WO2024142878A1 - 合金材料およびコンタクトプローブ - Google Patents

合金材料およびコンタクトプローブ Download PDF

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Publication number
WO2024142878A1
WO2024142878A1 PCT/JP2023/044187 JP2023044187W WO2024142878A1 WO 2024142878 A1 WO2024142878 A1 WO 2024142878A1 JP 2023044187 W JP2023044187 W JP 2023044187W WO 2024142878 A1 WO2024142878 A1 WO 2024142878A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy material
weight
contact
plunger
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/044187
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真魅 山口
一也 相馬
健 鈴木
紘介 柴入
裕仁 神谷
政隆 水本
風太 佐々木
諄 仁田
涼平 猪原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Priority to JP2024567410A priority Critical patent/JPWO2024142878A1/ja
Priority to CN202380088649.0A priority patent/CN120418460A/zh
Priority to KR1020257020731A priority patent/KR20250114061A/ko
Publication of WO2024142878A1 publication Critical patent/WO2024142878A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

Definitions

  • the alloy material according to the present invention is characterized in that it contains at least one of a group of trace elements consisting of nickel (Ni), tungsten (W), titanium (Ti), cobalt (Co), aluminum (Al), tin (Sn) and iridium (Ir) in a total amount ranging from 0.01% by weight to 3.0% by weight.
  • a group of trace elements consisting of nickel (Ni), tungsten (W), titanium (Ti), cobalt (Co), aluminum (Al), tin (Sn) and iridium (Ir) in a total amount ranging from 0.01% by weight to 3.0% by weight.
  • the probe 2 is a cross-sectional view showing the configuration of the main part of the probe unit according to one embodiment of the present invention.
  • the probe 2 is formed using a conductive material and includes a first plunger 21 that contacts an electrode of the semiconductor integrated circuit 100 when testing the semiconductor integrated circuit 100, a second plunger 22 that contacts an electrode of a circuit board 200 equipped with a test circuit, and a coil spring 23 that is provided between the first plunger 21 and the second plunger 22 and connects the first plunger 21 and the second plunger 22 so that they can move forward and backward.
  • the first plunger 21, the second plunger 22, and the coil spring 23 that constitute the probe 2 have the same axis.
  • the probe holder 3 is formed using an insulating material such as resin, machinable ceramic, or silicon, and is formed by stacking a first member 31 located on the upper side of FIG. 2 and a second member 32 located on the lower side.
  • the first member 31 and the second member 32 are each formed with the same number of holder holes 33 and 34 for accommodating a plurality of probes 2, and the holder holes 33 and 34 that accommodate the probes 2 are formed so that their axes coincide with each other.
  • the positions at which the holder holes 33 and 34 are formed are determined according to the wiring pattern of the semiconductor integrated circuit 100.
  • the present invention should not be limited to only the above-mentioned embodiment.
  • a contact probe has been explained as an example, but the alloy material of the present invention can be applied to any component for electrical or electronic equipment that comes into contact with a component containing Sn. In this case, at least the part of the component that comes into contact with the component needs to be made of the alloy material of the present invention.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Conductive Materials (AREA)
PCT/JP2023/044187 2022-12-28 2023-12-11 合金材料およびコンタクトプローブ Ceased WO2024142878A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2024567410A JPWO2024142878A1 (https=) 2022-12-28 2023-12-11
CN202380088649.0A CN120418460A (zh) 2022-12-28 2023-12-11 合金材料及接触式探针
KR1020257020731A KR20250114061A (ko) 2022-12-28 2023-12-11 합금 재료 및 콘택트 프로브

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-211785 2022-12-28
JP2022211785 2022-12-28

Publications (1)

Publication Number Publication Date
WO2024142878A1 true WO2024142878A1 (ja) 2024-07-04

Family

ID=91717504

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/044187 Ceased WO2024142878A1 (ja) 2022-12-28 2023-12-11 合金材料およびコンタクトプローブ

Country Status (5)

Country Link
JP (1) JPWO2024142878A1 (https=)
KR (1) KR20250114061A (https=)
CN (1) CN120418460A (https=)
TW (1) TWI874046B (https=)
WO (1) WO2024142878A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281837A (ja) * 1985-06-07 1986-12-12 Tanaka Kikinzoku Kogyo Kk 装飾品用白金合金
JPH03100159A (ja) * 1989-09-12 1991-04-25 Agency Of Ind Science & Technol 光輝ある黒色に着色した白金合金とその着色法
JPH11217638A (ja) * 1997-11-27 1999-08-10 Kyocera Corp 銀合金
JP2001040438A (ja) * 1999-07-29 2001-02-13 Kyocera Corp 装飾用銀合金
JP2001131654A (ja) * 1999-10-29 2001-05-15 Kyocera Corp 銀合金
US20170241004A1 (en) * 2014-11-13 2017-08-24 C. Hafner Gmbh + Co. Kg Amorphous solidifying precious metal alloy based on precious metals
JP2017145496A (ja) * 2016-02-19 2017-08-24 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
CN114318048A (zh) * 2021-12-16 2022-04-12 镇江市镇特合金材料有限公司 一种高焊接性能的导电瓦块用铜合金及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201009850A (en) * 2008-08-28 2010-03-01 King Yuan Electronics Co Ltd An alloy material for electrical contact and probe thereof
CN103249852A (zh) * 2010-12-09 2013-08-14 株式会社德力本店 电气/电子材料
JP4878401B1 (ja) 2011-05-17 2012-02-15 石福金属興業株式会社 プローブピン用材料、プローブピン及びその製造方法
WO2013099682A1 (ja) 2011-12-27 2013-07-04 株式会社徳力本店 電気・電子機器用のＰｄ合金
WO2014049874A1 (ja) * 2012-09-28 2014-04-03 株式会社徳力本店 電気・電子機器用途のＡｇ‐Ｐｄ‐Ｃｕ‐Ｃｏ合金

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281837A (ja) * 1985-06-07 1986-12-12 Tanaka Kikinzoku Kogyo Kk 装飾品用白金合金
JPH03100159A (ja) * 1989-09-12 1991-04-25 Agency Of Ind Science & Technol 光輝ある黒色に着色した白金合金とその着色法
JPH11217638A (ja) * 1997-11-27 1999-08-10 Kyocera Corp 銀合金
JP2001040438A (ja) * 1999-07-29 2001-02-13 Kyocera Corp 装飾用銀合金
JP2001131654A (ja) * 1999-10-29 2001-05-15 Kyocera Corp 銀合金
US20170241004A1 (en) * 2014-11-13 2017-08-24 C. Hafner Gmbh + Co. Kg Amorphous solidifying precious metal alloy based on precious metals
JP2017145496A (ja) * 2016-02-19 2017-08-24 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
CN114318048A (zh) * 2021-12-16 2022-04-12 镇江市镇特合金材料有限公司 一种高焊接性能的导电瓦块用铜合金及其制备方法

Also Published As

Publication number Publication date
CN120418460A (zh) 2025-08-01
KR20250114061A (ko) 2025-07-28
JPWO2024142878A1 (https=) 2024-07-04
TW202449182A (zh) 2024-12-16
TWI874046B (zh) 2025-02-21

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