CN117296448A - 陶瓷加热器和保持构件 - Google Patents

陶瓷加热器和保持构件 Download PDF

Info

Publication number
CN117296448A
CN117296448A CN202280035314.8A CN202280035314A CN117296448A CN 117296448 A CN117296448 A CN 117296448A CN 202280035314 A CN202280035314 A CN 202280035314A CN 117296448 A CN117296448 A CN 117296448A
Authority
CN
China
Prior art keywords
pair
folded
heating
heating element
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280035314.8A
Other languages
English (en)
Chinese (zh)
Inventor
铃木佳祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN117296448A publication Critical patent/CN117296448A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280035314.8A 2021-06-17 2022-05-16 陶瓷加热器和保持构件 Pending CN117296448A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-100825 2021-06-17
JP2021100825A JP2023000165A (ja) 2021-06-17 2021-06-17 セラミックスヒータおよび保持部材
PCT/JP2022/020342 WO2022264729A1 (ja) 2021-06-17 2022-05-16 セラミックスヒータおよび保持部材

Publications (1)

Publication Number Publication Date
CN117296448A true CN117296448A (zh) 2023-12-26

Family

ID=84526180

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280035314.8A Pending CN117296448A (zh) 2021-06-17 2022-05-16 陶瓷加热器和保持构件

Country Status (6)

Country Link
US (1) US20240244719A1 (https=)
JP (1) JP2023000165A (https=)
KR (1) KR20230156397A (https=)
CN (1) CN117296448A (https=)
TW (1) TWI874778B (https=)
WO (1) WO2022264729A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002015841A (ja) * 2000-04-29 2002-01-18 Ibiden Co Ltd セラミックヒータ
JP2003249330A (ja) * 2002-02-27 2003-09-05 Toshiba Ceramics Co Ltd 箔状抵抗発熱素子、その製造方法及び面状ヒーター
JP4119211B2 (ja) * 2002-09-13 2008-07-16 日本碍子株式会社 加熱装置
JP6804828B2 (ja) * 2015-04-20 2020-12-23 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
US9673025B2 (en) * 2015-07-27 2017-06-06 Lam Research Corporation Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
US11631597B2 (en) * 2017-02-01 2023-04-18 Ngk Spark Plug Co., Ltd. Holding apparatus
JP7025278B2 (ja) * 2018-05-01 2022-02-24 日本特殊陶業株式会社 セラミックスヒータ
WO2020170682A1 (ja) * 2019-02-22 2020-08-27 住友電気工業株式会社 ヒータ
JP7297637B2 (ja) * 2019-10-25 2023-06-26 京セラ株式会社 ヒータ

Also Published As

Publication number Publication date
KR20230156397A (ko) 2023-11-14
JP2023000165A (ja) 2023-01-04
TW202315458A (zh) 2023-04-01
TWI874778B (zh) 2025-03-01
WO2022264729A1 (ja) 2022-12-22
US20240244719A1 (en) 2024-07-18

Similar Documents

Publication Publication Date Title
JP7613848B2 (ja) 保持装置
JP2020035905A (ja) 静電チャック装置および静電チャック装置の製造方法
WO2018179891A1 (ja) ウエハ保持体
JP7577558B2 (ja) 保持部材
JP7613992B2 (ja) 保持装置
JP7587396B2 (ja) 保持装置
JP4540407B2 (ja) 静電チャック
CN117296448A (zh) 陶瓷加热器和保持构件
JP2025066175A (ja) 保持装置
JP2025120410A (ja) 保持装置
JP7411383B2 (ja) 加熱装置
JP7628881B2 (ja) 保持装置
JP7628867B2 (ja) 保持部材
JP7116241B2 (ja) 試料保持具
JP7606917B2 (ja) 保持装置
KR102896960B1 (ko) 유지 장치
JP7494972B1 (ja) 静電チャック
JP7697548B1 (ja) 静電チャック
JP7109273B2 (ja) 基板載置部材
JP2023141826A (ja) 保持部材
JP2025025801A (ja) 保持部材
WO2026048652A1 (ja) 試料保持具
JP2025038358A (ja) 保持部材および保持装置
WO2025115143A1 (ja) セラミックヒータ
JP2026053769A (ja) 静電チャック

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination