社 ヒータ
JP7297637B2 (ja) * 2019-10-25 2023-06-26 京セラ株式会社 ヒータ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040108308A1 (en) * 2002-09-13 2004-06-10 Ngk Insulators, Ltd. Ceramic heater having a resistant heater element
TW201703581A (zh) * 2015-04-20 2017-01-16 日本特殊陶業股份有限公司 陶瓷加熱器及靜電夾頭
US20170032935A1 (en) * 2015-07-27 2017-02-02 Lam Research Corporation Electrostatic Chuck Including Embedded Faraday Cage for RF Delivery and Associated Methods for Operation, Monitoring, and Control
US20200006095A1 (en) * 2017-02-01 2020-01-02 Ngk Spark Plug Co., Ltd. Holding apparatus

Also Published As

Publication number Publication date
CN117296448A (zh) 2023-12-26
KR20230156397A (ko) 2023-11-14
JP2023000165A (ja) 2023-01-04
TW202315458A (zh) 2023-04-01
WO2022264729A1 (ja) 2022-12-22
US20240244719A1 (en) 2024-07-18

Similar Documents

Publication Publication Date Title
JP7216710B2 (ja) マルチゾーンヒータ
US11574822B2 (en) Wafer support table with ceramic substrate including core and surface layer
KR101427427B1 (ko) 가열 장치
JP5426892B2 (ja) 基板加熱装置
CN104472010B (zh) 陶瓷加热器加热丝的结构
KR102807409B1 (ko) 반도체 제조 장치용 부재
JP7587396B2 (ja) 保持装置
JP7257211B2 (ja) セラミックヒータ
WO2020153086A1 (ja) セラミックヒータ
TWI874778B (zh) 陶瓷加熱器及保持構件
JP2018005998A (ja) セラミックスヒータ
JP7411383B2 (ja) 加熱装置
JP2025066175A (ja) 保持装置
JP2023141826A (ja) 保持部材
JP7628867B2 (ja) 保持部材
JP7698572B2 (ja) 保持装置
JP2025038356A (ja) 保持部材および保持装置
JP2025038358A (ja) 保持部材および保持装置
JP7812936B2 (ja) セラミックサセプタ
JP7109273B2 (ja) 基板載置部材
JP7202326B2 (ja) セラミックヒータ
JP6871277B2 (ja) 試料保持具
WO2025115143A1 (ja) セラミックヒータ
JP2010244864A (ja) 基板加熱構造体
JP2026008107A (ja) セラミックヒータ