TWI870582B - 壓電積層體、壓電元件及壓電積層體的製造方法 - Google Patents

壓電積層體、壓電元件及壓電積層體的製造方法 Download PDF

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TWI870582B
TWI870582B TW110114095A TW110114095A TWI870582B TW I870582 B TWI870582 B TW I870582B TW 110114095 A TW110114095 A TW 110114095A TW 110114095 A TW110114095 A TW 110114095A TW I870582 B TWI870582 B TW I870582B
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film
piezoelectric
electrode film
knn
substrate
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TW110114095A
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TW202203479A (zh
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黒田稔顕
柴田憲治
渡辺和俊
木村健司
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日商住友化學股份有限公司
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
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    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G33/00—Compounds of niobium
    • C01G33/006—Compounds containing niobium, with or without oxygen or hydrogen, and containing two or more other elements
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    • C01G9/00—Compounds of zinc
    • C01G9/02—Oxides; Hydroxides
    • C01G9/03—Processes of production using dry methods, e.g. vapour phase processes
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    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605—Treating the starting powders individually or as mixtures
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
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    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physical Vapour Deposition (AREA)
TW110114095A 2020-06-30 2021-04-20 壓電積層體、壓電元件及壓電積層體的製造方法 TWI870582B (zh)

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JP2020112459 2020-06-30
JP2020-112459 2020-06-30

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TW202203479A TW202203479A (zh) 2022-01-16
TWI870582B true TWI870582B (zh) 2025-01-21

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US (1) US20230270013A1 (https=)
EP (1) EP4174024A4 (https=)
JP (1) JP7696347B2 (https=)
TW (1) TWI870582B (https=)
WO (1) WO2022004068A1 (https=)

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DE102023207688A1 (de) * 2023-08-10 2025-02-13 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zur Regeneration eines Kalium-Natrium-Niobat-Dünnfilms
CN119615085B (zh) * 2024-11-21 2025-09-09 武汉大学 一种可激发纯横波的ZnO压电涂层材料及其制备方法和应用

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WO2004088840A1 (ja) * 2003-03-31 2004-10-14 Ube Industries, Ltd. 圧電薄膜デバイス及びその製造方法
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