TWI874046B - 合金材料及接觸式探針 - Google Patents

合金材料及接觸式探針 Download PDF

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Publication number
TWI874046B
TWI874046B TW112148790A TW112148790A TWI874046B TW I874046 B TWI874046 B TW I874046B TW 112148790 A TW112148790 A TW 112148790A TW 112148790 A TW112148790 A TW 112148790A TW I874046 B TWI874046 B TW I874046B
Authority
TW
Taiwan
Prior art keywords
alloy material
line segment
plunger
probe
weight
Prior art date
Application number
TW112148790A
Other languages
English (en)
Chinese (zh)
Other versions
TW202449182A (zh
Inventor
山口真魅
相馬一也
鈴木健
柴入紘介
神谷裕仁
水本政隆
佐々木風太
仁田諄
猪原涼平
Original Assignee
日商日本發條股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本發條股份有限公司 filed Critical 日商日本發條股份有限公司
Publication of TW202449182A publication Critical patent/TW202449182A/zh
Application granted granted Critical
Publication of TWI874046B publication Critical patent/TWI874046B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Conductive Materials (AREA)
TW112148790A 2022-12-28 2023-12-14 合金材料及接觸式探針 TWI874046B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-211785 2022-12-28
JP2022211785 2022-12-28

Publications (2)

Publication Number Publication Date
TW202449182A TW202449182A (zh) 2024-12-16
TWI874046B true TWI874046B (zh) 2025-02-21

Family

ID=91717504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112148790A TWI874046B (zh) 2022-12-28 2023-12-14 合金材料及接觸式探針

Country Status (5)

Country Link
JP (1) JPWO2024142878A1 (https=)
KR (1) KR20250114061A (https=)
CN (1) CN120418460A (https=)
TW (1) TWI874046B (https=)
WO (1) WO2024142878A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201009850A (en) * 2008-08-28 2010-03-01 King Yuan Electronics Co Ltd An alloy material for electrical contact and probe thereof
JP2017145496A (ja) * 2016-02-19 2017-08-24 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281837A (ja) * 1985-06-07 1986-12-12 Tanaka Kikinzoku Kogyo Kk 装飾品用白金合金
JPH03100159A (ja) * 1989-09-12 1991-04-25 Agency Of Ind Science & Technol 光輝ある黒色に着色した白金合金とその着色法
JP3347665B2 (ja) * 1997-11-27 2002-11-20 京セラ株式会社 装飾品用銀合金
JP4344439B2 (ja) * 1999-10-29 2009-10-14 京セラ株式会社 銀合金
JP3228730B2 (ja) * 1999-07-29 2001-11-12 京セラ株式会社 装飾用銀合金
CN103249852A (zh) * 2010-12-09 2013-08-14 株式会社德力本店 电气/电子材料
JP4878401B1 (ja) 2011-05-17 2012-02-15 石福金属興業株式会社 プローブピン用材料、プローブピン及びその製造方法
WO2013099682A1 (ja) 2011-12-27 2013-07-04 株式会社徳力本店 電気・電子機器用のＰｄ合金
WO2014049874A1 (ja) * 2012-09-28 2014-04-03 株式会社徳力本店 電気・電子機器用途のＡｇ‐Ｐｄ‐Ｃｕ‐Ｃｏ合金
WO2016074796A1 (de) * 2014-11-13 2016-05-19 C. Hafner Gmbh + Co. Kg Amorph erstarrende edelmetall-legierung auf edelmetallbasis
CN114318048A (zh) * 2021-12-16 2022-04-12 镇江市镇特合金材料有限公司 一种高焊接性能的导电瓦块用铜合金及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201009850A (en) * 2008-08-28 2010-03-01 King Yuan Electronics Co Ltd An alloy material for electrical contact and probe thereof
JP2017145496A (ja) * 2016-02-19 2017-08-24 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子

Also Published As

Publication number Publication date
CN120418460A (zh) 2025-08-01
KR20250114061A (ko) 2025-07-28
JPWO2024142878A1 (https=) 2024-07-04
TW202449182A (zh) 2024-12-16
WO2024142878A1 (ja) 2024-07-04

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