TWI873392B - 控制裝置、調整方法、光刻裝置及物品之製造方法 - Google Patents

控制裝置、調整方法、光刻裝置及物品之製造方法 Download PDF

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Publication number
TWI873392B
TWI873392B TW110146060A TW110146060A TWI873392B TW I873392 B TWI873392 B TW I873392B TW 110146060 A TW110146060 A TW 110146060A TW 110146060 A TW110146060 A TW 110146060A TW I873392 B TWI873392 B TW I873392B
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TW
Taiwan
Prior art keywords
control
signal
control device
deviation
adjustment
Prior art date
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TW110146060A
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English (en)
Chinese (zh)
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TW202223562A (zh
Inventor
猪股裕也
畑智康
森川寛
伊藤正裕
草柳博一
朝倉康伸
石井祐二
橋本拓海
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日商佳能股份有限公司
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Publication of TW202223562A publication Critical patent/TW202223562A/zh
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/36—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G05B13/027—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion using neural networks only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Feedback Control In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW110146060A 2020-12-11 2021-12-09 控制裝置、調整方法、光刻裝置及物品之製造方法 TWI873392B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-205546 2020-12-11
JP2020205546A JP7536626B2 (ja) 2020-12-11 2020-12-11 制御装置、調整方法、リソグラフィ装置、及び物品の製造方法

Publications (2)

Publication Number Publication Date
TW202223562A TW202223562A (zh) 2022-06-16
TWI873392B true TWI873392B (zh) 2025-02-21

Family

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TW110146060A TWI873392B (zh) 2020-12-11 2021-12-09 控制裝置、調整方法、光刻裝置及物品之製造方法

Country Status (5)

Country Link
JP (1) JP7536626B2 (https=)
KR (1) KR20230118130A (https=)
CN (1) CN116648773A (https=)
TW (1) TWI873392B (https=)
WO (1) WO2022124281A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024062786A (ja) * 2022-10-25 2024-05-10 キヤノン株式会社 制御方法、制御装置、リソグラフィ装置、および物品製造方法
CN119247877B (zh) * 2024-09-13 2025-08-01 济宁博硕工具有限公司 一种刀具点空间位姿控制方法及刀具运动控制装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233702A (ja) * 1990-02-09 1991-10-17 Hitachi Ltd コントローラの調整方法および調整システム
JPH06187006A (ja) * 1991-12-05 1994-07-08 Yokogawa Electric Corp 外乱補償装置
JPH07121206A (ja) * 1993-10-20 1995-05-12 Hitachi Ltd ニューラルネットワークによる制御方法および内蔵制御装置
WO2010023668A1 (en) * 2008-08-28 2010-03-04 Technion Research & Development Foundation Ltd. System and method for stabilizing a single-track vehicle
WO2018151215A1 (ja) * 2017-02-20 2018-08-23 株式会社安川電機 制御装置及び制御方法
JP2020112921A (ja) * 2019-01-09 2020-07-27 株式会社明電舎 プラント制御調節装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5396415A (en) 1992-01-31 1995-03-07 Honeywell Inc. Neruo-pid controller
JPH07277286A (ja) 1994-04-11 1995-10-24 Mitsubishi Heavy Ind Ltd 航空機用学習型飛行制御装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233702A (ja) * 1990-02-09 1991-10-17 Hitachi Ltd コントローラの調整方法および調整システム
JPH06187006A (ja) * 1991-12-05 1994-07-08 Yokogawa Electric Corp 外乱補償装置
JPH07121206A (ja) * 1993-10-20 1995-05-12 Hitachi Ltd ニューラルネットワークによる制御方法および内蔵制御装置
WO2010023668A1 (en) * 2008-08-28 2010-03-04 Technion Research & Development Foundation Ltd. System and method for stabilizing a single-track vehicle
WO2018151215A1 (ja) * 2017-02-20 2018-08-23 株式会社安川電機 制御装置及び制御方法
JP2020112921A (ja) * 2019-01-09 2020-07-27 株式会社明電舎 プラント制御調節装置

Also Published As

Publication number Publication date
KR20230118130A (ko) 2023-08-10
JP2022092690A (ja) 2022-06-23
JP7536626B2 (ja) 2024-08-20
TW202223562A (zh) 2022-06-16
CN116648773A (zh) 2023-08-25
WO2022124281A1 (ja) 2022-06-16

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